CN215061447U - LED lamp string - Google Patents

Abstract

The utility model discloses a LED lamp string, include: a wire including at least one positive wire, at least one negative wire, and at least one insulating layer arranged side by side; the LEDs are arranged on the lead at intervals along the axial direction of the lead at set intervals; the lamp bead comprises at least one patch type light-emitting module and a packaging colloid covering the surface of the at least one patch type light-emitting module, the patch type light-emitting module comprises at least one light-emitting chip, and the anode and the cathode of the at least one light-emitting chip are respectively and electrically connected with at least one anode wire and at least one cathode wire. The utility model discloses a LED lamp cluster because the direct encapsulation of SMD light-emitting module has saved the base plate on the wire, has only one deck encapsulation colloid moreover, greatly reduced the volume of lamp pearl to the volume and the weight of LED lamp cluster greatly have but also improved LED production efficiency, have reduced manufacturing cost.

Description

LED lamp string

Technical Field

The utility model relates to the field of lighting technology, especially, relate to a LED lamp cluster.

Background

The LED lamp has been widely used because of its advantages of small size, low power consumption, long service life, high brightness, low heat, environmental protection, etc. With the development of LED technology, LED lamps are more and more in form, and LED lamp strings in LED products are not only applied to scene-response decoration of various festivals such as Christmas and the like, but also applied to home decoration, urban lighting engineering and various entertainment places. LED lamps have incomparable advantages with conventional incandescent lamps: the colorful color-changing lamp has the advantages that the colorful color-changing lamp is gorgeous, various changes of colors can be realized, the energy consumption is effectively reduced, the formed colorful color-changing lamp not only can play a role in illumination, but also has a decorative effect, and the festive atmosphere is added to different programs and different occasions.

The existing LED lamp string generally comprises more than two wires arranged side by side, a plurality of lamp beads attached to the wires at certain intervals along the length direction of the wires, and a packaging colloid for packaging the lamp beads inside the lamp beads. When an existing LED lamp string is produced, one or more light-emitting chips are welded on the same substrate by a lamp bead manufacturer to form a basic light-emitting module, and then the light-emitting module is packaged in a packaging colloid to form an LED lamp bead. Then the LED lamp string manufacturer welds the lamp bead on the lead wire, and then encapsulates in the encapsulation colloid. Because the LED lamp beads are provided with the substrates and are wrapped by the two layers of packaging colloids, the finally formed lamp beads are large in size, the LED lamp string is large in size, and the requirement of a miniaturized application scene cannot be met; moreover, the production cost of the lamp beads is high, the production efficiency is low, and the cost of the whole LED lamp string is high.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned prior art current situation, the utility model aims to solve the technical problem that a LED lamp cluster small, with low costs, light in weight is provided.

In order to solve the technical problem, the utility model provides a LED lamp string, include: the lead comprises at least one positive lead, at least one negative lead and at least one insulating layer, wherein the positive lead and the negative lead are arranged side by side; the LEDs are arranged on the lead at intervals along the axial direction of the lead at set intervals; the lamp pearl includes that at least one SMD sends out optical module and covers at least one SMD send out optical module's encapsulation colloid on the surface, SMD send out optical module pastes the dress on the wire, SMD send out optical module includes at least one and sends out optical chip, at least one send out optical chip's positive pole and negative pole respectively with at least one anodal wire and at least one negative pole wire electric connection.

The utility model discloses a LED lamp cluster because the direct encapsulation of SMD luminous module has saved the base plate on the wire, has only one deck encapsulation colloid moreover, greatly reduced the volume of lamp pearl to the volume and the weight of LED lamp cluster have greatly promoted LED lamp cluster quality, have extended the use occasion of LED lamp cluster. In addition, an LED packaging flow is cancelled, the production process of the LED lamp string is simplified, the production efficiency of the LED lamp string is greatly improved, and therefore the production cost is reduced.

In one embodiment, the surface mount type light emitting module further includes an integrated circuit chip for driving at least one of the light emitting chips, the top surface of the integrated circuit chip is provided with at least one output terminal and at least one input terminal, the bottom surface of the integrated circuit chip is provided with a positive electrode pad and a negative electrode pad, the at least one light emitting chip is inversely mounted on the top surface of the integrated circuit chip, the positive electrode and the negative electrode of the at least one light emitting chip are electrically connected with the at least one output terminal and the at least one input terminal of the top surface of the integrated circuit chip, and the positive electrode pad and the negative electrode pad of the integrated circuit chip are respectively welded with the positive electrode lead and the negative electrode lead.

