CN213028027U - Radio frequency module - Google Patents
Radio frequency module Download PDFInfo
- Publication number
- CN213028027U CN213028027U CN202021335615.7U CN202021335615U CN213028027U CN 213028027 U CN213028027 U CN 213028027U CN 202021335615 U CN202021335615 U CN 202021335615U CN 213028027 U CN213028027 U CN 213028027U
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- CN
- China
- Prior art keywords
- module
- circuit board
- frequency circuit
- radio frequency
- antenna unit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Combinations Of Printed Boards (AREA)
- Telephone Set Structure (AREA)
- Support Of Aerials (AREA)
Abstract
The utility model provides a radio frequency module, which comprises a high-frequency circuit board, an antenna unit which is fixed on one side of the high-frequency circuit board in a stacking way, and a connecting module which is used for connecting with an external mainboard; one of the antenna unit and the high-frequency circuit board is manufactured by a low-temperature co-fired ceramic technology. Compared with the prior art, the utility model discloses a radio frequency module's small, easily processing and equipment.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a radio frequency terminal technical field especially relates to an apply to radio frequency module of 5G product.
[ background of the invention ]
With the advent of the 5G era, the number of 5G terminals and device applications has increased. Whereas among the 5G products, the 5G mobile device is undoubtedly the most common and portable 5G terminal device. Currently, a 5G mobile device includes a chip, an antenna and a radio frequency device for processing a transceiving signal to implement 5G data transmission, and therefore, a radio frequency module becomes an important module of the 5G mobile device.
The radio frequency module group of the related art comprises a high-frequency circuit board and an antenna unit which is fixedly overlapped on the high-frequency circuit board.
However, in the related art, the radio frequency module employs the high-frequency circuit board and is processed together with the antenna unit, and although the performance is excellent, the material and processing costs are high; in addition, the high-frequency circuit board has a large number of layers, generally more than 10 layers, and has high processing difficulty; in addition, the Dielectric Constant (DK) of the high frequency circuit board is low, and the application of the high frequency circuit board to the processing of the antenna unit directly causes the volume of the antenna unit to be large, which is not favorable for miniaturization application. In application, the radio frequency module in the related art needs to be connected with the radio frequency front-end module and the peripheral circuit module through connectors, and assembly is complex.
Therefore, there is a need to provide a new rf module to solve the above-mentioned problems.
[ Utility model ] content
An object of the utility model is to provide a radio frequency module of small, easily processing and equipment.
In order to achieve the above object, the present invention provides a radio frequency module, which includes a high frequency circuit board, an antenna unit stacked and fixed on one side of the high frequency circuit board, and a connection module for connecting with an external main board; one of the antenna unit and the high-frequency circuit board is manufactured by a low-temperature co-fired ceramic technology.
Preferably, the antenna unit is made by a low-temperature co-fired ceramic technology.
Preferably, the high-frequency circuit board is made of one of polytetrafluoroethylene, a liquid crystal polymer material and modified polyimide.
Preferably, the connection module and the high-frequency circuit board are integrally formed.
Preferably, the high-frequency circuit board is manufactured by a low-temperature co-fired ceramic technology.
Preferably, the antenna unit is made of one of polytetrafluoroethylene, a liquid crystal polymer material and modified polyimide.
Preferably, the connection module and the high-frequency circuit board are integrally formed.
Preferably, the connection module includes a flexible circuit board and two connectors detachably connected to the flexible circuit board, one of the connectors is connected to the high-frequency circuit board, and the other connector is used for connecting an external motherboard.
Preferably, the connection module includes a flexible circuit board and two connectors detachably connected to the flexible circuit board, one of the connectors is connected to the high-frequency circuit board, and the other connector is used for connecting an external motherboard.
Preferably, the antenna unit and the high-frequency circuit board are fixed by surface assembly technology or gluing.
