CN217655878U - LED lamp bead and LED lamp strip - Google Patents

Abstract

The application provides an LED lamp bead and an LED lamp strip, wherein the lamp bead comprises an insulating base, a light-emitting component, packaging adhesive and at least four pairs of pins, the light-emitting component comprises a driving chip and a wafer, and the driving chip is used for driving the wafer to emit light; the packaging adhesive covers the light-emitting component; the four pairs of pins are fixed on the insulating seat, each pin comprises a connecting part and a die bonding part, the light emitting assembly is arranged on the die bonding part, and the connecting parts are used for being electrically connected with the wires; the first pin comprises a first die bonding part, and the positive terminal of the driving chip is electrically connected with the first die bonding part; the third pin comprises a third die bonding part, the fourth pin comprises a fourth die bonding part, and the negative end of the driving chip is electrically connected with the fourth die bonding part through a bonding wire; the fifth pin comprises a fifth die bonding part, the sixth pin comprises a sixth die bonding part, the fifth die bonding part is used for transmitting a control signal to the signal input end of the driving chip, and the sixth die bonding part is connected with the signal output end of the driving chip through a bonding wire. This LED lamp pearl can reduce long distance LED lamp pearl and make the degree of difficulty.

Description

LED lamp bead and LED lamp strip

Technical Field

The application relates to the technical field of light emitting diodes, in particular to an LED lamp bead and an LED lamp strip.

Background

Light-Emitting diodes (LEDs) have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, environmental protection, etc., are widely used in the lighting industry, and become one of the most spotlighted products in recent years. For example, a plurality of LED lamp beads are used for manufacturing an LED lamp strip which can also be called an LED lamp string and is used for atmosphere lamps, but in the existing LED lamp strip, a single-color or multi-color LED lamp strip is basically realized by using plug-in LEDs in a series connection mode, but single LED cannot be controlled, and the light-emitting effect is single. Certainly, a power carrier scheme can be adopted at present, but the power carrier scheme is also limited by data loss and the number of cascading points caused by power supply voltage fluctuation, so that the LED lamp strip cannot be cascaded downwards by multiple points in a long distance. Therefore, it is necessary to provide an LED lamp bead, which is convenient for the LED lamp strip to cascade downwards in a long-distance and multi-point manner.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an LED lamp bead and an LED lamp strip, and aims to provide the LED lamp bead suitable for the LED lamp strip with the long-distance multi-point cascade.

In a first aspect, an embodiment of the present application provides an LED lamp bead, the LED lamp bead includes:

an insulating base;

the light-emitting component comprises a driving chip and a wafer, wherein the driving chip is electrically connected with the wafer and is used for driving the wafer to emit light;

the packaging glue covers the light-emitting component;

the four pairs of pins are fixed on the insulating seat and comprise connecting parts and die bonding parts, the light-emitting component is arranged on the die bonding parts, and the connecting parts are used for being electrically connected with wires; the four pairs of pins are respectively a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin, the first pin and the second pin form a first pin pair, the third pin and the fourth pin form a second pin pair, the fifth pin and the sixth pin form a third pin pair, and the seventh pin and the eighth pin form a fourth pin pair;

the first pins comprise first die bonding parts, the second pins comprise second die bonding parts, and the positive terminals of the driving chips are electrically connected with the first die bonding parts; the third pin comprises a third die bonding part, the fourth pin comprises a fourth die bonding part, and the negative end of the driving chip is electrically connected with the fourth die bonding part; the fifth pin comprises a fifth die bonding part, the sixth pin comprises a sixth die bonding part, the fifth die bonding part is used for transmitting a control signal to the signal input end of the driving chip, and the sixth die bonding part is connected with the signal output end of the driving chip; the seventh lead comprises a seventh die bonding portion, and the eighth lead comprises an eighth die bonding portion.

In a second aspect, an embodiment of the present application provides an LED lamp strip, where the LED lamp strip includes any one of the LED lamp beads provided in the present application.

