CN110662353B - Drilling quality evaluation method, drilling parameter determination method and circuit board - Google Patents
Drilling quality evaluation method, drilling parameter determination method and circuit board Download PDFInfo
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- CN110662353B CN110662353B CN201910856883.9A CN201910856883A CN110662353B CN 110662353 B CN110662353 B CN 110662353B CN 201910856883 A CN201910856883 A CN 201910856883A CN 110662353 B CN110662353 B CN 110662353B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
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Abstract
The invention discloses an evaluation method of drilling quality, a determination method of drilling parameters and a circuit board. The method for evaluating the quality of the drilled hole comprises the following steps: processing at least two first holes on the base material according to a first preset requirement to form a first hole array; processing at least two second holes on the base material according to a second preset requirement and based on the position of the first hole array to form a second hole array, wherein the second hole array is obtained by processing in a second feed sequence; acquiring a second hole to be measured which is the last processed second hole based on the second feed sequence; and evaluating the drilling quality of the hole to be measured and finishing the evaluation. Determining the position of the second hole array based on the position of the first hole array; based on the second feed sequence, the second hole of last processing can be determined, namely the hole to be measured, drilling quality evaluation is carried out on the hole to be measured, compared with a traditional evaluation mode, the real processing condition can be reflected, and therefore the evaluation quality of drilling is improved.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a drilling quality evaluation method, a drilling parameter determination method and a circuit board.
Background
In the process of processing a Circuit Board (PCB), whether the setting of the drilling parameters is reasonable will directly affect the quality of the hole wall and affect the reliability of the PCB (e.g., CAF (passive chemical additive ion migration), electrical connection performance, etc.). Therefore, the acquisition and control of drilling parameters are very important.
As PCBs are developed, the demand for substrates is more and more diversified, the processing performance of the substrates is generally evaluated before the substrates are used, and drilling parameters are very important items. The traditional evaluation method is to Design DOE or a full factor test (DOE: Design of Experiment Design, the factors and the corresponding levels are few, such as three factors and three levels, and the full factor test is a multi-factor and multi-level test, namely the test times are more) according to the parameters provided by a supplier, carry out slicing test on the obtained PCB, select the last row or a certain random position at the slicing position, and observe the hole wall under an optical microscope, thereby obtaining the corresponding hole wall quality result. However, this evaluation method is poor in evaluation effect and cannot provide effective reference for subsequent drilling parameter design.
Disclosure of Invention
Based on this, it is necessary to provide a method for evaluating the quality of a drilled hole, a method for determining drilling parameters, and a circuit board; the evaluation method of the drilling quality is more accurate in evaluation; the method for determining the drilling parameters is determined based on the method for evaluating the drilling quality; the drilling parameters are determined by the circuit board in the machining process by adopting the method for determining the drilling parameters.
The technical scheme is as follows:
in one aspect, a method for evaluating the quality of a borehole is provided, comprising the following steps:
processing at least two first holes on the base material according to a first preset requirement, wherein the at least two first holes form a first hole array;
processing at least two second holes on the base material according to a second preset requirement and based on the position of the first hole array, wherein the at least two second holes form a second hole array, and the second hole array is obtained by processing in a second feed sequence;
acquiring a last processed second hole based on the second feed sequence, wherein the hole to be detected is the last processed second hole acquired based on the second feed sequence;
and evaluating the drilling quality of the hole to be measured and finishing the evaluation.
According to the method for evaluating the drilling quality, the second hole array is obtained by processing based on the position of the first hole array, and the position of the second hole array can be determined based on the position of the first hole array; the second hole array is processed in the second feed sequence, and based on the second feed sequence, the second hole processed at the last can be clearly determined, namely the hole to be measured is subjected to drilling quality evaluation.
The technical solution is further explained below:
in one embodiment, at least two second hole arrays are processed on the substrate, and the adjacent second hole arrays are arranged at intervals.
