CN102811558B - Preparation method for copper-thickened blind and buried plates - Google Patents
Preparation method for copper-thickened blind and buried plates Download PDFInfo
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- CN102811558B CN102811558B CN201210256584.XA CN201210256584A CN102811558B CN 102811558 B CN102811558 B CN 102811558B CN 201210256584 A CN201210256584 A CN 201210256584A CN 102811558 B CN102811558 B CN 102811558B
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Abstract
The invention discloses a preparation method for copper-thickened blind and buried plates. The preparation method is characterized by comprising the following steps of: cutting plates, drilling holes on the plates, depositing copper on the plates, electroplating the plates, electroplating the whole circuit board, adhering films onto the plates, transferring inner layer circuit diagrams to the plates adhered with the films, etching the diagrams, removing the films, checking the diagrams, coarsening the plates, laminating the plates, mechanically drilling through holes on the plates, plating through holes (PTH), electroplating the plates, adhering films onto the plates, transferring outer layer circuit diagrams to the plates adhered with the films, electroplating the outer layer diagrams, etching the outer layer diagrams, checking the outer layer diagrams, silk-screening green ink on the plates, silk-screening characters on the plates, shaping the plates, circuit testing, processing surfaces, final checking and packaging. The invention aims to overcome defects in the prior art, and provides a preparation method for copper-thickened blind and buried plates. The method is simple, and can effectively solve the problem that resin is empty, and a dielectric layer is not uniform in the process of laminating thick copper plates.
Description
Technical field
The present invention relates to the manufacture method of the blind buried via hole plate of copper of a kind of thick end.
Background technology
Generally all can there is resin cavity in thick copper coin bonding processes in existing copper of the thick end blind buried via hole plate, the unequal problem of dielectric layer; The copper coin etching of the existing this thick end is difficult to control, and the qualification rate of product can not get ensureing.
Summary of the invention
The object of the invention is to overcome weak point of the prior art, providing a kind of technique simple, efficiently solve resin cavity in thick copper coin bonding processes, the manufacture method of the blind buried via hole plate of copper of the thick end of dielectric layer inequality.
In order to achieve the above object, the present invention adopts following scheme:
A manufacture method for the blind buried via hole plate of copper of the thick end, is characterized in that comprising the following steps:
A, sawing sheet: FR-4 sheet material is cut out the size meeting designing requirement;
B, boring: on each FR-4 sheet material, get out through hole and beat component hole;
C, heavy copper: carry out heavy Copper treatment to the FR-4 sheet material in step B, make deposition one deck copper in described through hole make described through hole form via;
D, plate electricity: electroplate the FR-4 sheet material in step C, thickeies the copper in via and the copper on plate face;
E, electric plating of whole board: electroplate monoblock circuit board, thicken the copper on copper and plate face in hole;
F, pad pasting: FR-4 sheet material as interior laminated on stick photosensitive dry film;
G, inner figure shift: transferred in step F by the circuit diagram on film and post on the FR-4 sheet material of photosensitive dry film;
H, Etching: with etching solution, the layers of copper exposed part that FR-4 sheet material is protected without photosensitive dry film is removed, be retained as the layers of copper of circuit;
I, move back film: all returned by the photosensitive dry film on FR-4 sheet material in step H, the layers of copper as circuit exposed;
J, figure inspection: adopt scanner to open short circuit phenomenon inspection to the FR-4 sheet material circuit in step I;
K, brown: alligatoring FR-4 sheet material is as the copper face of internal layer and line face;
L, lamination pressing: multiple FR-4 sheet material, dielectric layer are stacked successively by designing requirement, then each lamination is combined;
M, machine drilling: get out the through hole of each layer and beat component hole;
N, PTH: utilize the method for heavy copper to make the through hole in step M deposits one deck copper, thus form via;
O, plate electricity: electroplate the sheet material in step N, thickeies the copper in via and the copper on plate face;
P, pad pasting: the sheet material skin on step O sticks photosensitive dry film;
Q, outer graphics shift: transferred in step P by the circuit diagram on film and post on the sheet material of photosensitive dry film;
R, graphic plating: the sheet material in step Q is electroplated, increase via and surface copper thick;
S, outer graphics etch: removed by the layers of copper exposed part that sheet material is protected without photosensitive dry film with etching solution, be retained as the layers of copper of circuit;
T, outer graphics detect: adopt scanner to open short circuit phenomenon inspection to the sheet material circuit in step S;
U, green oil: on the sheet material skin of above-mentioned steps T, silk-screen one deck plays the green ink of insulating effect;
V, word: on the sheet material plate face of step U, silk-screen is as the word identified when playing element;
W, shaping: the sheet material gong of step V is gone out finished product profile;
X, electrical measurement: each layer of the sheet material of step W to be opened, short-circuit test;
Y, surface treatment: on foregoing circuit plate, paste one deck oxidation-resistant film;
Z, final inspection: finished product inspection, be confirmed whether function and problem of appearance;
AA, packaging: the plate of passed examination is packed.
