CN209822684U

CN209822684U - Packaging substrate, LED device and LED module

Info

Publication number: CN209822684U
Application number: CN201821853034.5U
Authority: CN
Inventors: 万垂铭; 朱文敏; 李真真; 曾照明; 肖国伟
Original assignee: Guangdong APT Electronics Ltd
Current assignee: Guangdong APT Electronics Ltd
Priority date: 2018-11-09
Filing date: 2018-11-09
Publication date: 2019-12-20
Anticipated expiration: 2028-11-09

Abstract

The utility model discloses a packaging substrate, LED device and LED module. The package substrate includes: the device comprises a first electrode, a second electrode and an insulating isolation region, wherein the insulating isolation region is arranged between the first electrode and the second electrode; the first electrode is provided with a first convex part and a second convex part, the second electrode is provided with a third convex part, and the first convex part and the second convex part of the first electrode and the third convex part of the second electrode are arranged in a staggered mode at intervals; the first side wall of the insulating isolation region is provided with a first concave part and a second concave part, the second side wall is provided with a third concave part, the first concave part is matched with the first convex part, the second concave part is matched with the second convex part, and the third concave part is matched with the third convex part, so that the joint surface of the insulating isolation region, the first electrode and the second electrode is of a concave-convex interdigital structure. The utility model discloses a packaging substrate, LED device and LED module can avoid first electrode and second electrode to drop, shorten the routing distance, improve the lead wire reliability.

Description

Packaging substrate, LED device and LED module

Technical Field

The utility model relates to a LED technical field especially relates to a packaging substrate, LED device and LED module.

Background

Fig. 1 is a schematic structural view of a conventional package substrate. The conventional package substrate 100 includes a first electrode 101, a second electrode 102, and an insulating isolation region 103, where the first electrode 101 and the second electrode 102 are separated from each other and parallel to each other, and an area of the first electrode 101 is smaller than an area of the second electrode 102; an insulating isolation region 103 is disposed between the first electrode 101 and the second electrode 102. When the LED chip 201 is packaged by the package substrate, the LED chip 201 and the zener diode 202 are usually fixed to the second electrode 102, the positive electrode of the LED chip 201 is connected to the first electrode 101 through the lead 203, and the negative electrode of the LED chip 202 is connected to the second electrode 102.

However, since the bonding surfaces between the first electrode 101 and the second electrode 102 and the insulating isolation region 103 in the conventional package substrate are planar, the bonding surfaces between the first electrode 101 and the second electrode 102 and the insulating isolation region 103 are easy to fall off; the insulating isolation region 103 is in a long strip shape, and in order to increase the strength of the insulating isolation region 103, the width of the existing insulating isolation region 103 is large, which may result in a large span of the lead 203, thereby reducing the reliability of the LED package device.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the utility model discloses a packaging substrate, LED device, LED module and manufacturing method thereof can effectively avoid first electrode and second electrode to drop, and can shorten zener diode and LED chip's routing distance, and then shorten the lead wire span.

In order to solve the above technical problem, the utility model provides a packaging substrate, include: a first electrode, a second electrode, and an insulating isolation region disposed between the first electrode and the second electrode; the first electrode is provided with a first convex part and a second convex part which are positioned at the same end, the second electrode is provided with a third convex part, and the first convex part and the second convex part of the first electrode and the third convex part of the second electrode are arranged in a staggered mode at intervals; the first side wall of the insulating isolation region is provided with a first concave part and a second concave part, the second side wall is provided with a third concave part, the first concave part is matched with the first convex part, the second concave part is matched with the second convex part, and the third concave part is matched with the third convex part, so that the joint surface of the insulating isolation region and the first electrode and the joint surface of the insulating isolation region and the second electrode are of a concave-convex interdigital structure.

