CN216624278U - Combined LED lamp strip - Google Patents
Combined LED lamp strip Download PDFInfo
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- CN216624278U CN216624278U CN202220106856.7U CN202220106856U CN216624278U CN 216624278 U CN216624278 U CN 216624278U CN 202220106856 U CN202220106856 U CN 202220106856U CN 216624278 U CN216624278 U CN 216624278U
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Abstract
The application provides a modular LED lamp area includes: the LED lamp comprises a controller and a plurality of groups of LED lamp belts arranged in parallel; the LED lamp belt comprises a plurality of LED integrated chips which are sequentially arranged; the grounding pin of the previous LED integrated chip in the same group of LED lamp belts is electrically connected with the power pin of the next LED integrated chip; power pins of the LED integrated chips in the same sequence in different groups of LED lamp belts are electrically connected with each other; the output end of the controller is electrically connected with the input pin of the last LED integrated chip in the first group of LED lamp strips; the output pins of the LED integrated chips in the front group of LED lamp belts are electrically connected with the input pins of the LED integrated chips in the rear group of LED lamp belts in the same sequence; and the output pins of the LED integrated chips in the last group of LED strips are electrically connected with the input pins of the LED integrated chips in the previous sequence in the first group of LED strips. The application is beneficial to realizing the overall uniform light emission.
Description
Technical Field
The application relates to the technical field of LED lamp belts, in particular to a combined LED lamp belt.
Background
The high voltage lamp strip is also called an ac lamp strip, and is powered by ac, and there are low voltage lamp strips (dc lamp strips) powered by dc. The high-voltage lamp strip is provided with the rectifier, so that the high-voltage lamp strip can be directly connected with commercial power for use, and the rectifier rectifies the commercial power and then supplies the commercial power to the lamp beads.
The existing high-voltage lamp strip circuit generally adopts a control mode of parallel connection of lamp beads, when the number of the lamp beads connected in parallel is large, the brightness of the lamp beads at the tail ends is reduced due to the reduction of the voltage of the lamp beads at the tail ends, and the brightness of different lamp beads is inconsistent, so that the overall luminous effect of the high-voltage lamp strip is influenced; moreover, when an existing LED (Light-Emitting Diode) integrated chip is applied to a lamp strip, four wires are generally used for welding, two wires are power lines, and the other two wires are signal lines, and since four electrical connection points (i.e., a power pin, a ground pin, an input pin, and an output pin) of the LED integrated chip are respectively located at four corners, the LED integrated chip needs to be welded with the wires after being rotated by a certain angle, which results in a large volume of the high-voltage lamp strip and high manufacturing cost.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application is proposed to provide a combined LED strip that overcomes or at least partially solves the above mentioned problems, comprising:
a modular LED light strip, comprising: the LED lamp comprises a controller and a plurality of groups of LED lamp belts arranged in parallel; the LED lamp strip comprises a plurality of LED lamp beads which are sequentially arranged; the LED lamp bead comprises an LED integrated chip and a packaging colloid adhered to the surface of the LED integrated chip; the grounding pin of the previous LED integrated chip in the same group of LED lamp belts is electrically connected with the power pin of the next LED integrated chip; the power pin of the first LED integrated chip in each group of LED lamp strips is connected with a power supply; the grounding pin of the last LED integrated chip in each group of the LED lamp belts is grounded;
the power pins of the LED integrated chips in the same sequence in different groups of LED lamp belts are electrically connected with each other; the output end of the controller is electrically connected with the input pin of the last LED integrated chip in the first group of LED lamp strips; the output pins of the LED integrated chips in the former group of LED lamp belts are electrically connected with the input pins of the LED integrated chips in the latter group of LED lamp belts in the same sequence; and the output pins of the LED integrated chips in the last group of LED strips are electrically connected with the input pins of the LED integrated chips in the previous sequence in the first group of LED strips.
Preferably, the LED integrated chip includes a package substrate, a chip assembly, the ground pin disposed on the left upper side of the front surface of the package substrate, the power pin disposed on the right upper side of the front surface of the package substrate, a spare pin disposed on the left side or the right side of the front surface of the package substrate, the output pin disposed on the left lower side of the front surface of the package substrate, the input pin disposed on the right lower side of the front surface of the package substrate, and a pad assembly disposed on the back surface of the package substrate;
the chip components are respectively arranged on the surfaces of the power supply pin and the standby pin; the grounding pin, the power supply pin, the standby pin, the output pin and the input pin are electrically connected with the welding disc assembly through via holes arranged in the packaging substrate respectively.
