CN214672611U

CN214672611U - Integrally formed LED packaging structure

Info

Publication number: CN214672611U
Application number: CN202120791512.XU
Authority: CN
Inventors: 伍建国
Original assignee: Shenzhen Deming New Microelectronics Co ltd
Current assignee: Shenzhen Deming New Microelectronics Co ltd
Priority date: 2021-04-16
Filing date: 2021-04-16
Publication date: 2021-11-09
Anticipated expiration: 2031-04-16

Abstract

The utility model discloses an integrated into one piece's LED packaging structure, including metal support, LED drive IC chip, LED chip and encapsulation glue film, LED drive IC chip and LED chip are fixed in respectively on the metal support, connect through the bonding wire between LED drive IC chip, LED chip and the pin of metal support respectively, the encapsulation glue film cladding is in LED drive IC chip, LED chip and metal support's periphery, one side of encapsulation glue film is equipped with the signal line and cuts out the incision, the metal support with LED drive IC chip and LED chip are integrated into one piece structure, and metal support and LED drive IC chip and LED chip are integrated into one piece structure, have also reduced the cost of labor when having practiced thrift the encapsulation time.

Description

Integrally formed LED packaging structure

Technical Field

The utility model relates to a semiconductor package technical field especially relates to an integrated into one piece's LED packaging structure.

Background

An LED (Light Emitting Diode) is a solid semiconductor device, which uses a solid semiconductor chip as a Light Emitting material, and generates recombination by carriers to release energy to cause photon emission, thereby directly converting electric energy into Light energy. The LED has the advantages of high brightness, small volume, high efficiency, long service life and the like, and is widely applied to the fields of traffic indication, outdoor full-color display and the like.

Generally, the packaging of the LED is divided into two types, one is a direct-insert LED packaging structure, and the other is a surface mount LED packaging structure, but no matter which packaging structure is adopted, a large amount of time and labor cost are required during packaging.

Therefore, there is a need to provide a new LED package structure to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In view of the above, embodiments of the present invention are provided to provide an integrally formed LED package structure that overcomes or at least partially solves the above-mentioned problems.

In order to solve the problem, the embodiment of the utility model discloses an integrated into one piece's LED packaging structure, including metal support, LED driver IC chip, LED chip and encapsulation glue film, LED driver IC chip and LED chip are fixed in respectively on the metal support, connect through the bonding wire between LED driver IC chip, LED chip and the pin of metal support respectively, the encapsulation glue film cladding is in LED driver IC chip, LED chip and metal support's periphery, one side of encapsulation glue film is equipped with the signal line and cuts out the incision, the metal support with LED driver IC chip and LED chip are integrated into one piece structure.

Preferably, the pins of the metal bracket are in a patch form.

Preferably, at least one of the LED chips is provided.

Preferably, the number of the LED chips is three, and the three LED chips are respectively connected with the LED drive IC chip through bonding wires.

Preferably, the packaging adhesive layer is square or round or in any other shape.

Preferably, the packaging adhesive layer is epoxy resin.

Preferably, the signal line cutting opening is located on one side of the LED drive IC chip, and the signal cutting opening is a longitudinal cutting opening penetrating through the packaging adhesive layer.

The embodiment of the utility model provides a include following advantage:

1. a line can be used as signal input and output through the cut of the signal line, so that each LED lamp signal is connected in series, namely the packaged lamp has an output pin and an input pin, the same line is used for welding, and the signal input line and the signal output line can be separated by cutting the line from the cut of the signal line after welding;

2. the metal support, the LED drive IC chip and the LED chip are of an integrated structure, so that the labor cost is reduced while the packaging time is saved.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of a chip LED package structure of the present invention;

fig. 2 is a schematic structural diagram of another embodiment of the chip LED package structure of the present invention;

1. the LED packaging structure comprises a metal support, 2 LED driving IC chips, 3 LED chips, 4 packaging adhesive layers, 5 bonding wires, 6 signal wire cutting notches, 7 signal input wires, 8 signal output wires.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.

