CN209784484U - Aging circuit board of SMD product - Google Patents
Aging circuit board of SMD product Download PDFInfo
- Publication number
- CN209784484U CN209784484U CN201920310466.XU CN201920310466U CN209784484U CN 209784484 U CN209784484 U CN 209784484U CN 201920310466 U CN201920310466 U CN 201920310466U CN 209784484 U CN209784484 U CN 209784484U
- Authority
- CN
- China
- Prior art keywords
- light source
- golden finger
- bottom plate
- circuit structure
- source bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to an aging circuit board of SMD products, belonging to the technical field of LED packaging SMD product aging experimental equipment.A plurality of positioning holes are fixedly arranged on the peripheral corners of a bottom plate; each light source bonding pad is fixedly provided with an LED light source; the light source bonding pads are connected in parallel through the anode circuit structure; each light source bonding pad is fixedly connected with a negative electrode circuit structure; the middle part of the lower side of the bottom plate is fixedly provided with a first golden finger, and the upper end of the first golden finger is connected with the positive circuit structure; fixed No. two golden fingers of several that are provided with on the bottom plate of a golden finger left and right sides, No. two golden fingers of several are connected with corresponding negative pole line structure respectively, and when can avoiding a plurality of panel ageing, because of the difference between a plurality of panels, and the bad phenomenon of the accuracy of influence experimental data to solve because of ageing panel to experimental data's influence, with this accuracy that promotes the experimental data of the operating efficiency of laboratory technical staff post simultaneously.
Description
Technical Field
The utility model relates to a LED encapsulation SMD product ageing testing equipment technical field, concretely relates to ageing circuit board of SMD product.
Background
The SMD products in the LED light source have small structures, after the product development is finished, reliability experiments are required to be carried out on the products, and when high-temperature and high-humidity experiments are carried out, a single product is often adopted to be matched with a PCB plum blossom plate at present, so that the efficiency is low when experimenters carry out the experiments, and because each PCB is provided with a thermal resistance difference, the experimental data can have larger deviation, the accuracy of the experimental result is questioned, the experimental verification can be carried out again, the development cycle of the products is prolonged, the time for the new products developed by companies to enter the market is delayed, and the market preemption is lost; in order to avoid the problem that the progress is delayed due to the influence of the aged PCB on the experiment in the development of new products, an aged PCB of an SMD product is needed because the structure or the circuit of the aged PCB used in the experiment is improved.
Disclosure of Invention
An object of the utility model is to prior art's defect and not enough, provide a simple structure, reasonable in design, convenient to use's an ageing circuit board of SMD product, when can avoiding a plurality of panel ageing, because of the difference between a plurality of panels, and influence the bad phenomenon of the accuracy of experimental data to solve because of ageing panel to the influence of experimental data, promote the operating efficiency of laboratory technical staff post and the accuracy of the experimental data that promotes with this simultaneously.
In order to achieve the above object, the utility model adopts the following technical scheme: the LED light source module comprises a bottom plate, a light source bonding pad, an LED light source, a positioning hole, a first golden finger, a second golden finger, a positive circuit structure and a negative circuit structure; a plurality of positioning holes are fixedly arranged on the peripheral corners of the bottom plate; a plurality of light source bonding pads are fixedly arranged at the middle part of the bottom plate in an equal round angle mode, and an LED light source is fixedly arranged on each light source bonding pad; the light source bonding pads are connected in parallel through the anode circuit structure; each light source bonding pad is fixedly connected with a negative electrode circuit structure; the middle part of the lower side of the bottom plate is fixedly provided with a first golden finger, and the upper end of the first golden finger is connected with the positive circuit structure; a plurality of second golden fingers are fixedly arranged on the bottom plates on the left side and the right side of the first golden finger and are respectively connected with the corresponding negative electrode circuit structures.
Further, the total number of the first golden finger and the second golden finger is larger than 11.
Further, the total number of the positive electrode circuit structures and the negative electrode circuit structures is more than 11.
Further, the total number of the light source bonding pads is larger than 9.
Further, the total number of the positioning holes is more than 3.
after the structure is adopted, the utility model discloses beneficial effect does: an ageing circuit board of SMD product, when can avoiding a plurality of panel ageing, because of the difference between a plurality of panels, and influence the bad phenomenon of the accuracy of experimental data to solve because of ageing panel is to the influence of experimental data, promote the operating efficiency of laboratory technical staff post and the accuracy of the experimental data that promotes with this simultaneously, the utility model has the advantages of simple structure sets up rationally, the cost of manufacture is low.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of the connection structure between the light source pad and the LED light source of the present invention.
Description of reference numerals:
The LED light source module comprises a bottom plate 1, a light source bonding pad 2, an LED light source 3, a positioning hole 4, a first golden finger 5, a second golden finger 6, an anode circuit structure 7 and a cathode circuit structure 8.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
Referring to fig. 1-2, the technical solution adopted by the present embodiment is: the LED light source module comprises a bottom plate 1, a light source bonding pad 2, an LED light source 3, a positioning hole 4, a first golden finger 5, a second golden finger 6, an anode circuit structure 7 and a cathode circuit structure 8; a plurality of positioning holes 4 are fixedly formed in the peripheral corners of the bottom plate 1, and the bottom plate 1 is made of metal, an insulating layer and an antistatic material; the middle part of the bottom plate 1 is provided with a plurality of light source bonding pads 2 in an equal-fillet embedding manner through copper foil wiring, and each light source bonding pad 2 is fixedly welded with an LED light source 3; the light source bonding pads 2 are connected in parallel through the anode circuit structure 7; each light source bonding pad 2 is fixedly connected with a negative electrode circuit structure 8, so that the negative electrode circuit structure 8, the positive electrode circuit structure 7 and the LED light sources 3 form a passage, and the LED light sources 3 are arranged on the bottom plate 1 for experiment, so that the consistency of experiment conditions is ensured; a first golden finger 5 is fixedly embedded in the middle of the lower side of the bottom plate 1, and the upper end of the first golden finger 5 is connected with the anode circuit structure 7; a plurality of second golden fingers 6 are fixedly arranged on the bottom plate 1 on the left side and the right side of the first golden finger 5, the plurality of second golden fingers 6 are respectively connected with the corresponding negative electrode circuit structures 8, the first golden finger 5 and the second golden finger 6 are connected with an external aging instrument, and an aging experiment can be performed on the LED light source 3.
Further, the total number of the first golden finger 5 and the second golden finger 6 is larger than 11.
Further, the total number of the positive electrode circuit structures 7 and the negative electrode circuit structures 8 is larger than 11, and the number of the first golden finger and the number of the second golden finger are matched.
Further, the total number of the light source bonding pads 2 is larger than 9, and the efficiency of the aging experiment is greatly improved.
Furthermore, the total number of the positioning holes 4 is larger than 3, so that the positioning accuracy is improved.
The working principle of the specific embodiment is as follows: the number of the light source bonding pads 2 on the surface of the base plate 1 is set according to the requirements of different products, the LED light sources 3 are attached to the surfaces of the light source bonding pads 2, and the positions of the LED light sources 3 are fixed, so that the aging test of a plurality of products on an aging board is ensured, and the conditions of the product test are basically consistent; the first golden finger 5 and the second golden finger 6 are connected with an external aging instrument, and then the aging experiment can be carried out on the LED light source 3.