Preferably, the chip assembly includes a first light emitting chip, a second light emitting chip, a third light emitting chip, and a light emission control chip; the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are respectively arranged on the surface of the power supply pin; the light emitting control chip is arranged on the surface of the standby pin;
the light emitting control chip is electrically connected with the grounding pin, the power supply pin, the output pin, the input pin, the first light emitting chip, the second light emitting chip and the third light emitting chip respectively; the first light-emitting chip and the second light-emitting chip are electrically connected with the power supply pin respectively.
Preferably, the light-emitting control chip comprises a chip substrate, a first pin arranged on the left upper side of the chip substrate, a second pin arranged in the middle of the upper side of the chip substrate, a third pin arranged on the right upper side of the chip substrate, a fourth pin arranged on the left side of the chip substrate, a fifth pin arranged on the right side of the chip substrate, a sixth pin arranged on the left lower side of the chip substrate, a seventh pin arranged in the middle of the lower side of the chip substrate, and an eighth pin arranged on the right lower side of the chip substrate;
the first pin is electrically connected with the negative electrode of the first light-emitting chip; the second pin is electrically connected with the anode of the first light-emitting chip; the third pin is electrically connected with the negative electrode of the third light-emitting chip; the fourth pin is electrically connected with the grounding pin; the fifth pin is electrically connected with the power supply pin; the sixth pin is electrically connected with the output pin; the seventh pin is electrically connected with the input pin.
Preferably, the pad assembly includes a power pad disposed on the left upper side of the back surface of the package substrate, a ground pad disposed on the right upper side of the back surface of the package substrate, a spare pad disposed at the middle position of the back surface of the package substrate, an input pad disposed on the left lower side of the back surface of the package substrate, and an output pad disposed on the right lower side of the back surface of the package substrate;
the power supply bonding pad is electrically connected with the power supply pin; the grounding pad is electrically connected with the grounding pin; the spare bonding pad is electrically connected with the spare pin; the input bonding pad is electrically connected with the input pin; the output pad is electrically connected with the output pin.
Preferably, a rectifier is also included; the power supply is electrically connected with the rectifier; the rectifier is electrically connected with a power pin of a first LED integrated chip in each group of LED lamp strips respectively.
Preferably, the device further comprises a resistor; the output end of the controller is electrically connected with the first end of the resistor; and the second end of the resistor is electrically connected with the input pin of the last LED integrated chip in the first group of LED lamp strips.
Preferably, a plurality of LED lamp beads in the same group of LED lamp strips are arranged on the same straight line.
The application has the following advantages:
in the embodiment of the application, the LED lamp belts are arranged in parallel through a controller; the LED lamp strip comprises a plurality of LED lamp beads which are sequentially arranged; the LED lamp bead comprises an LED integrated chip and a packaging colloid adhered to the surface of the LED integrated chip; the grounding pin of the previous LED integrated chip in the same group of LED lamp belts is electrically connected with the power pin of the next LED integrated chip; the power pin of the first LED integrated chip in each group of LED lamp strips is connected with a power supply; the grounding pin of the last LED integrated chip in each group of the LED lamp belts is grounded; the power pins of the LED integrated chips in the same sequence in different groups of LED lamp belts are electrically connected with each other; the output end of the controller is electrically connected with the input pin of the last LED integrated chip in the first group of LED lamp strips; the output pins of the LED integrated chips in the former group of LED lamp belts are electrically connected with the input pins of the LED integrated chips in the latter group of LED lamp belts in the same sequence; the output pins of the LED integrated chips in the last group of LED lamp strips are electrically connected with the input pins of the LED integrated chips in the previous sequence in the first group of LED lamp strips, so that the output power of different LED integrated chips can be ensured to be the same, and the whole uniform light emission is realized.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic circuit structure diagram of a combined LED strip provided in an embodiment of the present application.
The reference numbers in the drawings of the specification are as follows:
100. an LED integrated chip; 200. a resistance; 300. and a controller.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, a combined LED strip provided in an embodiment of the present application is shown, including: a controller 300 and a plurality of groups of LED strips arranged in parallel; the LED lamp strip comprises a plurality of LED lamp beads which are sequentially arranged; the LED lamp bead comprises an LED integrated chip 100 and a packaging colloid adhered to the surface of the LED integrated chip 100; the grounding pin of the previous LED integrated chip 100 in the same group of LED strips is electrically connected to the power pin of the next LED integrated chip 100; the power pin of the first LED integrated chip 100 in each group of LED strips is connected to a power supply; the grounding pin of the last LED integrated chip 100 in each group of LED strips is grounded;
the power pins of the LED integrated chips 100 in the same order in different groups of LED strips are electrically connected to each other; the output end of the controller 300 is electrically connected with the input pin of the last LED integrated chip 100 in the first group of LED strips; the output pins of the LED integrated chips 100 in the previous group of LED strips are electrically connected with the input pins of the LED integrated chips 100 in the next group of LED strips in the same order; the output pins of the LED ics 100 in the last group of LED strips are electrically connected to the input pins of the LED ics 100 in the previous order in the first group of LED strips.