The embodiment of the application discloses LED lamp pearl and LED lamp area, to LED lamp pearl, four to the pin and with light-emitting component's relation of connection, can make this LED lamp pearl be connected with other LED lamp pearls through four wires, arrange on four wires with other lamp pearls in order promptly, it forms a LED lamp cluster to see a plurality of LED lamp pearl welding on four wires in appearance, can make the processing in LED lamp area easier from this, can realize the high voltage power supply in LED lamp area simultaneously, long distance cascades and luminous diversity, for example can realize the luminous pattern such as running water lamp and horse lamp, the use experience of product has been improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an LED lamp bead provided in an embodiment of the present application;

fig. 2 is a schematic view of another view angle structure of an LED lamp bead provided in the embodiment of the present application;

fig. 3 is a schematic diagram of an explosion structure of an LED lamp bead provided in the embodiment of the present application;

fig. 4a and 4b are schematic structural diagrams of different viewing angles of a pin of an LED lamp bead provided in the embodiment of the present application;

fig. 5 is a schematic structural diagram of an LED lamp bead provided in the embodiment of the present application;

fig. 6 is a schematic diagram of a circuit connection relationship of an LED lamp bead provided in the embodiment of the present application;

fig. 7 is a schematic structural diagram of a driving chip provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of another pin of an LED lamp bead provided in the embodiment of the present application;

fig. 9 is a schematic structural diagram of another pin of an LED lamp bead provided in the embodiment of the present application;

fig. 10 is a schematic structural diagram of a connection relationship between an LED lamp bead and a wire provided in the embodiment of the present application;

fig. 11 is a schematic structural diagram of another view angle of a connection relationship between an LED lamp bead and a wire provided in the embodiment of the present application;

fig. 12 is a schematic structural diagram of an LED strip provided in an embodiment of the present application.

Description of the main elements and symbols:

100. an LED light strip; 10. LED lamp beads; 101. a bonding wire; 11. an insulating base; 111. a concave cavity; 12. a light emitting assembly; 121. a driving chip; 122. a wafer; 1221. a green chip; 1222. a red light chip; 1223. a blue light chip; 13. packaging glue; 14. a pin; 1401. a connecting portion; 1402. a die bonding part; 1403. a chip mounting groove; 141. a first pin; 1411. a first connection portion; 1412. a first die bonding section; 142. a second pin; 1421. a second connecting portion; 1422. a second die bonding section; 143. a third pin; 1431. a third connecting portion; 1432. a third die bonding section; 144. a fourth pin; 1441. a fourth connecting portion; 1442. a fourth die bonding section; 145. a fifth pin; 1451. a fifth connecting part; 1452. a fifth die bonding section; 146. a sixth pin; 1461. a sixth connecting portion; 1462. a sixth die bonding section; 147. a seventh pin; 1471. a seventh connecting portion; 1472. a seventh die bonding section; 148. an eighth pin; 1481. an eighth connecting portion; 1482. an eighth die bonding section; 14a, a first transition pin; 14a1, a die bonding part of the first transition pin; 14b, a second transition pin;

20. a wire; 201. a conductive wire core; 202. an insulating layer; 21. a first conductive line; 22. a second conductive line; 23. a third conductive line; 24. and a fourth conductive line.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is also to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.

The embodiment of the application provides an LED lamp bead and an LED lamp strip using the same, the LED lamp bead can enable the LED lamp strip to be manufactured more simply and easily, and meanwhile, the light emitting effect and the pattern of an LED can be improved.

Referring to fig. 1 to 3, fig. 1 to 3 respectively show a schematic structural diagram of an LED lamp bead provided in an embodiment of the present application. As shown in fig. 1 to 3, the LED lamp bead 10 includes an insulating base 11, a light emitting component 12, an encapsulation adhesive 13, and at least four pairs of pins 14.

The light emitting assembly 12 includes a driving chip 121 and a wafer 122, the driving chip 121 is connected to the wafer 122 through a bonding wire 101, and the driving chip 121 is used for driving the wafer 122 to emit light. In this embodiment, the wafer 122 may be a multi-color light emitting chip, and specifically may include a green chip 1221, a red chip 1222, and a blue chip 1223, and a full-color light lamp is formed by the green chip 1221, the red chip 1222, and the blue chip 1223.

In some embodiments, wafer 122 may further include a single color light emitting chip or a combination of multiple single color light emitting chips, such as a blue light chip, a red light chip, or a green light chip, or a full color light lamp formed by combining a blue light chip, a red light chip, and a green light chip, or may further be combined with a white light emitting chip, which may cooperate with one or more of the blue light chip, the red light chip, and the green light chip to form a multi-color light.

The package adhesive 13 covers the light emitting element 12, and specifically covers the driving chip 121 and the wafer 122, where the package adhesive 13 is a transparent adhesive, such as a transparent adhesive and a translucent adhesive, so that light emitted from the wafer can be transmitted to the outside through the package adhesive 13, and the package adhesive 13 can also protect a connection line between the light emitting element 12 and the light emitting element 12, where the connection line may be a bonding line.

It should be noted that the bonding wire provided in the embodiments of the present application includes one of a gold wire, a silver wire, a copper wire, an aluminum wire, and an alloy wire.