In one embodiment, the bottom surface of the integrated circuit chip is further provided with a control signal input pad and a control signal output pad, the wire further includes at least one control signal line, the control signal line is cut at a position corresponding to the surface mount type light emitting module to form a signal input end and a signal output end, the signal input end and the signal output end are respectively soldered to the control signal input pad and the control signal output pad, or the wire further includes at least one control signal input line and at least one control signal output line, and the control signal input pad and the control signal output pad are respectively soldered to the control signal input line and the control signal output line.

In one embodiment, at least one of said positive conductor, at least one of said negative conductor and at least one of said insulating layers are combined together to form a composite conductor core.

In one embodiment, at least one of the positive electrode lead and at least one of the negative electrode lead are arranged in a direction perpendicular to a central axis direction of the composite lead core.

In one embodiment, at least one of the surface mount type light emitting modules of the lamp bead is located on the same side or opposite sides of the composite wire core.

In one embodiment, at least one of the positive electrode lead and at least one of the negative electrode lead are arranged along a circumferential direction centered on a central axis of the composite lead core.

In one embodiment, the lamp bead includes more than two of the patch type light emitting modules, and the more than two of the patch type light emitting modules are arranged along a circumferential direction with the central axis as a center.

In one embodiment, at least one of the positive electrode lead and at least one of the negative electrode lead are coaxially arranged in order from the inside to the outside from the central axis of the composite lead core.

In one embodiment, the composite wire core on one side or two sides of the central axis is cut along the direction of the central axis at a position corresponding to the position of the lamp bead to expose the positive wire and the negative wire to form a first welding part and a second welding part, and the positive welding spot and the negative welding spot of the surface mount type light emitting module are electrically connected with the first welding part and the second welding part respectively.

In one embodiment, the cross section of the composite wire core is circular, oval or polygonal, and a groove matched with the surface shape of the wire is arranged on the surface of the patch type light-emitting module facing the wire.

In one embodiment, the wire further comprises an insulating sheath coated on a surface of the composite wire core.

The advantageous effects of the additional features of the present invention will be explained in the detailed description of the preferred embodiments of the present description.

Drawings

Fig. 1 is an isometric view of an LED light string according to embodiment 1 of the present invention;

FIG. 2 is a front view of the LED light string shown in FIG. 1;

FIG. 3 is a cross-sectional view taken along line C-C of FIG. 1;

FIG. 4 is a schematic structural diagram of a surface mount type light-emitting module of the LED light string shown in FIG. 1;

FIG. 5 is a circuit diagram of a surface mount light module of the LED light string shown in FIG. 1;

fig. 6 is an isometric view of an LED light string according to embodiment 2 of the present invention;

fig. 7 is a cross-sectional view of the LED light string according to embodiment 3 of the present invention without the encapsulant;

fig. 8 is a cross-sectional view of the LED light string according to embodiment 4 of the present invention without the encapsulant;

fig. 9 is a cross-sectional view of the LED light string according to embodiment 5 of the present invention without the encapsulant;

fig. 10 is a cross-sectional view of the LED light string according to embodiment 6 of the present invention without the encapsulant;

fig. 11 is an isometric view of an LED light string according to embodiment 7 of the present invention;

fig. 12 is a cross-sectional view of the LED light string according to embodiment 7 of the present invention without the encapsulant;

fig. 13 is a cross-sectional view of the LED light string according to embodiment 8 of the present invention without the encapsulant;

fig. 14 is a cross-sectional view of the LED light string according to embodiment 9 of the present invention without the encapsulant;

fig. 15 is a cross-sectional view of the LED light string according to embodiment 10 of the present invention without the encapsulant;

fig. 16 is a flowchart of a method for producing LED light strings according to an embodiment of the present invention.

