CN212936196U

CN212936196U - Radio frequency module and electronic equipment with same

Info

Publication number: CN212936196U
Application number: CN202021335612.3U
Authority: CN
Inventors: 王建安; 陈勇利
Original assignee: AAC Technologies Pte Ltd
Current assignee: AAC Technologies Pte Ltd
Priority date: 2020-07-08
Filing date: 2020-07-08
Publication date: 2021-04-09
Anticipated expiration: 2030-07-08
Also published as: WO2022006987A1

Abstract

The utility model provides a radio frequency module and have its electronic equipment, wherein the radio frequency module is applied to electronic equipment, and be connected with electronic equipment's mainboard electricity, the radio frequency module includes the first circuit board that piles up by multilayer substrate, the second circuit board that piles up by multilayer substrate and the antenna structure who piles up by multilayer substrate, first circuit board and the laminating of antenna structure stromatolite, first circuit board includes the radio frequency front end circuit of being connected with the antenna structure electricity, the second circuit board is used for the electricity to connect first circuit board and mainboard, one in first circuit board and the antenna structure uses the same material with the second circuit board to make, in first circuit board and the antenna structure with the same one of second circuit board material with second circuit board integrated into one piece. The technical scheme of the utility model radio frequency module structure is complicated among the prior art, the higher problem of processing cost can be solved effectively.

Description

Radio frequency module and electronic equipment with same

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electroacoustic conversion field especially relates to a sounding device and have its electronic equipment.

[ background of the invention ]

With the commercialization of 5G, not only the maturity of technology and the popularization of networks, but also terminals and applications are more implied. In 5G mobile equipment, a chip and a receiving and transmitting signal such as antenna radio frequency are needed to realize 5G data transmission, and a radio frequency module is required to operate. With the continuous release of 5G chips, manufacturers of large modules also actively prepare 5G rf modules.

At present, all radio frequency modules in the market are usually integrally stacked in one step by using high frequency circuit boards, as shown in fig. 9, both the radio frequency front end 10 'and the antenna structure 30' are processed by using the high frequency circuit boards, although the high frequency circuit boards have excellent performance, the stacking processing difficulty is large, and the cost is high. And the connecting wire 20 ' for connecting the main board and the high-frequency circuit board needs to be electrically connected with the high-frequency circuit board through the separate male connector end 51 ' and the separate female connector end 52 ', and has complex structure and higher cost.

[ Utility model ] content

An object of the utility model is to provide a radio frequency module and have its electronic equipment for solve among the prior art problem that radio frequency module structure is complicated, the processing cost is higher.

The technical scheme of the utility model as follows: in order to achieve the above object, an aspect is provided, the utility model discloses a radio frequency module is applied to electronic equipment, and be connected with electronic equipment's mainboard electricity, the radio frequency module includes the first circuit board that piles up by multilayer substrate, the second circuit board that piles up by multilayer substrate and the antenna structure who piles up by multilayer substrate, first circuit board and the laminating of antenna structure stromatolite, first circuit board includes the radio frequency front end circuit of being connected with the antenna structure electricity, the second circuit board is used for the electricity to connect first circuit board and mainboard, one in first circuit board and the antenna structure uses the same material with the second circuit board to make, in first circuit board and the antenna structure with the same one of second circuit board material with second circuit board integrated into one piece.

Preferably, one of the first circuit board and the antenna structure, which is integrally formed with the second circuit board, shares at least one layer of substrate with the second circuit board.

Preferably, the first circuit board is made of low temperature co-fired ceramic and the second circuit board and the antenna structure are made of liquid crystal polymer, or the first circuit board and the second circuit board are made of liquid crystal polymer and the antenna structure is made of low temperature co-fired ceramic.

Preferably, the first circuit board is made of low temperature co-fired ceramic, and the second circuit board and the antenna structure are made of polytetrafluoroethylene, or the first circuit board and the second circuit board are made of polytetrafluoroethylene, and the antenna structure is made of low temperature co-fired ceramic.

Preferably, the first circuit board is made of low temperature co-fired ceramic, and the second circuit board and the antenna structure are made of polyimide resin, or the first circuit board and the second circuit board are made of polyimide resin, and the antenna structure is made of low temperature co-fired ceramic.

