CN103152068A - Communication device with wireless module packaging structure and manufacture method thereof - Google Patents
Communication device with wireless module packaging structure and manufacture method thereof Download PDFInfo
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- CN103152068A CN103152068A CN2013100417960A CN201310041796A CN103152068A CN 103152068 A CN103152068 A CN 103152068A CN 2013100417960 A CN2013100417960 A CN 2013100417960A CN 201310041796 A CN201310041796 A CN 201310041796A CN 103152068 A CN103152068 A CN 103152068A
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- wireless module
- packaging structure
- module packaging
- communication device
- packing colloid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
The invention discloses a communication device with a wireless module packaging structure and a manufacture method of the communication device with the wireless module packaging structure. The communication device comprises a circuit board, the wireless module packaging structure and a top cover, wherein the wireless module packaging structure is provided with a bottom face and a top face, the bottom face of the wireless module packaging structure is arranged on the circuit board, the top face of the wireless module packaging structure is provided with a signal feed-in point, the top cover is connected with the circuit board and covered on the wireless module packaging structure, an antenna pattern and a pin are arranged on the surface of the top cover, the antenna pattern is connected with one end of the pin, and the other end of the pin is abutted against the signal feed-in point of the wireless module packaging structure in a corresponding mode. The top face of the wireless module packaging structure is directly fed in the antenna through the pin, packaging operation can be effectively simplified, a route of signal transmission is shortened, and signal losses are reduced.
Description
Technical field
The present invention relates to a kind of communication device, particularly relevant for a kind of communication device and manufacture method thereof of tool wireless module packaging structure.
Background technology
at present general wireless module (Wireless module) or RF front-end module (RF front-end module) are all that the bottom circuit that sees through its base plate for packaging (substrate) is electrically connected to system board (mother board), the radio frequency connector (RF connector) and the coaxial cable (RF cable) that see through on system board are connected to the antenna that is arranged on product casing again, or make system board be connected to a circuit of base plate for packaging, and provide a signal feed-in point on the mainboard surface, allow antenna be electrically connected described signal feed-in point, and then formation wireless communication apparatus, mobile phone for example.
Yet, due to above-mentioned from base plate for packaging bottom circuit to system board, long to the path that connects antenna by system board again, easily increase the loss of signal, and quite numerous and diverse and increase element cost (as radio frequency connector, coaxial cable) on assembling process.
Therefore, be necessary to provide a kind of communication device and manufacture method thereof of tool wireless module packaging structure, to solve the existing problem of prior art.
Summary of the invention
Main purpose of the present invention is to provide a kind of communication device of tool wireless module packaging structure, and it can be simplified assembling operation, shorten signaling path, dwindles the size of wireless product and reduces assembly cost.
For reaching aforementioned purpose, one embodiment of the invention provides a kind of communication device of tool wireless module packaging structure, and the communication device of described tool wireless module packaging structure comprises: a circuit substrate; One wireless module packaging structure has a bottom surface and an end face, and its bottom surface is arranged on described circuit substrate, and its end face is provided with a signal feed-in point; An and top cover, connect described circuit substrate and cover described wireless module packaging structure, described top cover surface is provided with an antenna pattern and a thimble, and described thimble one end connects the described signal feed-in point of described antenna pattern and the described wireless module packaging structure of the corresponding butt of another end.
Moreover, another embodiment of the present invention provides a kind of manufacture method of communication device of tool wireless module packaging structure, described manufacture method comprises step: a wireless module packaging structure is arranged at a circuit substrate, and described wireless module packaging structure end face is provided with a signal feed-in point; And a top cover correspondence with antenna pattern is covered described circuit substrate, make a thimble correspondence that connects described antenna pattern abut to described signal feed-in point.
The position of exporting due to the signal of wireless module packaging structure of the present invention directly is fed into antenna by thimble by the end face that the substrate bottom changes by the wireless module packaging structure, can effectively shorten the path that signal transmits, reduce the loss of signal, also help dwindle the size of wireless product and reduce costs simultaneously.
Description of drawings
Fig. 1 is the structural representation of communication device of the tool wireless module packaging structure of one embodiment of the invention.
Fig. 2 is the structural representation of communication device of the tool wireless module packaging structure of another embodiment of the present invention.
