CN108430174A - A kind of production method and mixed pressure PCB of mixed pressure PCB - Google Patents
A kind of production method and mixed pressure PCB of mixed pressure PCB Download PDFInfo
- Publication number
- CN108430174A CN108430174A CN201810252321.9A CN201810252321A CN108430174A CN 108430174 A CN108430174 A CN 108430174A CN 201810252321 A CN201810252321 A CN 201810252321A CN 108430174 A CN108430174 A CN 108430174A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
Abstract
The present invention relates to PCB technical fields, disclose a kind of production method and mixed pressure PCB of mixed pressure PCB；The production method includes：Second core plate is embedded in individual first core plate or multiple first core plates；For being intended to be stacked in the prepreg of the second core plate top surface and/or bottom surface, conductive layer is set in local location on the surface adjacent with the second core plate of the prepreg, the local location corresponds to the binding site between the second core plate internal layer circuit corresponding to the first core plate；Later, it is pressed after the first core plate for being embedded with the second core plate being stacked with other core plates and each prepreg according to preset order.The connection for realizing the corresponding internal layer circuit of the core plate of two kinds of different materials in the embodiment of the present invention using the conductive layer added on prepreg, improves the quality of PCB product.
Description
Technical field
The present invention relates to PCB (Printed Circuit Board, printed wiring board) technical fields, more particularly to one kind
The production method and mixed pressure PCB of mixed pressure PCB.
Background technology
Electric signal is generally divided into multiple grades in a system, i.e., different grades of signal (packet is walked in same system
Containing normal signal, high-frequency signal, high speed signal etc.), partial hybrid high-frequency high-speed PCB manufacturing technologies can not only meet high frequency height
Cost is greatly reduced in the case of fast signal transmission is low-loss, moreover it is possible to improve reliability to a certain extent, and have various combination
Mode, become the perfect solution of different brackets signal hierarchical transmission.But traditional partial hybrid technique is manufactured due to it
The limitation of technique can not achieve the conducting of the internal layer circuit between different materials core plate.For example, Fig. 1 show what thickness was close
After two kinds of material core plate (the first core plate 1 and the second core plate 2) combinations, the binding site A of the two opens a way；Fig. 2 is shown not
After two kinds of material core plates (the first core plate 1 and the second core plate 2) combination of stack pile, the binding site B of the two opens a way.Cause
And, it is necessary to internal layer circuit conducting demand when for the combination of different materials core plate provides a kind of effective solution scheme.
Invention content
The purpose of the present invention is to provide the production method of mixed pressure PCB a kind of and mixed pressure PCB, solve different materials core plate it
Between internal layer circuit conduction problem.
For this purpose, the present invention uses following technical scheme：
A kind of production method of mixed pressure PCB, the mixed pressure PCB include the first core plate and the second core being made from a different material
Plate, and the thickness difference of first core plate and the second core plate is less than predetermined threshold value, the production method includes：
Storage tank is opened up on first core plate, second core plate is embedded in the storage tank；
For being intended to be stacked in the prepreg of second core plate top surface and/or bottom surface, in the prepreg and second
Conductive layer is arranged in local location on the adjacent surface of core plate；The local location corresponds to second core plate and the first core plate
Binding site between corresponding internal layer circuit；
It is pressed after the first core plate for being embedded with the second core plate is stacked with other core plates and each prepreg according to preset order
It closes.
Optionally, the conductive layer is conducting resinl, is pasted on described to be stacked in the half of the second core plate top surface and/or bottom surface
In cured sheets；
Alternatively, the conductive layer is conductive paste, it is printed in described to be stacked in the half solid of the second core plate top surface and/or bottom surface
Change on piece.
Optionally, it in the production method, if second core plate is the outer layer core plate positioned at top, is being intended to stack
In conductive layer is arranged on the prepreg of the second core plate bottom surface；
If second core plate is the outer layer core plate positioned at the bottom, it is being intended to be stacked in the semi-solid preparation of the second core plate top surface
Conductive layer is arranged on piece；
If second core plate is core material, divide on the prepreg for being intended to be stacked in the second core plate top and bottom
Conductive layer is not set.
Optionally, the production method further includes：It after pressing, is drilled and is electroplated, make outer-layer circuit figure.
A kind of mixed pressure PCB, is made according to any of the above-described production method.
