CN109348614A - A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing - Google Patents
A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing Download PDFInfo
- Publication number
- CN109348614A CN109348614A CN201811266687.8A CN201811266687A CN109348614A CN 109348614 A CN109348614 A CN 109348614A CN 201811266687 A CN201811266687 A CN 201811266687A CN 109348614 A CN109348614 A CN 109348614A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board structure
- copper
- layers
- frequency signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
Abstract
The invention discloses a kind of circuit board structures and preparation method thereof for preventing high-frequency signal from revealing, the wherein circuit board structure, including for generating high-frequency signal signals layer, be stacked ground plane in the signals layer two sides, the outer surface of the ground plane is provided with for carrying out closed layers of copper to the signals layer and the ground plane, and the signals layer is made of high molecule liquid crystal polymer material.The present invention includes at least following advantages: it can be effectively reduced the high frequency model leakage problem of circuit board structure, relevant electronic product can be made to avoid interfering with each other, high-speed transfer, and safe handling.
Description
Technical field
The present invention relates to electronic circuit board technical fields, and particularly a kind of route for preventing high-frequency signal from revealing is hardened
Structure and preparation method thereof.
Background technique
The description of this part, which is only provided, discloses relevant background information to the present invention, without constituting the prior art.
With the development of 5G science and technology, more and more electronic products have poured in market, and electronic product occurs important at present
Problem first is that signal reveal.Signal leakage may cause area covered, it is also possible to cause same adjacent frequency to be interfered, this is just to electronics
The shielding class requirement of product high-frequency signal is also with raising, it is desirable that the problem of signal leakage is effectively reduced in electronic product.
It should be noted that the above description of the technical background be intended merely to it is convenient to technical solution of the present invention carry out it is clear,
Complete explanation, and facilitate the understanding of those skilled in the art and illustrate.Cannot merely because these schemes of the invention
Background technology part is expounded and thinks that above-mentioned technical proposal is known to those skilled in the art.
Summary of the invention
In order to overcome the defects of the prior art, the embodiment of the invention provides a kind of routes for preventing high-frequency signal from revealing
Hardened structure and preparation method thereof can be effectively reduced the high frequency model leakage problem of circuit board structure, can make relevant electricity
Sub- product safety uses and high-speed transfer.
The embodiment of the present application discloses: a kind of circuit board structure for preventing high-frequency signal from revealing, including for generating high frequency
The signals layer of signal is stacked ground plane in the signals layer two sides, the outer surface of the ground plane be provided with for pair
The signals layer and the ground plane carry out closed layers of copper, and the signals layer is made of high molecule liquid crystal polymer material.
Further, the first insulating layer is provided between the signals layer and the ground plane, first insulating layer is adopted
It is made of liquid crystal polymer material.
Further, second insulating layer is provided between the ground plane and the layers of copper, the second insulating layer uses
Covering membrane material is made.
Further, the layers of copper uses chemical technology to be electroplated on the circuit board structure and/or be with insulating materials
Carrier, which is wrapped up in, to be attached on the circuit board structure.
The embodiment of the present application also discloses a kind of production method of circuit board structure for preventing high-frequency signal from revealing, packet
Include following steps:
The signals layer made of high molecule liquid crystal polymer material is prepared, ground plane shape is set in the two sides of the signals layer
At the ontology of the circuit board structure；
The ontology is closed by layers of copper.
Further, the outer wall of the ontology includes side wall and end wall, and the ontology includes block elements and/or strip list
Member,
Step " being closed by layers of copper to the ontology " includes:
The first layers of copper is plated by way of PTH and flash on the side wall of the ontology；
After the completion of the plating of the first layers of copper is set, powers on and plate out or on the end wall of bar element in the outer wall of the block elements
Wrap up in attached second layers of copper out.
Further, before step " closing by layers of copper to the ontology ", including insulating layer is prepared, it is described exhausted
Edge layer includes that setting is provided with the first insulating layer, the setting ground plane far from institute between the signals layer and the ground plane
State the second insulating layer on the surface of signals layer.
Further, before step " preparing signal and and ground plane ", including using Radium art to the entire line
The hardened structure in road carries out preliminary shape cutting.
Further, second layers of copper uses shielding material as carrier, after the plating of the second layers of copper sets completion, to whole
A circuit board structure carries out final shape cutting, including cuts to the shielding material, can guarantee the shielding material
Thickness between 10-150 μm.
Further, before step " carrying out final shape cutting to entire circuit board structure ", to being loaded with described second
The shielding material of layers of copper carries out high-temperature laminating.