Fig. 3 is the structural representation of communication device of the tool wireless module packaging structure of further embodiment of this invention.
Fig. 4 is the structural representation of communication device of the tool wireless module packaging structure of further embodiment of this invention.
Fig. 5 is the structural representation of communication device of the tool wireless module packaging structure of further embodiment of this invention.
Fig. 6 is the structural representation of communication device of the tool wireless module packaging structure of further embodiment of this invention.
Fig. 7 is the manufacture method schematic diagram of the communication device of Fig. 1 tool wireless module packaging structure.
Embodiment
For allowing above-mentioned purpose of the present invention, feature and advantage become apparent, preferred embodiment of the present invention cited below particularly, and cooperation accompanying drawing are described in detail below.Moreover, the direction term that the present invention mentions, such as " on ", D score, 'fornt', 'back', " left side ", " right side ", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to limit the present invention.
Please refer to shown in Figure 1ly, Fig. 1 is the structural representation of communication device of the tool wireless module packaging structure of one embodiment of the invention.The communication device of disclosed tool wireless module packaging structure comprises a circuit substrate 1, a wireless module packaging structure 2 and a top cover 3.
Described circuit substrate 1 is a printed circuit board (PCB), and its surface is provided with several weld pads.
Described wireless module packaging structure 2 is arranged on described circuit substrate 1, and has a bottom surface 200 and an end face 201, and its bottom surface 200 is electrically connected described circuit substrate 1, and 201 of its end faces are provided with a signal feed-in point 202.In more detail, in the present embodiment, described wireless module packaging structure 2 comprises a base plate for packaging 21, a chip 22, at least one passive component 23, a packing colloid 24 and an electric-conductor.
Described base plate for packaging 21 is a small-sized multilayer board, and can first consist of its insulating barrier by glass fibre and epoxy resin, then replaces stacking forming by insulating barrier and circuit layer.The bottom surface of described base plate for packaging 21 is provided with several electrical junctions 210 (for example tin ball), to be electrically connected described circuit substrate 1 by described electrical junction 210.The end face of described base plate for packaging 21 also is provided with a metal endpoints 27 as wireless signal input/output end points.
Described chip 22 is a wireless telecommunications chip, it is located on described base plate for packaging 21 and has an active surface, described active surface down and the projection 220 that is provided with several chip pad and connects chip pad, wherein said chip 22 is electrically connected the surface circuit of the end face of described base plate for packaging 21 by projection 220, and then is electrically connected to described metal endpoints 27.
Described passive component 23 is be located on described base plate for packaging 21 and be electrically connected described chip 22 equally, can be for example electric capacity, described passive component 23 itself can provide the input/output end points of a wireless signal, and in the present embodiment, described passive component 23 is connected to described metal endpoints 27.
Described packing colloid 24 can be the composite material of epoxy resin and insulated particle (for example silica or aluminium oxide) for example, and it is located on the end face of described base plate for packaging 21 and coats described chip 22 and described passive component 23.
Described electric-conductor at least a portion is to be located in described packing colloid 24 and to connect described metal endpoints 27, and described electric-conductor part exposes the end face of described packing colloid 24 and described signal feed-in point is provided.And in the present embodiment, as shown in Figure 1, described electric-conductor is a conductive pole 26, described conductive pole 26 is to be arranged in described packing colloid 24, the one bottom connects described metal endpoints 27, the one top is exposed to the end face of described packing colloid 24, and its exposed top is namely as described signal feed-in point 202.Described conductive pole 26 can be to make shaping by for example wearing the sealing through hole manufacture crafts such as glue via (Through Molding Via, TMV).
Described wireless module packaging structure 2 also can further comprise a conduction shielding layer 25.Described conduction shielding layer 25 is located at surface and the exposed described electric-conductor (conductive pole 26) of described packing colloid 24, in the present embodiment, described conduction shielding layer 25 has the surface of the exposed described packing colloid 24 of a window and the top of described conductive pole 26, the window peritreme of wherein said conduction shielding layer 25 makes described conduction shielding layer 25 and the top of described conductive pole 26 keep electrically separating greater than the tip size of described conductive pole 26.Described conduction shielding layer 25 separately is electrically connected to the earthed circuit on described base plate for packaging 21, it can be to form by the mode such as sputter or plating etc. the surface that a metal coating covers described packing colloid 24, to reach the purpose of electromagnetic wave shielding, reduce extraneous electric charge, electromagnetic wave to the impact of described chip 22.
