CN113972465A - Electronic device - Google Patents

Abstract

The application discloses an electronic device. The electronic device includes: the antenna module is arranged on the inner side of the metal shell; the metal shell is provided with an antenna seam, and the antenna seam comprises a first antenna seam and a second antenna seam which are arranged in a crossed mode; the antenna module comprises an antenna unit, the antenna unit comprises a back cavity layer and a radiation layer, the back cavity layer is positioned between the radiation layer and the metal shell, the radiation layer is provided with a gap, and the gap comprises a first gap and a second gap which are arranged in a crossed mode; wherein, first antenna seam and first gap set up and the size is different relatively, and second antenna seam and second gap set up and the size is different relatively.

Description

Electronic device

Technical Field

The present application relates to the field of wireless communication technologies, and in particular, to an electronic device.

Background

With the development of 5G technology, electronic devices such as mobile phones and the like will integrate millimeter wave antenna array systems to support functions such as 5G communication and the like. The millimeter wave antenna array system comprises a millimeter wave antenna and components matched with the millimeter wave antenna, so that the requirements of the 5G communication technology are met. However, since electronic devices such as mobile phones and the like are generally configured with a metal frame or a metal rear cover, when the millimeter wave antenna array system is located inside the electronic devices such as mobile phones and the like, the metal frame or the metal rear cover will cause certain interference to the operation of the millimeter wave antenna, thereby affecting the structural design of the electronic devices on the millimeter wave antenna.

Disclosure of Invention

The application aims to provide electronic equipment to solve the problem of millimeter wave antenna integration of electronic equipment with a 5G communication function in a metal frame or metal rear cover environment.

In order to solve the above technical problem, the present application provides an electronic device, including: the antenna module is arranged on the inner side of the metal shell. The metal shell is provided with an antenna seam, and the antenna seam comprises a first antenna seam and a second antenna seam which are arranged in a crossed mode; the antenna module comprises an antenna unit, the antenna unit comprises a back cavity layer and a radiation layer, the back cavity layer is located between the radiation layer and the metal shell, the radiation layer is provided with a gap, and the gap comprises a first gap and a second gap which are arranged in a crossed mode; the first antenna seam and the first seam are oppositely arranged and have different sizes, and the second antenna seam and the second seam are oppositely arranged and have different sizes. Based on this, through the cooperation of metal casing and antenna module, the antenna seam can participate in the receipt and the sending of signal to provide smooth and easy communication experience. And the size of the second antenna seam is different from that of the first antenna seam due to the different sizes of the first antenna seam and the second antenna seam, thereby providing higher bandwidth.

In some embodiments, the radiation layer is a multilayer; the multilayer radiation layer is range upon range of the setting to all seted up the gap. In the multiple radiation layers, the size of gaps of at least part of the radiation layers is different; alternatively, the slits of the plurality of radiation layers are all different in size. Based on the multiple radiation layers, the electronic device may have a higher bandwidth to meet the frequency band specified by the 5G standard.

In some embodiments, the plurality of radiation layers includes at least a first radiation layer, a second radiation layer, a third radiation layer, a fourth radiation layer, and a fifth radiation layer, which are sequentially stacked; the second radiation layer is provided with a first power divider, and the first power divider is used for coupling and feeding the first antenna slot and the first slot. The fourth radiation layer is provided with a second power divider, and the second power divider is used for coupling and feeding the second antenna slot and the second slot. The third radiation layer is located between the second radiation layer and the fourth radiation layer, and is used for improving the isolation between the feed end of the first power divider and the feed end of the second power divider. It should be understood that the first to fifth radiation layers may have slits having different sizes, respectively, to have different resonance points, thereby expanding the bandwidth of the electronic device. Alternatively, the slits of at least some of the first to fifth radiation layers are different in size to have more resonance points, whereby the bandwidth of the electronic device can be extended as well.

In some embodiments, the first radiation layer is provided with a second protrusion at an end corresponding to the first slit, the second protrusion protruding toward the other end of the second slit to adjust impedance matching based on the second slit and the second antenna slit. This ensures normal transmission and reception of signals generated by the second slots and the second antenna slot.

In some embodiments, the first power splitter comprises a first feed end, a first feed branch, and a second feed branch; the first feeding branch and the second feeding branch are respectively connected with the first feeding end. The first feed end is positioned on one side of the first gap of the second radiation layer; a portion of the first feed branch and a portion of the second feed branch are both perpendicular to the first slot of the second radiating layer and span the first slot of the second radiating layer. Based on the first and second feeding branches, signals can be output to the first slot of each radiation layer in equal amplitude and equal phase, and to the first antenna slot of the metal housing.

In some embodiments, the second power splitter comprises a second feeding end, a third feeding branch and a fourth feeding branch; the third feeding branch and the fourth feeding branch are respectively connected with the second feeding end. The second feed end is positioned on one side of the second gap of the fourth radiation layer; a portion of the third feed branch and a portion of the fourth feed branch are both perpendicular to the second slot of the fourth radiating layer and span the second slot of the fourth radiating layer. Based on the third feeding branch and the fourth feeding branch, signals can be output to the second slits of the radiation layers in equal amplitude and equal phase, and to the second antenna slit of the metal shell.

In some embodiments, the fifth radiation layer is provided with a first protrusion at an end corresponding to the first slit, the first protrusion protruding toward the other end of the first slit to adjust impedance matching based on the first slit and the first antenna slit. Thus, normal transmission and reception of signals generated by the first slots and the first antenna slot can be ensured.

In some embodiments, the back cavity layer is located on a side of the fifth radiation layer and away from the metal housing. Based on the back cavity layer, when the antenna unit is coupled and fed through the first power divider and/or the second power divider, the related signals can be radiated more stably towards a direction far away from the electronic device.

In some embodiments, the inner wall of the metal shell corresponding to the first antenna seam and the second antenna seam is stepped. It should be appreciated that the stepped inner wall allows for the formation of multiple first and second antenna seams of different sizes within one antenna seam; based on the method, the bandwidth of the electronic equipment can be expanded to cover the frequency band specified by the 5G standard as far as possible under the condition that the number of the radiation layers of the antenna module is not increased.

