CN202473917U

CN202473917U - LED (light-emitting diode) module

Info

Publication number: CN202473917U
Application number: CN2012200868754U
Authority: CN
Inventors: 夏鼎智; 郭伦春; 何海生; 陈建昌; 张铁钟
Original assignee: Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
Current assignee: Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
Priority date: 2012-03-09
Filing date: 2012-03-09
Publication date: 2012-10-03
Anticipated expiration: 2022-03-09

Abstract

The utility model relates to an LED (light-emitting diode) module, and in particular relates to a white light LED module with a high reflectivity substrate. The LED module comprises a substrate, a wire layer and a chip, wherein the wire layer is arranged between the substrate and the chip; the chip of the LED module comprises blue light chips, or combination of the blue light chip and the red light chip, or combination of the red light chip, a green light chip and the blue light chip, which are distributed on the wire layer side by side in series, chips are electrically connected or the chip and the wire layer are electrically connected; the wire layer is provided with a box dam device, and the chips are arranged in the box damp device; and rubber mass is packaged on the substrate and the chips. The LED module adopts the structure, thus the heat dissipation of LED chips is facilitated and the light-emitting efficiency of an LED is improved through the substrate of high reflectivity.

Description

A kind of LED module

Technical field:

The utility model relates to a kind of LED module, particularly a kind of white light LEDs module with high reflectance substrate.

Background technology:

The major parameter that influences the power-type LED light efficiency has operating current, heat and light extraction efficiency.Prior art improves luminous flux through the power-type chip that adopts big current drives, but because the hot polymerization collection, photoelectric conversion efficiency is low, and light extraction efficiency is low; If will improve light efficiency, just must reduce operating current, reduce the generation of heat, solve the problem of chip hot polymerization collection.Though and power-type LED chip light efficiency under little current drives is able to promote, power is little, and then luminous flux is also just little.

Summary of the invention:

The purpose of the utility model is to overcome the deficiency of prior art and a kind of LED module with high reflectance substrate of providing, obtains the LED module of high light-emitting efficiency.

For realizing above-mentioned purpose, the utility model mainly adopts following technical scheme:

The described a kind of LED module of the utility model comprises substrate, line layer, chip, and line layer is arranged between substrate and the chip.The chip of described LED module comprises blue chip, or blue, red light chips combination or red, green, blue chip portfolio, goes here and there and is arranged on the line layer, is electrically connected between chip and chip and chip and the line layer; Described line layer is provided with the box dam device, and chip is positioned at the box dam device; Be packaged with colloid on the described substrate He on the chip.

Described substrate is the high reflectance substrate that is coated with the colloid that contains fluorescent material.

Described line layer is fixedly connected on the substrate, is electrically connected with chip on the line layer.

Described box dam device is fixedly connected on the line layer in the form of a ring, goes along with sb. to guard him at the chip periphery.

Colloid on described substrate, chip and the connection lead that is encapsulated in the box dam device is the colloid that contains fluorescent material.

The utility model LED module adopts said structure, can not only help the heat radiation of led chip, and through using the high reflectance baseplate material, can also improve the light extraction efficiency of LED.

Description of drawings:

Fig. 1 is the structural representation of the LED module of the utility model.

Embodiment:

For setting forth the thought and the purpose of the utility model, will combine accompanying drawing and specific embodiment that the utility model is further specified below.

See also shown in Figure 1, the described a kind of LED module of the utility model, comprise substrate 1, line layer 2, box dam device 3, led chip 4, packaging plastic or fluorescent material and packaging plastic mixture 5, be connected lead 6.

The chip 4 of the LED module of the utility model comprises blue chip, or blue, red light chips combination or red, green, blue chip portfolio, goes here and there and is arranged on the line layer 2, is electrically connected between chip 4 and chip 4 and chip 4 and the line layer 2; Line layer 2 is provided with box dam device 3, and chip 4 is positioned at box dam device 3; Be packaged with colloid on the substrate 1 He on the chip 4.

Substrate 1 is for being coated with the high reflectance substrate of the colloid 5 that contains fluorescent material.

Line layer 2 is fixedly connected on the substrate 1, is electrically connected with chip 4 on the line layer 2.

Box dam device 3 is fixedly connected on the line layer 2 in the form of a ring, goes along with sb. to guard him at chip 4 peripheries.

The colloid 5 that is encapsulated in substrate 1, the chip 4 in the box dam device 3 and connects on the lead 6 is the colloid 5 that contains fluorescent material.

Instance one concrete making step is following:

On high reflection substrate 1, make line layer 2 through the mode of fitting; On high reflection substrate 1 with the fixing blue-light LED chip 4 of crystal-bonding adhesive; Chip 4 is connected with line layer 2 usefulness plain conductors 6 with chip 4 and chip 4; Box dam device 3 is installed on line layer 2; In box dam device 3, fill the mixture 5 of packaging plastic and fluorescent material.

Instance two concrete making steps are following:

On high reflection substrate 1, make line layer 2 through the mode of fitting; On high reflection substrate 1 with crystal-bonding adhesive fixedly blue light and red LED chip 4; Chip 4 is connected with line layer 2 usefulness plain conductors 6 with chip 4 and chip 4; Box dam device 3 is installed on line layer 2; The mixture 5 of encapsulation silica gel and fluorescent material in box dam device 3.

Instance three concrete making steps are following:

On high reflection substrate 1, make line layer 2 through the mode of fitting; On high reflection substrate 1 with the fixing red, green and blue LED chip 4 of crystal-bonding adhesive; Chip 4 is connected with line layer 2 usefulness plain conductors 6 with chip 4 and chip 4; Box dam device 3 is installed on line layer 2; In box dam device 3, fill the mixture 5 of packaging plastic and fluorescent material.

More than be that a kind of LED module that the utility model is provided has carried out detailed introduction; Concrete the example of using among this paper set forth the structural principle and the execution mode of the utility model, and above embodiment just is used to help to understand the method and the core concept thereof of the utility model; Simultaneously, for one of ordinary skill in the art, according to the thought of the utility model, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as the restriction to the utility model.

Claims

1. LED module; Comprise substrate, line layer, chip; Line layer is arranged between substrate and the chip, it is characterized in that: the chip of described LED module comprises combination of blue chip or blue light and red light chips or red, green, blue chip string and combination; Be arranged on the line layer, be electrically connected between chip and chip and chip and the line layer; Described line layer is provided with the box dam device, and chip is positioned at the box dam device; Be packaged with colloid on the described substrate He on the chip.

2. a kind of LED module according to claim 1 is characterized in that: described substrate is the high reflectance substrate that is coated with the colloid that contains fluorescent material.

3. a kind of LED module according to claim 1, it is characterized in that: described line layer is fixedly connected on the substrate, is electrically connected with chip on the line layer.

4. a kind of LED module according to claim 1 is characterized in that: described box dam device is fixedly connected on the line layer in the form of a ring, goes along with sb. to guard him at the chip periphery.

5. a kind of LED module according to claim 1 is characterized in that: the colloid on described substrate, chip and the connection lead that is encapsulated in the box dam device is the colloid that contains fluorescent material.