CN216769135U - LED lamp strip - Google Patents
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- CN216769135U CN216769135U CN202220354319.4U CN202220354319U CN216769135U CN 216769135 U CN216769135 U CN 216769135U CN 202220354319 U CN202220354319 U CN 202220354319U CN 216769135 U CN216769135 U CN 216769135U
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Abstract
The application provides a LED lamp area, include: the LED lamp comprises a lead group and a plurality of LED lamp beads which are sequentially arranged along the extending direction of the lead group; the wire group comprises a power wire, a signal wire and a grounding wire which are arranged in parallel; wherein the signal line is disposed between the power line and the ground line; the LED lamp bead comprises an LED integrated chip and a packaging colloid adhered to the surface of the LED integrated chip; the power supply welding foot of the LED integrated chip is electrically connected with a power supply through the power line, the grounding welding foot of the LED integrated chip is grounded through the grounding wire, and the output welding foot of the LED integrated chip is electrically connected with the input welding foot of the adjacent LED integrated chip through the signal wire; and a breakpoint is arranged between the input welding foot and the output welding foot of the signal wire corresponding to the LED integrated chip. This application can effectively save wire quantity, reduction in production cost.
Description
Technical Field
The application relates to the technical field of LEDs, in particular to an LED lamp strip.
Background
An LED (Light Emitting Diode) is a solid semiconductor device, which uses a solid semiconductor chip as a Light Emitting material, and generates recombination by carriers to release energy to cause photon emission, thereby directly converting electrical energy into optical energy. The LED has the advantages of high brightness, small volume, high efficiency, long service life and the like, and is widely applied to the fields of traffic indication, outdoor full-color display and the like.
The existing LED integrated chip is generally welded by four wires when applied to a lamp strip, wherein two wires are power wires, the other two wires are signal wires, and because four electrical connection points (namely a power pin, a grounding pin, an input pin and an output pin) of the LED integrated chip are respectively positioned at four corners, the LED integrated chip needs to be welded with the wires after being rotated by a certain angle, so that the lamp strip is large in size and high in preparation cost.
SUMMERY OF THE UTILITY MODEL
In view of the problem, the present application is proposed in order to provide a LED strip that overcomes or at least partially solves the problem, comprising:
a LED light strip, comprising: the LED lamp comprises a lead group and a plurality of LED lamp beads sequentially arranged along the extension direction of the lead group;
the lead group comprises a power line, a signal line and a grounding line which are arranged in parallel; wherein the signal line is disposed between the power line and the ground line;
the LED lamp bead comprises an LED integrated chip and a packaging colloid adhered to the surface of the LED integrated chip; the power supply welding foot of the LED integrated chip is electrically connected with a power supply through the power line, the grounding welding foot of the LED integrated chip is grounded through the grounding wire, and the output welding foot of the LED integrated chip is electrically connected with the input welding foot of the adjacent LED integrated chip through the signal wire;
and a breakpoint is arranged between the input welding foot and the output welding foot of the signal wire corresponding to the LED integrated chip.
Preferably, the LED integrated chip includes a package substrate, a lead assembly disposed on the front surface of the package substrate, a chip assembly disposed on the surface of the lead assembly, and a solder tail assembly disposed on the back surface of the package substrate;
the leg assembly includes the power leg, the ground leg, the input leg, and the output leg;
the power supply welding foot, the grounding welding foot, the input welding foot and the output welding foot are electrically connected with the pin assembly through via holes arranged in the packaging substrate respectively; the pin assembly is electrically connected with the chip assembly.
Preferably, the power supply leg is disposed on the upper side of the back surface of the package substrate; the grounding welding foot is arranged on the lower side of the back surface of the packaging substrate; one of the input solder leg and the output solder leg is arranged in the middle of the left side of the back surface of the packaging substrate; the other of the input and output solder tails is disposed in the middle of the right side of the back side of the package substrate.