Compared with the prior art, the first electrode of the packaging substrate of the utility model is provided with the first convex part and the second convex part, the second electrode is provided with the third convex part, and the first convex part and the second convex part of the first electrode are arranged with the third convex part of the second electrode in a staggered way; and the first side wall of the insulating isolation region arranged between the first electrode and the second electrode is provided with a first concave part which is completely coincided with the first convex part and a second concave part which is completely coincided with the second convex part, and the second side wall is provided with a third concave part which is completely coincided with the third convex part, so that the combination surfaces of the first electrode and the second electrode and the two side walls of the insulating isolation region are of a concave-convex interdigital structure, the area of the combination surface is increased, and the first electrode and the second electrode are prevented from falling off. And, because the whole body of the insulating isolation region is of a concave-convex structure, and the joint of the two side walls of the insulating isolation region and the first electrode and the second electrode is in interdigital combination, the routing distance between the first convex part and the third convex part of the first electrode and between the second convex part and the second electrode can be effectively shortened, and the routing distance between the first convex part and the second convex part and between the second electrode can be shortened, so that when the packaging substrate is adopted to manufacture an LED device or an LED module, the span of a lead can be effectively shortened, the phenomenon that the lead is easily broken due to overlong lead when the LED device or the LED module is aged is avoided, and the reliability of the LED device or the LED module can be improved.

As an improvement of the above aspect, the first convex portion and the second convex portion are both rectangular convex portions, triangular convex portions, or semicircular convex portions, so that either one of the first convex portion and the second convex portion identifies the zener diode fixed crystal region, and the other one of the first convex portion and the second convex portion identifies the LED bonding region and faces the LED bonding region, and the third convex portion is a rectangular convex portion, a triangular convex portion, or a semicircular convex portion to identify the zener diode bonding region on the second electrode.

As an improvement of the above scheme, the area of the zener die bond region is equal to or larger than the area of the zener diode, and the area of the LED die bond region is larger than the area of the LED chip.

In order to solve the above technical problem, the utility model also provides a LED device, include: the first reflection cup is arranged around the outer edge of the packaging substrate;

a zener diode is fixed on the zener die attach region, and the zener diode is connected with the third convex part through a lead;

an LED chip is fixed on the LED die bonding area and is connected with the LED routing area through a lead.

Compared with the prior art, the utility model discloses a LED device, owing to adopt above-mentioned packaging substrate to reserve the solid brilliant position of zener diode and LED chip, can effectively shorten the span of routing distance and lead wire, improve the reliability of LED device.

As an improvement of the above scheme, a fluorescent sheet is bonded on the LED chip, and the area of the fluorescent sheet is greater than or equal to the area of the light emitting surface of the LED chip;

the first reflecting cup is filled with a resin body, the resin body surrounds the LED chip and the fluorescent sheet, and the upper surface of the resin body is flush with the upper surface of the fluorescent sheet.

As a modification of the above, the resin body includes one or more combinations of TiO2, SiO2, BaSO4, and ZnO filler particles.

As an improvement of the above scheme, the LED chip is connected to the first electrode by a plurality of leads to reduce the current density of a single lead.

The utility model also provides a LED module, include: the second reflection cup is arranged around the outer edges of the two packaging substrates, and the two packaging substrates are arranged in parallel and connected through an insulation dam; the two packaging substrates comprise a 1 st packaging substrate and a 2 nd packaging substrate;

a first zener diode and a second zener diode are respectively fixed to the first convex portion of the 1 st package substrate and the second convex portion of the 2 nd package substrate, the first zener diode is connected to the third convex portion of the 1 st package substrate by a lead, and the second zener diode is connected to the third convex portion of the 2 nd package substrate by a lead;

the second electrode of the 1 st packaging substrate and the second electrode of the 2 nd packaging substrate are respectively fixed with a first LED chip and a second LED chip, the first LED chip and the second convex part of the 1 st packaging substrate are opposite to each other and are connected through a lead, and the second LED chip and the first convex part of the 2 nd packaging substrate are opposite to each other and are connected through a lead.