In one embodiment, the adjacent second hole arrays are correspondingly arranged, so that the second holes at corresponding positions are arranged in rows or columns.
In one embodiment, the second array of holes processed in the second feed sequence comprises the steps of:
the drill cutter processes all the second holes corresponding to the first row on the base material;
the drill bit machines all second holes corresponding to the second row in the substrate.
In one embodiment, the first hole array is machined in a first feed sequence, and the machining process of the first hole array comprises the following steps:
the drill bit is used for processing a first hole at a first preset hole position of the base material;
the drill bit is used for processing another first hole at a second preset hole position of the base material, and at least one third preset hole position is arranged between the first preset hole position and the second preset hole position at intervals.
In one embodiment, the first hole array and the second hole array form a hole module, the number of the hole modules is at least two, and different hole modules are processed by different drilling tools;
and acquiring the last processed second hole based on the second feed sequence, wherein the process that the hole to be detected is the last processed second hole acquired based on the second feed sequence comprises the following steps: based on a second feed sequence corresponding to the hole module, the obtained corresponding last processed second hole is a hole to be measured;
the process of evaluating the drilling quality of the hole to be measured and finishing the evaluation comprises the following steps: and respectively evaluating the drilling quality of the corresponding holes to be measured and finishing the drilling quality evaluation of all the holes to be measured.
In one embodiment, two adjacent hole modules are arranged at intervals, and one hole module is obliquely arranged relative to the other hole module.
In one embodiment, the positions of the holes to be measured are arranged corresponding to the positions of the design holes, and the design holes are actually designed holes on the circuit board.
In another aspect, a method for determining drilling parameters is provided, which includes the following steps:
according to the method for evaluating the drilling quality of any one technical scheme, the drilling quality is evaluated to obtain a drilling quality index;
and determining drilling parameters required by machining according to a third preset requirement and based on the drilling quality index and the drill parameters.
According to the method for determining the drilling parameters, the drilling quality index is obtained according to the method for evaluating the drilling quality, and the drilling parameters required by actual processing are designed in combination with the parameters of the drill cutter, so that the drilling precision of the circuit board obtained by subsequent processing can be improved.
In addition, the circuit board is further provided, the processing of the circuit board comprises a drilling process, and the drilling parameters in the drilling process are determined by the method for determining the drilling parameters in the technical scheme.
Above-mentioned circuit board adopts more accurate drilling parameter to carry out drilling processing, and drilling accuracy is high, has promoted the processing quality of circuit board.
Drawings
FIG. 1 is a flow chart of a method for determining drilling parameters in an embodiment;
FIG. 2 is a layout of holes drilled in a substrate according to an embodiment;
FIG. 3 is a sequence diagram of drilling holes in a substrate according to an embodiment.
Reference is made to the accompanying drawings in which:
100. a substrate; 200. a hole module; 210. a first array of apertures; 220. a second array of apertures; 300. and (7) positioning the holes.
Detailed Description
Embodiments of the present invention are described in detail below with reference to the accompanying drawings:
it will be understood that when an element is referred to herein as being "secured" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 3, a method for evaluating the quality of a drilled hole includes the following steps:
processing at least two first holes and at least two second holes on the substrate 100 according to a first preset requirement to form a first hole array 210;
processing at least two second holes on the substrate 100 according to a second preset requirement and based on the position of the first hole array 210, wherein the at least two second holes form a second hole array 220, and the second hole array 220 is obtained by processing in a second feed sequence;
acquiring a last processed second hole based on the second feed sequence, wherein the hole to be detected is the last processed second hole acquired based on the second feed sequence;
and evaluating the drilling quality of the hole to be measured and finishing the evaluation.
According to the method for evaluating the drilling quality, the second hole array 220 is obtained by processing based on the position of the first hole array 210, and the position of the second hole array 220 can be determined based on the position of the first hole array 210; the second hole array 220 is processed in a second feed sequence, and based on the second feed sequence, the last processed second hole, namely the hole to be measured, can be clearly determined, and the quality of the drilled hole is evaluated.