Compared with the prior art, the utility model discloses an antenna unit and one of them of high frequency circuit board of radio frequency module adopt low temperature to burn ceramic technology altogether and make, will again the high frequency circuit board with the antenna unit equipment, this structure will the high frequency circuit board with the antenna unit parts to process and assembles again for effectual different products of sharing the product range upon range of, great reduction the processing degree of difficulty. In addition, because the ceramic dielectric constant value is higher, the antenna unit or the high-frequency circuit board which is manufactured by adopting the low-temperature co-fired ceramic technology can reduce the size of the antenna, thereby reducing the volume of the radio frequency module, saving the occupied space of the radio frequency module in the whole machine and being beneficial to assembly and application.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a schematic perspective view of the radio frequency module of the present invention;
fig. 2 is an exploded view of a part of the three-dimensional structure of the rf module of the present invention;
fig. 3 is a schematic view of a three-dimensional assembly structure of the radio frequency module and the motherboard of the present invention;
fig. 4 is a schematic perspective view of another embodiment of the rf module of the present invention;
fig. 5 is a schematic perspective view of an assembled structure of the rf module and the motherboard in fig. 4;
fig. 6 is a schematic perspective view of another embodiment of the rf module according to the present invention;
FIG. 7 is an exploded view of the RF module of FIG. 6;
fig. 8 is a schematic perspective view of an assembly structure of the rf module and the motherboard shown in fig. 6.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-8, a radio frequency module 100 is provided. The rf module 100 may be connected to an external motherboard 200. The radio frequency module 100 is used for realizing transmission and reception of signals to realize 5G data transmission. The rf module 100 and the main board 200 are mounted on a device having a 5G function.
The radio frequency module 100 includes a high frequency circuit board 1 for circuit routing connection, an antenna unit 2 stacked and fixed on one side of the high frequency circuit board 1, and a connection module 5. The connection module 5 is used for connecting with an external main board 200.
One of the antenna unit 2 and the high-frequency circuit board 1 is made by a low-temperature co-fired ceramic technology. The high-frequency circuit board 1 and the antenna unit 2 are separately manufactured using two different materials and then stacked. The structure separately processes and then assembles the high-frequency circuit board 1 and the antenna unit 2, so that the radio frequency module 100 is effectively layered and distributed to different parts, and the processing difficulty is greatly reduced. In addition, because the Ceramic dielectric constant value is high, the high-frequency circuit board 1 or the antenna unit 2 made of Low Temperature Co-fired Ceramic (LTCC for short) technology can reduce the size of the antenna, thereby reducing the volume of the radio frequency module 100 and saving the occupied space of the radio frequency module in the whole machine, i.e., the radio frequency module 100 has small volume, which is beneficial to assembly and application.
The antenna unit 2 and the high-frequency circuit board 1 are fixed by Surface Mount Technology (SMT) or gluing.
The rf module 100 further includes an rf front end module 3 and a peripheral circuit module 4 electrically connected to the antenna unit 2. The radio frequency front end module 3, the peripheral circuit module 4 and the high-frequency circuit board 5 are integrally formed. That is, the rf module 100 is manufactured by processing the rf front-end module 3, the peripheral circuit module 4 and the high-frequency circuit board 1 together and then assembling the processed rf front-end module, the peripheral circuit module and the high-frequency circuit board with the antenna unit 2; or the radio frequency front end module 3 and the peripheral circuit module 4 are integrally formed by a high frequency circuit processing technology, that is, the radio frequency module 100 is manufactured by respectively assembling the radio frequency front end module 3 and the peripheral circuit module 4 with the high frequency circuit board 1 and the antenna unit 2 after being processed by the high frequency circuit processing technology. In addition, the radio frequency front end module 3, the peripheral circuit module 4 and the high frequency circuit board 1 can be processed together, so that connectors electrically connected with each other can be saved, assembly is reduced, and the processing and reliability of the radio frequency module 100 can be improved.
The present invention is described below by way of three embodiments, respectively:
(embodiment one)
Referring to fig. 1-3, the present embodiment provides a radio frequency module 100. In this embodiment, the high-frequency circuit board 1 is made of Polytetrafluoroethylene (PTFE) or/and Liquid Crystal Polymer (LCP).