The manufacture method of the blind buried via hole plate of copper of a kind of thick end as above, is characterized in that described etching solution is acid CuCl
2.
The manufacture method of the blind buried via hole plate of copper of a kind of thick end as above, is characterized in that adopting NaOH stripping liquid to carry out moving back film in step I.
In sum, beneficial effect of the present invention:
Preparation method of the present invention is simple, convenient for production, efficiently solves resin cavity in thick copper coin bonding processes, the unequal problem of dielectric layer; Compensated by adjustment film live width, efficiently solve copper coin of the thick end and etch unmanageable technological difficulties.
Embodiment
Below in conjunction with embodiment, the present invention is described further:
Embodiment 1
The manufacture method of the blind buried via hole plate of the present invention a kind of thick end copper, comprises the following steps:
A, sawing sheet: FR-4 sheet material is cut out the size meeting designing requirement;
B, boring: on each FR-4 sheet material, get out through hole and beat component hole;
C, heavy copper: carry out heavy Copper treatment to the FR-4 sheet material in step B, make deposition one deck copper in described through hole make described through hole form via;
D, plate electricity: electroplate the FR-4 sheet material in step C, thickeies the copper in via and the copper on plate face;
E, electric plating of whole board: electroplate monoblock circuit board, thicken the copper on copper and plate face in hole;
F, pad pasting: FR-4 sheet material as interior laminated on stick photosensitive dry film;
G, inner figure shift: transferred in step F by the circuit diagram on film and post on the FR-4 sheet material of photosensitive dry film;
H, Etching: with etching solution, the layers of copper exposed part that FR-4 sheet material is protected without photosensitive dry film is removed, be retained as the layers of copper of circuit;
I, move back film: all returned by the photosensitive dry film on FR-4 sheet material in step H, the layers of copper as circuit exposed;
J, figure inspection: adopt scanner to open short circuit phenomenon inspection to the FR-4 sheet material circuit in step I;
K, brown: alligatoring FR-4 sheet material is as the copper face of internal layer and line face;
L, lamination pressing: multiple FR-4 sheet material, dielectric layer are stacked successively by designing requirement, then each lamination is combined;
M, machine drilling: get out the through hole of each layer and beat component hole;
N, PTH: utilize the method for heavy copper to make the through hole in step M deposits one deck copper, thus form via;
O, plate electricity: electroplate the sheet material in step N, thickeies the copper in via and the copper on plate face;
P, pad pasting: the sheet material skin on step O sticks photosensitive dry film;
Q, outer graphics shift: transferred in step P by the circuit diagram on film and post on the sheet material of photosensitive dry film;
R, graphic plating: the sheet material in step Q is electroplated, increase via and surface copper thick;
S, outer graphics etch: removed by the layers of copper exposed part that sheet material is protected without photosensitive dry film with etching solution, be retained as the layers of copper of circuit;
T, outer graphics detect: adopt scanner to open short circuit phenomenon inspection to the sheet material circuit in step S;
U, green oil: on the sheet material skin of above-mentioned steps T, silk-screen one deck plays the green ink of insulating effect;
V, word: on the sheet material plate face of step U, silk-screen is as the word identified when playing element;
W, shaping: the sheet material gong of step V is gone out finished product profile;
X, electrical measurement: each layer of the sheet material of step W to be opened, short-circuit test;
Y, surface treatment: on foregoing circuit plate, paste one deck oxidation-resistant film;
Z, final inspection: finished product inspection, be confirmed whether function and problem of appearance;
AA, packaging: the plate of passed examination is packed.