A kind of production method of mixed pressure PCB, the mixed pressure PCB include the first core that thickness is different and is made from a different material
Plate and the second core plate, the production method include：
The first storage tank is opened up respectively at least two first core plates, is being intended to be stacked in adjacent two described first
Open up the second storage tank respectively on every prepreg between core plate, by second core plate be embedded in first storage tank and
Second storage tank combines the accommodating space to be formed；
For being intended to be stacked in the prepreg of second core plate top surface and/or bottom surface, in the prepreg with it is described
Conductive layer is arranged in local location on the adjacent surface of second core plate；The local location corresponds to second core plate and corresponding the
Binding site between the internal layer circuit of one core plate；
All first core plates for being embedded with the second core plate are stacked with other core plates and each prepreg according to preset order
After press.
Optionally, the conductive layer is conducting resinl, is pasted on described to be stacked in second core plate top surface and/or bottom surface
Prepreg on；
Alternatively, the conductive layer is conductive paste, it is printed in second core plate top surface and/or the bottom surface of being stacked in
On prepreg.
Optionally, it in the production method, if second core plate is the outer layer core plate positioned at top, is being intended to stack
In conductive layer is arranged on the prepreg of the second core plate bottom surface；
If second core plate is the outer layer core plate positioned at the bottom, it is being intended to be stacked in the semi-solid preparation of the second core plate top surface
Conductive layer is arranged on piece；
If second core plate is core material, divide on the prepreg for being intended to be stacked in the second core plate top and bottom
Conductive layer is not set.
Optionally, the production method further includes：It after pressing, is drilled and is electroplated, make outer-layer circuit figure.
A kind of mixed pressure PCB is made according to any production method as above.
Compared with prior art, beneficial effects of the present invention are：
In the embodiment of the present invention, when the second core plate is embedded in individual first core plate or multiple first core plates, for being intended to fold
It is put in the prepreg of the second core plate top surface and/or bottom surface, in part on the surface adjacent with the second core plate of the prepreg
Conductive layer is arranged in position, and the first core plate and other core plates and prepreg are sequentially stacked and pressed later, using conductive layer
The connection for realizing the second core plate internal layer circuit corresponding to the first core plate, effectively improves the quality of PCB product.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is the internal layer circuit open circuit schematic diagram for the different materials core plate that thickness is close in the prior art；
Fig. 2 is the internal layer circuit open circuit schematic diagram of the different different materials core plate of thickness in the prior art；
Fig. 3 is the production method flow chart for the mixed pressure PCB that the embodiment of the present invention one provides；
Fig. 4 is topology view of appointed first core plate before and after opening up storage tank in the embodiment of the present invention one；
Fig. 5 is topology view of second core plate before and after cutting into junior unit in the embodiment of the present invention one；
Fig. 6 is topology view of the prepreg before and after its regional area adds conductive layer in the embodiment of the present invention one；
Fig. 7 is that the structure after each the first core plate and prepreg are stacked according to preset order in the embodiment of the present invention one regards
Figure；
Fig. 8 is topology view of the stacked configuration after pressing shown in Fig. 7；
Fig. 9 is topology views of the PCB shown in Fig. 8 after drilling is electroplated；
Figure 10 is the production method flow chart of mixed pressure PCB provided by Embodiment 2 of the present invention；
Figure 11 is topology view of appointed first core plate before and after opening up storage tank in the embodiment of the present invention two；
Figure 12 is topology view of the prepreg before and after opening up storage tank in the embodiment of the present invention two；
Figure 13 is topology view of second core plate before and after cutting into junior unit in the embodiment of the present invention two；
Figure 14 is topology view of the prepreg before and after its regional area adds conductive layer in the embodiment of the present invention two；
Figure 15 is the structure after each the first core plate and prepreg are stacked according to preset order in the embodiment of the present invention two
View；
Figure 16 is PCB construction view of the stacked configuration after pressing shown in Figure 15；
Figure 17 is topology views of the PCB shown in Figure 16 after drilling is electroplated.
Specific implementation mode
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
Attached drawing in embodiment, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that disclosed below
Embodiment be only a part of the embodiment of the present invention, and not all embodiment.Based on the embodiments of the present invention, this field
All other embodiment that those of ordinary skill is obtained without making creative work, belongs to protection of the present invention
Range.