Preferably, the package substrate has a rectangular structure; the power supply welding foot, the grounding welding foot, the input welding foot and the output welding foot are respectively in a rectangular structure in a long strip shape; the power supply solder leg, the grounding solder leg, the input solder leg and the output solder leg extend in directions respectively parallel to the width direction of the package substrate.
Preferably, the lengths of the power supply solder leg and the ground solder leg are 1/2-1 times the width of the package substrate respectively; the lengths of the input and output solder fillets are 1/5-1/3 of the width of the package substrate, respectively; the input and output solder fillets are spaced apart 1/3-1/2 of the width of the package substrate.
Preferably, the pin assembly comprises a power pin, a ground pin, an input pin and an output pin;
the power supply pin is electrically connected with the power supply welding foot; the grounding pin is electrically connected with the grounding welding foot; the input pin is electrically connected with the input welding foot; the output pin is electrically connected with the output welding foot.
Preferably, the power supply pin extends from the upper left corner of the front surface of the package substrate to the lower right corner; the grounding pin extends from the lower right corner of the front surface of the packaging substrate to the upper left; one of the input pin and the output pin extends from the middle part of the left side of the front surface of the packaging substrate to the lower right; the other of the input pin and the output pin extends from the middle part of the right side of the front surface of the packaging substrate to the upper left.
Preferably, the chip assembly comprises a first light emitting chip, a second light emitting chip and a third light emitting chip which are arranged on the surface of the power pin, and a light emitting control chip arranged on the surface of the ground pin;
the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are electrically connected with the power supply pin respectively; the light emitting control chip is electrically connected with the first light emitting chip, the second light emitting chip, the third light emitting chip, the power pin, the ground pin, the input pin and the output pin respectively.
Preferably, the light-emitting control chip comprises a chip substrate, and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin which are arranged on the chip substrate;
the first pin is electrically connected with the negative electrode of the first light-emitting chip; the second pin is electrically connected with the anode of the second light-emitting chip; the third pin is electrically connected with the negative electrode of the third light-emitting chip; the fourth pin is electrically connected with one of the input pin and the output pin; the fifth pin is electrically connected with the power supply pin; the sixth pin is electrically connected with the grounding pin; the seventh pin is electrically connected to the other of the input pin and the output pin.
Preferably, the LED lamp also comprises a protective layer coated outside the lead group and the LED lamp beads; the protective layer is formed after UV glue is cured.
The application has the following advantages:
in the embodiment of the application, the LED lamp beads are sequentially arranged along the extending direction of the lead group through the lead group; the lead group comprises a power line, a signal line and a grounding line which are arranged in parallel; wherein the signal line is disposed between the power line and the ground line; the LED lamp bead comprises an LED integrated chip and a packaging colloid adhered to the surface of the LED integrated chip; the power supply welding foot of the LED integrated chip is electrically connected with a power supply through the power line, the grounding welding foot of the LED integrated chip is grounded through the grounding wire, and the output welding foot of the LED integrated chip is electrically connected with the input welding foot of the adjacent LED integrated chip through the signal wire; the signal line is provided with a breakpoint between the input welding leg and the output welding leg corresponding to the LED integrated chip, so that the cascade communication of the LED integrated chip can be realized, the number of wires is effectively saved, and the production cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic view of a back structure of an LED strip provided in an embodiment of the present application.
Fig. 2 is a schematic front structural diagram of an LED integrated chip in an LED strip according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a back structure of an LED integrated chip in an LED strip according to an embodiment of the present application.