In some embodiments, along the direction from the outer side to the inner side of the metal shell, the long side of the stepped inner wall is gradually reduced, and the short side of the stepped inner wall is gradually increased; or, along the direction from the outer side to the inner side of the metal shell, the long side of the stepped inner wall is gradually increased, and the short side of the stepped inner wall is gradually decreased; or the long sides and the short sides of the stepped inner wall are gradually increased along the direction from the outer side to the inner side of the metal shell; or, the long side and the short side of the step-shaped inner wall are gradually reduced along the direction from the outer side to the inner side of the metal shell.

In some embodiments, the metal housing includes a metal bezel, and the number of the antenna modules is two. The two antenna modules are arranged oppositely and are respectively arranged on the inner sides of the metal frames.

In some embodiments, the metal housing includes a metal rear cover, and the number of the antenna modules is two. The two antenna modules are arranged at intervals and are respectively arranged on the inner side of the metal rear cover.

In some embodiments, the electronic device further comprises: a dielectric material. The dielectric material is disposed within the first antenna seam and the second antenna seam of the metal shell. Therefore, the dielectric material can ensure normal receiving and transmitting of signals of the electronic equipment and improve the sealing performance of the electronic equipment.

In some embodiments, the dielectric material is a low dielectric constant, low dielectric loss material. For example: the dielectric material is teflon.

In some embodiments, the electronic device further comprises: mainboard and millimeter wave phased array chip. The mainboard is electrically connected with the antenna module and the millimeter wave phased array chip; the millimeter wave phased array chip is arranged on the antenna module and is far away from the metal shell. The number of the millimeter wave phased array chips is the same as that of the antenna modules; that is, each antenna module is configured with a millimeter wave phased array chip, and the millimeter wave phased array chip can control the antenna units in the antenna module to cooperate with the antenna units to realize the transceiving of signals.

In some embodiments, the antenna module includes four antenna elements to ensure gain and scanning of an antenna beam of the electronic device.

In some embodiments, the metal housing comprises a metal bezel comprising a main portion and a raised portion; the bulge part is positioned on one side of the main body part and is far away from the millimeter wave phased array chip; the protruding part is used for connecting a front cover and a rear cover of the electronic equipment. Based on this, through the size control to the bellying of metal frame, the electronic equipment of each embodiment can also reach the outward appearance effect of narrow frame when providing good communication experience to realize the frivolousness of electronic equipment.

In some embodiments, the millimeter wave phased array chip is electrically connected with the antenna module through flip chip bonding or reflow soldering, so that the loss of signal transmission is reduced.

This application sets up the antenna seam at metal casing, at the antenna module of the inboard integrated millimeter wave of metal casing, the metal casing that has the antenna seam from this can cooperate the antenna module to realize the receiving and dispatching of signal and satisfy the bandwidth demand of 5G communication.

Drawings

Fig. 1 is a perspective view of an electronic device according to an embodiment of the present application.

Fig. 2 is a partial schematic diagram of a millimeter wave antenna array system according to an embodiment of the present application.

Fig. 3 is a partial schematic view of a metal housing according to an embodiment of the present application.

Fig. 4 is an exploded view of an antenna module according to an embodiment of the present application.

Fig. 5 is a schematic view of a first radiation layer according to an embodiment of the present application.

Fig. 6 is a schematic view of a fifth radiation layer according to an embodiment of the present application.

Fig. 7 is a schematic view of a second radiation layer according to an embodiment of the present application.

Fig. 8 is a schematic view of a fourth radiation layer according to an embodiment of the present application.

Fig. 9 is a schematic view of a third radiation layer according to an embodiment of the present application.

FIG. 10 is a perspective view of a portion of a metal housing of an embodiment of the present application from a first perspective.

FIG. 11 is a perspective view of a portion of a metal housing of an embodiment of the present application from a second perspective.

FIG. 12 is a top view of a portion of a metal housing of an embodiment of the present application from a first perspective.

FIG. 13 is a top view of a portion of a metal housing of an embodiment of the present application from a first perspective.

Fig. 14 is a current distribution diagram of the millimeter wave antenna array system when feeding is coupled through the first power divider.

Fig. 15 and 16 are schematic diagrams of S parameters of a millimeter wave antenna array system according to an embodiment of the present application.

Fig. 17 is a data diagram of an equivalent omnidirectional radiation power and an accumulated distribution function of the millimeter wave antenna array system under the action of the 3-bit phase shifter according to the embodiment of the present application.

Fig. 18 is a cross polarization pattern of the millimeter wave antenna array system when fed by the first power divider.

Fig. 19 is a cross polarization pattern of the millimeter wave antenna array system when fed by the second power divider.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

In an electronic device having a wireless communication function, a frame thereof is mostly a metal frame to achieve both functions of beauty and practicality (e.g., wear resistance or drop resistance). Taking a mobile phone as an example, the metal frame is disposed between the front cover and the rear cover. One side of protecgulum can set up display module assembly, and display module assembly can be used for presenting visual information such as characters, image to the user acquires. One side of the rear cover can be provided with a rear shooting component which can realize the functions of shooting, recording and the like. The metal frame, the front cover and the rear cover jointly surround to form an inner space of the mobile phone, and the inner space can contain electronic elements such as a circuit board, a processor, a loudspeaker, a battery and the like, so that the mobile phone can realize functions such as data processing, music playing and the like.

In order to realize the communication function, an antenna module is further arranged in the inner space of the mobile phone so as to realize the receiving and sending of wireless signals. However, most mobile phones are configured with a metal frame, and based on the inherent electromagnetic shielding property of the metal frame, signals of the mobile phones are easily affected by the metal frame in the process of receiving and transmitting the signals, so that the signals are unstable, and the actual use experience of users is affected.