Preferably, the first circuit board is bonded or soldered to the antenna structure.

Preferably, the second circuit board is a flexible circuit board.

Preferably, a connector is arranged on the second circuit board, and the connector is used for connecting the second circuit board and the mainboard.

Preferably, the antenna structure includes a radiation surface, and the radiation surface is disposed on a side of the antenna structure facing away from the first circuit board.

On the other hand, the utility model also provides an electronic equipment, including the radio frequency module, the radio frequency module is for containing the above-mentioned radio frequency module of whole or partial technical structure.

The beneficial effects of the utility model reside in that: the circuit board at which the antenna structure and the radio frequency front-end circuit are arranged in a split mode and processed respectively, so that materials of all parts can be selected according to functional requirements, and the processing cost of the radio frequency module is reduced. One of the first circuit board and the antenna structure is made of the same material as the second circuit board, and the first circuit board and the antenna structure which are made of the same material as the second circuit board are integrally formed with the second circuit board, so that a connector which is independently arranged and used for connecting the first circuit board and the second circuit board is replaced, the structure of the radio frequency module is simplified, and the processing cost of the radio frequency module is reduced.

[ description of the drawings ]

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of a first embodiment of a sound generating device according to the present invention;

FIG. 2 is a schematic view of the sound device of FIG. 1 from another perspective;

FIG. 3 is a schematic view of the sound device of FIG. 1 from another perspective;

FIG. 4 is an enlarged partial schematic view of the sound device of FIG. 3 at A;

fig. 5 is a schematic structural view of a second embodiment of the sound generating device according to the present invention;

FIG. 6 is a schematic view of the sound device of FIG. 5 from another perspective;

FIG. 7 is a schematic view of the sound device of FIG. 5 from another perspective;

FIG. 8 is an enlarged partial schematic view of the sounder device of FIG. 7 at B; and

fig. 9 is a schematic structural diagram of an embodiment of a prior art sound production device.

The above figures contain the following reference numerals:

10. a first circuit board; 20. a second circuit board; 21. a substrate; 30. an antenna structure; 31. a radiating surface; 40. a connector; 10', a radio frequency front end; 20', connecting lines; 30', an antenna structure; 51', a connector male end; 52' and a connector female end.

[ detailed description ] embodiments

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example one

As shown in fig. 1, the radio frequency module of this embodiment includes a first circuit board 10 stacked by multiple layers of substrates, a second circuit board 20 stacked by multiple layers of substrates, and an antenna structure 30 stacked by multiple layers of substrates, the first circuit board 10 and the antenna structure 30 are laminated in the direction X in the drawing, the first circuit board 10 includes a radio frequency front end circuit electrically connected to the antenna structure 30, the second circuit board 20 is used for electrically connecting the first circuit board 10 and the motherboard, and the antenna structure 30 and the second circuit board 20 are made of the same material and are integrally formed.

By applying the technical scheme of the embodiment, the antenna structure 30 and the first circuit board 10 where the rf front-end circuit is located are separately arranged and respectively processed, so that materials of each part can be selected according to functional requirements, which is beneficial to reducing the processing cost of the rf module. The antenna structure 30 and the second circuit board 20 are made of the same material and are integrally formed, and a connector which is independently arranged and used for connecting the antenna structure 30 and the second circuit board 20 is replaced, so that the structure of the radio frequency module is simplified, and the processing cost of the radio frequency module is reduced.

As shown in fig. 1, the antenna structure 30 of the present embodiment includes a radiation surface 31, and the radiation surface 31 is disposed on a side of the antenna structure 30 away from the first circuit board 10.

As shown in fig. 4, the antenna structure 30 of the present embodiment and the second circuit board 20 at least share one substrate 21.

Preferably, the first circuit board 10 of the present embodiment is made of Low Temperature Co-fired Ceramic (LTCC), and the first circuit board 10 and the antenna structure 30 may be fixed by Surface Mount Technology (SMT). The second circuit board 20 and the antenna structure 30 are integrally formed using Liquid Crystal Polymer (LCP).