The conventional evaluation method: designing DOE (design of tools) or full factor experiments according to parameters provided by suppliers, setting different feed speeds, tool rotating speeds and hole numbers, processing a first hole array 210 on a substrate 100, then carrying out slicing test on the obtained PCB, selecting the last row or any position of the first hole array 210 at the slicing position, observing the hole wall processing quality of the corresponding first hole under an optical microscope, obtaining related quality evaluation indexes, further analyzing index data design and determining the optimal drilling parameters so as to carry out subsequent production. However, the slicing test has a problem that the quality of hole wall machining of the first hole cannot be accurately evaluated because: the number of holes of the first hole array 210 is large, when a hole to be tested is selected, the first hole in the last row or at any position is directly selected for testing, the problem that the hole to be tested is not the first hole obtained by final processing easily exists, the quality of the hole wall of the first hole obtained by processing cannot be truly reflected, the reliability of an evaluation result is poor, and a reliable basis cannot be provided for subsequent drilling parameter design.
In this embodiment, the first hole array 210 is used as a position reference for searching the second hole array 220, and simultaneously, the abrasion process of the drill tool during machining is simulated, after the first hole array 210 is machined, the second hole array 220 performs feed machining according to the determined second feed sequence, so that which hole is the second hole which is machined last can be obtained very definitely, the second hole can be used as a hole to be measured, and the result obtained by detection truly reflects whether the drilling quality of the second hole obtained by machining reaches the standard after the drill tool is worn for a period of time, so that the influence of the drill tool on the drilling quality possibly caused by abrasion during the machining process can be really simulated in actual production, and the drill tool can be used as a reference in subsequent drilling parameter design to avoid the influence and improve the drilling quality.
It should be noted that:
the first preset requirements refer to the number of the first holes, drilling requirements and the like;
the second preset requirements refer to the number of the second holes, the drilling requirements, the orientation of the second hole array 220 relative to the first hole array 210, and the like;
in the evaluation, a single index or two or more drilling quality indexes can be used for evaluation, such as roughness/smoothness of hole walls, lamp wicks, glass yarn whitening and the like.
Wherein:
the lamp wick is as follows: the glass fibers on the hole wall are separated after drilling, and the length of copper whiskers formed by residual liquid medicine during subsequent copper deposition exceeds the standard;
glass yarn whiting indicates: the phenomenon of looseness of base material layers at the edge of the hole is caused by the acting force of the drill during drilling, and the phenomenon of whitening of glass fibers formed during subsequent copper deposition.
Referring to fig. 2 and 3, at least two second hole arrays 220 are formed on the substrate 100, and adjacent second hole arrays 220 are spaced apart from each other.
The second hole array 220 is provided with at least two, is the interval setting between the different second hole arrays 220 to when processing, when the drilling tool feed, there is the time that can stop in the middle, leads to the heat dissipation and the chip removal poor in order to avoid too intensive drilling, no longer gives details.
Referring to fig. 2 and 3, the adjacent second hole arrays 220 are correspondingly disposed, so that the second holes at corresponding positions are disposed in rows or columns.
In fig. 2, the two rows of the second hole arrays 220 form a large row, and thus correspond to each other, which not only facilitates processing, but also facilitates slice sampling.
In one embodiment, the second hole array 220 is machined in a second feed sequence comprising the steps of:
the drill bit machines all the second holes corresponding to the first row on the substrate 100;
the drill produces a second row of corresponding second holes in the substrate 100.
Referring to fig. 3, the second hole arrays 220 are respectively 2 × 2 square arrays, two second holes in the first row in the left second hole array 220 and two second holes in the first row in the right second hole array 220 form one row, two second holes in the second row in the left second hole array 220 and two second holes in the second row in the right second hole array 220 form another row, when machining is performed, after the whole row is machined, the machining is performed to the second row, and another whole row is machined; of course, the processing can be performed according to the sequence, and the description is omitted.