In some embodiments, as shown in fig. 3, the insulating base 11 is recessed to form a cavity 111 for accommodating the light emitting assembly 12, the encapsulation glue 13 is filled in the cavity 111, so as to increase the firmness of the encapsulation glue 13, and the cavity 111 can also be used as a reflective cup for reflecting light emitted from the wafer 122, so that the light emitted from the wafer 122 travels toward the opening of the cavity 111.

At least four pairs of pins 14 are fixed on the insulating base 11, for example, the four pairs of pins 14 are integrally formed with the insulating base 11, and may be formed by an injection molding process. The lead 14 includes a connection portion 1401 and a die bonding portion 1402, the light emitting element 12 is disposed on the die bonding portion 1402, and the connection portion 1401 is used for electrically connecting to a conductive wire. Specifically, the connecting portion 1401 and the die bonding portion 1402 are electrically connected, and specifically, the connecting portion 1401 and the die bonding portion 1402 are integrally formed. The wire is external wire, specifically can include the conductive core and wrap up the insulating layer on this conductive core, from the function of wire, the wire can divide into power supply wire and communication wire again.

Specifically, for example, as shown in fig. 2, the connecting portions of four pairs of pins 14 are located at the bottom of the insulating base 11 and are arranged at intervals, and the connecting portions of each pair of pins 14 are located at two sides of the bottom of the insulating base 11 and are opposite to each other; accordingly, the die bonding portions of the leads 14 are spaced apart from each other at the top of the insulating base 11.

When a cavity 111 for accommodating the light emitting element 12 is formed by recessing the insulating base 11, a portion of the die bonding portion 1402 of the lead 14 or a portion of the die bonding portion 1402 is located at the bottom of the cavity 111.

The four pairs of pins 14 are a first pin 141, a second pin 142, a third pin 143, a fourth pin 144, a fifth pin 145, a sixth pin 146, a seventh pin 147, and an eighth pin 148, respectively. The first pin 141 and the second pin 142 form a first pin pair, the third pin 143 and the fourth pin 144 form a second pin pair, the fifth pin 145 and the sixth pin 146 form a third pin pair, and the seventh pin 147 and the eighth pin 148 form a fourth pin pair.

It should be noted that the LED lamp beads provided in the present application all include at least four pairs of pins 14, but it is understood that more pins 14 may also be included, for example, five pairs of pins 14 or more pairs of pins 14 may be included, and the present application is not limited herein.

As shown in fig. 4a and 4b, the first pin 141 includes a first connection portion 1411 and a first die attach portion 1412, and the second pin 142 includes a second connection portion 1421 and a second die attach portion 1422, wherein the first die attach portion 1412 and the second die attach portion 1422 may be integrally formed, so that the bonding wires of the first pin 141 and the second pin 142 and the wires can be less solder points, and the electrical connection is performed by the integral die attach portion, and since the wires soldered to the first pin 141 and the second pin 142 are common positive electrodes (anodes) when the LED lamp bead is used to form the LED lamp strip, the wires may be combined together from head to tail, that is, from the head lamp bead to the tail lamp bead, so as to relatively improve the reliability of the lamp strip. The third pin 143 includes a third connection portion 1431 and a third die bonding portion 1432, the fourth pin 144 includes a fourth connection portion 1441 and a fourth die bonding portion 1442, the fifth pin 145 includes a fifth connection portion and a fifth die bonding portion, the sixth pin 146 includes a sixth die bonding portion, the seventh pin 147 includes a seventh connection portion 1471 and a seventh die bonding portion 1472, and the eighth pin includes an eighth connection portion 1481 and an eighth die bonding portion 1482.

In addition, unless otherwise specified, the die bonding portions of the leads 14 are provided at intervals in the insulating base 11, and the reason for the intervals is that electrical connection is required. Special cases such as the first die bond portion 1412 and the second die bond portion 1422 may also be integrally formed. For two or more die bonding portions formed integrally, because part of the die bonding portions are provided with electronic devices, and part of the die bonding portions are not provided with electronic devices, for example, the fourth die bonding portion 1442 is provided with the driving chip 121 or the wafer 122, etc., the die bonding portions provided with electronic devices generate heat during working, and the heat generated by the die bonding portions not provided with electronic devices is relatively small, so if the die bonding portions are not arranged at intervals, the die bonding portions are easy to arch up due to different heating, the die bonding portions can be effectively prevented from being heated unevenly and arching due to the interval arrangement, and further, the firmness of the pins 14 and the insulating base 11 can be improved.