In the embodiment of the present application, the LED light beams pass through the controller 300 and a plurality of groups of LED light strips arranged in parallel; the LED lamp strip comprises a plurality of LED lamp beads which are sequentially arranged; the LED lamp bead comprises an LED integrated chip 100 and a packaging colloid adhered to the surface of the LED integrated chip 100; the grounding pin of the previous LED integrated chip 100 in the same group of LED strips is electrically connected to the power pin of the next LED integrated chip 100; the power pin of the first LED integrated chip 100 in each group of LED strips is connected to a power supply; the grounding pin of the last LED integrated chip 100 in each group of LED strips is grounded; the power pins of the LED integrated chips 100 in the same sequence in different groups of LED strips are electrically connected to each other; the output end of the controller 300 is electrically connected with the input pin of the last LED integrated chip 100 in the first group of LED strips; the output pins of the LED integrated chips 100 in the previous group of LED strips are electrically connected with the input pins of the LED integrated chips 100 in the next group of LED strips in the same order; the output pins of the LED integrated chips 100 in the last group of LED strips are electrically connected to the input pins of the LED integrated chips 100 in the previous sequence in the first group of LED strips, so that the output powers of the different LED integrated chips 100 can be ensured to be the same, thereby realizing uniform light emission as a whole.
A combined LED strip in the present exemplary embodiment will be further described below.
As an example, the modular LED strip includes a controller 300 and four sets of LED strips arranged in parallel; the LED lamp strip comprises four LED lamp beads which are sequentially arranged; the LED lamp bead comprises an LED integrated chip 100 and a packaging colloid adhered to the surface of the LED integrated chip 100; the grounding pin of the previous LED integrated chip 100 in the same group of LED strips is electrically connected to the power pin of the next LED integrated chip 100; the power pin of the first LED integrated chip 100 in each group of LED strips is connected to a power supply; the grounding pin of the last LED integrated chip 100 in each group of LED strips is grounded;
the power pins of the LED integrated chips 100 in the same order in different groups of LED strips are electrically connected to each other; the output end of the controller 300 is electrically connected with the input pin of the last LED integrated chip 100 in the first group of LED strips; the output pins of the LED integrated chips 100 in the previous group of LED strips are electrically connected with the input pins of the LED integrated chips 100 in the next group of LED strips in the same order; the output pins of the LED ics 100 in the last group of LED strips are electrically connected to the input pins of the LED ics 100 in the previous order in the first group of LED strips.
As another example, the combined LED strip comprises a controller 300 and five groups of LED strips arranged in parallel; the LED lamp strip comprises six LED lamp beads which are sequentially arranged; the LED lamp bead comprises an LED integrated chip 100 and a packaging colloid adhered to the surface of the LED integrated chip 100; the grounding pin of the previous LED integrated chip 100 in the same group of LED strips is electrically connected to the power pin of the next LED integrated chip 100; the power supply pin of the first LED integrated chip 100 in each group of LED strips is connected to a power supply; the grounding pin of the last LED integrated chip 100 in each group of LED strips is grounded;
the power pins of the LED integrated chips 100 in the same order in different groups of LED strips are electrically connected to each other; the output end of the controller 300 is electrically connected with the input pin of the last LED integrated chip 100 in the first group of LED strips; the output pins of the LED integrated chips 100 in the previous group of LED strips are electrically connected with the input pins of the LED integrated chips 100 in the next group of LED strips in the same order; the output pins of the LED ics 100 in the last group of LED strips are electrically connected to the input pins of the LED ics 100 in the previous sequence in the first group of LED strips.