Compared with the prior art, the LED module of the utility model has the advantages that on one hand, the routing distance between the Zener diode and the LED chip can be effectively shortened due to the adopted packaging substrate, and the die bonding position of the Zener diode and the LED chip is reserved on the packaging substrate, so that the routing distance and the lead span can be further shortened, and the reliability of the LED module is improved; on the other hand, because the first LED chip is fixed on the second electrode of the 1 st packaging substrate, the second LED chip is fixed on the second electrode of the 2 nd packaging substrate, the first LED chip is arranged opposite to the second convex part of the 1 st packaging substrate, and the second LED chip is arranged opposite to the first convex part of the 2 nd packaging substrate, the distance between the first LED chip and the second LED chip is shortened, the light mixing distance between the first LED chip and the second LED chip is further shortened, and the ultra-short distance light mixing can be effectively realized.

The utility model discloses still provide another kind of LED module, include: the third reflection cup is arranged around the outer edges of the N packaging substrates; the N packaging substrates are arranged in parallel and connected through an insulation dam; n is an integer and is not less than 3;

zener diodes are fixed on the first electrodes of the 2 nd package substrate to the (N-1) th package substrate in the N package substrates, each Zener diode is positioned on any one of the first convex part and the second convex part of the corresponding package substrate, and each Zener diode is connected with the third convex part of the corresponding package substrate through a lead;

LED chips are fixed in the middle of the second electrodes of the 2 nd package substrate to the N-1 th package substrate, and each LED chip is connected with the other one of the first convex part and the second convex part of the corresponding package substrate through a lead;

a first zener diode and a second zener diode are respectively fixed to the first convex portion of the 1 st package substrate and the second convex portion of the nth package substrate of the N package substrates, the first zener diode is connected to the third convex portion of the 1 st package substrate through a lead, and the second zener diode is connected to the third convex portion of the nth package substrate through a lead;

and a first LED chip and a second LED chip are respectively fixed on the second electrode of the 1 st packaging substrate and the second electrode of the Nth packaging substrate, the first LED chip is just opposite to the second convex part of the 1 st packaging substrate and is connected with the second LED chip through a lead, and the second LED chip is just opposite to the first convex part of the Nth packaging substrate and is connected with the first LED chip through a lead.

Drawings

Fig. 1 is a schematic structural diagram of a conventional package support.

Fig. 2 is a schematic structural diagram of a package substrate according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of an LED device according to an embodiment of the present invention.

Fig. 4 is a schematic diagram of a LED device in which a fluorescent sheet is stacked on an LED chip according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of an LED module according to an embodiment of the present invention.

Fig. 6 is a schematic diagram of a LED module in which a fluorescent sheet is stacked on an LED chip according to an embodiment of the present invention.

Fig. 7 is a top view of an LED module according to an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of another LED module according to an embodiment of the present invention.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention can be embodied in many other forms without departing from the spirit or essential characteristics thereof, and it should be understood that the invention is not limited to the specific embodiments disclosed below.

The technical solution of the present invention will be described in detail and fully with reference to the following embodiments and accompanying drawings.

The package substrate includes: the electrode structure comprises a first electrode 1, a second electrode 2 and an insulating isolation region 3, wherein the insulating isolation region 3 is arranged between the first electrode 1 and the second electrode 2; the first electrode 1 is provided with a first convex part 11 and a second convex part 12 which are positioned at the same end, the second electrode 2 is provided with a third convex part 21, and the first convex part 11 and the second convex part 12 of the first electrode 1 are arranged in a staggered way with the third convex part 21 of the second electrode 2; the first sidewall 31 of the isolation region 3 has a first concave portion and a second concave portion, the second sidewall 32 has a third concave portion 21, the first concave portion is matched with the first convex portion 11, the second concave portion is matched with the second convex portion 12, and the third concave portion is matched with the third convex portion 21, so that the combination surface of the isolation region 3 and the first electrode 1 and the second electrode 2 is a concave-convex interdigital structure.