In the embodiment of the present application, as shown in fig. 5 and 6 in particular, the driving chip 121 is disposed on the fourth die bonding portion 1442 of the fourth lead 144, and the wafer 122 includes a green chip 1221, a red chip 1222 and a blue chip 1223, wherein one terminal of each of the green chip 1221, the red chip 1222 and the blue chip 1223 is connected to the driving chip 121. It is understood that the driving chip 121 may be disposed on the die attach portions of other pins, and the wafer 122 may include other color light emitting chips, or less than three or more than three light emitting chips.

The die 122 is electrically connected to the first die attach portion 1412, specifically, the die 122 can be electrically connected to the first die attach portion 1412 through a bonding wire 101, or the die 122 can be electrically connected to the first die attach portion 1412 through an adhesive contact, for example, the bottom of the die 122 can be electrically connected to the first die attach portion 1412 in a thermosetting manner by using a conductive silver adhesive. Since the first die bonding portion 1412 and the second die bonding portion 1422 are integrally formed, the chip 122 is electrically connected to the second die bonding portion 1422. Even if the first die bonding portion 1412 and the second die bonding portion 1422 are not integrally formed but are disposed at an interval, the wafer 122 can be electrically connected to the first die bonding portion 1412 or the second die bonding portion 1422, and the electrical connection manner includes bonding wires or conductive silver paste.

Specifically, the electrical connection between the wafer and the die attach portion needs to be realized by using bonding wires or conductive silver paste, which is determined according to the type of the wafer, and the structure of the PN junction of the wafer may be a vertical structure or a horizontal structure. For the vertical structure, the bottom terminal of the wafer needs to be connected with the die bonding portion by using conductive silver paste, the bottom of the wafer refers to an end portion arranged on the die bonding portion, and the top terminal of the wafer needs to be electrically connected with the driving chip by using a bonding wire.

The embodiment provides an LED lamp pearl 10, because the design of four pairs of pins 14 and the relation of connection of four pairs of pins 14 and light-emitting component 12, can make this LED lamp pearl 10 be connected with other LED lamp pearls through four wires, arrange on four wires in order with other lamp pearls promptly, it is a LED lamp cluster to see that a plurality of LED lamp pearls welding constitutes on four wires in appearance, but there are series connection and parallelly connected at the circuit connection, each LED lamp pearl all is the series connection and is convenient for control on communication connection relation, can make the processing in LED lamp area easier from this, realize the high voltage power supply in LED lamp area simultaneously, long distance cascades and luminous diversity, for example can realize the luminous patterns such as running water lamp and horse race lamp.

As shown in fig. 6 and 7, the positive terminal VDD of the driving chip 121 is electrically connected to the first die attach portion 1412, which may also be referred to as being electrically connected to the second die attach portion 1422, through the bonding wire 101, the negative terminal GND of the driving chip 121 is electrically connected to the fourth die attach portion 1442, the positive terminal VDD of the driving chip 121 may also be referred to as being a power supply terminal, and the negative terminal GND of the driving chip 121 may also be referred to as being a ground terminal. The fifth die bonding portion 1452 is used for transmitting a control signal to the signal input terminal Din of the driver chip 121, and the sixth die bonding portion 1462 is connected to the signal output terminal Dout of the driver chip 121 through the bonding wire 101.

Specifically, in some embodiments, as shown in fig. 5, the first die bond 1412 (or the second die bond 1422) is provided with one or more wafers 122; the wafer 122 is electrically connected to the driving chip 121 through the bonding wires 101, the wafer 122 is also electrically connected to the first die attach portion 1412 (or the second die attach portion 1422) through the bonding wires 101, or the wafer 122 is also electrically connected to the first die attach portion 1412 (or the second die attach portion 1422) through an adhesive contact. The driving chip 121 is used to control light emission of the wafer 122. The wafer 122 and the driving chip 121 may be provided on other die bond portions, and are not limited herein.

Specifically, as shown in fig. 6 and 7, the first die attach portion 1412 is provided with a green chip 1221 and a red chip 1222, or referred to as a second die attach portion 1422 is provided with a green chip 1221 and a red chip 1222. The green chip 1221 is electrically connected to the first die attach portion 1412 and the driving chip 121 through the bonding wires 101. The red chip 1222 is connected to the driving chip 121 through the bonding wire 101, and is electrically connected to the first die attach portion 1412 through an adhesive contact.