Described top cover 3 connects described circuit substrate 1 and covers described wireless module packaging structure 2, described top cover 3 surfaces are provided with an antenna pattern 30 and a thimble 31, described thimble 31 1 ends connect described antenna pattern 30, and the signal feed-in point 202 of the end face 201 of the described wireless module packaging structure 2 of the corresponding butt of another end, that is the described electric-conductor of butt (conductive pole 26).In the present embodiment, as shown in Figure 1, described thimble 31 is tops that butt is exposed to the described conductive pole 26 of described packing colloid 24 end faces.
As shown in Figure 1, described wireless module packaging structure 2 directly contacts with the thimble 31 of the antenna pattern 30 of described top cover 3 by described electric-conductor (conductive pole 26), needn't just can reach the purpose of wireless signal input/output through the circuit of described circuit substrate 1, the loss of signal can be effectively reduced in the path of therefore relatively having shortened the signal feed-in; Circuit substrate 1 does not need to arrange extra radio frequency connector and coaxial cable yet again simultaneously, therefore helps to simplify assembling operation yet, dwindles the size of wireless product and reduce element and assembly cost.
In the communication device of tool wireless module packaging structure of the present invention, the link position of described conductive pole 26 is not limited to the embodiment of Fig. 1, and its link position can change according to the particular location of signal feed-in point.
Please refer to shown in Figure 2, in another feasible embodiment of the present invention, can set in advance a tin ball 28 on described metal endpoints 27, after described packing colloid 24 to be formed, corresponding described tin ball 28 positions described conductive poles 26 that are shaped again, make the bottom of described conductive pole 26 connect described tin ball 28, and be electrically connected by described tin ball 28 and described metal endpoints 27.Thus, can relatively shorten the length of described conductive pole 26, help to reduce the higher high-precision borehole equipment of use cost, and accelerate to lead sealing through hole manufacturing speed.
Please refer to shown in Figure 3ly, in another embodiment of the present invention, itself can provide the input/output end points of a wireless signal due to described passive component 23, therefore the bottom of described conductive pole 26 also can be directly connected on an electric connecting terminal of described passive component 23.Perhaps, described conductive pole 26 also can be by wearing glue via (TMV) and wearing silicon through hole (Through Silicon Via, TSV) manufacture craft forms in described packing colloid 24 and passes on the silicon substrate of described chip 22, and then is electrically connected to a wireless signal input/output end points of the active circuit (lower surface) of described chip 22.Or, when described chip 22 is when being arranged on described base plate for packaging 21 by the routing joint technology, due to its active surface (upper surface) relation up, described conductive pole 26 also can corresponding form in one of described chip 22 active surfaces to be provided on the connection pad of input/output of wireless signal.
Except above-mentioned conductive pole form, described electric-conductor also can other forms present.
Please refer to Fig. 4, the structural representation of the communication device of the tool wireless module packaging structure of its summary signal further embodiment of this invention.Compared to previous embodiment, the difference of Fig. 4 embodiment is, described electric-conductor is a crown cap 29, and the cross section of described crown cap 29 generally is Ω type or inverted U, can be embedded in advance in described packing colloid 24 and contact with described metal endpoints 27, consisting of electric connection; Perhaps can make its perforation with a suitable size and corresponding exposed described metal endpoints 27 in advance prior to carrying out bore operation on described packing colloid 24, more described crown cap 29 is inserted described perforations and then contacts with described metal endpoints 27, consist of electric connection.The top of described crown cap 29 exposes, and comes to connect with described thimble 31 to consist of signal feed-in point.
And for example shown in Figure 5, in further embodiment of this invention, described electric-conductor can be a metal wire 40, and (wire bonding) is arranged on described base plate for packaging 21 by routing technique, and is electrically connected with described metal endpoints 27.After the described packing colloid 24 that is shaped, further described packing colloid 24 is ground or etching, so that the described metal wire 40 of part is exposed to the end face of described packing colloid 24, consists of signal feed-in point and come to connect with described thimble 31.