Description of reference numerals: 10. a wire; 11. a composite wire core; 111. a positive electrode lead; 112. a negative electrode lead; 113. an insulating layer; 114. a positive electrode welding part; 115. a negative electrode welding part; 12. insulating a wire sheath; 20. a lamp bead; 21. a surface mount type light emitting module; 211. an integrated circuit chip; 211a, a positive electrode welding spot; 211b, negative welding spots; 211c, an output end; 211d, an input end; 211e, a groove; 212. a light emitting chip; 212a, a positive electrode; 212b, a negative electrode; 22. and (5) encapsulating the colloid.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the features in the following embodiments and examples may be combined with each other without conflict.

In this document, the terms front, back, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are used for clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.

Fig. 1 is an isometric view of an LED light string according to embodiment 1 of the present invention, fig. 2 is a front view of the LED light string shown in fig. 1, and fig. 3 is a cross-sectional view taken along line C-C of fig. 1. As shown in fig. 1-3, the LED light string of this embodiment 1 includes a conductive wire 10 and a plurality of beads 20 disposed on the conductive wire 10 at intervals along an axial direction of the conductive wire 10.

The lead 10 includes a composite lead core 11, the composite lead core 11 is formed by combining at least one positive lead 111 extending along the central axis X, at least one negative lead 112 extending along the central axis X, and an insulating layer 113 located therebetween, and the at least one positive lead 111 and the at least one negative lead 112 are arranged in a direction perpendicular to the central axis X (i.e., a direction indicated by an arrow a in fig. 3). In this embodiment, the number of the positive electrode lead 111, the negative electrode lead 112, and the insulating layer 113 is one, the cross section of the insulating layer 113 is in a shape of a straight line, the cross sections of the positive electrode lead 111 and the negative electrode lead 112 are approximately semicircular, and the positive electrode lead 111 and the negative electrode lead 112 are oppositely disposed on both sides of the insulating layer 113, so that the cross section of the composite lead core 11 is circular. Of course, the cross-sectional shape of the composite wire core 11 may also be polygonal or rectangular.

The material of the positive electrode lead 111 and the negative electrode lead 112 may be Cu, Al, Ag or an alloy thereof, the material of the insulating layer 113 may be a nonmetal or a metal oxide, and the metal oxide may be an oxide of one or more metal elements of Ni, Nb, Cr, Fe, Al, Zr, Ti, V, W, Mo, and Cu.

Preferably, in order to prevent the positive electrode lead 111 and the negative electrode lead 112 from contacting other conductive objects to cause leakage, the lead 10 in this embodiment further includes an insulating sheath 12 covering part or all of the surface of the composite lead core 11. The material of the insulated wire sheath 12 can be insulated paint or insulated plastic. In the embodiment, since the two conductive layers are separated from each other by the insulating layer 113, short circuit does not occur between the two conductive layers, and therefore, the insulating wire sheath 12 can be omitted in some places where the requirement for leakage current is not high.

As shown in fig. 4, each of the lamp beads 20 includes at least one surface mount type light emitting module 21 and an encapsulant 22, the surface mount type light emitting module 21 includes at least one light emitting chip 212 and an integrated circuit chip 211 for driving at least one of the light emitting chips 212, the top surface of the integrated circuit chip 211 is provided with at least one output terminal 211c and at least one input terminal 211d, the bottom surface of the integrated circuit chip 211 is provided with a positive electrode pad 211a and a negative electrode pad 211b, at least one of the light emitting chips 212 is upside down mounted on the top surface of the integrated circuit chip 211, the positive electrode pad 212a and the negative electrode pad 211bb of at least one of the light emitting chips 212 are electrically connected with at least one of the output terminals 211c and at least one of the input terminals 211d respectively, the positive electrode pad 211a and the negative electrode pad 211b of the ic chip 211 are respectively welded to the positive electrode lead and the negative electrode lead. Preferably, the cross section of the composite wire core is circular, oval or polygonal, and a groove 211e matched with the surface shape of the wire is arranged on the surface of the patch type light emitting module 21 facing the wire, so that the patch type light emitting module 21 and the composite wire core 11 are tightly attached together, and the volume of the lamp bead is smaller.

Fig. 5 is a circuit diagram of the surface mount type light emitting module 21 of the LED light string in this embodiment. As shown in fig. 5, the surface mount type light emitting module 21 in the embodiment has three light emitting chips 212, wherein the positive electrodes 212a of the three light emitting chips 212 are electrically connected to three output terminals 211c of the integrated circuit chip 211, respectively, and the negative electrode pads 211bb of the three light emitting chips 212 are electrically connected to three input terminals 211d of the integrated circuit chip 211, respectively. The three light emitting chips 212 may be the same color or different colors. Of course, the number of the light emitting chips 212 may be one, or other numbers.