Compared with the prior art, the first electrode 1 of the package substrate of the present invention has the first convex portion 11 and the second convex portion 12 located at the same end, the second electrode 2 has the third convex portion 21, and the first convex portion 11 and the second convex portion 12 of the first electrode 1 and the third convex portion 21 of the second electrode 2 are alternately arranged; moreover, the first sidewall 31 of the insulating isolation region 3 disposed between the first electrode 1 and the second electrode 2 has a first concave portion completely matching with the first convex portion 11, and a second concave portion completely matching with the second convex portion 12, and the second sidewall 32 has a third concave portion completely matching with the third convex portion 21, so that the joint surfaces of the first electrode 1, the second electrode 2 and the insulating isolation region 3 have a concave-convex interdigital structure, the area of the joint surface is increased, and the first electrode 1 and the second electrode 2 are prevented from falling off. Moreover, the whole insulating isolation region 3 is of a concave-convex structure, and the joint of the two side walls of the insulating isolation region 3 and the first electrode 1 and the second electrode 2 is in interdigital combination, so that the routing distance between the first convex part 11 and the second convex part 12 of the first electrode 1 and the third convex part 21 of the second electrode 2 can be effectively shortened, the routing distance between the first convex part 11 and the second convex part 12 and the second electrode 2 can be shortened, further, when the packaging substrate is adopted to manufacture an LED device or an LED module, the span of a lead can be effectively shortened, the problem that the lead is easy to be broken due to overlong aging of the LED device or the LED module is avoided, and the reliability of the LED device or the LED module can be improved. In addition, because the whole insulating isolation region 3 is of a concave-convex interdigital structure, the strength of the insulating isolation region 3 can be improved, and the packaging substrate has higher strength.

Optionally, the first convex portion 11 and the second convex portion 12 in the package substrate are rectangular convex portions, triangular convex portions or semicircular convex portions, so that any one of the first convex portion 11 and the second convex portion 12 identifies the zener die bond region and the other one of the first convex portion 11 and the second convex portion 12 identifies the LED bonding region and faces the LED die bond region; the Zener die bonding area is used for fixing a Zener diode, and the LED routing area is used for fixing a lead of an LED chip; the third convex portion 21 is a matrix convex portion, a triangular convex portion, or a semicircular convex portion to identify a zener wiring region on the second electrode 2. In this embodiment, since the first protrusion 11 and the second protrusion 12 are disposed at the same end of the first electrode 1 and both have a rectangular shape, the zener die attach region, the LED bonding region, and the LED die attach region can be identified by the shapes of the first protrusion 11 and the second protrusion 12, so that the die attach positions of the zener diode and the LED chip can be accurately located before the zener diode is fixed on the package substrate, and the zener diode and the LED chip are prevented from shifting during die attach; in addition, since the second electrode 2 of the package substrate is provided with the third convex portion 21, and the third convex portion 21 is rectangular, the third convex portion 21 can mark a zener bonding area, wherein the zener bonding area is used for fixing a lead of a zener diode, and the LED die bonding area is used for fixing an LED chip; the cache line region can thus be recognized by the third projection 21 and its shape. Therefore, the first electrode 1 and the second electrode 2 can effectively prevent the Zener diode and the LED chip on the packaging substrate from deviating, and improve the light-color consistency of the packaging device. In addition, the first electrode 1 is provided with the Zener die bonding area and the LED wire bonding area, and the second electrode 2 is provided with the Zener wire bonding area and the LED die bonding area, so that the die bonding positions of the Zener diode and the LED chip and the wire bonding positions of the Zener diode and the LED chip are reserved on the packaging substrate, the overlong lead of the Zener diode and the LED chip can be effectively avoided, and the reliability of the lead is further improved.

It is understood that the above embodiment is described by taking the first, second and third protrusions 11, 12 and 21 as rectangular protrusions, and the first, second and third protrusions 11, 12 and 21 are similar to the above embodiment and are triangular or semicircular protrusions, which is not repeated herein.

Optionally, the first protruding portion 11 of the first electrode 1 includes at least one, the second protruding portion 12 includes at least one, the third protruding portion 21 of the second electrode 2 includes at least one, and the at least one first protruding portion 11 and the at least one second protruding portion 12 of the first electrode 1 are alternately arranged with the at least one third protruding portion 21 of the second electrode 2 at intervals to form a concave-convex interdigital structure with the insulating isolation region 3. The above-described embodiment is only an embodiment in which the first electrode 1 has one first protrusion 11 and one second protrusion 12, and the second electrode 2 has one third protrusion 21, and it is understood that, in order to further increase the area of the bonding surface or reserve the mounting positions of a plurality of LED chips and zener diodes, the first protrusion 11 and the second protrusion 12 of the first electrode 1 may be two or more, and the third protrusion 21 of the second electrode 2 may be two or more.