The reference numbers in the drawings of the specification are as follows:
110. a power line; 120. a signal line; 130. a ground line; 200. an LED integrated chip; 201. a package substrate; 211. a power supply pin; 212. a ground pin; 213. inputting a pin; 214. an output pin; 215. a power supply leg; 216. a ground leg; 217. inputting a welding leg; 218. outputting a welding leg; 221. a first light emitting chip; 222. a second light emitting chip; 223. a third light emitting chip; 224. and a light emission control chip.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 to 3, a LED strip provided in an embodiment of the present application is shown, including: the LED lamp comprises a lead group and a plurality of LED lamp beads sequentially arranged along the extension direction of the lead group;
the lead group comprises a power supply line 110, a signal line 120 and a grounding line 130 which are arranged in parallel; wherein the signal line 120 is disposed between the power line 110 and the ground line 130;
the LED lamp bead comprises an LED integrated chip 200 and a packaging colloid adhered to the surface of the LED integrated chip 200; the power supply pin 215 of the LED integrated chip 200 is electrically connected to a power supply through the power line 110, the ground pin 216 of the LED integrated chip 200 is grounded through the ground line 130, and the output pin 218 of the LED integrated chip 200 is electrically connected to the input pin 217 of the adjacent LED integrated chip 200 through the signal line 120;
a break point is provided on the signal line 120 corresponding to the input solder leg 217 and the output solder leg 218 of the LED integrated chip 200.
In the embodiment of the application, the LED lamp beads are sequentially arranged along the extending direction of the lead group through the lead group; the lead group comprises a power supply line 110, a signal line 120 and a grounding line 130 which are arranged in parallel; wherein the signal line 120 is disposed between the power line 110 and the ground line 130; the LED lamp bead comprises an LED integrated chip 200 and a packaging colloid adhered to the surface of the LED integrated chip 200; the power supply pin 215 of the LED integrated chip 200 is electrically connected to a power supply through the power line 110, the ground pin 216 of the LED integrated chip 200 is grounded through the ground line 130, and the output pin 218 of the LED integrated chip 200 is electrically connected to the input pin 217 of the adjacent LED integrated chip 200 through the signal line 120; a break point is arranged between the input solder leg 217 and the output solder leg 218 of the LED integrated chip 200 on the signal line 120, so that the cascade communication of the LED integrated chip 200 can be realized, the number of wires can be effectively reduced, and the production cost can be reduced.
Next, a LED strip in the present exemplary embodiment will be further described.
Referring to fig. 2-3, in the present embodiment, the LED integrated chip 200 includes a package substrate 201, a lead assembly disposed on a front surface of the package substrate 201, a chip assembly disposed on a surface of the lead assembly, and a solder tail assembly disposed on a back surface of the package substrate 201;
the solder tail assembly includes the power solder tail 215, the ground solder tail 216, the input solder tail 217, and the output solder tail 218;
the power supply solder leg 215, the ground solder leg 216, the input solder leg 217 and the output solder leg 218 are electrically connected to the pin assembly through via holes disposed inside the package substrate 201, respectively; the pin assembly is electrically connected with the chip assembly.
In this embodiment, the power pads 215 are disposed on the upper side of the back surface of the package substrate 201; the ground solder leg 216 is disposed on the lower side of the back surface of the package substrate 201; one of the input and output solder tails 217 and 218 is disposed at the left middle portion of the back surface of the package substrate 201; the other of the input and output solder tails 217 and 218 is disposed at the right middle portion of the back surface of the package substrate 201.
The positions of the input solder leg 217 and the output solder leg 218 may be changed according to actual needs, for example, the output solder leg 218 is disposed in the middle of the left side of the back surface of the package substrate 201, and the input solder leg 217 is disposed in the middle of the right side of the back surface of the package substrate 201, so that the output solder leg 218 of the previous LED integrated chip 200 is electrically connected to the input solder leg 217 of the next LED integrated chip 200 through the signal line 120, or the input solder leg 217 is disposed in the middle of the left side of the back surface of the package substrate 201, and the output solder leg 218 is disposed in the middle of the right side of the back surface of the package substrate 201, so that the output solder leg 218 of the next LED integrated chip 200 is electrically connected to the input solder leg 217 of the previous LED integrated chip 200 through the signal line 120.
By setting the positions of the solder legs with different functions, the position of the power supply solder leg 215 corresponds to the power supply line 110, the positions of the input solder leg 217 and the output solder leg 218 correspond to the signal line 120, and the position of the ground solder leg 216 corresponds to the ground line 130, so that the soldering operation of each solder leg is facilitated, and the LED integrated chip 200 does not need to be rotated by a certain angle and then soldered with a wire, thereby effectively reducing the volume of the lamp strip and lowering the production cost.