The utility model discloses a LED lamp cluster because the direct encapsulation of SMD light-emitting module 21 has saved the base plate on the wire, has only one deck encapsulation colloid moreover, greatly reduced the volume of lamp pearl to the volume and the weight of LED lamp cluster have greatly promoted LED lamp cluster quality, have extended the use occasion of LED lamp cluster. In addition, an LED packaging flow is cancelled, the production process of the LED is simplified, the production efficiency of the LED is greatly improved, and therefore the production cost is reduced. In addition, through directly encapsulating control chip in the lamp pearl, reduce the product technology degree of difficulty in production, reduce the required extra space of independent external control chip in volumetric, satisfied the controllable full-color control ability of single-point in the color.

A carrier signal processing module is arranged in the integrated circuit chip 211, and a control signal of the integrated circuit chip 211 is transmitted in two modes, namely, a waveform is loaded on the positive lead 111 and the negative lead 112 to transmit signals, so that the power supply and the signals are transmitted in the same line. In another mode, the insulating layer 113 is made of a metal oxide insulating material, and a waveform is loaded on the insulating layer 113 to achieve the purpose of signal transmission.

In another embodiment, the bottom surface of the integrated circuit chip 211 is provided with a control signal input pad (not shown) and a control signal output pad (not shown), the conductive wire further includes at least one control signal line (not shown), the control signal line is cut at a position corresponding to the patch type light emitting module 21 to form a signal input end 211d and a signal output end 211c, and the signal input end 211d and the signal output end 211c are respectively soldered to the control signal input pad and the control signal output pad. Or, the wire further comprises at least one control signal input line and at least one control signal output line, and the control signal input welding point and the control signal output welding point are respectively welded with the control signal input line and the control signal output line.

Alternatively, the surface mount type light emitting module 21 includes a light emitting chip 212, and the light emitting chip 212 is directly packaged on the wire.

In this embodiment, each lamp bead 20 includes a surface mount type light emitting module 21, the surface mount type light emitting module 21 is located on one side of the composite lead core 11, and the positive electrode and the negative electrode of the surface mount type light emitting module 21 are electrically connected with the positive electrode lead 111 and the negative electrode lead 112 through laser welding respectively.

The encapsulant 22 may be a UV glue or a general curing glue, and the cross-sectional profile of the encapsulant 22 may be circular, oval, square, etc.

In the LED lamp string in the embodiment, one composite wire is used, and the surface mount type light emitting module 21 is mounted on the composite wire, so that the number of the wires is reduced, and the product cost is reduced; and the wire adopts composite wire, and composite wire compares with conventional wire, has light in weight, small advantage, has promoted LED lamp cluster quality, has expanded LED lamp cluster's use occasion.

Preferably, the LED light string further includes a plurality of partially or completely transparent or translucent decoration pieces (not shown in the figure), and the plurality of decoration pieces are respectively covered outside the plurality of lamp beads. The decorative part can increase the beauty of the product and protect the lamp beads. The decoration part can be directly injection-molded with the lamp string to be integrally formed, or the LED lamp string is firstly produced and then a plurality of decoration parts are assembled with the LED lamp string.

Fig. 6 is a perspective view of an LED light string in embodiment 2 of the present invention. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 1, except that: each lamp bead 20 comprises two or more patch-type light-emitting modules 21, the two or more patch-type light-emitting modules 21 are positioned at the same side of the direction of the composite lead core 11, and the directions of the positive pole and the negative pole of the two patch-type light-emitting modules 21 are opposite. In this way, when the power is supplied in the forward direction (i.e., the first conductor layer 111 is connected to the positive electrode of the power supply, and the second conductor layer 112 is connected to the negative electrode of the power supply), the patch type LED lighting element 21 positioned on the left side emits light, and when the power is supplied in the reverse direction (i.e., the first conductor layer 111 is connected to the negative electrode of the power supply, and the second conductor layer 112 is connected to the positive electrode of the power supply), the patch type LED lighting element 21 positioned on the right side emits light, and the patch type LED lighting element 21 positioned on the left side does not emit light.