Preferably, in order to facilitate easy operation of the die attach process, the area of the zener die attach region in the package substrate is equal to or slightly larger than the area of the zener diode, and the area of the LED die attach region is larger than the area of the LED chip.

As shown in fig. 3 and 4, the LED device includes: a first reflector cup 41 and the package substrate, wherein the first reflector cup 41 is arranged around the outer edge of the package substrate; a Zener diode 5 is fixed on the Zener die bonding area, the anode of the Zener diode 5 is connected with the Zener routing area through a lead, and the cathode of the Zener diode 5 is connected with the first electrode 1; an LED chip 6 is fixed on the LED die bonding area, the anode of the LED chip 6 is connected with the LED routing area through a lead, and the cathode is connected with the second electrode 2; a fluorescent sheet 7 is adhered on the LED chip 6, and the area of the fluorescent sheet 7 is larger than or equal to the area of the light emitting surface of the LED chip 6; the first reflecting cup 41 is filled with a resin body 8, the resin body 8 surrounds the LED chip 6 and the fluorescent sheet 7, and the upper surface of the resin body 8 is flush with the upper surface of the fluorescent sheet 7.

Preferably, in the LED device, the LED chip 6 is a high power LED chip, the high power LED chip may be a vertical chip or a normal chip, and one pole of the LED chip may be connected to the first electrode 1 through a plurality of leads, so as to reduce the current density of a single lead.

Please refer to fig. 5, which is a schematic structural diagram of an LED module according to the present invention.

As shown in fig. 5, the LED module includes: the second reflection cup 42 is arranged around the outer edges of the two packaging substrates, and the two packaging substrates are arranged in parallel and connected through the insulation dam 9; the two package substrates comprise a 1 st package substrate and a 2 nd package substrate; a first zener diode 51 and a second zener diode 52 are fixed to the first convex portion 111 of the 1 st package substrate and the second convex portion 122 of the 2 nd package substrate, respectively, the first zener diode 51 is connected to the third convex portion 211 of the 1 st package substrate by a wire, and the second zener diode 122 is connected to the third convex portion 212 of the 2 nd package substrate by a wire; and a first LED chip 61 and a second LED chip 62 are respectively fixed on the second electrode of the 1 st packaging substrate and the second electrode of the 2 nd packaging substrate, the first LED chip 61 is opposite to and connected with the second convex part 121 of the 1 st packaging substrate, and the second LED chip 62 is opposite to and connected with the first convex part 112 of the 2 nd packaging substrate through a lead.

Compared with the prior art, the LED module can effectively shorten the routing distance of the Zener diode and the LED chip due to the adopted packaging substrate, and the packaging substrate is reserved with the die bonding positions of the Zener diode and the LED chip, so that the routing distance and the lead span can be further shortened, and the reliability of the LED module is improved; on the other hand, because the first LED chip 61 is fixed to the second electrode of the 1 st package substrate, and the second LED chip 62 is fixed to the second electrode of the 2 nd package substrate, and the first LED chip 61 and the second protrusion 121 of the 1 st package substrate are arranged right opposite to each other, and the second LED chip 62 and the first protrusion 112 of the 2 nd package substrate are arranged right opposite to each other, the distance between the first LED chip 61 and the second LED chip 62 is shortened, and further the light mixing distance between the first LED chip 61 and the second LED chip 62 is shortened, so that ultra-short-distance light mixing can be effectively realized.