And for example shown in Figure 6, in further embodiment of this invention, described electric-conductor can be a separating part 250 of described conduction shielding layer 25, described separating part 250 coats a sidepiece of described packing colloid 24 and separates with conduction shielding layer 25 insulation of described ground connection, one bottom of described separating part 250 extends into the bottom surface of described packing colloid 24, or be located on described base plate for packaging 21 and connect described metal endpoints 27, come to connect with the thimble 31 of described top cover 3 as signal feed-in point in a top of described separating part 250.
Please refer to Fig. 7, Fig. 7 is the manufacture method schematic diagram of communication device of the tool wireless module packaging structure of above-mentioned Fig. 1 embodiment, described manufacture method comprises following step: at first, above-mentioned described wireless module packaging structure 2 with described conductive pole 26 is arranged at described circuit substrate 1; Then, described top cover 3 correspondences with antenna pattern 30 are covered described circuit substrate 1, thimble 31 correspondences that make described antenna pattern 30 connect abut to the exposed top of described conductive pole 26, consist of to be electrically connected.Thus, can complete the making of the communication device of tool wireless module packaging structure as shown in Figure 1.
In sum, the long disappearance in path compared to existing communication device signal feed-in, the present invention directly contacts with the thimble that is connected antenna pattern by the electric-conductor on the packing colloid that is arranged on the wireless module packaging structure, needn't just can reach the purpose of wireless signal feed-in through circuit and the element of system board, the loss of signal can be effectively reduced in the path of therefore relatively having shortened the signal feed-in; Simultaneously also do not need extra radio frequency connector and coaxial cable are set again, so the present invention also helps to simplify assembling operation, dwindles the size of wireless product and reduce element and assembly cost.
The present invention is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present invention.Must be pointed out that, published embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in scope of the present invention.
Claims (10)
1. the communication device of a tool wireless module packaging structure, it is characterized in that: the communication device of described tool wireless module packaging structure comprises:
One circuit substrate;
One wireless module packaging structure is arranged on described circuit substrate and has a bottom surface and an end face, and described bottom surface is electrically connected described circuit substrate, and described end face is provided with a signal feed-in point; And
One top cover, connect described circuit substrate and cover described wireless module packaging structure, described top cover surface is provided with an antenna pattern and a thimble, and described thimble one end connects the described signal feed-in point of described antenna pattern and the described wireless module packaging structure of the corresponding butt of another end.
2. the communication device of tool wireless module packaging structure as claimed in claim 1, it is characterized in that: described wireless module packaging structure comprises:
One base plate for packaging, one end face are provided with a metal endpoints as wireless signal input/output end points;
One chip is located on described base plate for packaging and is electrically connected to described metal endpoints;
One packing colloid is located on described base plate for packaging and coats described chip; And
One electric-conductor, its at least a portion are located in described packing colloid and are connected described metal endpoints, and described electric-conductor part exposes the end face of described packing colloid and described signal feed-in point is provided.
3. the communication device of tool wireless module packaging structure as claimed in claim 2, it is characterized in that: described electric-conductor is a conductive pole, described conductive pole is to be arranged in described packing colloid, and the one bottom connects described metal endpoints, and the one top is exposed to the end face of described packing colloid; The top of the described conductive pole of described thimble butt.
4. the communication device of tool wireless module packaging structure as claimed in claim 2, it is characterized in that: described metal endpoints is provided with a tin ball; Described electric-conductor is a conductive pole, and described conductive pole is to be arranged in described packing colloid, and the one bottom connects described tin ball, and the one top is exposed to the end face of described packing colloid; The top of the described conductive pole of described thimble butt.
5. the communication device of tool wireless module packaging structure as claimed in claim 2, it is characterized in that: described wireless module packaging structure also comprises at least one passive component, and described passive component is be located on described base plate for packaging and be electrically connected described chip; Described electric-conductor is a conductive pole, and described conductive pole is to be arranged in described packing colloid, and the one bottom is connected on an electric connecting terminal of described passive component, and the one top is exposed to the end face of described packing colloid; The top of the described conductive pole of described thimble butt.
6. the communication device of tool wireless module packaging structure as claimed in claim 2, it is characterized in that: described electric-conductor is a crown cap, it is positioned at described packing colloid and contacts with described metal endpoints, and the top of described crown cap exposes, and connects with described thimble.