The antenna unit 2 is made by low temperature co-fired ceramic technology. The antenna unit 2 is fixed on one side of the high-frequency circuit board 1 in a stacking mode.
The radio frequency front end module 3, the peripheral circuit module 4 and the connection module 5 are fixedly installed on the other side of the high-frequency circuit board 1. The radio frequency front end module 3, the peripheral circuit module 4 and the high frequency circuit board 1 are processed together into an integrated processing and forming structure, which is beneficial to the assembly of the radio frequency module 100.
The connection module 5 is used for connecting with the motherboard 200. Specifically, the connection module 5 includes a flexible circuit board 51 and two connectors 52 detachably connected to the flexible circuit board 51, one of the connectors is connected to the high-frequency circuit board 1, and the other connector is used for connecting the external motherboard 200. This structure is advantageous for reducing the processing cost of the rf module 100.
In this embodiment, the flexible printed circuit board 51 is made of one of PTFE, LCP, Modified Polyimide (abbreviated as MPI), and Polyimide (abbreviated as PI).
(second embodiment)
Referring to fig. 4-5, a second embodiment of the invention provides a radio frequency module 100 a.
The RF module 100a is substantially the same as the RF module 100. The difference from the rf module 100 of the first embodiment is: the connection module 5a is integrally formed with the high-frequency circuit board 1 a.
In the present embodiment, the high-frequency circuit board 1a is a high-frequency flexible circuit board. Of course, it is also possible that the high-frequency circuit board 1a is a general high-frequency circuit board.
The high-frequency circuit board 1a is made of one of Polytetrafluoroethylene (PTFE), Liquid Crystal Polymer (LCP) and Modified Polyimide (MPI).
In this embodiment, the antenna unit 2a is fixed to one side of the high-frequency circuit board 1a in a stacked manner, and the radio frequency front end module 3a, the peripheral circuit module 4a, and the connection module 5a are fixed to the other side of the high-frequency circuit board 1a in an installed manner. That is, the rf front-end module 3a, the peripheral circuit module 4a, and the connection module 5a are mounted and fixed on the high-frequency flexible circuit board.
The connection module 5a includes a connector 51a detachably connected to the high-frequency circuit board 1a, and the connector 51a is used for connecting to the external motherboard 200. Compared with the rf module 100 of the first embodiment, in this embodiment, the connection module 5a has one less connector than the connection module 5, which is beneficial to assembling the rf module 100a, reducing assembly, and improving reliability.
(third embodiment)
Referring to fig. 6-8, a radio frequency module 100b is provided in the third embodiment.
The RF module 100b is substantially the same as the RF module 100. The difference from the rf module 100 of the first embodiment is: the high-frequency circuit board 1b is made by a low-temperature co-fired ceramic technology; and the antenna unit 2b is made of one of Polytetrafluoroethylene (PTFE), Liquid Crystal Polymer (LCP) and Modified Polyimide (MPI).
Specifically, the antenna unit 2b is fixed to one side of the high-frequency circuit board 1b in a stacked manner.
The radio frequency front end module 3b, the peripheral circuit module 4b and the connection module 5b are fixed to the other side of the high-frequency circuit board 1 b. The radio frequency front end module 3b, the peripheral circuit module 4b and the high-frequency circuit board 1b are processed together into an integrated processing and forming structure, which is beneficial to the assembly of the radio frequency module 100 b.
In this embodiment, the connection module 5b includes a flexible circuit board 51b and two connectors 52b detachably connected to the flexible circuit board 51b, wherein one of the connectors 52b is connected to the high-frequency circuit board 1b, and the other connector 52b is used for connecting the external motherboard 200. This structure is advantageous for reducing the processing cost of the rf module 100 b.
Synthesize above-mentioned embodiment one, embodiment two and embodiment three, the utility model discloses a radio frequency module's small, easily processing and equipment.