As shown in fig. 6 to 7, in this embodiment, a first fluorescent sheet 71 and a second fluorescent sheet 72 are respectively disposed on the upper surfaces of the first LED chip 61 and the second LED chip 62, the area of the first fluorescent sheet 71 is greater than or equal to the area of the light emitting surface of the first LED chip 61, the area of the second fluorescent sheet 72 is greater than or equal to the area of the light emitting surface of the second LED chip 62, and the light emitted by the first LED chip 61 and the second LED chip 62 can be efficiently converted, so as to improve the light emitting efficiency of the LED module; in addition, the resin body 8 filled in the second reflective cup 42 covers the 1 st package substrate, the 2 nd package substrate and the insulation dam 9 located in the second reflective cup 42, so that the first electrode, the second electrode and the insulation isolation region 301 of the 1 st package substrate, the first electrode, the second electrode and the insulation isolation region 302 of the 2 nd package substrate, the side walls of the insulation dam 9, the first fluorescent sheet 71 and the second fluorescent sheet 72 are all connected with the resin body 8, the strength of the LED module can be increased, and the separation of the first electrode and the second electrode of the 1 st package substrate and the 2 nd package substrate can be further avoided.

The utility model also provides another kind of LED module, include: the third reflection cup is arranged around the outer edges of the N packaging substrates; the N packaging substrates are arranged in parallel and connected through an insulation dam; n is an integer and is not less than 3; zener diodes are fixed on the first electrodes of the 2 nd to the (N-1) th packaging substrates in the N packaging substrates, each Zener diode is positioned on any one of the first convex part and the second convex part of the corresponding packaging substrate, and each Zener diode is connected with the third convex part of the corresponding packaging substrate through a lead; LED chips are fixed in the middle of the second electrodes of the 2 nd packaging substrate to the (N-1) th packaging substrate, and each LED chip is connected with the other one of the first convex part and the second convex part of the corresponding packaging substrate through a lead; a first zener diode and a second zener diode are respectively fixed on the first convex portion of the 1 st package substrate and the second convex portion of the nth package substrate of the N package substrates, the first zener diode is connected with the third convex portion of the 1 st package substrate through a lead, and the second zener diode is connected with the third convex portion of the nth package substrate through a lead; and a first LED chip and a second LED chip are respectively fixed on the second electrode of the 1 st packaging substrate and the second electrode of the Nth packaging substrate, the first LED chip is arranged opposite to the second convex part of the 1 st packaging substrate and is connected with the second convex part of the Nth packaging substrate through a lead, and the second LED chip is arranged opposite to the first convex part of the Nth packaging substrate and is connected with the first convex part of the Nth packaging substrate through a lead.

Next, the structure of the LED module will be described with N being 3 as an example.

Please refer to fig. 8, which is a schematic structural diagram of another LED module according to an embodiment of the present invention.

This LED module includes: the third reflecting cup 43 and 3 packaging substrates, the third reflecting cup 43 is arranged around the outer edges of the 3 packaging substrates; the 3 packaging substrates are arranged in parallel and connected through an insulating dam 9; a first zener diode 51, a second zener diode 52, and a third zener diode 53 are respectively fixed on the first electrodes of the 1 st to 3 rd package substrates, wherein the first zener diode 51 is located on the first convex portion 111 of the 1 st package substrate first electrode, the second zener diode 52 is located on any one of the first convex portion 112 and the second convex portion 122 of the 2 nd package substrate first electrode, and the third zener diode 53 is located on the second convex portion 123 of the 3 rd package substrate first electrode; the first electrodes of the 1 st to 3 rd packaging substrates are respectively fixed with a first LED chip 61, a second LED chip 62 and a third LED chip 63, wherein the first LED chip 61 is opposite to the second convex part 121 of the 1 st packaging substrate first electrode and is connected with the second LED chip through a lead, the second LED chip 62 is positioned in the middle of the 2 nd packaging substrate second electrode and is connected with the other one of the first convex part 112 and the second convex part 122 of the 2 nd packaging substrate first electrode through a lead, and the third LED chip 63 is opposite to the first convex part 113 of the 3 rd packaging substrate first electrode and is connected with the first LED chip through a lead. In this embodiment, the first zener diode 51, the second zener diode 52, the third zener diode 53, the first LED chip 61, the second LED chip 62, and the third LED chip 63 are packaged and arranged, so that the distance between the first LED chip 61, the second LED chip 62, and the third LED chip 63 in the LED module can be shortened, the light mixing distance can be further shortened, and ultra-short-distance light mixing can be realized.