The utility model discloses one of the core design in, metal support and LED drive IC chip and LED chip are integrated into one piece structure, have also reduced the cost of labor when having practiced thrift the encapsulation time.

Referring to fig. 1 and fig. 2, a schematic structural diagram of an embodiment of an integrally formed LED package structure of the present invention is shown.

The method specifically comprises the following steps: the LED chip comprises a metal support 1, an LED drive IC chip 2, three LED chips 3 and a packaging adhesive layer 4, wherein the number of the LED chips 3 is three, and the LED chips comprise a red LED chip, a blue LED chip and a green LED chip, the LED driving IC chip 2 and the three LED chips 3 are respectively fixed on the metal bracket 1, the LED driving IC chip 2, the three LED chips 3 and the pins of the metal bracket 1 are respectively connected through bonding wires 5, the packaging adhesive layer 4 is coated on the peripheries of the LED driving IC chip 2, the LED chip 3 and the metal bracket 1, a signal wire cutting opening 6 is arranged on one side of the packaging adhesive layer 4, the signal wire cutting opening 6 is positioned on one side of the LED drive IC chip 2, and the signal cutting 6 is a longitudinal cutting penetrating through the packaging adhesive 4 layer, and the metal support 1, the LED drive IC chip 2 and the LED chip 3 are of an integrally formed structure.

In this embodiment, LED driver IC chip 2 and three LED chip 3 separately admittedly on metal support 1, avoided LED chip 3 and LED driver IC chip 2 to overlap and shelter from the heat dissipation, heat dispersion is good, signal line cut 6 through seting up on encapsulation glue film 4, can regard as signal input output with a line, make each LED lamp signal establish ties, the lamp that encapsulates promptly has input pin of an output pin, with same line welding, it can divide signal input line 7 and signal output line 8 to weld to have decided the line from signal line cut 6.

In the present embodiment, the number of the LED chips 3 may be one or two.

In this embodiment, the pins of the metal support 1 are in a patch form, so that brightness, a visual angle and flatness are improved, light emission of the integrated packaging lamp bead is uniform, a light emitting angle is large, and display effect consistency is good.

In the present embodiment, the encapsulating adhesive layer 4 is square or round or a combination of square and round, and is not limited in the present application.

In this embodiment, the encapsulating adhesive layer 4 is made of epoxy resin, and has high surface glossiness and good waterproof performance.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.

The above detailed description is made on the integrally formed LED package structure provided by the present invention, and the specific examples are applied herein to explain the principles and embodiments of the present invention, and the description of the above embodiments is only used to help understand the method and core ideas of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be some changes in the specific implementation and application scope, and to sum up, the content of the present specification should not be understood as a limitation to the present invention.

Claims

1. The utility model provides an integrated into one piece's LED packaging structure, includes metal support, LED driver IC chip, LED chip and encapsulation glue film, its characterized in that, LED driver IC chip and LED chip are fixed in respectively on the metal support, connect through the bonding wire between LED driver IC chip, LED chip and the pin of metal support respectively, the encapsulation glue film cladding is in LED driver IC chip, LED chip and metal support's periphery, one side of encapsulation glue film is equipped with the signal line and cuts out the incision, the metal support with LED driver IC chip and LED chip are integrated into one piece structure.

2. The integrally formed LED package structure of claim 1, wherein the pins of the metal support are in the form of patches.

3. The integrally formed LED package structure of claim 1, wherein at least one of the LED chips is formed.

4. The integrally formed LED package structure of claim 3, wherein there are three LED chips, and the three LED chips are respectively connected to the LED driver IC chips through bonding wires.

5. The integrally formed LED package structure of claim 1, wherein the encapsulant layer is square or circular or any other shape.

6. The integrally formed LED package structure of claim 5, wherein the encapsulant layer is an epoxy resin.

7. The integrally formed LED package structure of claim 6, wherein the signal line cutout is located on one side of the LED driver IC chip, and the signal cutout is a longitudinal cutout penetrating through the packaging adhesive layer.