With the development and popularization of 5G, the antenna module of millimeter wave is correspondingly disposed in the electronic device, which also becomes one of the requirements for meeting the communication experience of users. Since the wavelength range of the millimeter wave is 1mm to 10mm, and the corresponding frequency band is 26.5GHz to 300GHz, the metal frame has a more serious influence on the signal in the frequency band. Therefore, the electronic equipment can also modify the metal frame in various ways, so that the millimeter wave antenna module in the electronic equipment can stably transmit signals of a certain specific frequency band. For example: holes are formed in the frame of the mobile phone so as to embed the millimeter wave antenna module in the holes, and the like. However, based on these methods, the frequency band of the signal that can be transmitted and received by the mobile phone is narrow, and problems such as impedance mismatch, poor structural stability, poor interconnection between the antenna and the chip are likely to occur, which results in large loss of the signal during the transmission and reception process.

With reference to fig. 1 to fig. 19, in view of the above problems, embodiments of the present application provide an electronic device 10, where the electronic device 10 includes a millimeter wave antenna array system 20. Through the cooperation of the metal shell and the antenna module, the millimeter wave antenna array system 20 and the corresponding electronic device 10 can both meet the bandwidth requirement of 5G, and provide good 5G communication experience.

In some embodiments, the millimeter wave antenna array system 20 may be applied in IEEE 802.11.ad (60GHz WiGig), IEEE 802.11.aj (45GHz Q-Link-Pan), and other high frequency mobile, wireless communication systems, which should not be limited in this application.

It should be appreciated that the millimeter wave antenna array system 20 of various embodiments integrates the relevant structures for 5G communications, which may be configured in various types of electronic devices 10. For convenience of understanding, the electronic device 10 of each embodiment is mainly illustrated as a widely-used electronic device such as a mobile phone, but is not limited thereto. For example: the electronic device 10 of each embodiment may also be a car navigator, a tablet computer, a notebook computer, or the like; alternatively, the electronic device 10 may also be a wearable electronic device 10, such as a smart watch or a smart bracelet, or the like. Similarly, the metal housing of the millimeter-wave antenna array system 20 is mainly illustrated by a metal frame, but not limited thereto. For example: the metal housing may be a metal back cover; alternatively, the metal housing includes a metal bezel and a metal back cover.

In addition to the millimeter wave antenna array system 20, the electronic device 10 of each embodiment may further include a camera module, a display module, and other modules, so as to meet various use requirements of users.

In some embodiments, the camera module may include a front-view component and a rear-view component. The proactive component may include at least one camera to provide identification (e.g., face recognition), self-timer, and video call functions. The rear-view component can comprise one, two or more cameras to provide abundant camera shooting, video recording and other functions. It should be understood that when the rear-view assembly includes at least two cameras, the rear-view assembly may include a combination of at least two of high-definition cameras, telephoto cameras, wide-angle cameras, depth cameras, and the like, without limitation.

In some embodiments, the display module may include a self-luminous display panel or a passive luminous display panel. The self-luminous display panel may be, for example, an OLED display panel. The passive light emitting display panel may be, for example, a liquid crystal display panel, and may be used in conjunction with a related backlight unit to present visual information.

Referring to fig. 2 and fig. 3 synchronously, a millimeter wave antenna array system 20 provided in the embodiment of the present application includes: a metal housing and an antenna module 200. The antenna module 200 is disposed inside the metal housing and attached to the metal housing, so as to electrically connect the metal housing and the antenna module 200. The inner side of the metal shell is the side facing the inner space of the mobile phone, and the outer side of the metal shell is the side facing the free space; accordingly, the antenna module 200 is located in the inner space of the mobile phone. As explained above, this metal housing is exemplified by the metal bezel 100.

Referring to fig. 3, in some embodiments, in order to improve the signal transceiving effect of the millimeter wave antenna array system 20, the metal frame 100 is provided with a cross-shaped slot as the antenna seam 100a, and the antenna module 200 is located inside the metal frame 100 and directly faces the antenna seam 100 a. The antenna slot 100a includes a first antenna slot and a second antenna slot which are arranged to intersect with each other, and thus, when transmitting and receiving signals, the metal bezel 100 having the antenna slot 100a can implement transmission and reception of signals in cooperation with the antenna module 200.

In some embodiments, the connection form between the metal bezel 100 and the antenna module 200 includes, but is not limited to, a threaded connection, a welding, a conductive adhesive bonding, and the like.

Referring to fig. 1 to fig. 3, when the metal housing is a metal frame 100, the metal frame 100 includes a main body portion 110 and a protrusion portion 120. The protrusion 120 protrudes from the main body 110 and is located on a side of the main body 110 away from the inner space; the antenna seam penetrates the main body 110 and the protrusion 120. The protrusion 120 is located outside the body 110 and serves to connect the front cover and the rear cover. It should be appreciated that when the millimeter-wave antenna array system 20 is applied to a mobile phone, the protruding portion 120 is the exposed portion of the metal bezel 100. When the user takes the mobile phone, the portion of the metal frame 100 touched by the palm of the user is referred to as the protrusion 120. Based on this, by controlling the size of the protruding portion 120 of the metal bezel 100, the electronic device 10 of each embodiment can achieve the appearance effect of a narrow bezel while providing a good communication experience, and achieve the lightness and thinness of the electronic device 10.

Referring to fig. 2, in some embodiments, the antenna slot 100a of the metal bezel 100 is filled with a low-loss and low-k dielectric material 130. For example: teflon is filled in the antenna slot 100a of the metal bezel 100. Based on this, the dielectric material 130 can ensure the normal transmission and reception of signals and improve the sealing performance (such as waterproof, dustproof, etc.) of the mobile phone.

In other embodiments, the metal housing includes at least a metal back cover that may have only a main body portion and no raised portion. The metal rear cover is provided with an antenna seam, and therefore the metal rear cover can be matched with the antenna module to achieve signal receiving and sending.

In other embodiments, the metal housing includes at least a metal bezel and a metal back cover. The metal frame and the metal rear cover are both provided with antenna seams.