It should be noted that, in other embodiments not shown in the drawings, the high-frequency circuit board and the antenna structure may also be fixed by gluing.

In other embodiments, not shown in the figures, the second circuit board and the antenna structure may also be made of teflon or polyimide resin,

as shown in fig. 1 and 2, the second circuit board 20 of the present embodiment is a flexible circuit board, which can be bent and deformed to some extent, and is convenient for connecting with a main board.

As shown in fig. 2 and fig. 3, the second circuit board 20 of the present embodiment is provided with a connector 40, and the connector 40 is used for connecting the rf module to the motherboard to realize electrical connection between the rf module and the motherboard.

Example two

In the second embodiment, the connection manner between the antenna structure 30, the second circuit board 20 and the first circuit board 10 is changed on the basis of the first embodiment, and specifically, as shown in fig. 5 to 8, the first circuit board 10 and the second circuit board 20 of the present embodiment are made of the same material and are integrally formed.

Specifically, the antenna structure 30 of the present embodiment is made of low temperature co-fired ceramic (LTCC), the first circuit board 10 and the antenna structure 30 can be connected and fixed by Surface Mount Technology (SMT), and the second circuit board 20 and the first circuit board 10 are integrally formed by using Liquid Crystal Polymer (LCP).

In other embodiments not shown in the figures, the first circuit board and the second circuit board are made of polytetrafluoroethylene or polyimide resin.

Referring to fig. 5 to 8, the first circuit board 10 of the present embodiment is stacked on the antenna structure 30 along the X direction in the drawing.

The utility model also provides an electronic equipment, the electronic equipment (not shown in the figure) according to this embodiment includes the sound production device, specifically, the sound production device is for containing the sound production device of above-mentioned whole or partial technical structure. The electronic equipment of the embodiment has the advantages of simple structure and low processing cost.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.

Claims

1. The utility model provides a radio frequency module, is applied to electronic equipment, and with electronic equipment's mainboard electricity is connected, its characterized in that, the radio frequency module include by the first circuit board that multilayer substrate piled up, by the second circuit board that multilayer substrate piled up and by the antenna structure that multilayer substrate piled up, first circuit board with the laminating of antenna structure stromatolite, first circuit board include with the radio frequency front end circuit that antenna structure electricity is connected, the second circuit board is used for the electricity to be connected first circuit board with the mainboard, first circuit board with one in the antenna structure with the second circuit board uses the same material to make, first circuit board with in the antenna structure with the same one of second circuit board material with second circuit board integrated into one piece.

2. The radio frequency module of claim 1, wherein one of the first circuit board and the antenna structure that is integrally formed with the second circuit board shares at least one substrate with the second circuit board.

3. The radio frequency module of claim 2, wherein the first circuit board is made of low temperature co-fired ceramic and the second circuit board and the antenna structure are made of liquid crystal polymer, or the first circuit board and the second circuit board are made of liquid crystal polymer and the antenna structure is made of low temperature co-fired ceramic.

4. The radio frequency module of claim 2, wherein the first circuit board is made of low temperature co-fired ceramic and the second circuit board and the antenna structure are made of polytetrafluoroethylene, or the first circuit board and the second circuit board are made of polytetrafluoroethylene and the antenna structure is made of low temperature co-fired ceramic.

5. The radio frequency module according to claim 2, wherein the first circuit board is made of low temperature co-fired ceramic and the second circuit board and the antenna structure are made of polyimide resin, or the first circuit board and the second circuit board are made of polyimide resin and the antenna structure is made of low temperature co-fired ceramic.

6. The radio frequency module of claim 1, wherein the first circuit board is bonded or soldered to the antenna structure.

7. The radio frequency module of claim 1, wherein the second circuit board is a flexible circuit board.

8. The RF module of claim 1, wherein the second circuit board has a connector disposed thereon, the connector being configured to connect the second circuit board to a motherboard.

9. The radio frequency module of claim 1, wherein the antenna structure includes a radiating surface, and the radiating surface is disposed on a side of the antenna structure facing away from the first circuit board.

10. An electronic device comprising a radio frequency module, wherein the radio frequency module is as claimed in any one of claims 1 to 9.