Specifically, a first terminal of the green chip 1221 is electrically connected to the first die attach portion 1412 through a bonding wire, a second terminal of the green chip 1221 is electrically connected to a G control terminal of the driver chip 121 through a bonding wire 101, and the first terminal and the second terminal of the green chip 1221 correspond to two ends of a PN junction, so that the PN junction of the green chip 1221 can be controlled to emit light by controlling a voltage between the first terminal and the second terminal of the green chip 1221.

Specifically, the first terminal conductive silver paste of the red chip 1222 is electrically connected to the first die attach portion 1412, the second terminal of the red chip 1222 is electrically connected to the R control terminal of the driver chip 121 through the bonding wire 101, the first terminal and the second terminal of the red chip 1222 correspond to two ends of the PN junction, and the PN junction of the red chip 1222 can be controlled to emit light by controlling the voltage between the first terminal and the second terminal of the red chip 1222. Note that the red chip 1222 has a PN junction with an upper and lower vertical structure.

In some embodiments, the fourth die attach portion 1442 is provided with the driving chip 121 and the wafer 122, the wafer 122 is electrically connected to the first die attach portion 1412 through bonding wires, which may also be referred to as the second die attach portion 1422, and the wafer 122 is also electrically connected to the driving chip 121 through bonding wires.

For example, as shown in fig. 6 and 7, the wafer disposed in the fourth die bonding portion 1442 is a blue chip 1223, but may also be a color wafer, a first terminal of the blue chip 1223 is electrically connected to the first die bonding portion 1412 through a bonding wire, and a second terminal of the blue chip 1223 is also electrically connected to the B control terminal of the driving chip 121 through a bonding wire. In order to improve the light emitting effect of the LED lamp bead, the blue chip 1223 is disposed in the fourth die attach area 1442 near the first die attach area 1412, so that the blue chip 1223 is close to the wafer disposed on the first die attach area 1412, such as the green chip 1221 and the red chip 1222. And then can utilize the luminous chip of three kinds of different colours to produce different colour combinations under driver chip 121's control, not only can reduce product cost, promote product reliability, still promoted the compound luminous colour mixture effect of this LED lamp pearl.

In some embodiments, in order to improve reliability and service life of the LED lamp bead in practical applications, the first die attach part 1412 and the second die attach part 1422 which are integrally formed as shown in fig. 4a and fig. 6 may be cut off, as shown in fig. 8 and fig. 9 for example, because of the cut-off section, when the first die attach part 1412 and the second die attach part 1422 expand due to heat, internal stress release may be reduced, so that reliability and service life of the LED lamp bead may be improved.

The cutting of the first die bond portion 1412 and the second die bond portion 1422 that are integrally molded specifically includes the first die bond portion 1412 and the second die bond portion 1422 that are cut in two ways as shown in fig. 8 and 9. Therefore, the positive terminal VDD of the driving chip 121 can be electrically connected to the first die attach part 1412 after being cut through the bonding wire 101, and the positive terminal VDD of the driving chip 121 can also be electrically connected to the second die attach part 1422 after being cut through the bonding wire 101, as shown in fig. 9.

In some embodiments, as shown in fig. 4a and fig. 6, the LED lamp bead 10 further includes a first transition pin 14a, the first transition pin 14a includes a die attach portion 14a1, the die attach portion 14a1 of the first transition pin 14a is provided with a diode D1, one end of the diode D1 is electrically connected to the die attach portion 14a1 of the first transition pin 14a, the other end of the diode D1 is electrically connected to the first die attach portion 1412 through a bonding wire, the die attach portion 14a1 of the first transition pin 14a is further connected to the signal input Din end of the driver chip 121 through a bonding wire 101, and the die attach portion 14a1 of the first transition pin 14a is further electrically connected to the fifth die attach portion 1452. The diode D1 may be a schottky diode. Because the signal input end Din of the driving chip 121 needs a reference voltage, a schottky diode pull-out voltage with a fast response is needed so as to make reference to the signal of the signal input end Din, thereby improving the communication quality of the LED lamp bead.

In some embodiments, as shown in fig. 6, the die bonding part 14a1 of the first transition pin 14a is electrically connected to the fifth die bonding part 1452 through a capacitor C1. Because the LED lamp pearl that this application embodiment provided can make high voltage supply's LED lamp area, control signal is also corresponding for high-voltage high-low level signal simultaneously, consequently utilizes this electric capacity C1 coupling signal, can improve the transmission quality of signal.