Referring to fig. 1 to fig. 3, in some embodiments, after the antenna seam 100a is formed, the metal frame 100 is still an integrated housing structure. In contrast, the connection between the metal frame 100 and the antenna module 200 may be more secure, so as to satisfy the normal transceiving of signals by the millimeter wave antenna array system 20, and in addition, the integrated metal frame 100 also has a stronger deformation resistance, so as to protect the relevant electronic components located in the internal space of the mobile phone.

Referring to fig. 1, in some embodiments, the millimeter wave antenna array system 20 illustratively includes two antenna modules 200, but not limited thereto.

Taking a metal housing as the metal bezel 100, the metal bezel 100 is substantially rectangular and includes opposing top and bottom portions and first and second side edges between the top and bottom portions. The two antenna modules 200 may be respectively located at two sides of the metal bezel 100. Based on this, the two antenna modules 200 can cooperate with the metal bezel 100 to radiate in different directions and implement transceiving of signals.

In some embodiments, the antenna module may be located at a middle upper portion of the side of the metal frame, so as to avoid an area held by a hand of a user as much as possible, thereby reducing a possibility that the antenna module is blocked by the user and improving radiation efficiency of the antenna module.

Taking the metal housing as the metal back cover as an example, the two antenna modules may be spaced apart from each other and located inside the metal back cover and facing the inner space. Based on this, two antenna module can cooperate the metal back cover and radiate towards free space and realize the receiving and dispatching to the signal.

Taking the metal housing including the metal frame and the metal rear cover as an example, one of the two antenna modules may be located at the first side of the metal frame and face the inner space of the mobile phone, and the other antenna module may be located at the metal rear cover and face the inner space of the mobile phone. Based on this, one antenna module can cooperate the metal frame and radiate towards the side of cell-phone, and another antenna module can cooperate the metal back lid and radiate towards the back of cell-phone to this realization is to the receiving and dispatching of signal.

In other embodiments, the number of the antenna modules may be one or more according to the requirements of structural design, signal coverage, and the like, which is not limited in this application. For example: the number of the antenna modules is three, four or five, etc.

For example: the metal casing is the metal frame, and the quantity of antenna module is four. The four antenna modules can be divided into two groups to be respectively positioned at two side edges of the metal frame. Wherein, two antenna module intervals that are located the first side of metal frame set up, and two antenna module intervals that are located the second side of metal frame 100 also set up to improve the stability of signal receiving and dispatching.

Or, the two antenna modules are respectively located at two side edges of the metal frame, and the other two antenna modules are respectively located at the top and the bottom of the metal frame. Namely, the first side, the second side, the top and the bottom of the metal frame are all provided with an antenna module. From this, through the cooperation of antenna module in the different position with the metal frame, can improve the stability of the signal receiving and dispatching of cell-phone to improve user's communication experience.

Referring to fig. 2, in some embodiments, each antenna module 200 includes at least one antenna unit 210, and the at least one antenna unit 210 may be used with a millimeter wave phased array chip or the like to perform modulation, mixing, filtering, and other processing on signals. It should be understood that the total number of antenna elements 210 is the same as the number of antenna slots 100a of the metal bezel 100.

For example: the millimeter wave antenna array system comprises two antenna modules, each antenna module comprises four antenna units, and the total number of the antenna units is eight. Therefore, the metal shell is provided with eight antenna seams to correspondingly match with the eight antenna units to realize the receiving and sending of signals.

Another example is: the millimeter wave antenna array system comprises three antenna modules, each antenna module comprises three antenna units, and the total number of the antenna units is nine. Therefore, the metal shell is provided with nine antenna slots to correspondingly match with the nine antenna units to realize the receiving and transmitting of signals.

It should be understood that the antenna module 200 of various embodiments illustratively includes four antenna elements 210 to ensure gain and scanning of the antenna beam; correspondingly, the metal frame 100 is also provided with four antenna seams at positions corresponding to the antenna module 200 to match the four antenna units 210. In some other embodiments, each antenna module may include one, two, three, or five antenna elements, and the application does not limit the number of the antenna elements in the antenna module.

In some embodiments, each antenna element 210 includes a radiating layer and a back cavity layer, which is located on one side of the radiating layer and away from the metal housing; i.e. the radiation layer is located between the back cavity layer and the metal housing. The radiation layer is provided with a first gap and a second gap which are arranged in a crossed manner; wherein the first slot and the first antenna slot are oppositely arranged and have different sizes, and the second slot and the second antenna slot are oppositely arranged and have different sizes. Based on this, millimeter-wave antenna array system 20 and electronic device 10 may have a higher bandwidth to provide a smooth communication experience.

Referring to fig. 2 and 4, in some embodiments, each antenna unit 210 has a first slot antenna assembly, which includes at least a first radiation layer 220, a second radiation layer 230, a third radiation layer 240, a fourth radiation layer 250, and a fifth radiation layer 260 stacked in sequence. Wherein a medium is arranged between adjacent radiation layers; overall, the multilayer radiating layer and dielectric can be analogized to a multilayer PCB board or substrate. The first to fifth radiation layers (220, 230, 240, 250, 260) are all provided with slots, so that the corresponding radiation layers (220, 230, 240, 250, 260) can be used as slot antennas.

It should be understood that, as shown in fig. 2, along the extending direction a of the metal frame (e.g. along the extending direction of the side edges), the slots of each radiation layer and the antenna slots on the metal frame 100 are cross slots disposed at ± 45 °, so that the spacing between the antenna elements 210 is reduced as much as possible while achieving ± 45 ° dual polarization, so as to reduce the size of the antenna module as a whole.

In some embodiments, the apertures of the respective radiating layers (220, 230, 240, 250, 260) are all different in size; based on this, the slot antennas of the radiation layers (220, 230, 240, 250, 260) have different resonance points, and the corresponding millimeter wave antenna array system 20 can provide a higher bandwidth to better cover the frequency band specified by the 5G standard; for example: the millimeter wave antenna array system 20 provided in each embodiment may cover frequency bands of n257(26.5GHz to 29.5GHz) and n258(24.25GHz to 27.5GHz) as much as possible, so as to implement functions such as smooth 5G communication.

In other embodiments, the slits of at least some of the radiation layers are different in size among the radiation layers. Taking the number of the radiation layers as five layers as an example, the sizes of the gaps of the first radiation layer and the second radiation layer are the same, the sizes of the gaps of the fourth radiation layer and the fifth radiation layer are the same, and the sizes of the gaps of the second radiation layer, the third radiation layer and the fourth radiation layer are different. Based on this, the slot antennas of each radiation layer have more resonance points, and the corresponding millimeter wave antenna array system can also provide higher bandwidth to better cover the frequency band specified by the 5G standard.

In some embodiments, electrical connections between the radiating layers (220, 230, 240, 250, 260) of the first slot antenna assembly are made through metallized vias (not shown). Based on this, after the power feeding is coupled, the multi-layer radiation layers (220, 230, 240, 250, 260) can transmit and receive signals to and from the free space, so as to realize the functions of 5G communication and the like. Due to the different shapes and/or patterns and/or sizes of the slots of the multi-layer radiation layers (220, 230, 240, 250, 260), the millimeter wave antenna array system 20 has a higher bandwidth and can more stably receive and transmit signals.

Referring to fig. 5, in some embodiments, the first radiation layer 220 has a first slit 220a, and the first slit 220a includes a first slit 220b and a second slit 220c crossing perpendicularly. Wherein the first radiation layer 220 is provided with a second protrusion 222 at an end of the second slit 220 c. The second protrusion 222 protrudes toward the other end of the second slit 220 c. Therefore, based on the structure of the second protrusion 222, the overall impedance matching between the second antenna slot of the metal frame and the second slot of each radiation layer can be adjusted, and the normal transmission and reception of signals generated based on each second slot and each second antenna slot can be ensured.

Referring to fig. 6, in some embodiments, the fifth radiation layer 260 has a fifth gap 260a, and the fifth gap 260a includes a first gap 260b and a second gap 260c crossing perpendicularly. The fifth radiation layer 260 is provided with a first protrusion 262 at an end of the first slit 260b corresponding to the second protrusion 222 of the first radiation layer 220. The first projection 262 is projected toward the other end of the first slit 260 b. Therefore, based on the structure of the first protrusion 262, the impedance matching of the first antenna seam of the metal frame and the first seam of each radiation layer on the whole can be adjusted, and the normal receiving and transmitting of signals generated based on each first seam and the first antenna seam can be ensured.

Referring to fig. 7, in some embodiments, the second radiation layer 230 has a second slit 230a, and the second slit 230a includes a first slit 230b and a second slit 230c that intersect perpendicularly. To implement the feeding to each first slot, the second radiation layer 230 further includes a first power divider 232. The first power divider 232 includes a first feeding end 232a, and a first feeding branch 232b and a second feeding branch 232c respectively connected to the first feeding end 232 a. Wherein the first feeding end 232a is located at one side of the first slot 230 b; a portion of the first feeding branch 232b and a portion of the second feeding branch 232c are both perpendicular to the first slot 230b, and a portion of the first feeding branch 232b and a portion of the second feeding branch 232c both cross the first slot 230 b.

In some embodiments, the two feeding branches (232b, 232c) each comprise a connecting portion and a parallel portion, the parallel portion spanning the first slot 230b, the connecting portion being connected between the parallel portion and the first feeding end. Wherein the parallel portions of the two feeding branches (232b, 232c) both extend in a direction perpendicular to the first slot 230b and both cross the first slot 230 b. The shape of the connecting part is exemplified by a straight line shape, but not limited thereto; in other embodiments, the connecting portion of the two feeding branches (232b, 232c) may also be in the shape of an arc, a fold, a wave, or the like.

In some embodiments, the first feeding end 232a of the first power divider 232 may be connected to various types of coaxial lines to input signals through the coaxial lines. Correspondingly, the other radiation layers located at one side of the second radiation layer 230 and far away from the first radiation layer 220 are provided with corresponding through holes (not labeled), and the through holes can be used for the coaxial lines to pass through the radiation layers and be connected with the feeding end 232a of the first power divider 232. For example: the first feeding end 232a may be connected to a SICL (Substrate Integrated Coaxial Line) or a SIW (Substrate Integrated Waveguide). And the signal may be output to the first slot of each radiation layer and to the first antenna slot of the metal bezel in equal amplitude and in equal phase based on the first and second feeding branches 232b and 232 c.

Referring to fig. 8, in some embodiments, the fourth radiation layer 250 has a fourth slit 250a, and the fourth slit 250a includes a first slit 250b and a second slit 250c crossing perpendicularly. To implement the feeding of each second slot, the fourth radiation layer 250 further includes a second power divider 252, similar to the structure of the first power divider 232 of the second radiation layer 230. The second power divider 252 includes a second feeding end 252a, and a third feeding branch 252b and a fourth feeding branch 252c respectively connected to the second feeding end 252 a. Wherein the second feeding end 252a is located at one side of the second slot 250c, a portion of the third feeding branch 252b and a portion of the fourth feeding branch 252c are both perpendicular to the second slot 250c, and a portion of the third feeding branch 252b and a portion of the fourth feeding branch 252c both cross the second slot 250 c.

In some embodiments, like the feeding branches (232b, 232c) of the first power divider, the two feeding branches (252b, 252c) each comprise a connecting portion and a parallel portion, the parallel portion spanning the second slot 250c, the connecting portion being connected between the parallel portion and the second feeding end. Wherein the parallel portions of the two feeding branches (252b, 252c) both extend in a direction perpendicular to the second slot 250c and both cross the second slot 250 c. The shape of the connecting part is exemplified by a straight line shape, but not limited thereto; in other embodiments, the connecting portion of the two feeding branches (252b, 252c) may also be in the shape of an arc, a fold, a wave, or the like.