Fig. 7 is a cross-sectional view of the LED light string according to embodiment 3 of the present invention without the encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 1, except that: every lamp pearl 20 in this embodiment all includes two SMD light emitting module 21, and two SMD light emitting module 21 are located the both sides of compound wire core 11's direction respectively, can increase LED's luminous area like this, improve lamp pearl 20's luminance, but also can improve the utilization ratio of wire. In this embodiment, the polarities of the two patch-type light-emitting modules 21 in the same lamp bead 20 are the same, that is, the anodes of the two patch-type light-emitting modules 21 are electrically connected to the anode wire 111, and the cathodes of the two patch-type light-emitting modules 21 are electrically connected to the cathode wire 112. As an alternative scheme, the polarities of the two patch light emitting modules 21 in the same lamp bead 20 may also be opposite, that is, the positive electrode of one patch light emitting module 21 is electrically connected to the positive electrode lead 111, the negative electrode is electrically connected to the negative electrode lead 112, the positive electrode of the other patch light emitting module 21 is electrically connected to the negative electrode lead 112, and the negative electrode is electrically connected to the positive electrode lead 111.

Fig. 8 is a cross-sectional view of the LED light string according to embodiment 4 of the present invention without the encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 3, except that: the cross section of the composite lead core 11 in this embodiment is rectangular, the composite lead core 11 is formed by combining one positive lead 111, two negative leads 112, and an insulating layer 113 therebetween, and the one positive lead 111 and the two negative leads 112 are arranged along a direction perpendicular to the central axis X (i.e., a direction indicated by an arrow B in fig. 8). Each of the lamp beads 20 includes two surface mount type LED light emitting members 21, the positive electrode solder joint 211a (or the negative electrode solder joint 211b) of the two surface mount type LED light emitting members 21 is electrically connected to the first conductive layer 111, and the negative electrode solder joint 211b (or the positive electrode solder joint 211a) of the two surface mount type LED light emitting members 21 is electrically connected to the two second conductive layers 112 respectively. In addition, the colors of the two patch LED lighting members 21 may be set to be different.

Fig. 9 is a cross-sectional view of the LED light string according to embodiment 5 without the encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 2, except that: at least one positive electrode lead 111 and at least one negative electrode lead 112 are arranged along a circumferential direction centered on the central axis X. As an example, the cross section of the composite lead core 11 is circular, the number of the positive lead 111 and the negative lead 112 is two, the cross sections of the positive lead 111 and the negative lead 112 are 90-degree sectors, and the cross section of the insulating layer 113 is in a cross shape. Each lamp bead 20 includes two patch type light emitting modules 21, the two patch type light emitting modules 21 are arranged in a circumferential direction with a central axis X as a center, an anode and a cathode of one of the patch type light emitting modules 21 are welded with one anode lead 111 and one anode lead 111 respectively, and an anode and a cathode of the other patch type light emitting module 21 are welded with the other anode lead 111 and the other anode lead 111 respectively. Compared with the embodiment 2, the LED lamp string of the present embodiment can realize independent control of the two surface mount type light emitting modules 21 in the lamp beads 20 under the same diameter.

Fig. 10 is a cross-sectional view of the LED light string according to embodiment 6 of the present invention without the encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 4, except that: the polarities of the positive electrodes and the negative electrodes of the two patch type light emitting modules 21 are opposite, when the power is conducted in the forward direction, one patch type light emitting module 21 emits light, the other patch type light emitting module 21 does not emit light, when the power is conducted in the reverse direction, one patch type light emitting module 21 does not emit light, and the other patch type light emitting module 21 emits light, so that the electrodeless effect is achieved.