It should be noted that, when the diode is a PN-type structure, the cathode of the diode D1 is electrically connected to the die attach portion 14a1 of the first transition pin 14a, and the anode of the diode D1 is electrically connected to the first die attach portion 1412 through a bonding wire; when the diode is in an NP-type structure, the anode of the diode D1 is electrically connected to the die attach portion 14a1 of the first transition lead 14a, and the cathode of the diode D1 is electrically connected to the first die attach portion 1412 through a bonding wire. The diode D1 and the die bonding portion may be bonded together by conductive silver paste. The capacitor C1 and the die bonding portion may be connected by bonding with conductive silver paste.

It should be further noted that the diode D1 and the capacitor C1 may not be disposed on the first transition pin 14a, for example, the exterior of the LED lamp bead 10 may be disposed, that is, the same effect may be achieved by disposing an external circuit.

In some embodiments, in order to facilitate processing of the LED lamp bead, as shown in fig. 5 and fig. 6, the LED lamp bead 10 may further include a second transition pin 14b, and the first transition pin 14a and the second transition pin 14b are disposed on two opposite sides of the insulating base 11, where it can be understood that the die bonding portion of the second transition pin 14b is integrally formed with the fourth die bonding portion 1442, or it can be understood that the second transition pin 14b extends from the fourth die bonding portion 1442.

It should be noted that, after the LED lamp bead 10 is processed, it is generally indicated in the insulating base of the LED lamp bead or the product specification that the first transition pin 14a and the second transition pin 14b are empty pins, and the empty pins are not electrically connected, so as to perform a transition or receiving function.

In some embodiments, in order to subsequently distinguish the direction of the LED lamp bead, for example, the direction of the pin of the LED lamp bead, the insulating base 11 may be further provided with an identification component 112, specifically as shown in fig. 1 and fig. 3, the identification component is specifically provided with a notch on the insulating base 11, and may also be a mark, for example, a character.

As shown in fig. 10 and fig. 11, in the plurality of LED lamp beads 10 provided in the above embodiment, the first connection portion 1411 of the first pin 141 and the second connection portion 1421 of the second pin 142 are both used for electrically connecting with the first wire 21; the third connection part 1431 of the third pin 143 and the fourth connection part 1441 of the fourth pin 144 are both used for electrically connecting with the second wire 22; the fifth connection portion 1451 of the fifth lead 145 and the sixth connection portion 1461 of the sixth lead 146 are electrically connected to the third wire 23, and the seventh connection portion 1471 of the seventh lead 147 and the eighth connection portion 1481 of the eighth lead 148 are electrically connected to the fourth wire 24. The first wire 21 is a positive wire, the second wire 22 is a positive wire, the third wire 23 is a communication wire, and the fourth wire 24 is a negative wire. The conducting wire 20 comprises a conducting wire core 201 and an insulating layer 202 wrapping the conducting wire core 201, and the conducting wire 20 can also be an enameled wire.

As shown in fig. 10 and 11, a portion of the conductive wire core 201 of the second conductive wire 22 between the third connection part 1431 of the third pin 143 and the fourth connection part 1441 of the fourth pin 144 is cut off; the portion of the conductive core 201 of the third wire 23 between the fifth connection portion 1451 of the fifth pin 145 and the sixth connection portion 1461 of the sixth pin 1461 is cut off.

The processing technology for connecting the LED lamp bead 10 and the lead 20 specifically comprises the following steps: the insulating layer 202 at the corresponding position in the wire 20 is planed to expose the conductive wire core 201, soldering tin is coated on the conductive wire core 201 or the connecting part of the pins 14 of the LED lamp bead 10, and then the pins 14 of the LED lamp bead 10 are welded on the wire 20. It should be noted that, when the LED lamp bead 10 and the lead 20 are subsequently used to manufacture an LED lamp strip, the processing technology is also adopted.

It should be further noted that, the pins 14 of the LED lamp beads 10 are electrically connected to the wires 20, including direct connection or indirect connection, where the direct connection is, for example, the pins 14 of the LED lamp beads 10 are welded to the wires 20, the indirect connection may be, for example, a receiving plate is welded to the wires 20 first, the receiving plate includes a plurality of solder tails, the pins 14 of the LED lamp beads 10 are correspondingly welded to the solder tails on the receiving plate, and the LED lamp beads 10 are electrically connected to the wires 20 by using the receiving plate.

In some embodiments, as shown in fig. 4a, a chip mounting groove 1403 may be further disposed on the fourth die bonding part 1442, and the driving chip 121 is disposed in the chip mounting groove 1403. Because the tank bottom of chip mounting groove 1403 is less than other solid crystalline substance portions to can let driver chip 121 sink into the bottom of chip mounting groove 1403, not only can ensure that wafer 122 is located driver chip 121's top like this, avoid driver chip to shelter from the light of wafer 122, effectively improve the luminance of LED lamp pearl. Meanwhile, the position of the bonding wire connected to the highest point of the driving chip 121 can be reduced, the using length of the bonding wire 101 is reduced, and the manufacturing cost of the LED lamp bead is saved. Meanwhile, the peripheral stress release of the driving chip can be reduced, and the reliability of the product is further improved.

In some embodiments, the distance between the bottom of the chip mounting groove 1403 and the other die bonding portions may be set to be a predetermined distance. The preset distance may be any size smaller than the thickness of the driving chip 121, and the driving chip 121 is intended to be sunk into the bottom of the cavity 111, so that the wafer 122 is ensured to be located above the driving chip 121, light rays of the wafer 122 shielded by the driving chip 121 are avoided, and the brightness of the LED structure is effectively improved without increasing the manufacturing cost of the LED structure. In addition, the packaging structure of the LED is formed by compounding inorganic materials and organic materials, and because the thermal expansion coefficients of the inorganic materials and the organic materials are different, the stress generated by the inorganic materials and the stress generated by the organic materials are different, so that the wire punching or the fracture of the bonding wire 101 is easily caused, and the application reduces the use length of the bonding wire 101, thereby reducing the impact force on the bonding wire 101 in the subsequent process and avoiding the bad phenomena of wire punching or fracture and the like of the bonding wire 101.

Referring to fig. 12, fig. 12 is a schematic structural diagram of a LED strip provided in an embodiment of the present application, where the LED strip 100 includes any one of the LED beads 10 provided in the foregoing embodiments, and specifically may include one or more LED beads 10.

The method for manufacturing the LED lamp strip specifically comprises the following steps: at least four wires are arranged along a straight track in an extending way; arranging corresponding LED lamp beads on at least four wires at intervals along a straight track; welding the LED lamp beads and at least four wires; and performing punching processing on the cut part of the partial lead.

As shown in fig. 10 and 11, the conductive wire 20 includes a conductive core 201 and an insulating layer 202 wrapping the conductive core, wherein the conductive wire includes an enameled wire, and the insulating layer may also be referred to as an enameled wire layer. Before at least four wires are extended and arranged along a straight track, the insulating layers of the wires are required to be stripped, so that each wire is exposed to a conductive wire core matched with the pins of the LED lamp beads. It will of course be appreciated that the conductors may also be stripped after at least four conductors have been provided extending along a straight track.

In some embodiments, for the aesthetic appearance, the insulating layer of the wires may be stripped at equal intervals, so that the LED beads of the LED modules in the LED strip may be arranged at equal intervals on the four wires. Of course, the wires may be arranged at unequal intervals on the four wires.

The LED lamp beads and at least four wires are welded by coating the tin paste on the conductive wire cores of the wires, so that the welding reliability of the conductive wire cores of the LED lamp beads and the wires can be improved. In some embodiments, of course, solder paste may be coated on the connection portion of the LED lamp bead. Can specifically use hot-blast mechanism to carry out welded fastening with the connecting portion of LED lamp pearl and the conductor core of wire, at the welding end, still need cut off the conductor core of partial wire, specifically need cut off the treatment to the conductor core of second wire and third wire. When punching, the wire welded with the LED lamp beads is overturned, so that the wire faces upwards and the LED lamp beads face downwards, and the LED lamp strips are manufactured by punching from top to bottom by utilizing the cutter.

In some embodiments, can also dial the insulating layer of wire earlier and expose the conductive core, then die-cut second wire and third wire, coat the tin cream on the wire core, put LED lamp pearl on the conductive core who is stained with the tin cream again, weld again, then go up to drip UV and glue the back solidification. And (4) reversing the LED lamp strip in the next procedure, and dripping UV glue on the other surface of the LED lamp strip for curing to finish the manufacturing of the LED lamp strip.

This LED lamp area 100, because four pairs of pins of LED lamp pearl 10 and the relation of being connected with light-emitting component, can make this LED lamp pearl be connected with other LED lamp pearls through four wires, arrange in order on four wires with other lamp pearls promptly, see that a plurality of LED lamp pearl welding constitutes a LED lamp cluster on four wires from the outward appearance, but can have in series connection and parallelly connected at circuit connection, each LED lamp pearl all is the series connection and is convenient for control on communication connection relation, can make the processing in LED lamp area easier from this, can realize the high voltage power supply in LED lamp area simultaneously, long distance cascades and luminous diversity, for example can realize the luminous pattern such as running water lamp and horse race lamp, the use experience of product has been improved.