By above technical solution, beneficial effects of the present invention are as follows: poly- for the liquid crystal with preferable laser propagation effect
Object material is closed, as transmission at the leakage for be easy to causeing high-frequency signal, is closed using layers of copper, then can be effectively reduced line
The high frequency model leakage problem of the hardened structure in road, can make relevant electronic product avoid interfering with each other, high-speed transfer makes safely
With.
For above and other objects, features and advantages of the invention can be clearer and more comprehensible, preferred embodiment is cited below particularly,
And cooperate institute's accompanying drawings, it is described in detail below.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the single unit system structural schematic diagram in the embodiment of the present invention.
The appended drawing reference of the figures above: 1, signals layer；2, ground plane；3, the first insulating layer；4, second insulating layer；5, blocky
Unit；6, bar element；7, the first layers of copper；8, the second layers of copper；9, shielding material.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It should be noted that in the description of the present invention, term " first ", " second " etc. are used for description purposes only and distinguish
Similar object between the two and is not present sequencing, can not be interpreted as indication or suggestion relative importance.In addition,
In description of the invention, unless otherwise indicated, the meaning of " plurality " is two or more.
As shown in connection with fig. 1, disclosed in present embodiment it is a kind of prevent high-frequency signal reveal circuit board structure, including with
In generating the signals layer 1 of high-frequency signal, be stacked ground plane 2 in 1 two sides of signals layer, the appearance of the ground plane 2
Face is provided with for carrying out closed layers of copper to the signals layer 1 and the ground plane 2, and the signals layer 1 uses macromolecule liquid
Crystalline polymer material (LCP) is made.For the liquid crystal polymer material (LCP) with preferable laser propagation effect, it is used as transport layer
It is be easy to cause the leakage of high-frequency signal, is closed using layers of copper, then the high frequency model that can be effectively reduced circuit board structure is let out
Dew problem can make relevant electronic product avoid interfering with each other, high-speed transfer, safe handling.
In another implementable way, the first insulating layer 3 is provided between the signals layer 1 and the ground plane 2,
First insulating layer 3 is made of liquid crystal polymer material (LCP).Is provided between the ground plane 2 and the layers of copper
Two insulating layers 4, the second insulating layer 4 are made of covering membrane material.
In another implementable way, the layers of copper using chemical technology be electroplated on the circuit board structure and/
Or it is wrapped up in and is attached on the circuit board structure as carrier using insulating materials.
The production method for the circuit board structure that the invention also discloses a kind of for preventing high-frequency signal leakage, including it is following
Step:
Preliminary shape cutting is carried out to the entire circuit board structure using Radium art.
The signals layer 1 made of high molecule liquid crystal polymer material (LCP) is prepared, is arranged in the two sides of the signals layer 1
Ground plane 2 forms the ontology of the circuit board structure.
Insulating layer is prepared, the insulating layer includes that setting is provided with first between the signals layer 1 and the ground plane 2
Second insulating layer 4 on insulating layer 3, the setting surface of the ground plane 2 far from the signals layer 1；By being provided with described
One insulating layer 3 and the second insulating layer 4 can preferably protect the route on signals layer 1 and ground plane 2.
Closed by layers of copper to the ontology: the outer wall of the ontology includes side wall and end wall, and the ontology includes
Block elements 5 and/or bar element 6.On the side wall of the ontology by PTH (heavy copper Plated Through Hole) and
The mode of flash plates the first layers of copper 7；The thickness of first layers of copper 7 passes through above-mentioned set-up mode, energy between 3-5 μm
Enough tentatively to 2 partial closure of signals layer 1 and ground plane, the preliminary leakage for reducing high-frequency signal.Completion is set in the plating of the first layers of copper 7
Afterwards, it is powered in the outer wall of the block elements 5 and plates out or wrap up on the end wall of bar element 6 attached second layers of copper 8 out.Described second
The thickness of layers of copper 8 is between 7-9 μm, by being provided with the second layers of copper 8, can completely enclose the signals layer 1 and ground plane 2,
And then the leakage of high-frequency signal, structure optimization is effectively reduced.
Second layers of copper 8 is used as carrier using shielding material 9, after the plating of the second layers of copper 8 sets completion, to entire route
Hardened structure carries out final shape cutting, including cuts to the shielding material 9, can guarantee the thickness of the shielding material 9
Degree is between 10-150 μm.Extra shielding material 9 is mainly trimmed, and makes the shielding material 9 that there can not be layering.To cutting
The shielding material 9 for being loaded with second layers of copper 8 after cutting carries out high-temperature laminating.