Compared with the prior art, the utility model discloses an antenna unit and one of them of high frequency circuit board of radio frequency module adopt low temperature to burn ceramic technology altogether and make, will again the high frequency circuit board with the antenna unit equipment, this structure will the high frequency circuit board with the antenna unit parts to process and assembles again for effectual different products of sharing the product range upon range of, great reduction the processing degree of difficulty. In addition, because the ceramic dielectric constant value is higher, the antenna unit or the high-frequency circuit board which is manufactured by adopting the low-temperature co-fired ceramic technology can reduce the size of the antenna, thereby reducing the volume of the radio frequency module, saving the occupied space of the radio frequency module in the whole machine and being beneficial to assembly and application.
The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.
Claims (10)
1. A radio frequency module is characterized by comprising a high-frequency circuit board, an antenna unit and a connecting module, wherein the antenna unit is fixedly stacked on one side of the high-frequency circuit board, and the connecting module is used for being connected with an external mainboard; one of the antenna unit and the high-frequency circuit board is manufactured by a low-temperature co-fired ceramic technology.
2. The radio frequency module of claim 1, wherein the antenna unit is fabricated using a low temperature co-fired ceramic technology.
3. The rf module of claim 2, wherein the high frequency circuit board is made of one of teflon, liquid crystal polymer material and modified polyimide.
4. The RF module of claim 2 or 3, wherein the connection module is integrally formed with the high frequency circuit board.
5. The RF module according to claim 2 or 3, wherein the connection module comprises a flexible circuit board and two connectors detachably connected to the flexible circuit board, one of the connectors is connected to the high frequency circuit board, and the other connector is used for connecting an external motherboard.
6. The radio frequency module of claim 1, wherein the high frequency circuit board is fabricated using a low temperature co-fired ceramic technology.
7. The RF module of claim 6, wherein the antenna element is made of one of Teflon, a liquid crystal polymer material and modified polyimide.
8. The RF module of claim 6 or 7, wherein the connection module is integrally formed with the high frequency circuit board.
9. The RF module according to claim 6 or 7, wherein the connection module comprises a flexible circuit board and two connectors detachably connected to the flexible circuit board, one of the connectors is connected to the high frequency circuit board, and the other connector is used for connecting an external motherboard.
10. The RF module of claim 1, wherein the antenna unit is fixed to the high-frequency circuit board by surface mounting or gluing.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021335615.7U CN213028027U (en) | 2020-07-08 | 2020-07-08 | Radio frequency module |
| PCT/CN2020/123394 WO2022007245A1 (en) | 2020-07-08 | 2020-10-23 | Radio frequency module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021335615.7U CN213028027U (en) | 2020-07-08 | 2020-07-08 | Radio frequency module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213028027U true CN213028027U (en) | 2021-04-20 |
Family
ID=75501182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021335615.7U Expired - Fee Related CN213028027U (en) | 2020-07-08 | 2020-07-08 | Radio frequency module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN213028027U (en) |
| WO (1) | WO2022007245A1 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7167688B2 (en) * | 2003-07-30 | 2007-01-23 | Chi Mei Communication Systems, Inc. | RF transceiver module formed in multi-layered ceramic |
| KR100859319B1 (en) * | 2006-12-15 | 2008-09-19 | 한국과학기술원 | Package structure of ltcc module |
| CN201966901U (en) * | 2011-03-08 | 2011-09-07 | 世盟科信（北京）国际科技发展有限公司 | Radio frequency receiving and transmitting device |
| CN105024154B (en) * | 2015-07-08 | 2018-02-16 | 东莞电子科技大学电子信息工程研究院 | A kind of polynary LTCC LTCC microwave radios circuit and use its method |
| US10847869B2 (en) * | 2017-06-07 | 2020-11-24 | Mediatek Inc. | Semiconductor package having discrete antenna device |
-
2020
- 2020-07-08 CN CN202021335615.7U patent/CN213028027U/en not_active Expired - Fee Related
- 2020-10-23 WO PCT/CN2020/123394 patent/WO2022007245A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022007245A1 (en) | 2022-01-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210420 Termination date: 20210708 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |