CN112467389B - Electronic equipment - Google Patents
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- CN112467389B CN112467389B CN202011329901.7A CN202011329901A CN112467389B CN 112467389 B CN112467389 B CN 112467389B CN 202011329901 A CN202011329901 A CN 202011329901A CN 112467389 B CN112467389 B CN 112467389B
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- dielectric
- metal layer
- electronic device
- antenna
- waveguide structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
Abstract
The application discloses electronic equipment, and belongs to the technical field of communication. An electronic device includes: the integrated waveguide structure comprises a metal frame, a dielectric antenna and a dielectric integrated waveguide structure, wherein a containing hole is formed in the metal frame, the dielectric antenna is arranged in the containing hole, the dielectric integrated waveguide structure is located on one side of the metal frame, a first gap is formed in the first surface of the dielectric integrated waveguide structure, the first gap is opposite to the dielectric antenna, and the first surface faces the surface of the dielectric antenna. The electronic equipment in the embodiment of the application has better radiation performance.
Description
Technical Field
The application belongs to the technical field of electronics, and particularly relates to electronic equipment.
Background
With the development of electronic technology, antennas are generally required to be provided in the current electronic devices, so that the electronic devices have functions of communication, network access and the like. In practical use, the inventors found that the following problems exist in existing electronic devices: the radiation performance of antennas of current electronic devices is poor.
Disclosure of Invention
The embodiment of the application aims to provide electronic equipment, which can solve the problem of poor radiation performance of an antenna of the current electronic equipment.
In order to solve the technical problems, the application is realized as follows:
the embodiment of the application provides electronic equipment, which comprises: the integrated waveguide structure comprises a metal frame, a dielectric antenna and a dielectric integrated waveguide structure, wherein a containing hole is formed in the metal frame, the dielectric antenna is arranged in the containing hole, the dielectric integrated waveguide structure is located on one side of the metal frame, a first gap is formed in the first surface of the dielectric integrated waveguide structure, the first gap is opposite to the dielectric antenna, and the first surface faces the surface of the dielectric antenna.
In the embodiment of the application, the first slot on the dielectric integrated waveguide structure can be used as a slot antenna to generate low-frequency resonance, and meanwhile, the first slot can be combined with the dielectric antenna to form a dielectric resonance antenna, namely, the first slot can be used as a feed source of the dielectric antenna, so that high-frequency resonance is generated in the dielectric antenna, and thus, two resonances can be generated, and the radiation performance of the antenna of the electronic equipment is enhanced.
Drawings
FIG. 1 is an exploded view of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a second embodiment of an electronic device;
FIG. 4 is a third schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 5 is a schematic diagram showing the reflection coefficient of an antenna of an electronic device according to an embodiment of the present application;
FIG. 6 is a diagram of the overall efficiency of an antenna of an electronic device provided by an embodiment of the present application;
fig. 7 is a radiation pattern of an antenna of an electronic device at 60GHz according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The electronic device provided by the embodiment of the application is described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.
Referring to fig. 1, as shown in fig. 1, an embodiment of the present application provides a schematic structural diagram of an electronic device, as shown in fig. 1, including: the dielectric integrated waveguide structure comprises a metal frame 10, a dielectric antenna 20 and a dielectric integrated waveguide structure 30, wherein a containing hole 11 is formed in the metal frame 10, the dielectric antenna 20 is arranged in the containing hole 11, the dielectric integrated waveguide structure 30 is located on one side of the metal frame 10, a first gap 301 is formed in a first surface of the dielectric integrated waveguide structure 30, the first gap 301 is opposite to the dielectric antenna 20, and the first surface is the surface of the dielectric integrated waveguide structure 30 facing the dielectric antenna 20.