It should be understood that the second feeding end 252a of the second power divider 252 may also be connected to various types of coaxial lines to input signals through the coaxial lines. Correspondingly, the other radiation layers (e.g., the fifth radiation layer 260) located on the fourth radiation layer 250 side and far away from the third radiation layer 240 are also provided with corresponding through holes (not labeled) for the coaxial lines to pass through the radiation layers and connect with the feeding end 252a of the second power divider 252. For example: like the first feeding end 232a, the second feeding end 252a of the second power divider 252 may also be connected to the SICL or SIW. And based on the third feeding branch 252b and the fourth feeding branch 252c, the signal can be output to the second slot of each radiation layer, and to the second antenna slot of the metal bezel, with equal amplitude and equal phase, as well.

Referring to fig. 9, in some embodiments, the third radiation layer 240 has a third slit 240a, and the third slit 240a includes a first slit 240b and a second slit 240c crossing perpendicularly. It should be understood that, as shown in fig. 7 to 9, the third radiation layer 240 is located between the second radiation layer 230 and the fourth radiation layer 250, and based on the inherent electromagnetic shielding property of metal, the third radiation layer 240 may isolate the influence of the first power divider 232 and the second power divider 252 when feeding power, so as to reduce the interference between the first slots and the second slots of the antenna unit 120. Based on this, the third radiation layer 240 can ensure sufficient isolation between the first feeding end 232a and the second feeding end 252a while providing the third slot antenna 240a, thereby ensuring the normal operation of the antenna module 200.

Referring again to fig. 5 and 6, in some embodiments, the second protrusion 222 and the first protrusion 262 are illustrated as semi-circular in shape; however, the present application is not limited to the structure, number, position, and the like of the second protrusion 222, as long as the second protrusion 222 can adjust the impedance matching between each second slot and the second antenna slot. Similarly, the present application is not limited to the structure, number, position, etc. of the first protrusions 262, as long as the first protrusions 262 can adjust the impedance matching between each first slot and the first antenna slot. For example: the first protrusion 262 may be triangular or rectangular, the second protrusion 222 may be rectangular or semi-elliptical, and so on; the number of the first protrusions 262 may be one or two; the first projection 262 may be provided in the fifth radiation layer at any position of the second slit.

Referring to fig. 4, in some embodiments, the back cavity layer 270 of the antenna unit 210 is located on one side of the fifth radiation layer 260 and away from the first radiation layer 220. Wherein, the cavity back layer 270 is not provided with a gap, and a cavity back of the antenna unit 210 is located between the cavity back layer 270 and the fifth radiation layer 260; based on the back cavity, when the antenna unit is fed through the first power divider and/or the second power divider, the related signals can be radiated more stably towards the direction far away from the mobile phone.

In some embodiments, a medium is disposed between the radiation layers, and between the fifth radiation layer and the back cavity layer. The medium between the back cavity layer 270 and the fifth radiation layer 260 may be hollowed out, and the hollowed-out portion forms an air cavity to expand the bandwidth of the antenna unit 210. It should be understood that the shape of the air cavity may be rectangular, triangular, or cross-shaped, etc., without limitation.

In some embodiments, the number of radiation layers of each antenna unit 210 may be greater than or equal to six, which is not limited in this application. It should be understood that, like the first to fifth radiation layers 220 to 260, the sixth radiation layer or more has a cross slit; wherein the sizes of the cross gaps of the radiation layers are different; alternatively, the cross slits of at least some of the radiation layers are all of different sizes. Based on this, the bandwidths of the millimeter wave antenna array system 20 and the electronic device 10 can be expanded as much as possible by matching the radiation layers. The radiation layers are fed by corresponding power dividers, and can realize the receiving and transmitting of signals, so as to meet the requirement of 5G communication as much as possible.

It should be understood that the difference in size may refer to a difference in length of the cross-shaped slit, a difference in width of the cross-shaped slit, and a difference in both length and width of the cross-shaped slit.

Referring to fig. 10, fig. 11, fig. 12 and fig. 13, in some embodiments, the metal frame 100 forms the antenna slot 100a on the metal frame 100 by forming a cross-shaped slot. In order to extend the bandwidth of the millimeter wave antenna array system 20, the metal frame 100 is disposed in a step shape on the inner wall corresponding to the antenna seam 100 a. It should be understood that the metal bezel 100 may be divided into a plurality of slots having different sizes within one antenna slot 100a based on the stepped inner wall. Based on this, the metal bezel 100 may serve as a second slot antenna assembly, which may extend the bandwidth of the millimeter wave antenna array system 20.

For example: the inner wall of the antenna seam 100a of the metal frame 100 has four steps, so four gaps with different sizes are correspondingly formed on the metal frame 100. The metal bezel 100 with the four slots may be used in conjunction with the first slot antenna assembly to make the millimeter wave antenna array system 20 have a higher bandwidth and cover the frequency band specified by the 5G standard as much as possible.

In some embodiments, each antenna seam 100a of the metal bezel 100 includes a plurality of intersecting perpendicular first and second antenna seams 100b and 100 c. It should be understood that the sizes of the respective first antenna seams 100b and the respective second antenna seams 100c are different accordingly based on the difference in the steps of the inner wall in the long side direction and the short side direction.

As shown in fig. 12 and 13, taking the example that the same antenna seam 100a includes four first antenna seams 100b and four second antenna seams 100c, the long sides (L1, L2, L3, L4) of the stepped inner wall gradually decrease in the direction from the outer side to the inner side of the metal bezel 100, but the short sides (W1, W2, W3, W4) of the inner wall gradually increase. Thus, by the stepped structure corresponding to the inner wall of the antenna slot 100a, the antenna slot 100a is formed, and the sizes of the corresponding first antenna slot 100b and the second antenna slot 100c are different, and the corresponding resonance points are different, thereby expanding the bandwidth of the millimeter wave antenna array system 20.