Core of the invention thought is：When the second core plate is embedded in individual first core plate or multiple first core plates, for
It is intended to be stacked in the prepreg of the second core plate top surface and/or bottom surface, on the surface adjacent with the second core plate of the prepreg
Conductive layer is arranged in local location, and the first core plate and other core plates and prepreg are sequentially stacked and pressed later, utilizes conduction
Layer realizes the connection of the second core plate internal layer circuit corresponding to the first core plate.
Embodiment one
Referring to Fig. 3, present embodiments providing a kind of production method of mixed pressure PCB, mixed pressure PCB includes the first core plate 1
With the second core plate 2, the material of the first core plate 1 and the second core plate 2 is different and the thickness difference of the two is less than predetermined threshold value (such as
0.025mm)；Specific production method includes step：
Step 101, according to normal process, the first core plate 1 and other core plates are respectively completed after inner line figure makes,
Predeterminated position opens up storage tank on the first core plate 1, as shown in Figure 4.
Wherein, the stacked position of the first core plate 1 does not limit, and can be core material, or outer layer core plate, according to setting
Meter demand is set.
Step 102 completes the second core plate 2 to cut into junior unit after inner line figure makes, as shown in Figure 5.
In this step, the second core plate 2 is different from the material of the first core plate 1, but thickness is close, and after cutting into junior unit
The size of the second core plate 2 and the storage tank opened up in step 101 match.
Step 103, for being intended to be stacked in the prepreg 3 of 2 top surface of the second core plate and/or bottom surface, in the prepreg 3
A conductive layer 4 is arranged in local location on the surface adjacent with the second core plate 2, as shown in Figure 6；Local location therein, corresponds to
Binding site between second core plate 2 and the corresponding internal layer circuit of the first core plate 1.
In this step, conductive layer 4 will be for realizing the corresponding internal layer circuit of appointed first core plate 1 and the second core plate 2
Connection.The conductive layer 4 can be conducting resinl, be pasted on the regional area on 3 surface of prepreg；May be conductive paste, print
It brushes in the localized area on 3 surface of prepreg.
In subsequent lamination process, if the second core plate 2 is the outer layer core plate positioned at top, only it is being intended to be stacked in
Conductive layer 4 is set on the prepreg 3 of second core plate, 2 bottom surface；If the second core plate 2 is the outer layer core plate positioned at the bottom,
Conductive layer 4 is then set only on the prepreg 3 for being intended to be stacked in 2 top surface of the second core plate；If the second core plate 2 is internal layer core
Then conductive layer 4 need to be respectively set on two prepregs 3 for being intended to be stacked in 2 bottom surface of the second core plate and top surface in plate.
Step 104, after the storage tank that the second core plate 2 is embedded in the first core plate 1, will embedded second core plate 2 the first core
Plate 1 and other core plates and prepreg are stacked according to the preset sequence that stacks.
As shown in fig. 7, the second core plate 2 is the outer layer core plate positioned at top in the figure, it is located at the half of 2 bottom surface of the second core plate
The regional area of the upper surface of cured sheets 3 is provided with conductive layer 4.
Step 105 carries out stitching operation.
After stitching operation, the internal layer circuit of the second core plate 2 is connected to by conductive layer 4 with the internal layer circuit of the first core plate 1, such as
Shown in Fig. 8.
Simultaneously as not carrying out curing process before pressing, conductive layer 4 has certain mobility, thus is pressing
Conductive layer 4 can be flowed into partly in the surrounding gap of the second core plate 2 and the first core plate 1 later, realize the reliable of the two internal layer circuit
Connection.
Step 106 carries out drilling and the plating of heavy copper, makes outer-layer circuit figure and carries out other routine operations, such as Fig. 9 later
It is shown.
In the present embodiment, the first core plate 1 is close with the thickness of the second core plate 2, positioned at two core plate bottom surfaces before pressing
Prepreg 3 on add conductive layer 4, using the conductive layer 4 by the internal layer circuit of two core plates of different materials after pressing
Junction is connected to, and the quality of PCB has been effectively ensured.
In above-mentioned flow, how to realize that internal layer circuit connection is described only for two kinds of material core plates, in practical behaviour
The quantity of different materials core plate is not limited in work, can be that the core plate of two or more materials combines, realization principle is same as described above,
Local location on corresponding prepreg 3 adds conductive layer 4, and details are not described herein again.