Fig. 11 is an isometric view of a single wire LED light string according to embodiment 7 of the present invention, and fig. 12 is a cross-sectional view of the single wire LED light string without encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 1, except that: the positive electrode lead 111 and the negative electrode lead 112 are coaxially arranged in this order from the center axis X from the inside to the outside. The position of the composite conductor core 11 corresponding to the position of the lamp bead 20 on one side or both sides of the central axis X is cut along the central axis X to expose the positive conductor 111 and the negative conductor 112 to form a positive welding portion 114 and a negative welding portion 115, and the positive electrode and the negative electrode of the surface mount type light emitting module 21 are electrically connected with the positive welding portion 114 and the negative welding portion 115 respectively. In this embodiment, the number of the positive wire 111, the negative wire 112 and the insulating layer 113 is one, the positive wire 111 is located at the center, the insulating layer 113 and the negative wire 112 are sequentially coated on the positive wire 111, the position of the composite wire core 11 on one side of the central axis X corresponding to the position of the lamp bead 20 is cut along the central axis X, so as to expose the positive wire 111 and the negative wire 112 to form a positive welding portion 114 and a negative welding portion 115, the lamp bead 20 includes a surface mount type light emitting module 21, and the positive electrode and the negative electrode of the surface mount type light emitting module 21 are respectively welded with the positive welding portion 114 and the negative welding portion 115.

Fig. 13 is a cross-sectional view of the LED light string according to embodiment 8 without the encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 6, except that: in this embodiment, the number of the positive wires 111 and the insulating layers 113 is two, the number of the negative wires 112 is one, the parts of the composite wire core 11 at the two sides of the central axis X corresponding to the position of the lamp bead 20 are cut along the central axis X, so as to expose the anode lead 111 and the cathode lead 112 to form an anode welding part 114 and a cathode welding part 115, the lamp bead 20 includes two patch type light emitting modules 21, the two patch type light emitting modules 21 are respectively located at two sides of the composite lead core 11, the anode of one patch type light emitting module 21 is electrically connected with the anode welding part 114 of the middle anode lead 111, the negative electrode of the patch type light emitting module 21 is electrically connected to the negative electrode welding portion 115 of the negative electrode lead 112, the positive electrode of the other patch type light emitting module 21 is electrically connected to the positive electrode welding portion 114 of the external positive electrode lead 111, the negative electrode of the surface mount type light emitting module 21 is electrically connected to the negative electrode soldering portion 115 of the negative electrode lead 112. (by way of example only, if 9 layers of round wire are used later, the bead can be welded in a staggered manner according to the principle, without limiting the number of layers of the multi-layer wire)

Fig. 14 is a cross-sectional view of the LED light string according to embodiment 9 of the present invention without the encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 6, except that: the cross-section of the composite wire core 11 is rectangular.

Fig. 15 is a cross-sectional view of the LED light string according to embodiment 10 of the present invention without the encapsulant 22. As shown in the drawings, the LED light string in this embodiment has substantially the same structure as the LED light string in embodiment 7, except that: the cross-section of the composite wire core 11 is rectangular. Only provide the example, if later with 9 layers of rectangular wire, can misplace welding lamp pearl according to this principle, do not restrict the lamp pearl number of piles.

In another embodiment of the present invention, a method for producing an LED light string is provided, as shown in fig. 16, the method comprises the following steps:

and step S1, getting on the wire. The wire feeding mechanism comprises a coil rack for placing wire coil raw materials and a tension controller for controlling tension, and the tension controller comprises a plurality of tension wheels.

And step S2, stripping wires. And removing the insulating wire coatings of the positive electrode lead and the negative electrode lead at set intervals to form a positive electrode welding part and a negative electrode welding part respectively. This step is omitted for wires without an insulated sheath.

Step S3, spot welding material: the surfaces of the positive electrode welded portion and the negative electrode welded portion are coated with a welding material. Specifically, the positive electrode welding part and the negative electrode welding part are conveyed to a spot welding material station by a wire feeding mechanism, a spot welding material mechanism is arranged on the spot welding material station, and welding materials are coated on the positive electrode welding part and the negative electrode welding part by the spot welding material mechanism.

Step S4, feeding patch type light emitting module 21: the patch type light-emitting module 21 is placed on the lead wire through a manipulator, so that the positive electrode welding point 211a and the negative electrode welding point 211b of the patch type light-emitting module 21 are respectively opposite to the positive electrode welding part and the negative electrode welding part coated with the welding material.

Step S5, welding: the positive electrode welding point 211a and the negative electrode welding point 211b of the patch type light emitting module 21 are respectively laser-welded with the positive electrode welding part and the negative electrode welding part.

Step S6, welding detection: and detecting the welding quality of the patch type light-emitting module 21. Specifically, the welded patch type light emitting module 21 is conveyed to a welding detection station through a wire feeding mechanism, and the welding quality of the patch type light emitting module 21 is detected through the welding detection mechanism at the welding detection station.