In this embodiment, the package substrate 201 has a rectangular structure; the power supply terminal 215, the ground terminal 216, the input terminal 217, and the output terminal 218 are respectively rectangular structures having long strips; the extending directions of the power supply pad 215, the ground pad 216, the input pad 217, and the output pad 218 are parallel to the width direction of the package substrate 201, respectively. The rectangular structure can increase the contact area when each welding leg is welded with the wire, thereby improving the stability of connection between each welding leg and the wire.
In this embodiment, the lengths of the power supply pad 215 and the ground pad 216 are 1/2-1 times, preferably 1 time, the width of the package substrate 201; the lengths of the input and output solder tails 217 and 218 are 1/5-1/3, preferably 1/3, respectively, of the width of the package substrate 201; the input and output solder tails 217 and 218 are spaced apart from each other 1/3-1/2, preferably 1/3, of the width of the package substrate 201. By providing a sufficient length of space between the input and output solder tails 217 and 218, clipping of the signal line 120 between the input and output solder tails 217 and 218 is facilitated.
In this embodiment, the pin assembly includes a power pin 211, a ground pin 212, an input pin 213, and an output pin 214;
the power pin 211 is electrically connected with the power leg 215; the ground pin 212 is electrically connected to the ground solder leg 216; the input pin 213 is electrically connected with the input solder leg 217; the output pin 214 is electrically connected to the output solder 218.
In this embodiment, the power pin 211 extends from the upper left corner of the front surface of the package substrate 201 to the lower right corner; the ground pin 212 extends from the lower right corner of the front surface of the package substrate 201 to the upper left; one of the input pin 213 and the output pin 214 extends from the left middle portion of the front surface of the package substrate 201 to the lower right; the other of the input pin 213 and the output pin 214 extends from the right middle portion of the front surface of the package substrate 201 to the upper left.
The input pin 213 and the output pin 214 correspond to the positions of the input solder leg 217 and the output solder leg 218, respectively, for example, when the output solder tails 218 are arranged at the left middle part of the back surface of the package substrate 201, the input solder tails 217 are arranged at the right middle part of the back surface of the package substrate 201, the input pins 213 extend from the left middle portion of the front surface of the package substrate 201 to the lower right, the output pin 214 extends from the right middle portion of the front surface of the package substrate 201 to the upper left, when the input pad 217 is disposed at the middle of the left side of the back surface of the package substrate 201, the output pad 218 is disposed at the middle of the right side of the back surface of the package substrate 201, the output pin 214 extends from the left middle portion of the front surface of the package substrate 201 to the lower right, the input pins 213 extend from the right middle portion of the front surface of the package substrate 201 to the upper left.
In this embodiment, the chip assembly includes a first light emitting chip 221, a second light emitting chip 222, and a third light emitting chip 223 disposed on the surface of the power pin 211, and a light emitting control chip 224 disposed on the surface of the ground pin 212;
the first light emitting chip 221, the second light emitting chip 222 and the third light emitting chip 223 are electrically connected to the power pin 211, respectively; the light emitting control chip 224 is electrically connected to the first light emitting chip 221, the second light emitting chip 222, the third light emitting chip 223, the power pin 211, the ground pin 212, the input pin 213, and the output pin 214, respectively. Specifically, the first light emitting chip 221 is a blue light emitting chip; the second light emitting chip 222 is a red light emitting chip; the third light emitting chip 223 is a green light emitting chip; the light-emitting control chip 224 is a programmable control chip; the light emission control chip 224 is disposed on a center line of the width direction of the package substrate 201.
In this embodiment, the light emission control chip 224 includes a chip substrate, and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, and an eighth pin disposed on the chip substrate;
the first pin is electrically connected to the negative electrode of the first light emitting chip 221; the second pin is electrically connected to the positive electrode of the second light emitting chip 222; the third pin is electrically connected with the cathode of the third light emitting chip 223; the fourth pin is electrically connected to one of the input pin 213 and the output pin 214; the fifth pin is electrically connected with the power supply pin 211; the sixth pin is electrically connected with the ground pin 212; the seventh pin is electrically connected to the other of the input pin 213 and the output pin 214.