Embodiment two
Referring to Fig. 10, the production method for present embodiments providing another mixed pressure PCB, mixed pressure PCB includes the first core
The material of plate 1 and the second core plate 2, the first core plate 1 and the second core plate 2 is different, and the thickness of the second core plate 2 is equal at least about two first
The sum of the thickness of core plate 1 and at least one prepreg 3；Specific production method includes step：
Step 201, according to normal process, at least two the first core plates 1 are respectively completed after inner line figure makes,
Predeterminated position opens up the first storage tank respectively on every first core plate 1, as shown in figure 11；Meanwhile it being intended to be stacked in adjacent two
The second storage tank is opened up respectively on every prepreg 3 between first core plate 1, as shown in figure 12；First storage tank and second
Storage tank forms combination to accommodate the accommodating space of the second core plate 2.
In subsequent lamination process, the first core plate 1 positioned at top layer in these first core plates 1 can be internal layer core
Plate, or outer layer core plate；It can be core material to be located at undermost first core plate 1 in these first core plates 1, also may be used
Think outer layer core plate；It is set according to design requirement.
Step 202 completes the second core plate 2 to cut into junior unit after inner line figure makes, as shown in figure 13.
In this step, the second core plate 2 is different from the material of the first core plate 1, and the thickness of the second core plate 2 is equal to S the first cores
The sum of the thickness of plate 1 and at least S-1 prepregs, S are integer and S >=2；Cut into the second core plate 2 after junior unit and step
The size of accommodating space formed in rapid 101 is adapted.
Step 203, for being intended to be stacked in the prepreg 3 of 2 top surface of the second core plate and/or bottom surface, in the prepreg 3
Conductive layer 4 is arranged in local location on the surface adjacent with the second core plate 2, as shown in figure 14；Local location therein corresponds to the
Binding site between two core plates 2 and the internal layer circuit of corresponding first core plate 1；
In this step, conductive layer 4 will be for realizing the connection of the first core plate 1 and the corresponding internal layer circuit of the second core plate 2.It should
Conductive layer 4 can be conducting resinl, be pasted on the regional area on 3 surface of prepreg；It may be conductive paste, be printed in semi-solid preparation
The localized area on 3 surface of piece.
In subsequent lamination process, if the second core plate 2 is the outer layer core plate positioned at top, only it is being intended to be stacked in
Conductive layer 4 is set on the prepreg 3 of second core plate, 2 bottom surface；If the second core plate 2 is the outer layer core plate positioned at the bottom,
Conductive layer 4 is then set only on the prepreg 3 for being intended to be stacked in 2 top surface of the second core plate；If the second core plate 2 is internal layer core
Then conductive layer 4 need to be respectively set on two prepregs 3 for being intended to be stacked in 2 bottom surface of the second core plate and top surface in plate.
Step 204, after the second core plate 2 is positioned over accommodating space, will embedded second core plate 2 all first core plates 1
It is stacked according to the preset sequence that stacks with other core plates and prepreg, as shown in figure 15.
Step 205 carries out stitching operation.
After stitching operation, conductive layer 4 by the internal layer circuit of the internal layer circuit of the second core plate 2 and corresponding first core plate 1 it
Between connection, as shown in figure 16.
Step 206 carries out drilling and the plating of heavy copper, makes outer-layer circuit figure and carries out other routine operations later, such as schemes
Shown in 17.
To sum up, in the present embodiment, the first core plate 1 is different from 2 thickness of the second core plate, positioned at the second core plate 2 before pressing
Conductive layer 4 is added on the prepreg 3 of top surface and/or bottom surface, utilizes the conductive layer 4 by two core plates of different materials after pressing
Internal layer circuit junction connection, the quality of PCB has been effectively ensured.
Embodiment three
The present embodiment three provides a kind of mixed pressure PCB comprising material different the first core plate 1 and the second core plate 2, application
The method of embodiment one or embodiment two is made.
The above, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to before
Stating embodiment, invention is explained in detail, it will be understood by those of ordinary skill in the art that：It still can be to preceding
The technical solution recorded in each embodiment is stated to modify or equivalent replacement of some of the technical features；And these
Modification or replacement, the spirit and scope for various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of production method of mixed pressure PCB, the mixed pressure PCB includes the first core plate and the second core being made from a different material
Plate, and the thickness difference of first core plate and the second core plate is less than predetermined threshold value, which is characterized in that the production method packet
It includes：
Storage tank is opened up on first core plate, second core plate is embedded in the storage tank；
For being intended to be stacked in the prepreg of second core plate top surface and/or bottom surface, in the prepreg and the second core plate
Conductive layer is arranged in local location on adjacent surface；It is corresponding to the first core plate that the local location corresponds to second core plate
Binding site between internal layer circuit；
It is pressed after the first core plate for being embedded with the second core plate is stacked with other core plates and each prepreg according to preset order.