Step S7, packaging: and packaging the surface mount type light-emitting module 21 in a packaging colloid to form a lamp bead. Specifically, the detected surface mount type light emitting module 21 is conveyed to a packaging station through a wire feeding mechanism, and the surface mount type light emitting module 21 is packaged in a packaging colloid to form a lamp bead through a dispensing mechanism at the packaging station. The glue dispensing mechanism comprises a glue dispensing mechanism for dispensing curing glue on the surface mount type light-emitting module 21 and a curing mechanism for curing the curing glue, and the curing glue can be UV glue.

The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention.

Claims (12)

1. An LED light string comprising:

the lead comprises at least one positive lead, at least one negative lead and at least one insulating layer, wherein the positive lead and the negative lead are arranged side by side;

the LEDs are arranged on the lead at intervals along the axial direction of the lead at set intervals;

the LED lamp is characterized in that the lamp bead comprises at least one patch type light-emitting module and at least one packaging colloid covering the surface of the patch type light-emitting module, the patch type light-emitting module is attached to the lead, the patch type light-emitting module comprises at least one light-emitting chip, and the anode and the cathode of the light-emitting chip are respectively connected with the anode lead and the cathode lead in an electrical mode.

2. The LED light string according to claim 1, wherein the surface mount type light emitting module further comprises an integrated circuit chip for driving at least one of the light emitting chips, the top surface of the integrated circuit chip is provided with at least one output terminal and at least one input terminal, the bottom surface of the integrated circuit chip is provided with a positive electrode pad and a negative electrode pad, the at least one light emitting chip is inversely mounted on the top surface of the integrated circuit chip, the positive electrode and the negative electrode of the at least one light emitting chip are electrically connected with the at least one output terminal and the at least one input terminal of the top surface of the integrated circuit chip, and the positive electrode pad and the negative electrode pad of the integrated circuit chip are respectively welded with the positive electrode lead and the negative electrode lead.

3. The LED light string according to claim 2, wherein the bottom surface of the ic chip is further provided with a control signal input pad and a control signal output pad, the wire further comprises at least one control signal line, the control signal line is cut at a position corresponding to the surface mount type light emitting module to form a signal input terminal and a signal output terminal, the signal input terminal and the signal output terminal are respectively soldered to the control signal input pad and the control signal output pad, or the wire further comprises at least one control signal input line and at least one control signal output line, the control signal input pad and the control signal output pad are respectively soldered to the control signal input line and the control signal output line.

4. The LED light string according to any one of claims 1 to 3, wherein at least one of the positive conductors, at least one of the negative conductors and at least one of the insulating layers are combined together to form a composite conductor core.

5. The LED light string of claim 4, wherein at least one of the positive conductors and at least one of the negative conductors are arranged in a direction perpendicular to a central axis of the composite conductor core.

6. The LED light string according to claim 5, wherein at least one of the surface mount light emitting modules of the lamp bead is located on the same side or on opposite sides of the composite wire core.

7. The LED light string of claim 4, wherein at least one of the positive conductors and at least one of the negative conductors are arranged along a circumferential direction centered on a central axis of the composite conductor core.

8. The LED lamp string according to claim 7, wherein the lamp bead comprises more than two patch type light emitting modules, and the more than two patch type light emitting modules are arranged along a circumferential direction with the central axis as a center.

9. The LED light string of claim 4, wherein at least one of the positive wires and at least one of the negative wires are coaxially arranged in an inside-out order from a central axis of the composite wire core.

10. The LED light string of claim 9, wherein a portion of the composite lead core on one or both sides of the central axis corresponding to the position of the bead is cut along the central axis to expose the positive lead and the negative lead to form a first welding portion and a second welding portion, and the positive solder joint and the negative solder joint of the surface mount light emitting module are electrically connected to the first welding portion and the second welding portion, respectively.

11. The LED lamp string according to claim 4, wherein the cross section of the composite wire core is circular, oval or polygonal, and a surface of the patch type light emitting module facing the wire is provided with a groove matching with the surface shape of the wire.

12. The LED light string of claim 4, wherein the wire further comprises an insulating sheath coated over a surface of the composite wire core.

Images