After adopting above-mentioned structure, this embodiment beneficial effect does:
What adopt is that a plurality of LED light sources 3 set up and carry out the experiment on same ageing board, when can avoiding a plurality of panel ageing, because of the difference between a plurality of panels, and the bad phenomenon of the accuracy of influence experimental data to solve because of ageing panel is to the influence of experimental data, with this accuracy that promotes the experimental data of the operating efficiency of laboratory technical staff post simultaneously.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. The utility model provides an ageing circuit board of SMD product which characterized in that: the LED lamp comprises a bottom plate (1), a light source bonding pad (2), an LED light source (3), a positioning hole (4), a first golden finger (5), a second golden finger (6), a positive circuit structure (7) and a negative circuit structure (8); a plurality of positioning holes (4) are fixedly arranged on the peripheral corners of the bottom plate (1); the middle part of the bottom plate (1) is fixedly provided with a plurality of light source bonding pads (2) at equal round angles, and each light source bonding pad (2) is fixedly provided with an LED light source (3); the light source bonding pads (2) are connected in parallel through the anode circuit structure (7); each light source bonding pad (2) is fixedly connected with a negative electrode circuit structure (8) respectively; a first golden finger (5) is fixedly arranged in the middle of the lower side of the bottom plate (1), and the upper end of the first golden finger (5) is connected with the anode circuit structure (7); a plurality of second golden fingers (6) are fixedly arranged on the bottom plates (1) at the left side and the right side of the first golden finger (5), and the plurality of second golden fingers (6) are respectively connected with corresponding negative electrode circuit structures (8).
2. a burn-in board for SMD products as set forth in claim 1, characterized in that: the total number of the first golden finger (5) and the second golden finger (6) is more than 11.
3. A burn-in board for SMD products as set forth in claim 1, characterized in that: the total number of the positive electrode circuit structures (7) and the negative electrode circuit structures (8) is more than 11.
4. A burn-in board for SMD products as set forth in claim 1, characterized in that: the total number of the light source bonding pads (2) is more than 9.
5. A burn-in board for SMD products as set forth in claim 1, characterized in that: the total number of the positioning holes (4) is more than 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920310466.XU CN209784484U (en) | 2019-03-12 | 2019-03-12 | Aging circuit board of SMD product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920310466.XU CN209784484U (en) | 2019-03-12 | 2019-03-12 | Aging circuit board of SMD product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209784484U true CN209784484U (en) | 2019-12-13 |
Family
ID=68797255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920310466.XU Expired - Fee Related CN209784484U (en) | 2019-03-12 | 2019-03-12 | Aging circuit board of SMD product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209784484U (en) |
-
2019
- 2019-03-12 CN CN201920310466.XU patent/CN209784484U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106847801B (en) | Surface-mounted RGB-LED packaging module and manufacturing method thereof | |
| US9673138B2 (en) | Semiconductor package structure having a heat sink frame connected to a lead frame | |
| CN203445108U (en) | Chip packaging and switching board and circuit board with chip packaging and switching board | |
| CN109327958A (en) | Flexible circuit board, circuit board assemblies and mobile terminal | |
| CN205406565U (en) | Cspled | |
| CN206945903U (en) | Integrated chip test bench and integrated chip test module | |
| CN206338768U (en) | A kind of integrated substrates of surface-adhered type RGB LED | |
| CN209784484U (en) | Aging circuit board of SMD product | |
| CN212625492U (en) | LED chip detection device | |
| CN216411361U (en) | Test fixture for parallel testing IGBT (insulated Gate Bipolar transistor) chip and FRD (fast recovery diode) chip | |
| CN107978667B (en) | LED display dot matrix module | |
| CN217521216U (en) | LED chip aging test fixture | |
| CN203658494U (en) | Chip tantalum capacitor independent current limiting aging plate | |
| CN209543219U (en) | A kind of computer module based on 3 D stereo encapsulation | |
| CN203377265U (en) | LED packaging structure | |
| CN205546198U (en) | Display screen and display device | |
| CN203287491U (en) | Device and system for testing chip | |
| CN207133321U (en) | One kind is anti-to weigh formula testing jig structure wounded | |
| CN207651047U (en) | A kind of patch chip experiment bread board | |
| CN202140813U (en) | Integrally-packaged LED (light emitting diode) light source | |
| CN101975921A (en) | Chip test board and test method, and DFN packaging device test board and test method | |
| TW201510543A (en) | Test tool | |
| CN202905704U (en) | Combined surface-mount-type diode lead frame member | |
| CN215525909U (en) | Voltage detection device for electric core of energy storage system | |
| CN204696156U (en) | A kind of ceramic COB circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191213 Termination date: 20210312 |