Specific embodiment is applied in the present invention, and principle and implementation of the present invention are described, above embodiments
Explanation be merely used to help understand method and its core concept of the invention；At the same time, for those skilled in the art,
According to the thought of the present invention, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Appearance should not be construed as limiting the invention.
Claims (10)
1. a kind of circuit board structure for preventing high-frequency signal from revealing, which is characterized in that including the signal for generating high-frequency signal
Layer is stacked ground plane in the signals layer two sides, and the outer surface of the ground plane is provided with for the signals layer
Closed layers of copper is carried out with the ground plane, the signals layer is made of high molecule liquid crystal polymer material.
2. the circuit board structure for preventing high-frequency signal from revealing as described in claim 1, which is characterized in that the signals layer and institute
It states and is provided with the first insulating layer between ground plane, first insulating layer is made of liquid crystal polymer material.
3. the circuit board structure for preventing high-frequency signal from revealing as described in claim 1, which is characterized in that the ground plane and institute
It states and is provided with second insulating layer between layers of copper, the second insulating layer is made of covering membrane material.
4. the circuit board structure for preventing high-frequency signal from revealing as described in claim 1, which is characterized in that the layers of copper useization
Technique, which is electroplated on the circuit board structure and/or is wrapped up in using insulating materials as carrier, to be attached on the circuit board structure.
5. a kind of production method of the circuit board structure for preventing high-frequency signal from revealing, which comprises the following steps:
The signals layer made of high molecule liquid crystal polymer material is prepared, setting ground plane forms institute in the two sides of the signals layer
State the ontology of circuit board structure；
The ontology is closed by layers of copper.
6. the production method of the circuit board structure as claimed in claim 5 for preventing high-frequency signal from revealing, which is characterized in that
The outer wall of the ontology includes side wall and end wall, and the ontology includes block elements and/or bar element,
Step " being closed by layers of copper to the ontology " includes:
The first layers of copper is plated by way of PTH and flash on the side wall of the ontology；
After the completion of the plating of the first layers of copper is set, is powered in the outer wall of the block elements and plate out or wrapped up on the end wall of bar element attached
Second layers of copper out.
7. the production method of the circuit board structure as claimed in claim 5 for preventing high-frequency signal from revealing, which is characterized in that
Before step " closing by layers of copper to the ontology ", including insulating layer is prepared, the insulating layer includes being arranged in institute
It states and is provided with the first insulating layer between signals layer and the ground plane, is arranged on the surface of the ground plane far from the signals layer
Second insulating layer.
8. the production method of the circuit board structure as claimed in claim 5 for preventing high-frequency signal from revealing, which is characterized in that
The entire circuit board structure is carried out outside preliminary before step " preparing signal and and ground plane ", including using Radium art
Shape cutting.
9. the production method of the circuit board structure as claimed in claim 5 for preventing high-frequency signal from revealing, which is characterized in that
Second layers of copper carries out entire circuit board structure after the plating of the second layers of copper sets completion as carrier using shielding material
Final shape cutting, including the shielding material is cut, the thickness of the shielding material can be guaranteed at 10-150 μm
Between.
10. the production method of the circuit board structure as claimed in claim 5 for preventing high-frequency signal from revealing, feature exist
In before step " carrying out final shape cutting to entire circuit board structure ", to the shielding material for being loaded with second layers of copper
Carry out high-temperature laminating.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811266687.8A CN109348614A (en) | 2018-10-29 | 2018-10-29 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
| TW108102721A TWI690247B (en) | 2018-10-29 | 2019-01-24 | A circuit board structure and a manufacturing method for preventing leakage of high-frequency signals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811266687.8A CN109348614A (en) | 2018-10-29 | 2018-10-29 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109348614A true CN109348614A (en) | 2019-02-15 |
Family
ID=65310854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811266687.8A Pending CN109348614A (en) | 2018-10-29 | 2018-10-29 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109348614A (en) |
| TW (1) | TWI690247B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110149757A (en) * | 2019-05-30 | 2019-08-20 | 苏州福莱盈电子有限公司 | A kind of high frequency circuit board and preparation method thereof |
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| CN110149757A (en) * | 2019-05-30 | 2019-08-20 | 苏州福莱盈电子有限公司 | A kind of high frequency circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI690247B (en) | 2020-04-01 |
| TW202017440A (en) | 2020-05-01 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 215000 189 Jinfeng Road, high tech Zone, Suzhou City, Jiangsu Province Applicant after: Fulaiying Electronics Co.,Ltd. Address before: 215100 No.189, Jinfeng Road, Huqiu District, Suzhou City, Jiangsu Province Applicant before: FOREWIN FPC (SUZHOU) Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190215 |
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| RJ01 | Rejection of invention patent application after publication |