Embodiment 2
The manufacture method of the blind buried via hole plate of the present invention a kind of thick end copper, comprises the following steps:
A, sawing sheet: FR-4 sheet material is cut out the size meeting designing requirement;
B, boring: on each FR-4 sheet material, get out through hole and beat component hole;
C, heavy copper: carry out heavy Copper treatment to the FR-4 sheet material in step B, make deposition one deck copper in described through hole make described through hole form via;
D, plate electricity: electroplate the FR-4 sheet material in step C, thickeies the copper in via and the copper on plate face;
E, electric plating of whole board: electroplate monoblock circuit board, thicken the copper on copper and plate face in hole;
F, pad pasting: FR-4 sheet material as interior laminated on stick photosensitive dry film;
G, inner figure shift: transferred in step F by the circuit diagram on film and post on the FR-4 sheet material of photosensitive dry film;
H, Etching: use acid CuCl
2the layers of copper exposed part that FR-4 sheet material is protected without photosensitive dry film is removed, is retained as the layers of copper of circuit;
I, move back film: adopt NaOH stripping liquid all to be returned by the photosensitive dry film on FR-4 sheet material in step H, the layers of copper as circuit exposed;
J, figure inspection: adopt scanner to open short circuit phenomenon inspection to the FR-4 sheet material circuit in step I;
K, brown: alligatoring FR-4 sheet material is as the copper face of internal layer and line face;
L, lamination pressing: multiple FR-4 sheet material, dielectric layer are stacked successively by designing requirement, then each lamination is combined;
M, machine drilling: get out the through hole of each layer and beat component hole;
N, PTH: utilize the method for heavy copper to make the through hole in step M deposits one deck copper, thus form via;
O, plate electricity: electroplate the sheet material in step N, thickeies the copper in via and the copper on plate face;
P, pad pasting: the sheet material skin on step O sticks photosensitive dry film;
Q, outer graphics shift: transferred in step P by the circuit diagram on film and post on the sheet material of photosensitive dry film;
R, graphic plating: the sheet material in step Q is electroplated, increase via and surface copper thick;
S, outer graphics etch: removed by the layers of copper exposed part that sheet material is protected without photosensitive dry film with etching solution, be retained as the layers of copper of circuit;
T, outer graphics detect: adopt scanner to open short circuit phenomenon inspection to the sheet material circuit in step S;
U, green oil: on the sheet material skin of above-mentioned steps T, silk-screen one deck plays the green ink of insulating effect;
V, word: on the sheet material plate face of step U, silk-screen is as the word identified when playing element;
W, shaping: the sheet material gong of step V is gone out finished product profile;
X, electrical measurement: each layer of the sheet material of step W to be opened, short-circuit test;
Y, surface treatment: on foregoing circuit plate, paste one deck oxidation-resistant film;
Z, final inspection: finished product inspection, be confirmed whether function and problem of appearance;
AA, packaging: the plate of passed examination is packed.
Claims (3)
1. a manufacture method for the blind buried via hole plate of copper of the thick end, is characterized in that comprising the following steps:
A, sawing sheet: FR-4 sheet material is cut out the size meeting designing requirement;
B, boring: on each FR-4 sheet material, get out through hole and beat component hole;
C, heavy copper: carry out heavy Copper treatment to the FR-4 sheet material in step B, make deposition one deck copper in described through hole make described through hole form via;
D, plate electricity: electroplate the FR-4 sheet material in step C, thickeies the copper in via and the copper on plate face;
E, electric plating of whole board: electroplate monoblock circuit board, thicken the copper on copper and plate face in hole;
F, pad pasting: FR-4 sheet material as interior laminated on stick photosensitive dry film;
G, inner figure shift: transferred in step F by the circuit diagram on film and post on the FR-4 sheet material of photosensitive dry film;
H, Etching: with etching solution, the layers of copper exposed part that FR-4 sheet material is protected without photosensitive dry film is removed, be retained as the layers of copper of circuit;
I, move back film: all returned by the photosensitive dry film on FR-4 sheet material in step H, the layers of copper as circuit exposed;
J, figure inspection: adopt scanner to open short circuit phenomenon inspection to the FR-4 sheet material circuit in step I;
K, brown: alligatoring FR-4 sheet material is as the copper face of internal layer and line face;
L, lamination pressing: multiple FR-4 sheet material, dielectric layer are stacked successively by designing requirement, then each lamination is combined;
M, machine drilling: get out the through hole of each layer and beat component hole;
N, PTH: utilize the method for heavy copper to make the through hole in step M deposits one deck copper, thus form via;
O, plate electricity: electroplate the sheet material in step N, thickeies the copper in via and the copper on plate face;
P, pad pasting: the sheet material skin on step O sticks photosensitive dry film;
Q, outer graphics shift: transferred in step P by the circuit diagram on film and post on the sheet material of photosensitive dry film;
R, graphic plating: the sheet material in step Q is electroplated, increase via and surface copper thick;
S, outer graphics etch: removed by the layers of copper exposed part that sheet material is protected without photosensitive dry film with etching solution, be retained as the layers of copper of circuit;
T, outer graphics detect: adopt scanner to open short circuit phenomenon inspection to the sheet material circuit in step S;
U, green oil: on the sheet material skin of above-mentioned steps T, silk-screen one deck plays the green ink of insulating effect;
V, word: on the sheet material plate face of step U, silk-screen is as the word identified when playing element;
W, shaping: the sheet material gong of step V is gone out finished product profile;
X, electrical measurement: each layer of the sheet material of step W to be opened, short-circuit test;
Y, surface treatment: on foregoing circuit plate, paste one deck oxidation-resistant film;
Z, final inspection: finished product inspection, be confirmed whether function and problem of appearance;
AA, packaging: the plate of passed examination is packed.