In this embodiment, the LED integrated chip 100 includes a package substrate, a chip assembly, the ground pin disposed on the upper left side of the front surface of the package substrate, the power pin disposed on the upper right side of the front surface of the package substrate, a spare pin disposed on the left side or right side of the front surface of the package substrate, the output pin disposed on the lower left side of the front surface of the package substrate, the input pin disposed on the lower right side of the front surface of the package substrate, and a pad assembly disposed on the back surface of the package substrate;
the chip components are respectively arranged on the surfaces of the power supply pin and the standby pin; the grounding pin, the power supply pin, the standby pin, the output pin and the input pin are electrically connected with the welding disc assembly through via holes arranged in the packaging substrate respectively.
In this embodiment, the chip assembly includes a first light emitting chip, a second light emitting chip, a third light emitting chip, and a light emission control chip; the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are respectively arranged on the surface of the power supply pin; the light emitting control chip is arranged on the surface of the standby pin;
the light-emitting control chip is electrically connected with the grounding pin, the power supply pin, the output pin, the input pin, the first light-emitting chip, the second light-emitting chip and the third light-emitting chip respectively; the first light-emitting chip and the second light-emitting chip are electrically connected with the power supply pin respectively. Specifically, the first light emitting chip is a red light emitting chip; the second light-emitting chip is a green light-emitting chip; the third light-emitting chip is a blue light-emitting chip; the light emitting control chip is a programmable control chip.
In this embodiment, the light-emitting control chip includes a chip substrate, a first pin disposed on an upper left side of the chip substrate, a second pin disposed at a middle position of the upper side of the chip substrate, a third pin disposed on an upper right side of the chip substrate, a fourth pin disposed on a left side of the chip substrate, a fifth pin disposed on a right side of the chip substrate, a sixth pin disposed on a lower left side of the chip substrate, a seventh pin disposed at a middle position of a lower side of the chip substrate, and an eighth pin disposed on a lower right side of the chip substrate;
the first pin is electrically connected with the negative electrode of the first light-emitting chip; the second pin is electrically connected with the anode of the first light-emitting chip; the third pin is electrically connected with the negative electrode of the third light-emitting chip; the fourth pin is electrically connected with the grounding pin; the fifth pin is electrically connected with the power supply pin; the sixth pin is electrically connected with the output pin; the seventh pin is electrically connected with the input pin.
In this embodiment, the pad assembly includes a power pad disposed on the upper left side of the back surface of the package substrate, a ground pad disposed on the upper right side of the back surface of the package substrate, a spare pad disposed at the middle position of the back surface of the package substrate, an input pad disposed on the lower left side of the back surface of the package substrate, and an output pad disposed on the lower right side of the back surface of the package substrate;
the power pins are electrically connected with the power welding pins through power through holes arranged in the package substrate; the grounding pin is electrically connected with the grounding welding foot through a grounding through hole arranged in the packaging substrate; the standby pins are electrically connected with the standby welding pins through standby via holes arranged in the package substrate; the input pins are electrically connected with the input welding pins through the input through holes arranged in the package substrate; the output pins are electrically connected with the output welding pins through output through holes arranged in the packaging substrate.
In this embodiment, the device further comprises a rectifier; the power supply is electrically connected with the rectifier; the rectifier is electrically connected to the power pin of the first LED integrated chip 100 in each group of LED strips. The rectifier is used for rectifying the high-voltage alternating current and supplying the rectified high-voltage alternating current to the LED integrated chip 100.
In this embodiment, the device further includes a resistor 200; the output end of the controller 300 is electrically connected with the first end of the resistor 200; the second end of the resistor 200 is electrically connected to the input pin of the last LED integrated chip 100 in the first group of LED strips. Specifically, the controller 300 is further provided with a power supply terminal and a ground terminal; the power end of the controller 300 is connected with a power supply; the ground terminal of the controller 300 is grounded; the resistance of the resistor 200 is 2.5-3k omega, preferably 2.7k omega.
In this embodiment, a plurality of in the same group LED lamp area LED lamp pearl sets up on same straight line. Specifically, a plurality of LED lamp pearl is with presetting interval equidistance setting.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is given to the combined LED strip provided by the present application, and a specific example is applied in the present application to explain the principle and the implementation of the present application, and the description of the above example is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (8)
1. A combined LED lamp strip, comprising: the LED lamp comprises a controller and a plurality of groups of LED lamp belts arranged in parallel; the LED lamp strip comprises a plurality of LED lamp beads which are sequentially arranged; the LED lamp bead comprises an LED integrated chip and a packaging colloid adhered to the surface of the LED integrated chip; the grounding pin of the previous LED integrated chip in the same group of LED lamp belts is electrically connected with the power pin of the next LED integrated chip; the power pin of the first LED integrated chip in each group of LED lamp strips is connected with a power supply; the grounding pin of the last LED integrated chip in each group of the LED lamp belts is grounded;
the power pins of the LED integrated chips in the same sequence in different groups of LED lamp belts are electrically connected with each other; the output end of the controller is electrically connected with the input pin of the last LED integrated chip in the first group of LED lamp strips; the output pins of the LED integrated chips in the former group of LED lamp belts are electrically connected with the input pins of the LED integrated chips in the latter group of LED lamp belts in the same sequence; and the output pins of the LED integrated chips in the last group of LED strips are electrically connected with the input pins of the LED integrated chips in the previous sequence in the first group of LED strips.