7. the communication device of tool wireless module packaging structure as claimed in claim 2, it is characterized in that: described electric-conductor is a metal wire, it is arranged on described base plate for packaging and with described metal endpoints and is electrically connected; The described metal wire of part is exposed to the end face of described packing colloid, connects with described thimble.
8. the communication device of tool wireless module packaging structure as described in claim 2 to 7 any one, it is characterized in that: described wireless module packaging structure further comprises a conduction shielding layer, described conduction shielding layer is located at surface and the exposed described electric-conductor of described packing colloid, and described conduction shielding layer is electrically connected to the earthed circuit on described base plate for packaging.
9. the communication device of tool wireless module packaging structure as claimed in claim 2, it is characterized in that: described wireless module packaging structure further comprises a conduction shielding layer, and described conduction shielding layer is located at the surface of described packing colloid and is electrically connected to an earthed circuit on described base plate for packaging; Described electric-conductor is a separating part of described conduction shielding layer, described separating part coats a sidepiece of described packing colloid and separates with the conduction shielding layer insulation of described ground connection, one bottom of described separating part extends into the bottom surface of described packing colloid and connects described metal endpoints, and a top and the described thimble of described separating part connect.
10. the manufacture method of the communication device of a tool wireless module packaging structure, it is characterized in that: described manufacture method comprises step:
One wireless module packaging structure is arranged at a circuit substrate, and described wireless module packaging structure end face is provided with a signal feed-in point; And
The one top cover correspondence with antenna pattern is covered described circuit substrate, make a thimble correspondence that connects described antenna pattern abut to described signal feed-in point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100417960A CN103152068A (en) | 2013-02-04 | 2013-02-04 | Communication device with wireless module packaging structure and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100417960A CN103152068A (en) | 2013-02-04 | 2013-02-04 | Communication device with wireless module packaging structure and manufacture method thereof |
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| Publication Number | Publication Date |
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| CN103152068A true CN103152068A (en) | 2013-06-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013100417960A Pending CN103152068A (en) | 2013-02-04 | 2013-02-04 | Communication device with wireless module packaging structure and manufacture method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786932A (en) * | 2019-01-29 | 2019-05-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of encapsulating antenna, communication equipment and encapsulating antenna |
| WO2022006987A1 (en) * | 2020-07-08 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Radio frequency module and electronic device having same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697254A (en) * | 2004-05-14 | 2005-11-16 | 广达电脑股份有限公司 | Hidden type antenna |
| CN201194229Y (en) * | 2008-04-22 | 2009-02-11 | 卓恩民 | Semiconductor package for integrated antenna |
| US20100200965A1 (en) * | 2009-02-11 | 2010-08-12 | Advanced Semiconductor Engineering, Inc. | Package structure for wireless communication module |
| CN102044532A (en) * | 2010-09-16 | 2011-05-04 | 日月光半导体制造股份有限公司 | Wireless communication module and manufacturing method thereof |
| CN102074784A (en) * | 2009-11-25 | 2011-05-25 | 英业达股份有限公司 | Portable electronic device, back cover structure thereof and manufacturing method of back cover structure |
-
2013
- 2013-02-04 CN CN2013100417960A patent/CN103152068A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697254A (en) * | 2004-05-14 | 2005-11-16 | 广达电脑股份有限公司 | Hidden type antenna |
| CN201194229Y (en) * | 2008-04-22 | 2009-02-11 | 卓恩民 | Semiconductor package for integrated antenna |
| US20100200965A1 (en) * | 2009-02-11 | 2010-08-12 | Advanced Semiconductor Engineering, Inc. | Package structure for wireless communication module |
| CN102074784A (en) * | 2009-11-25 | 2011-05-25 | 英业达股份有限公司 | Portable electronic device, back cover structure thereof and manufacturing method of back cover structure |
| CN102044532A (en) * | 2010-09-16 | 2011-05-04 | 日月光半导体制造股份有限公司 | Wireless communication module and manufacturing method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786932A (en) * | 2019-01-29 | 2019-05-21 | 上海安费诺永亿通讯电子有限公司 | A kind of preparation method of encapsulating antenna, communication equipment and encapsulating antenna |
| WO2022006987A1 (en) * | 2020-07-08 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Radio frequency module and electronic device having same |
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Application publication date: 20130612 |