In other embodiments, the long side of the stepped inner wall gradually increases in the direction from the outer side to the inner side of the metal frame, but the short side of the inner wall gradually decreases. Based on this, the bandwidth of the millimeter wave antenna array system can be extended as well.

In other embodiments, the long side and the short side of the stepped inner wall are gradually increased in the direction from the outer side to the inner side of the metal frame. Based on this, the bandwidth of the millimeter wave antenna array system can be extended as well.

In other embodiments, the long side and the short side of the stepped inner wall are gradually reduced in the direction from the outer side to the inner side of the metal frame. Based on this, the bandwidth of the millimeter wave antenna array system can be extended as well.

In other embodiments, the long side of the stepped inner wall may increase and then decrease or decrease and then increase in the direction from the outer side to the inner side of the metal frame, and similarly, the short side of the stepped inner wall may also increase and then decrease or decrease and then increase. That is, the steps on the inner wall of the metal frame are not monotonously changed, which can also extend the bandwidth of the millimeter wave antenna array system.

In some embodiments, each first slot (220b, 230b, 240b, 250b, 260b) in the first slot antenna assembly and each first antenna slot 100b in the second slot antenna assembly are coupled to feed through a first power divider 232; each second slot (220c, 230c, 240c, 250c, 260c) and each second antenna slot 100c are coupled and fed through a second power divider 252. It should be understood, however, that the slots (220a, 230a, 240a, 250a, 260a) of the first slot antenna assembly are not the same size as the antenna slot 100a of the second slot antenna assembly; however, as explained above, the dimensions of the respective apertures (220a, 230a, 240a, 250a, 260a) may be at least partially different or all different. Based on this, through the cooperation of the first slot antenna assembly and the second slot antenna assembly, the millimeter wave antenna array system 20 can have a higher bandwidth while realizing dual polarization, so as to meet the bandwidth requirement of the 5G standard.

In some embodiments, when the antenna module 200 includes at least two antenna units 210, the first radiating antenna element in each antenna unit 210 has a radiating antenna with different size, so as to expand the bandwidth of the millimeter wave antenna array system 20 and improve the stability of transmitting and receiving signals.

The millimeter-wave antenna array system 20 of the above embodiments will be specifically described with reference to some simulation diagrams.

Referring to fig. 14, in some embodiments, when the first antenna slot of the metal bezel and each first slot of the antenna module are excited by the first power divider, the first slots and the first antenna slot have stronger currents around the whole, and the currents around each second slot and each second antenna slot are small. On this basis, the mutual influence between the two polarizations can be made small by the isolation of the second and fourth radiation layers by the third radiation layer.

Referring to fig. 15, in the millimeter wave antenna array system and the electronic device according to the embodiments of the present application, the range of return loss of each port better than 10dB is wide, and the ranges substantially cover the frequency bands of n257 and n258 specified by the 5G standard. Referring to fig. 16, in the millimeter wave antenna array system and the electronic device according to the embodiments of the present application, the isolation between the ports is substantially better than 15dB based on the isolation effect of the third radiation layer. Based on this, when the millimeter wave antenna array is applied to a mobile phone, various 5G communication requirements daily required by a user can be met.

Referring to fig. 17, under the action of the 3-bit phase shifter, the EIRP (Equivalent isotropic Radiated Power) of the millimeter wave antenna array system according to the embodiments of the present application at 26GHz and 28GHz meets the 3GPP standard. Based on the standard defined by 3GPP, the EIRP of the millimeter wave antenna module for implementing 5G communication at 50% CDF (Cumulative Distribution Function) is 11.5dB, and the EIRP of 50% CDF of the millimeter wave antenna array system and the electronic device in each embodiment is 18dB under the condition that the output power and other losses of the power amplifier are reasonably assumed, that is, the millimeter wave antenna array system in each embodiment has a margin of 6.5dB at 50% CDF. Therefore, when the millimeter wave antenna array is applied to actual communication, the corresponding electronic equipment can have better signal quality, so that the functions of conversation, video chat and the like can be realized for users.

Referring to fig. 18, in some embodiments, each of the first slot and the first antenna slot has better gain as a whole when excited. For example, in the-60 deg., there is a large gain difference between the main polarization and the cross polarization. It can be seen that when the first slots and the first antenna slots are excited, the interference effect of the second slots and the second antenna slots is small, and the signals transmitted by the first slots and the first antenna slots can be relatively stably propagated in free space.

Referring to fig. 19, in some embodiments, each of the second slot and the second antenna slot has better gain as a whole when excited. For example in the direction of-100 deg., there is a large gain difference between the main polarization and the cross polarization. It can be seen that when the second slots and the second antenna slots are excited, the interference effect of the first slots and the first antenna slots is small, and the signals transmitted by the second slots and the second antenna slots can be relatively stably propagated in free space.

The millimeter-wave antenna array system 20 of each embodiment realizes the transmission and reception of signals through the structures of the metal frame 100 and the antenna unit 210. It should be appreciated that, unlike the millimeter-wave antenna module in other mobile phones, as shown in the above embodiments, the millimeter-wave antenna array system 20 in the electronic devices 10 substantially covers the frequency bands of n257 and n258 to provide high bandwidth, and meanwhile, the structure is relatively simple and easy to assemble in the electronic devices, and the manufacturing process is relatively difficult, thereby facilitating the industrial manufacturing.

Referring to fig. 1 again, the electronic device 10 provided in the embodiment of the present application further includes a motherboard 30 and a millimeter wave phased array chip 40. The motherboard 30 is electrically connected to the antenna module 200, and the millimeter wave phased array chip 40 is disposed on one side of the antenna module 200 and away from the metal frame 100. The number of the millimeter wave phased array chips 40 is the same as the number of the antenna modules 200, that is, each antenna module 200 is configured with one millimeter wave phased array chip 40, and the one millimeter wave phased array chip 40 can respectively control at least one antenna unit 210 in the antenna module 200 to cooperatively realize the transceiving of signals.