Further, the second hole array 220 includes n × n second holes, where n is greater than or equal to 2 and less than or equal to 5.
In order to avoid the problems of poor heat dissipation and difficult chip removal of the tool caused by the excessively dense second holes during machining, n cannot be too large, and is not described herein again.
In one embodiment, the first hole array 210 is machined in a first feed sequence, the machining of the first hole array 210 comprising the steps of:
the drill bit is used for processing a first hole at a first preset hole position of the substrate 100;
the drill bit is used for processing another first hole at a second preset hole position of the substrate 100, and at least one third preset hole position is arranged between the first preset hole position and the second preset hole position at intervals.
During processing, a plurality of preset hole sites are planned in advance, the preset hole sites comprise a first preset hole site, a second preset hole site and a third preset hole site, only one third preset hole site exists between the first preset hole site and the second preset hole site, at least one preset hole site is arranged between the first preset hole site and the second preset hole site at an interval, the preset hole sites at intervals are collectively called the third preset hole site for convenience in expression, during processing, a first hole is processed, when another first hole is processed, the preset hole site which is not adjacent to the processed first hole is selected for processing, and positions with a plurality of preset hole sites at intervals are selected for processing the next first hole, so that the problems that the positions of the continuously processed first holes are too close to cause difficulty in heat dissipation and chip removal are avoided; when another first hole is machined, the next first hole is machined by selecting a non-adjacent preset hole position, and the description is omitted here.
The first feeding sequence belongs to an irregular feeding mode, and aims to avoid the problems that the heat dissipation of a cutter is difficult, the chip removal is difficult due to the pulling of resin and glass fibers and the like, which are possibly caused by intensive feeding.
Referring to fig. 2, the first hole array 210 and the second hole array 220 form a hole module 200, and at least two hole modules 200 are formed, and different hole modules 200 are processed by different drilling tools.
The aperture module 200 includes a first aperture array 210 and a second aperture array 220, but is not limited to two aperture arrays; after one hole module 200 is processed, the drill is changed, and the next hole module 200 is processed, so that each hole array has a hole to be measured which is processed finally, and a plurality of holes to be measured can be obtained, so that the drilling quality of each area on the whole substrate 100 can be comprehensively reflected.
At this time:
and acquiring the last processed second hole based on the second feed sequence, wherein the process that the hole to be detected is the last processed second hole acquired based on the second feed sequence comprises the following steps: based on the second feed sequence corresponding to the hole module 200, the obtained corresponding last processed second hole is a hole to be measured;
the process of evaluating the drilling quality of the hole to be measured and finishing the evaluation comprises the following steps: and respectively evaluating the drilling quality of the corresponding holes to be measured and finishing the drilling quality evaluation of all the holes to be measured.
Further, different hole modules 200 are machined using different hole machining parameters and different drill bits.
Different hole machining parameters are set through different hole modules 200 to evaluate the drilling quality obtained under different machining parameters, at the moment, a plurality of holes to be tested are generated under different machining parameters, the drilling quality of the holes to be tested is evaluated, and the evaluation quality is further improved.
It should be noted that: different hole modules 200 may be understood as the hole modules 200 arranged in the same manner and distributed at different positions of the substrate 100, and different hole modules 200 may also be understood as the hole modules 200 including different numbers of first holes and second holes and distributed at different positions of the substrate 100, and will not be described in detail.
Referring to fig. 2, two adjacent hole modules 200 are spaced apart from each other, and one hole module 200 is inclined with respect to the other hole module 200.
In fig. 2, four hole modules 200 are distributed from left to right, and the omission in fig. 2 also indicates that more hole modules 200 may be arranged in a row as needed.
As can be seen from fig. 2, when the first pore module 200 is taken as a reference, the second pore module 200 is rotated 90 ° counterclockwise, the third pore module 200 is rotated 45 ° counterclockwise, and the fourth pore module 200 is rotated 135 ° counterclockwise, which are arranged at different inclination angles.