In this embodiment, the LED lamp further comprises a protective layer covering the wire group and the LED lamp beads; the protective layer is formed after UV glue is cured. The protective layer is used for protecting the light emitting surface of the LED lamp beads and the welding positions of the LED lamp beads and the wires so as to enhance the sealing performance of the LED lamp strip.
The preparation method of the LED lamp strip comprises the following steps:
scheme one
Removing the insulating layers of the power line 110, the signal line 120 and the ground line 130 at preset lengths and preset intervals respectively to expose the core of the power line 110 to form a plurality of power welding sections, the core of the signal line 120 to form a plurality of signal welding sections, and the core of the ground line 130 to form a plurality of ground welding sections;
coating welding materials on the surfaces of the power supply welding sections, the signal welding sections and the grounding welding sections in sequence;
conveying the LED lamp beads to the positions below the power supply welding section, the signal welding section and the grounding welding section coated with the welding materials respectively;
sequentially welding the power supply welding leg 215 and the power supply welding section of the LED lamp bead, welding the input welding leg 217 and the output welding leg 218 of the LED lamp bead and the signal welding section, and welding the grounding welding leg 216 and the grounding welding section of the LED lamp bead;
sequentially cutting the signal welding section between the input welding leg 217 and the output welding leg 218 of the LED lamp bead to form the break point on the signal welding section;
and packaging the power line 110, the signal line 120, the grounding line 130 and the plurality of LED lamp beads inside the protective layer to obtain the LED lamp strip.
Scheme two
Removing the insulating layers of the power line 110, the signal line 120 and the ground line 130 at preset lengths and preset intervals respectively to expose the core of the power line 110 to form a plurality of power welding sections, the core of the signal line 120 to form a plurality of signal welding sections, and the core of the ground line 130 to form a plurality of ground welding sections;
cutting the signal welding sections in a preset interval in sequence to form the breakpoints on the signal welding sections;
coating welding materials on the surfaces of the power supply welding sections, the cut signal welding sections and the ground welding sections in sequence;
conveying the LED lamp beads to the positions below the power supply welding section, the signal welding section and the grounding welding section coated with the welding materials respectively;
sequentially welding the power supply leg 215 of the LED lamp bead with the power supply welding segment, welding the input leg 217 of the LED lamp bead with the signal welding segment on one side of the breakpoint, welding the output leg 218 of the LED lamp bead with the signal welding segment on the other side of the breakpoint, and welding the ground leg 216 of the LED lamp bead with the ground welding segment;
and packaging the power line 110, the signal line 120, the grounding line 130 and the LED lamp beads in the protective layer to obtain the LED lamp strip.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "include", "including" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or terminal device including a series of elements includes not only those elements but also other elements not explicitly listed or inherent to such process, method, article, or terminal device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or terminal equipment comprising the element.
The above detailed description is given to the LED strip provided by the present application, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the above embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A LED strip, comprising: the LED lamp comprises a lead group and a plurality of LED lamp beads sequentially arranged along the extension direction of the lead group;
the lead group comprises a power line, a signal line and a grounding line which are arranged in parallel; wherein the signal line is disposed between the power line and the ground line;
the LED lamp bead comprises an LED integrated chip and a packaging colloid adhered to the surface of the LED integrated chip; the power supply welding foot of the LED integrated chip is electrically connected with a power supply through the power line, the grounding welding foot of the LED integrated chip is grounded through the grounding wire, and the output welding foot of the LED integrated chip is electrically connected with the input welding foot of the adjacent LED integrated chip through the signal wire;
and a breakpoint is arranged between the input welding foot and the output welding foot of the signal wire corresponding to the LED integrated chip.