2. the production method of mixed pressure PCB according to claim 1, which is characterized in that the conductive layer is conducting resinl, is pasted
It to be stacked on the prepreg of the second core plate top surface and/or bottom surface in described；
Alternatively, the conductive layer is conductive paste, it is printed in the prepreg to be stacked in the second core plate top surface and/or bottom surface
On.
3. the production method of mixed pressure PCB according to claim 1, which is characterized in that in the production method, if described
Two core plates are the outer layer core plate positioned at top, then conductive layer are arranged on the prepreg for being intended to be stacked in the second core plate bottom surface；
If second core plate is the outer layer core plate positioned at the bottom, on the prepreg for being intended to be stacked in the second core plate top surface
Conductive layer is set；
If second core plate is core material, set respectively on the prepreg for being intended to be stacked in the second core plate top and bottom
Set conductive layer.
4. the production method of mixed pressure PCB according to claim 1, which is characterized in that the production method further includes：It is pressing
It after conjunction, is drilled and is electroplated, make outer-layer circuit figure.
5. a kind of mixed pressure PCB, which is characterized in that the mixed pressure PCB is made according to any production method of Claims 1-4.
6. a kind of production method of mixed pressure PCB, the mixed pressure PCB includes the first core plate that thickness is different and is made from a different material
With the second core plate, and it is characterized in that, the production method includes：
The first storage tank is opened up respectively at least two first core plates, is being intended to be stacked in adjacent two first core plates
Between every prepreg on open up the second storage tank respectively, second core plate is embedded in first storage tank and second
Storage tank combines the accommodating space to be formed；
For being intended to be stacked in the prepreg of second core plate top surface and/or bottom surface, in the prepreg and described second
Conductive layer is arranged in local location on the adjacent surface of core plate；The local location corresponds to second core plate and corresponding first core
Binding site between the internal layer circuit of plate；
It is pressed after all first core plates for being embedded with the second core plate are stacked with other core plates and each prepreg according to preset order
It closes.
7. the production method of mixed pressure PCB according to claim 6, which is characterized in that the conductive layer is conducting resinl, is pasted
It to be stacked on the prepreg of second core plate top surface and/or bottom surface in described；
Alternatively, the conductive layer is conductive paste, it is printed in described to be stacked in the half solid of second core plate top surface and/or bottom surface
Change on piece.
8. the production method of mixed pressure PCB according to claim 6, which is characterized in that in the production method, if described
Two core plates are the outer layer core plate positioned at top, then conductive layer are arranged on the prepreg for being intended to be stacked in the second core plate bottom surface；
If second core plate is the outer layer core plate positioned at the bottom, on the prepreg for being intended to be stacked in the second core plate top surface
Conductive layer is set；
If second core plate is core material, set respectively on the prepreg for being intended to be stacked in the second core plate top and bottom
Set conductive layer.
9. the production method of mixed pressure PCB according to claim 6, which is characterized in that the production method further includes：It is pressing
It after conjunction, is drilled and is electroplated, make outer-layer circuit figure.
10. a kind of mixed pressure PCB, which is characterized in that the mixed pressure PCB is according to any production method system of claim 6 to 9
At.
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| CN112638032A (en) * | 2020-12-09 | 2021-04-09 | 锐捷网络股份有限公司 | Circuit board and antenna device compatible with digital circuit and radio frequency circuit |
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| CN112638032A (en) * | 2020-12-09 | 2021-04-09 | 锐捷网络股份有限公司 | Circuit board and antenna device compatible with digital circuit and radio frequency circuit |
| CN112638032B (en) * | 2020-12-09 | 2022-07-19 | 锐捷网络股份有限公司 | Circuit board and antenna device compatible with digital circuit and radio frequency circuit |
| CN114190015A (en) * | 2021-12-29 | 2022-03-15 | 湖北金禄科技有限公司 | PCB of wearable product and processing method thereof |
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| CN108430174B (en) | 2019-07-23 |
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