In the above embodiments, the LED chip is a vertical type LED chip or a forward type LED chip. When the LED chip is a vertical LED chip, the cathode of the LED chip is connected with the second electrode through the silver colloid or the soldering flux; when the LED chip is a forward-mounted LED chip, the LED chip is fixed on the second electrode through the solid crystal glue, and the cathode of the LED chip is connected with the second electrode through the lead. It is understood that the zener diode in the above embodiments is a vertical zener diode, and the cathode of the zener diode is connected to the first electrode through silver paste.

Preferably, the resin body in the above embodiment includes one or a combination of TiO2, SiO2, BaSO4, and ZnO filler particles.

Preferably, the second isolation region and the isolation dam in the above embodiments are injection molded using a polyester PCT, an epoxy injection molding compound, or a sheet molding compound.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any form, so that any simple modification, equivalent change and modification made by the technical entity of the present invention to the above embodiments without departing from the technical solution of the present invention all fall within the scope of the technical solution of the present invention.

Claims

1. A package substrate, comprising: a first electrode, a second electrode, and an insulating isolation region disposed between the first electrode and the second electrode;

the first electrode is provided with a first convex part and a second convex part which are positioned at the same end, the second electrode is provided with a third convex part, and the first convex part and the second convex part of the first electrode and the third convex part of the second electrode are arranged in a staggered mode at intervals;

the first side wall of the insulating isolation region is provided with a first concave part and a second concave part, the second side wall is provided with a third concave part, the first concave part is matched with the first convex part, the second concave part is matched with the second convex part, and the third concave part is matched with the third convex part, so that the joint surface of the insulating isolation region and the first electrode and the joint surface of the insulating isolation region and the second electrode are of a concave-convex interdigital structure.

2. The package substrate according to claim 1, wherein the first convex portion and the second convex portion are each a rectangular convex portion, a triangular convex portion, or a semicircular convex portion, such that either one of the first convex portion and the second convex portion identifies a zener bonding area and the other one of the first convex portion and the second convex portion identifies an LED bonding area and faces the LED bonding area, and the third convex portion is a rectangular convex portion, a triangular convex portion, or a semicircular convex portion to identify a zener bonding area on the second electrode.

3. The package substrate of claim 2, wherein the area of the zener die bond region is equal to or slightly larger than the area of the zener diode, and the area of the LED die bond region is larger than the area of the LED chip.

4. An LED device, comprising: a first reflector cup and a package substrate of claim 2, said first reflector cup being disposed around an outer edge of said package substrate;

a Zener diode is fixed on the Zener die bonding area and is connected with the Zener routing area through a lead;

5. The LED device of claim 4, wherein a fluorescent sheet is adhered to the LED chip, and the area of the fluorescent sheet is greater than or equal to the area of the light emitting surface of the LED chip;

6. The LED device according to claim 5, wherein the resin body includes one of TiO2, SiO2, BaSO4, and ZnO filler particles.

7. The LED device of claim 4, wherein the LED chip is connected to the first electrode by a plurality of leads to reduce current density of a single lead.

8. An LED module, comprising: a second reflective cup and two package substrates according to claim 1, wherein the second reflective cup is arranged around the outer edges of the two package substrates, and the two package substrates are arranged in parallel and connected through an insulating dam; the two packaging substrates comprise a 1 st packaging substrate and a 2 nd packaging substrate;

the second electrode of the 1 st packaging substrate and the second electrode of the 2 nd packaging substrate are respectively fixed with a first LED chip and a second LED chip, the first LED chip and the second convex part of the 1 st packaging substrate are opposite to each other and are connected, and the second LED chip and the first convex part of the 2 nd packaging substrate are opposite to each other and are connected through a lead.

9. An LED module, comprising N package substrates according to claim 1 and a third reflective cup, wherein the third reflective cup is disposed around the outer edges of the N package substrates; the N packaging substrates are arranged in parallel and connected through an insulation dam; n is an integer and is not less than 3;