The working principle of the embodiment of the application can be seen in the following expression:
since the first slot 301 is formed on the first surface of the dielectric integrated waveguide structure 30, the first slot 301 can be used as a slot antenna for radiation, i.e. the first slot 301 can be used as the slot antenna for generating first resonance; meanwhile, the first slot 301 and the dielectric antenna 20 are coupled, that is, the first slot 301 and the dielectric antenna 20 can be combined to form a dielectric resonance antenna, the first slot 301 can be used as a feed source of the dielectric resonance antenna, and can excite the dielectric antenna 20 to generate second resonance, so that two resonances can be generated, and the radiation performance of the antenna of the electronic device is enhanced.
It should be noted that, the first slot 301 is disposed opposite to the dielectric antenna 20, and may be understood as: the perpendicular projection of the first slot 301 on the plane of the dielectric antenna 20 coincides with the dielectric antenna 20.
In addition, referring to fig. 4, fig. 1-3 are enlarged views of the structure of the area a in fig. 4 in the embodiment of the present application.
For example: referring to fig. 5, fig. N is a schematic diagram of reflection coefficient of an electronic device provided in an embodiment of the present application, and as can be seen from fig. 5, an antenna of the electronic device provided in the embodiment of the present application may cover 53.7GHz-73GHz, so as to meet a frequency band requirement (generally 57GHz-64 GHz) of a millimeter wave antenna; meanwhile, referring to fig. 6, fig. 6 is a diagram of total efficiency of an antenna of an electronic device according to an embodiment of the present application, referring to fig. 7, and fig. 7 is a radiation pattern of the antenna according to an embodiment of the present application at 60 GHz. As can be seen from fig. 6 and fig. 7, the antenna of the electronic device provided by the embodiment of the application has an efficiency of more than-2 dB and a maximum gain greater than 4.5dB within the impedance bandwidth, that is, the radiation performance of the whole antenna of the electronic device provided by the embodiment of the application is good.
Meanwhile, the frequency band corresponding to the first resonance can be a high frequency band part in the first frequency band, and the frequency band corresponding to the second resonance can be a low frequency band part in the first frequency band, so that the frequency band corresponding to the first resonance and the frequency band corresponding to the second resonance can be mutually close to each other, and the radiation bandwidth of a radiation signal of an antenna of the electronic equipment is increased. The high-band portion and the low-band portion are relatively speaking, and are not limited to specific values.
In addition, since the dielectric antenna 20 is disposed in the accommodating hole 11 and the accommodating hole 11 is located on the metal frame 10, the blocking effect of other components of the electronic device on the radiation signals of the dielectric antenna 20 and the first slot 301 on the dielectric integrated waveguide structure 30 can be reduced, so that the radiation performance of the radiation signals of the dielectric antenna 20 and the first slot 301 on the dielectric integrated waveguide structure 30 is enhanced. While the dielectric integrated waveguide structure 30 is located on one side of the metal bezel 10, for example: the dielectric integrated waveguide structure 30 may be located on a first side of the metal bezel 10, which is the same side as a side of a screen (which may also be referred to as a display screen) of the electronic device facing away from the external environment. Of course, the dielectric integrated waveguide structure 30 may also be located on a second side of the metal bezel 10, which may be opposite to the first side.
For example: the dielectric antenna 20 and the dielectric integrated waveguide structure 30 can be used for face or gesture recognition, and compared with the mode that the dielectric antenna 20 and the dielectric integrated waveguide structure 30 are arranged below a display screen of an electronic device, the embodiment can reduce distortion influence of the display screen on the radiation direction of a radiation signal of the antenna, enhances the accuracy and the speed of face recognition or gesture recognition, namely enhances the effect of face recognition and gesture recognition.
In addition, compared with the prior art, the mode of arranging the dielectric antenna 20 and the dielectric integrated waveguide structure 30 in the accommodating hole 11 in this embodiment can reduce the size of the antenna in the whole electronic device, and simultaneously can make the size of the accommodating hole 11 smaller, so that the appearance integrity of the metal frame 10 of the whole electronic device is better.
It should be noted that, the metal frame 10 may also be used as a radiator of a communication antenna, and the communication antenna may be a non-millimeter wave communication antenna; of course, when the feed source connected to the dielectric integrated waveguide structure 30 is a millimeter wave feed source, both the slot antenna and the dielectric resonator antenna in this embodiment may be referred to as millimeter wave antennas. Thus, the integrated design of the millimeter wave antenna and the non-millimeter wave antenna can be completed on the metal frame 10, namely, the millimeter wave antenna is arranged on the radiator of the non-millimeter wave antenna, so that the arrangement space and the volume of the antenna in the electronic equipment are saved; meanwhile, the non-millimeter wave antenna may include a cellular (cellular) antenna and a non-cellular (no-cellular) antenna.
The specific form of the first slit 301 is not limited herein, for example: the first slit 301 may be an H-shaped slit, a circular slit, a rectangular slit, or the like.
The shapes of the dielectric antenna 20 and the accommodating hole 11 are not limited herein, for example: the dielectric antenna 20 and the accommodation hole 11 may be rectangular, or may be circular, for example.
Wherein the dielectric constant of the dielectric antenna 20 may be greater than 10, for example: the dielectric antenna 20 may have a dielectric constant within 10-20. Thus, since the dielectric constant of the dielectric antenna 20 is high, the radiation performance of the dielectric antenna 20 can be further enhanced.
As an alternative embodiment, the dielectric antenna 20 has a first gap with the inner wall of the receiving hole 11. In this way, the insulation effect between the dielectric antenna 20 and the inner wall of the accommodating hole 11 can be further enhanced, and the phenomenon that the dielectric antenna 20 and the inner wall of the accommodating hole 11 radiate towards the inner wall of the accommodating hole 11 is avoided, so that the radiation direction of the dielectric antenna 20 is ensured to be mainly concentrated at the two ends of the dielectric antenna 20, and the radiation effect of the dielectric antenna 20 is further enhanced.
As an alternative embodiment, referring to fig. 1-3, the first gap is filled with a second insulating dielectric body 40. In this way, the insulating effect between the dielectric antenna 20 and the inner wall of the accommodation hole 11 can be further enhanced.
As an alternative embodiment, the second dielectric body 40 is disposed around the dielectric antenna 20. In this way, the fixing effect on the dielectric antenna 20 can be enhanced, and at the same time, the first gap can be filled with the second insulating dielectric body 40, so that the waterproof and dustproof effects can be achieved.
Wherein the dielectric constant of the second dielectric body 40 may be much smaller than the dielectric constant of the dielectric antenna 20. And the material of the second insulating dielectric body 40 may be a plastic material or the like.
As an alternative embodiment, referring to fig. 1-2, the dielectric integrated waveguide structure 30 includes a first metal layer 31, a substrate 32, and a second metal layer 33 that are sequentially stacked, where the first metal layer 31 is disposed towards the dielectric antenna 20, the first metal layer 31 may form at least a part of the first surface, the second metal layer 33 is disposed opposite to the dielectric antenna 20, and the first slot 301 is located on the first metal layer 31;
the dielectric integrated waveguide structure 30 further includes a plurality of first through holes 311, where the first through holes 311 sequentially penetrate through the first metal layer 31, the substrate 32, and the second metal layer 33, and each first through hole is filled with a first metal connection member.
The first metal layer 31 and the second metal layer 33 may be copper layers, respectively, and may be fixed on the substrate 32 by a plating process, respectively.
The plurality of first through holes 311 may be disposed at equal intervals. And the first metal connection member may be the same material as the first and second metal layers 31 and 33, of course, the first metal connection member may be different from the material of the first and second metal layers 31 and 33, and the conductive property of the first metal conductive connection member may be superior to that of the first and second metal layers 31 and 33.
In this embodiment, the first through hole 311 may form a dielectric integrated waveguide (Substrate Integrated Waveguides, SIW) cavity; meanwhile, at least one of the first and second metal layers 31 and 33 may be grounded, and the grounding performance of the first and second metal layers 31 and 33 may be further enhanced through the first via 311.
Note that, the type of the substrate 32 is not limited herein, and examples include: as an alternative embodiment, the substrate 32 may be a printed circuit board, which may also be a flexible circuit board.
As another alternative embodiment, the substrate 32 is a liquid crystal polymer substrate, which may also be referred to as an LCP substrate, so that the slot antenna has less loss when transmitting high frequency signals, and at the same time, the stability of the radiation signals of the slot antenna can be enhanced.
Of course, the distribution manner of the plurality of first through holes 311 in the first metal layer 31 is not limited herein, for example: as an alternative embodiment, the plurality of first through holes 311 are distributed along the edge of the first metal layer 31. In this way, since the first through hole 311 is disposed at the edge position of the first metal layer 31, compared with the manner in which the first through hole 311 is disposed at the middle position of the first metal layer 31, the connection strength between the first metal layer 31 and the second metal layer 33 can be enhanced, and at the same time, the aesthetic degree and the user experience can be enhanced.
As another alternative embodiment, referring to fig. 1, the plurality of first through holes 311 are distributed in a ring shape on the first metal layer 31, and the first slits 301 are located in the ring shape. In this way, the degree of loss of the high frequency signal and the degree of stability of the signal radiation when the SIW cavity emits the high frequency signal can be further enhanced, and the radiation performance of the first slit 301 can be enhanced because the first slit 301 is located in the ring shape.
As an alternative embodiment, referring to fig. 3, the electronic device includes a feeder line 50, and the second metal layer 33 includes a conductive connection portion 331, and the conductive connection portion 331 is electrically connected to the feeder line 50. And one end of the feeder line 50 may be electrically connected to the conductive connection part 331 and the other end may be connected to a feed source, so that feeding to the second metal layer 33 and feeding to the first slot 301 through the first through hole 311 may be realized, so that the first slot 301 radiates as a slot antenna, and coupling feeding to the dielectric antenna 20 may be performed, so that the dielectric antenna 20 radiates.
The specific manner in which the feed source feeds through the feeder 50 is not limited herein, for example: the feeding mode may be at least one of a mode of feeding through the microstrip feeder 50 (i.e., the feeder 50 is a microstrip feeder), a coaxial feeding mode, and a coplanar waveguide feeding mode.
The conductive connection portion 331 may be a linear connection portion, a rectangular connection portion, or an arc connection portion. The specific manner is not limited herein.
As an alternative embodiment, referring to fig. 1, a second slit 332 is formed on the second metal layer 33 and located on at least one side of the conductive connection portion 331; or alternatively, the process may be performed,
a plurality of second through holes are formed on the second metal layer 33 and located on at least one side of the conductive connection portion 331.
In this way, impedance matching of the feeding position (i.e., the connection position of the feeder line 50 and the conductive connection portion 331) can be achieved by opening the second slit 332 or the second through hole on at least one side of the conductive connection portion 331. So that the feeding effect to the conductive connection portion 331 is better.
The number of the second slits 332, or the size and number of the second through holes may be set as needed, and is not particularly limited herein.
Wherein, as an alternative embodiment, referring to fig. 3, the electronic device further includes a radio frequency chip 60, and the substrate is connected to the radio frequency chip 60 through a liquid crystal polymer connection line. In this way, the radio frequency chip 60 and the liquid crystal polymer connection lines can be integrated together, thereby reducing the occupied volume and lowering the use cost.
In this case, the substrate may be a liquid crystal polymer substrate. While the substrate may be disposed on the first side (see in particular the description of the first side above), both the liquid crystal polymer connection lines and the radio frequency chip 60 may be disposed on the side of the display screen facing away from the external environment.
It should be noted that, the rf chip 60 and the liquid crystal polymer connection line (may also be referred to as a feeder line 50) may be disposed on one side of the display screen 70 of the electronic device.
In addition, components such as a radio frequency transceiver may be disposed on the radio frequency chip 60.