In one embodiment, the positions of the holes to be measured are arranged corresponding to the positions of the design holes, and the design holes are actually designed holes on the circuit board.
When the design holes are arranged, the second hole processed at the last time, namely the hole to be measured, is just the position of the design hole, so that the drilling situation in actual production can be simulated more vividly, and the reliability of drilling quality evaluation is further improved.
The design hole refers to a position of an actually designed hole on the circuit board, such as an actual design position of a metal hole.
In fig. 2, there are four hole modules 200, each hole module 200 includes a first hole array 210 and two second hole arrays 220, the first hole array 210 is a four-row five-column hole array, and the second hole array 220 is a two-row two-column square array. The meaning of the ellipses in fig. 2 means: as required, the hole modules 200 may be further arranged in an array to fill the entire substrate 100 and obtain more holes to be tested, so as to more comprehensively evaluate the drilling quality of the holes drilled in the substrate 100.
In fig. 3, the edge of the substrate 100 is further provided with a positioning hole 300, and during processing, the positioning hole 300 is processed first to facilitate positioning or clamping, which is not described herein again.
Referring to fig. 1, a method for determining drilling parameters includes the following steps:
the method for evaluating the drilling quality according to any one of the embodiments is used for evaluating the drilling quality and obtaining a drilling quality index;
and determining drilling parameters required by machining according to a third preset requirement and based on the drilling quality index and the drill parameters.
According to the method for determining the drilling parameters, the drilling quality index is obtained according to the method for evaluating the drilling quality, and the drilling parameters required in actual processing are designed in combination with the parameters of the drill cutter, so that the drilling precision of the circuit board obtained by subsequent processing can be improved.
Before the drilling parameters are determined, firstly, drilling processing is carried out on the base material 100, and the actual drilling situation and the finally obtained drilling quality are evaluated, so that the drilling situation in actual production is predicted; then, based on the evaluation result and in combination with the used drill parameters, suitable drilling parameters are determined according to a third preset requirement.
The third preset requirement refers to a design requirement obtained by comprehensively considering the drilling position, the possible abrasion condition of the drill, the actual condition of the processing, the actual condition of the base material 100 and the like.
And after the drilling parameters are determined, generating or compiling a drilling strip file, and performing machining processes such as drilling, copper deposition, plate plating and the like according to the drilling strip file.
During evaluation, the position of the hole to be measured is sliced, ground and observed, so as to evaluate through roughness, wick and glass sand whitening indexes, and judge whether the receiving standards of IPC (Institute of Printed Circuits, now International electronic industry Association) are met, such as whether the roughness is less than or equal to 25 mm, the wick is less than or equal to 80 microns, and the glass sand whitening is less than or equal to 100 microns. Through slicing processing, hole wall quality data under different parameter designs can be obtained, and main effect diagram analysis is carried out through Mintab software to obtain reasonable drilling parameters so as to be applied to subsequent actual production.
The embodiment also provides a circuit board, wherein the processing of the circuit board comprises a drilling process, and the drilling parameters of the drilling process are determined by adopting the method for determining the drilling parameters in the embodiment.
This circuit board in the course of working, has the flow of drilling, because adopt more accurate drilling parameter to carry out drilling processing, the drilling precision is high, has promoted the processing quality of circuit board.
The circuit board can be a single-layer board, or a two-layer board or a multi-layer board, and in the processing process, the required circuit board is finally obtained through the processes of circuit pattern design, development exposure, drilling, copper deposition, board plating and the like, and the description is omitted.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method of assessing the quality of a borehole, comprising the steps of:
processing at least two first holes on a base material according to a first preset requirement, wherein the at least two first holes form a first hole array;
processing at least two second holes on the base material according to a second preset requirement and based on the position of the first hole array, wherein the at least two second holes form a second hole array, and the second hole array is obtained by processing in a second feed sequence;
acquiring the last processed second hole based on the second feed sequence, wherein the hole to be detected is the last processed second hole acquired based on the second feed sequence;
and evaluating the drilling quality of the hole to be tested and finishing the evaluation.