2. the manufacture method of the blind buried via hole plate of copper of a kind of thick end according to claim 1, is characterized in that described etching solution is acid CuCl
2.
3. the manufacture method of the blind buried via hole plate of copper of a kind of thick end according to claim 1, is characterized in that adopting NaOH stripping liquid to carry out moving back film in step I.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210256584.XA CN102811558B (en) | 2012-07-24 | 2012-07-24 | Preparation method for copper-thickened blind and buried plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210256584.XA CN102811558B (en) | 2012-07-24 | 2012-07-24 | Preparation method for copper-thickened blind and buried plates |
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| Publication Number | Publication Date |
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| CN102811558A CN102811558A (en) | 2012-12-05 |
| CN102811558B true CN102811558B (en) | 2015-02-11 |
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| CN201210256584.XA Expired - Fee Related CN102811558B (en) | 2012-07-24 | 2012-07-24 | Preparation method for copper-thickened blind and buried plates |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103533741B (en) * | 2013-10-29 | 2016-07-06 | 景旺电子科技(龙川)有限公司 | A kind of double-side thick copper plate and preparation method thereof |
| CN103731981B (en) * | 2013-12-31 | 2017-01-18 | 邢台市海纳电子科技有限责任公司 | Aluminum magnesium alloy embedded-type circuit board and manufacturing method thereof |
| CN104902694B (en) * | 2014-03-05 | 2018-02-23 | 深南电路有限公司 | The processing method and inner-layer thick copper circuit board of inner-layer thick copper circuit board |
| CN107041067A (en) * | 2017-05-10 | 2017-08-11 | 深圳市深联电路有限公司 | A kind of preparation method of thermistor printed circuit board |
| CN111405758A (en) * | 2019-01-03 | 2020-07-10 | 鸿富锦精密工业(武汉)有限公司 | Circuit board processing method and circuit board |
| CN109719404A (en) * | 2019-01-15 | 2019-05-07 | 广东科翔电子科技有限公司 | A kind of method of IC support plate laser drill |
| CN111343800B (en) * | 2020-03-18 | 2023-03-24 | 四川英创力电子科技股份有限公司 | Processing technology for local electroplating of blind buried hole |
| CN114340164A (en) * | 2021-12-28 | 2022-04-12 | 龙南骏亚柔性智能科技有限公司 | Novel circuit board electroplating slot hole manufacturing process |
| CN114900946A (en) * | 2022-03-28 | 2022-08-12 | 诚亿电子（嘉兴）有限公司 | Micro-space SLP carrier plate and preparation process thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102364997A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of Rogers board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050093595A (en) * | 2004-03-20 | 2005-09-23 | 주식회사 에스아이 플렉스 | The production method of double side flexible printed circuit board by partial and selected cupper plating |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102364997A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of Rogers board |
Non-Patent Citations (1)
| Title |
|---|
| 多层盲埋孔板传统法制作工艺流程;柳祖伟;《电子电路与贴装》;20070831(第4期);第96页第2节，示意图1 * |
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Granted publication date: 20150211 Termination date: 20210724 |