As an alternative embodiment, the metal frame 10 is provided with a plurality of accommodating holes 11, and each accommodating hole 11 is provided with the dielectric antenna 20 and the dielectric integrated waveguide structure 30. In this way, since the metal frame 10 is provided with the plurality of accommodating holes 11, and each accommodating hole 11 is internally provided with the dielectric antenna 20 and the dielectric integrated waveguide structure 30, the radiation performance of the electronic device can be enhanced, and the dielectric antenna 20 and the dielectric integrated waveguide structure 30 in different accommodating holes 11 can realize different functions, thereby increasing the diversity of the functions of the electronic device.
Wherein, as an alternative embodiment, the plurality of receiving holes 11 may be linearly distributed; as another alternative embodiment, the plurality of receiving holes 11 may be distributed in an array. In this way, flexibility and diversity of the distribution mode of the accommodating holes 11 are enhanced, and at the same time, flexibility and diversity of the distribution mode of the antenna of the electronic device can be enhanced, and radiation effect is further enhanced.
It should be noted that, when the plurality of accommodating holes 11 are distributed in an array, and the slot antennas and the dielectric resonant antennas in the plurality of accommodating holes 11 are millimeter wave antennas, no additional accommodating space is needed on the electronic device to set the millimeter wave array antennas, so that the volume of the electronic device is reduced; meanwhile, the plurality of accommodating holes 11 are distributed in an array manner, so that space coverage with broadband and high gain can be realized.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.
Claims (9)
1. An electronic device, comprising: the dielectric integrated waveguide structure is positioned at one side of the metal frame, a first gap is formed in the first surface of the dielectric integrated waveguide structure, the first gap is arranged opposite to the dielectric antenna, and the first surface is the surface of the dielectric integrated waveguide structure facing the dielectric antenna;
the dielectric integrated waveguide structure comprises a first metal layer, a substrate and a second metal layer which are sequentially stacked, wherein the first metal layer is arranged towards the dielectric antenna, the first metal layer forms at least one part of the first surface, the second metal layer is arranged back to the dielectric antenna, and the first gap is positioned on the first metal layer;
the dielectric integrated waveguide structure further comprises a plurality of first through holes, wherein the first through holes sequentially penetrate through the first metal layer, the substrate and the second metal layer, and each first through hole is filled with a first metal connecting piece;
the first slot is used as a feed source of the dielectric antenna to excite the dielectric antenna to generate second resonance.
2. The electronic device of claim 1, wherein the plurality of first vias are distributed along an edge of the first metal layer.
3. The electronic device of claim 1, wherein the plurality of first vias are distributed in a ring shape on the first metal layer, the first gap being located within the ring shape.
4. The electronic device of claim 1, wherein the electronic device comprises a feed line and the second metal layer comprises a conductive connection electrically connected to the feed line.
5. The electronic device of claim 4, wherein a second gap is formed on the second metal layer and located on at least one side of the conductive connection portion; or alternatively, the process may be performed,
and a plurality of second through holes are formed in the second metal layer and positioned on at least one side of the conductive connecting part.
6. The electronic device of claim 1, wherein a first gap is provided between the dielectric antenna and an inner wall of the receiving aperture.
7. The electronic device of claim 6, wherein the first gap is filled with a second insulating dielectric body.
8. The electronic device of claim 1, further comprising a radio frequency chip, wherein the substrate is connected to the radio frequency chip by a liquid crystal polymer connection line.
9. The electronic device of claim 1, wherein a plurality of the receiving holes are provided in the metal bezel, and the dielectric antenna is provided in each of the receiving holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011329901.7A CN112467389B (en) | 2020-11-24 | 2020-11-24 | Electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011329901.7A CN112467389B (en) | 2020-11-24 | 2020-11-24 | Electronic equipment |
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| CN112467389A CN112467389A (en) | 2021-03-09 |
| CN112467389B true CN112467389B (en) | 2023-09-05 |
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| CN202011329901.7A Active CN112467389B (en) | 2020-11-24 | 2020-11-24 | Electronic equipment |
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