2. The method according to claim 1, wherein at least two of the second hole arrays are formed on the substrate, and the adjacent second hole arrays are spaced apart from each other.
3. The method according to claim 1, wherein the second hole arrays adjacent to each other are disposed correspondingly so that the second holes at corresponding positions are disposed in a row or a column.
4. The method of claim 3, wherein the second array of holes is processed in a second feed sequence comprising the steps of:
the drill bit is used for processing all the second holes corresponding to the first row on the base material;
and the drill bit is used for processing all the second holes corresponding to the second row on the base material.
5. The method of claim 1, wherein the first array of holes is machined in a first feed sequence, the machining of the first array of holes comprising the steps of:
the drill bit is used for processing a first hole at a first preset hole position of the base material;
and the drill bit processes another first hole at a second preset hole position of the base material, and at least one third preset hole position is arranged between the first preset hole position and the second preset hole position at intervals.
6. The method of claim 1, wherein the first array of holes and the second array of holes form at least two hole modules, and different drill bits are used to machine different hole modules;
the second hole processed last is obtained based on the second feed sequence, and the process that the hole to be measured is the second hole processed last obtained based on the second feed sequence includes: based on the second feed sequence corresponding to the hole module, the obtained corresponding last processed second hole is the hole to be measured;
the process of evaluating the drilling quality of the hole to be measured and finishing the evaluation comprises the following steps: and respectively evaluating the drilling quality of the corresponding holes to be measured and finishing the drilling quality evaluation of all the holes to be measured.
7. The method of claim 6, wherein adjacent two of said hole modules are spaced apart and one of said hole modules is inclined relative to the other of said hole modules.
8. The method for evaluating the quality of drilled holes according to any of claims 1 to 7, wherein the positions of the holes to be measured are set corresponding to the positions of design holes which are actually designed holes on the circuit board.
9. A method of determining drilling parameters, comprising the steps of:
the method for evaluating the quality of a drilled hole according to any one of claims 1 to 8, wherein the quality of the drilled hole is evaluated and a drilled hole quality index is obtained;
and determining drilling parameters required by machining according to a third preset requirement and based on the drilling quality index and the drill parameters.
10. A circuit board, characterized in that the processing of the circuit board includes a drilling process, and the drilling parameters of the drilling process are determined by the method for determining the drilling parameters according to claim 9.
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| JPH05259605A (en) * | 1992-03-09 | 1993-10-08 | Hitachi Telecom Technol Ltd | Printed board and manufacture thereof |
| JP4554460B2 (en) * | 2005-07-22 | 2010-09-29 | 日立ビアメカニクス株式会社 | Drilling method |
| CN102854079B (en) * | 2011-06-30 | 2015-08-12 | 大族激光科技产业集团股份有限公司 | The optimum drilling parameter acquisition methods of a kind of PCB rig and bore hole test system |
| CN202262041U (en) * | 2011-09-19 | 2012-05-30 | 湖北建浩科技有限公司 | Circuit board convenient for users to check drill hole quality |
| CN103185733B (en) * | 2011-12-30 | 2015-04-22 | 北大方正集团有限公司 | Quality detection method of boring on printed circuit board |
| CN104526758B (en) * | 2014-11-06 | 2016-03-23 | 深圳崇达多层线路板有限公司 | A kind of method controlling pcb board boring positioning precision |
| CN104476611B (en) * | 2014-12-03 | 2016-05-04 | 深圳崇达多层线路板有限公司 | A kind of large scale backboard subregion boring method |
| CN105787137A (en) * | 2014-12-23 | 2016-07-20 | 重庆航凌电路板有限公司 | PCB (Printed Circuit Board) drilling path optimization algorithm |
| CN104841969A (en) * | 2015-06-03 | 2015-08-19 | 洛阳伟信电子科技有限公司 | PCB (printed circuit board) numerical-control drilling method |
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