2. The LED strip according to claim 1, wherein the LED integrated chip comprises a package substrate, a lead assembly disposed on a front surface of the package substrate, a chip assembly disposed on a surface of the lead assembly, and a solder tail assembly disposed on a back surface of the package substrate;
the leg assembly includes the power leg, the ground leg, the input leg, and the output leg;
the power supply welding foot, the grounding welding foot, the input welding foot and the output welding foot are electrically connected with the pin assembly through via holes arranged in the packaging substrate respectively; the pin assembly is electrically connected with the chip assembly.
3. The LED strip of claim 2, wherein said power supply solder tails are disposed on an upper side of the back side of said package substrate; the grounding welding foot is arranged on the lower side of the back surface of the packaging substrate; one of the input solder leg and the output solder leg is arranged in the middle of the left side of the back surface of the packaging substrate; the other of the input and output solder tails is disposed in the middle of the right side of the back side of the package substrate.
4. The LED strip according to claim 3, wherein the package substrate has a rectangular structure; the power supply welding foot, the grounding welding foot, the input welding foot and the output welding foot are respectively in a rectangular structure in a long strip shape; the power supply solder leg, the grounding solder leg, the input solder leg and the output solder leg extend in directions respectively parallel to the width direction of the package substrate.
5. The LED strip according to claim 4, wherein the lengths of the power and ground solder tails are 1/2-1 times the width of the package substrate, respectively; the lengths of the input and output solder fillets are 1/5-1/3 of the width of the package substrate, respectively; the input and output solder fillets are spaced apart 1/3-1/2 of the width of the package substrate.
6. The LED light strip of claim 2, wherein the pin assembly comprises a power pin, a ground pin, an input pin, and an output pin;
the power supply pin is electrically connected with the power supply welding foot; the grounding pin is electrically connected with the grounding welding foot; the input pin is electrically connected with the input welding foot; the output pin is electrically connected with the output welding foot.
7. The LED strip according to claim 6, wherein the power pin extends from the upper left corner of the front surface of the package substrate to the lower right; the grounding pin extends from the lower right corner of the front surface of the packaging substrate to the upper left; one of the input pin and the output pin extends from the middle part of the left side of the front surface of the packaging substrate to the lower right; the other of the input pin and the output pin extends from the middle part of the right side of the front surface of the packaging substrate to the upper left.
8. The LED strip of claim 6, wherein the chip assembly comprises a first light emitting chip, a second light emitting chip and a third light emitting chip disposed on the surface of the power pin, and a light emitting control chip disposed on the surface of the ground pin;
the first light-emitting chip, the second light-emitting chip and the third light-emitting chip are electrically connected with the power supply pin respectively; the light emitting control chip is electrically connected with the first light emitting chip, the second light emitting chip, the third light emitting chip, the power pin, the ground pin, the input pin and the output pin respectively.
9. The LED light strip according to claim 8, wherein the lighting control chip comprises a chip substrate and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, and an eighth pin disposed on the chip substrate;
the first pin is electrically connected with the negative electrode of the first light-emitting chip; the second pin is electrically connected with the anode of the second light-emitting chip; the third pin is electrically connected with the negative electrode of the third light-emitting chip; the fourth pin is electrically connected with one of the input pin and the output pin; the fifth pin is electrically connected with the power supply pin; the sixth pin is electrically connected with the grounding pin; the seventh pin is electrically connected to the other of the input pin and the output pin.
10. The LED strip of claim 1, further comprising a protective layer covering the exterior of said wire set and said LED bead; the protective layer is formed after UV glue is cured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220354319.4U CN216769135U (en) | 2022-02-21 | 2022-02-21 | LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220354319.4U CN216769135U (en) | 2022-02-21 | 2022-02-21 | LED lamp strip |
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| Publication Number | Publication Date |
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| CN216769135U true CN216769135U (en) | 2022-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220354319.4U Active CN216769135U (en) | 2022-02-21 | 2022-02-21 | LED lamp strip |
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| CN (1) | CN216769135U (en) |
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- 2022-02-21 CN CN202220354319.4U patent/CN216769135U/en active Active
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