In some embodiments, millimeter wave phased array chip 40 may be a bare chip without package, or may be a chip after package, which is not limited in this application. The millimeter wave phased array chip 40 may be electrically connected to the antenna module 200 by flip chip bonding, reflow soldering, or the like, so as to reduce the loss of signal transmission.

In some embodiments, each antenna element 210 of antenna module 200 may be grounded via millimeter-wave phased array chip 40. For example: each antenna element 210 is electrically connected to the ground pin of millimeter wave phased array chip 40 through a ground via hole in antenna module 200.

In some embodiments, the motherboard 30 may be electrically connected to the antenna module 200 through various transmission lines 50 suitable for millimeter wave signal transmission. The transmission line 50 suitable for millimeter wave signal transmission may be, for example, a flexible board transmission line or a radio frequency coaxial line.

In some embodiments, the electronic device 10 may further include decoupling capacitors, filters, flex board interfaces, and the like.

In some embodiments, electronic device 10 may also include other types of antenna modules suitable for millimeter-wave applications. The millimeter wave antenna modules can be used in cooperation with the millimeter wave antenna module 200 of the embodiments of the present application to realize functions such as 5G communication. For example: the millimeter wave antenna module of the embodiment of the application can be attached to the inner side of the metal frame, and other types of millimeter wave antenna modules can be attached to the metal rear cover, which is not limited to this.

While the foregoing is directed to embodiments of the present application, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the principles of the application, and it is intended that such changes and modifications be covered by the scope of the application.

Claims (13)

1. An electronic device, comprising: the antenna module is arranged on the inner side of the metal shell;

the metal shell is provided with an antenna seam, and the antenna seam comprises a first antenna seam and a second antenna seam which are arranged in a crossed mode;

the antenna module comprises an antenna unit, the antenna unit comprises a back cavity layer and a radiation layer, the back cavity layer is located between the radiation layer and the metal shell, the radiation layer is provided with a gap, and the gap comprises a first gap and a second gap which are arranged in a crossed mode;

the first antenna seam and the first seam are oppositely arranged and have different sizes, and the second antenna seam and the second seam are oppositely arranged and have different sizes.

2. The electronic device of claim 1, wherein the radiating layer is a multilayer; the radiation layers are stacked and provided with gaps;

in the multiple radiation layers, the size of gaps of at least part of the radiation layers is different; alternatively, the slits of the plurality of radiation layers are all different in size.

3. The electronic device according to claim 2, wherein the plurality of radiation layers include at least a first radiation layer, a second radiation layer, a third radiation layer, a fourth radiation layer, and a fifth radiation layer which are sequentially stacked;

the second radiation layer is provided with a first power divider, and the first power divider is used for coupling and feeding the first antenna slot and the first slot;

the fourth radiation layer is provided with a second power divider, and the second power divider is used for coupling and feeding the second antenna slot and the second slot;

the third radiation layer is located between the second radiation layer and the fourth radiation layer, and is used for improving the isolation between the feed end of the first power divider and the feed end of the second power divider.

4. The electronic device according to claim 3, wherein the first radiation layer is provided with a second projection at an end corresponding to the second slit, the second projection projecting toward the other end of the second slit to adjust impedance matching based on the second slit and the second antenna slit.

5. The electronic device of claim 3 or 4, wherein the first power divider comprises a first feed end, a first feed branch, and a second feed branch; the first feed branch and the second feed branch are respectively connected with the first feed end;

the first feed end is positioned on one side of the first gap of the second radiation layer; a portion of the first feed branch and a portion of the second feed branch are both perpendicular to the first slot of the second radiating layer and span the first slot of the second radiating layer.

6. The electronic device of any of claims 3-5, wherein the second power splitter comprises a second feed end, a third feed branch, and a fourth feed branch; the third feeding branch and the fourth feeding branch are respectively connected with the second feeding end;

the second feed end is positioned on one side of the second gap of the fourth radiation layer; a portion of the third feed branch and a portion of the fourth feed branch are both perpendicular to the second slot of the fourth radiating layer and span the second slot of the fourth radiating layer.

7. The electronic device according to any one of claims 3 to 6, wherein the fifth radiation layer is provided with a first projection at an end corresponding to the first slit, the first projection projecting toward the other end of the first slit to adjust impedance matching based on the first slit and the first antenna slit.

8. An electronic device as claimed in any one of claims 3 to 7, characterized in that the back cavity layer is situated on the side of the fifth radiation layer and remote from the metal housing.

9. The electronic device of any of claims 1-8, wherein an inner wall of the metal housing corresponding to the first antenna seam and the second antenna seam is stepped.

10. The electronic device according to claim 9, wherein along a direction from an outer side to an inner side of the metal case, a long side of the stepped inner wall is gradually decreased and a short side thereof is gradually increased; alternatively, the first and second electrodes may be,

the long side of the stepped inner wall is gradually increased and the short side is gradually decreased along the direction from the outer side to the inner side of the metal shell; alternatively, the first and second electrodes may be,

the long sides and the short sides of the stepped inner wall are gradually increased along the direction from the outer side to the inner side of the metal shell; alternatively, the first and second electrodes may be,

and the long sides and the short sides of the stepped inner wall are gradually reduced along the direction from the outer side to the inner side of the metal shell.

11. The electronic device of any of claims 1-10, wherein the electronic device further comprises: a dielectric material; the dielectric material is disposed within the first antenna seam and the second antenna seam of the metal shell.

12. The electronic device of any of claims 1-11, wherein the electronic device further comprises: a mainboard and a millimeter wave phased array chip;

the mainboard is electrically connected with the antenna module and the millimeter wave phased array chip; the millimeter wave phased array chip is arranged on the antenna module and is far away from the metal shell.

13. The electronic device of claim 12, wherein the metal housing comprises a metal bezel comprising a body portion and a boss portion; the bulge part is positioned on one side of the main body part and is far away from the millimeter wave phased array chip; the protruding part is used for connecting a front cover and a rear cover of the electronic equipment.

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