While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. The utility model provides a LED lamp pearl which characterized in that, the lamp pearl includes:

an insulating base;

the light-emitting component comprises a driving chip and a wafer, wherein the driving chip is electrically connected with the wafer and is used for driving the wafer to emit light;

the packaging glue covers the light-emitting component;

the four pairs of pins are fixed on the insulating seat and comprise connecting parts and die bonding parts, the light-emitting component is arranged on the die bonding parts, and the connecting parts are used for being electrically connected with the wires; the four pairs of pins are respectively a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin, the first pin and the second pin form a first pin pair, the third pin and the fourth pin form a second pin pair, the fifth pin and the sixth pin form a third pin pair, and the seventh pin and the eighth pin form a fourth pin pair;

the first pin comprises a first die bonding part, the second pin comprises a second die bonding part, and the positive terminal of the driving chip is electrically connected with the first die bonding part; the third pin comprises a third die bonding part, the fourth pin comprises a fourth die bonding part, and the negative end of the driving chip is electrically connected with the fourth die bonding part; the fifth pin comprises a fifth die bonding part, the sixth pin comprises a sixth die bonding part, the fifth die bonding part is used for transmitting a control signal to the signal input end of the driving chip, and the sixth die bonding part is connected with the signal output end of the driving chip; the seventh lead comprises a seventh die bonding portion, and the eighth lead comprises an eighth die bonding portion.

2. The LED lamp bead according to claim 1, wherein the first die attach part and the second die attach part are integrally formed; or the first die bonding part and the second die bonding part are arranged at intervals, and the positive end of the driving chip can be electrically connected with the second die bonding part.

3. The LED lamp bead of claim 1, wherein the LED lamp bead further comprises: the first transition pin comprises a die bonding part, a diode is arranged on the die bonding part of the first transition pin, one end of the diode is electrically connected with the die bonding part of the first transition pin, the other end of the diode is electrically connected with the first die bonding part through a bonding wire, the die bonding part of the first transition pin is further connected with a signal input end of the driving chip through the bonding wire, and the die bonding part of the first transition pin is further electrically connected with the fifth die bonding part.

4. The LED lamp bead of claim 3, wherein the LED lamp bead further comprises: and the first transition pin and the second transition pin are arranged on two opposite sides of the insulating seat, and the die bonding part of the second transition pin and the fourth die bonding part are integrally formed.

5. The LED lamp bead according to claim 3, wherein the die attach portion of the first transition pin is electrically connected to the fifth die attach portion through a capacitor.

6. The LED lamp bead according to claim 1, wherein the first die attach portion is provided with one or more of the wafers; the wafer is electrically connected with the driving chip through a bonding wire; the wafer is electrically connected with the first die bonding part through a bonding wire, or the wafer is electrically connected with the first die bonding part through bonding contact.

7. The LED lamp bead according to claim 6, wherein the first die attach portion is provided with a green chip and a red chip; the green chip is electrically connected with the first die bonding part and the driving chip through bonding wires respectively; the red light chip is connected with the driving chip through a bonding wire and is electrically connected with the first die bonding part through bonding contact.

8. The LED lamp bead according to claim 1, wherein the fourth die attach section is provided with the driving chip and the wafer; the wafer is electrically connected with the first die bonding part through a bonding wire, and the wafer is also electrically connected with the driving chip through the bonding wire.

9. The LED lamp bead according to claim 8, wherein the wafer disposed in the fourth die bonding portion is a blue chip, and the blue chip is disposed in the fourth die bonding portion at a position close to the first die bonding portion, so that the blue chip is close to the wafer disposed on the first die bonding portion.

10. The LED lamp bead according to claim 1, wherein the connection portions of the first and second pins are each adapted to electrically connect to a first wire; the connecting parts of the third pin and the fourth pin are both used for being electrically connected with a second lead, the connecting parts of the fifth pin and the sixth pin are both used for being electrically connected with a third lead, and the connecting parts of the seventh pin and the eighth pin are both used for being electrically connected with a fourth lead;

the first lead is a positive pole wire, the second lead is a positive pole wire, the third lead is a communication lead, and the fourth lead is a negative pole wire; the part of the conductive wire core of the second wire, which is positioned between the connecting parts of the third pin and the fourth pin, is cut off; and the part of the conductive wire core of the third wire, which is positioned between the connecting parts of the fifth pin and the sixth pin, is cut off.

11. The LED lamp bead according to claim 1, wherein a cavity for accommodating the light emitting assembly is formed in the insulating base in a recessed manner, and the encapsulation adhesive is filled in the cavity.

12. A LED strip, comprising the LED bead of any one of claims 1-11.

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