2. The combined LED lamp strip according to claim 1, wherein the LED integrated chip comprises a package substrate, a chip assembly, the ground pin disposed on the upper left side of the front surface of the package substrate, the power pin disposed on the upper right side of the front surface of the package substrate, a spare pin disposed on the left side or right side of the front surface of the package substrate, the output pin disposed on the lower left side of the front surface of the package substrate, the input pin disposed on the lower right side of the front surface of the package substrate, and a pad assembly disposed on the back surface of the package substrate;
the chip components are respectively arranged on the surfaces of the power supply pin and the standby pin; the grounding pin, the power supply pin, the standby pin, the output pin and the input pin are electrically connected with the welding disc assembly through via holes arranged in the packaging substrate respectively.
3. A modular LED strip according to claim 2, wherein the chip module comprises a first, second, third and lighting control chip; the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are respectively arranged on the surface of the power supply pin; the light emitting control chip is arranged on the surface of the standby pin;
the light emitting control chip is electrically connected with the grounding pin, the power supply pin, the output pin, the input pin, the first light emitting chip, the second light emitting chip and the third light emitting chip respectively; the first light-emitting chip and the second light-emitting chip are electrically connected with the power supply pin respectively.
4. The combined LED light strip according to claim 3, wherein the light-emitting control chip comprises a chip substrate, a first pin disposed on the left upper side of the chip substrate, a second pin disposed on the middle position of the upper side of the chip substrate, a third pin disposed on the right upper side of the chip substrate, a fourth pin disposed on the left side of the chip substrate, a fifth pin disposed on the right side of the chip substrate, a sixth pin disposed on the left lower side of the chip substrate, a seventh pin disposed on the middle position of the lower side of the chip substrate, and an eighth pin disposed on the right lower side of the chip substrate;
the first pin is electrically connected with the negative electrode of the first light-emitting chip; the second pin is electrically connected with the anode of the first light-emitting chip; the third pin is electrically connected with the cathode of the third light-emitting chip; the fourth pin is electrically connected with the grounding pin; the fifth pin is electrically connected with the power supply pin; the sixth pin is electrically connected with the output pin; the seventh pin is electrically connected with the input pin.
5. The combined LED light strip according to claim 2, wherein the pad assembly comprises a power pad disposed on the upper left side of the back surface of the package substrate, a ground pad disposed on the upper right side of the back surface of the package substrate, a spare pad disposed at the middle position of the back surface of the package substrate, an input pad disposed on the lower left side of the back surface of the package substrate, and an output pad disposed on the lower right side of the back surface of the package substrate;
the power supply bonding pad is electrically connected with the power supply pin; the grounding pad is electrically connected with the grounding pin; the spare bonding pad is electrically connected with the spare pin; the input bonding pad is electrically connected with the input pin; the output pad is electrically connected with the output pin.
6. A modular LED strip according to claim 1, further comprising a rectifier; the power supply is electrically connected with the rectifier; the rectifier is electrically connected with a power pin of a first LED integrated chip in each group of LED lamp strips respectively.
7. A modular LED strip according to claim 1, further comprising a resistor; the output end of the controller is electrically connected with the first end of the resistor; and the second end of the resistor is electrically connected with the input pin of the last LED integrated chip in the first group of LED lamp strips.
8. The modular LED strip of claim 1, wherein a plurality of said LED beads in a same group of said LED strips are disposed in a same line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220106856.7U CN216624278U (en) | 2022-01-14 | 2022-01-14 | Combined LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220106856.7U CN216624278U (en) | 2022-01-14 | 2022-01-14 | Combined LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216624278U true CN216624278U (en) | 2022-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220106856.7U Active CN216624278U (en) | 2022-01-14 | 2022-01-14 | Combined LED lamp strip |
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|---|---|
| CN (1) | CN216624278U (en) |
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- 2022-01-14 CN CN202220106856.7U patent/CN216624278U/en active Active
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