CN106848862A - A kind of composite flame-proof cardboard and preparation method thereof - Google Patents
A kind of composite flame-proof cardboard and preparation method thereof Download PDFInfo
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- CN106848862A CN106848862A CN201710044568.7A CN201710044568A CN106848862A CN 106848862 A CN106848862 A CN 106848862A CN 201710044568 A CN201710044568 A CN 201710044568A CN 106848862 A CN106848862 A CN 106848862A
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- composite flame
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- proof cardboard
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/584—Scratch resistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
Abstract
The invention discloses a kind of composite flame-proof cardboard and preparation method thereof.Composite flame-proof cardboard, it is characterised in that its structure is followed successively by top layer, secondary top layer and sandwich part from Wai Dao centers;Wherein top layer is MP layer of 12 layers;Secondary top layer is CEM1 layer of minimum 1 layer;Sandwich part is at least one layer of laminboard layer, and wherein laminboard layer is CEM1 layers of composition of PP layers and 12 layers of 13 layers.Composite flame-proof cardboard of the present invention has good tensile strength (133 140MPa), perpendicular layers to bending strength (MPa) (257 267MPa), comparative tracking index (more than or equal to 400), resistance to electric arc (124 128) and perpendicular layers to electrical strength (during normality is oily, rapid pressure, 25mm/75mm cylinder electrodes) (27.2 30), flammability is 0 grade of V, good properties.
Description
Technical field
The present invention relates to flame-retardant board field, more particularly to a kind of composite flame-proof cardboard and preparation method thereof.
Background technology
The UPGM203 sheet materials of the warning dividing plate mostly entire body used in switch cubicle on current market, relatively costly, Cheng Cheng
Pale red, and unobtrusively, and material hardness is relatively low easy to wear.
The content of the invention
It is bright-coloured large red it is an object of the invention to provide a kind of surface, mechanical strength, electric property meet electrically to be opened
Close the requirement of dividing plate, the composite flame-proof cardboard of low cost.
To achieve the above object, the present invention provides a kind of composite flame-proof cardboard, it is characterised in that its structure is from Wai Dao centers
It is followed successively by top layer, secondary top layer and sandwich part;Wherein top layer is MP layer of 1-2 layers;Secondary top layer is CEM1 layer of minimum 1 layer;Folder
Core is divided at least one layer of laminboard layer, and wherein laminboard layer is CEM1 layers of composition of PP layers and 1-2 layers of 1-3 layers.
Further, described MP layers thickness in monolayer is 0.13-0.2mm.
Further, described CEM1 layers thickness in monolayer is 0.15-0.25mm.
Further, described PP layers thickness in monolayer is 0.10--0.20mm.
Further, preparation method is that, by material requested PP layers, CEM1 layers, MP layers, according to structural arrangement, is sent into laminating machine,
Initial temperature is 30-35 DEG C, and pressing pressure is 60-90bar, press tonnage 1250T, product wide cut
1050x1250mm;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;
Then pressurize, is warming up to 150 DEG C;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;
To normal temperature state.
The present invention also provides a kind of preparation method of the composite flame-proof cardboard, it is characterised in that by material requested PP layers,
CEM1 layers, MP layers, according to structural arrangement, is sent into laminating machine,
Initial temperature is 30-35 DEG C, and pressing pressure is 60-90bar;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;
Then pressurize, is naturally cooling to 150 DEG C;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;To normal temperature state.
Parent material temperature is 30-35 DEG C, and pressing pressure is 60-90bar;Press tonnage 1250T, product wide cut
1050x1250mm, now glue is semi-solid state;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;Now glue is liquid
Body state;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;Now glue is
Liquid condition;
Then pressurize, is warming up to 150 DEG C;Now glue switchs to solid-state for semi-solid preparation state;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;Now glue is solid state, and each layer is tight
Close links together;
It is to obtain composite flame-proof cardboard of the invention to normal temperature state.
, higher than above steps requirement, not cooling in time after formed product can be aging, and temperature is low for the temperature of above-mentioned laminating machine
In above steps requirement, then solidify incomplete;Intensification rate of temperature fall is faster than above-mentioned requirements, and the easy bubble of material is slower than above-mentioned
It is required that, efficiency is low, is unfavorable for industrialized production.If temperature is high, now glue is slowly melting, and it is high to add pressure, glue
Can overflow, steel may run out so that the composite flame-proof cardboard out-of-flatness for obtaining.
Composite flame-proof cardboard of the present invention, with product cost reduction, strengthens the advantage of dividing plate safe warning function.
Present invention use selection hardness is high, wear-resisting, the bright-coloured melamine impregnated paper that can be served as warning in surface does plate
Material surface.It is melmac good electric property, heat-resist, but fragility is high after solidification, and price is high, and epoxy resin soaks
The fire retardant papers of stain, price is low, good toughness after solidification.
The present invention uses layer composite construction, and being impregnated with paper using flame retardant type melmac makes surface, makes product hardness
Height, is difficult to scratch, and plate core uses epoxy radicals fire retardant papers and epoxy glass fabric composite, makes electrical property more stable, intensity, toughness
Lifted.
Described MP layers is melamine impregnated paper, and thickness in monolayer requirement is 0.13-0.2mm/ layers;CEM1 is epoxy resin
Dipping paper, thickness in monolayer requirement is 0.15-0.25mm/ layers;Described PP layers is epoxy glass fabric, and thickness in monolayer requirement is 0.1-
0.2mm/ layers.
MP layers of the present invention is 1-2 layers, and Main Function is wear-resisting;Outward appearance harmony and color balancing;Fire prevention.It is higher than
2 layers, harder more crisp, easy chip in process.Excellent electrical properties, such as resistance to electricity ambuscade itself is worn.
Sandwich is PP+CEM1, and wherein PP can not simultaneously be superimposed unnecessary layer 2-3, plus mechanical strength such as tensile strength, curved after cloth
Qu Qiangdu and impact strength strengthen.
Composite flame-proof cardboard of the present invention uses symmetrical structure:Symmetrical superposition, so that two sides effect is consistent.
Composite flame-proof cardboard of the present invention, tensile strength meets standard, but case hardness is high, thickness is smooth, thickness
Uniformity is good, and proportion reduction reaches 1.5-1.6 (prior art is 1.9-2.1), electric property burden requirement, cost reduction.
Composite flame-proof cardboard of the present invention has good tensile strength (133-140MPa), perpendicular layers to bending strength
(MPa) (257-267MPa), comparative tracking index (being more than or equal to 400), resistance to electric arc (124-128) and perpendicular layers are to electrically strong
Degree (in normality oil, rapid pressure, 25mm/75mm cylinder electrodes) (27.2-30), flammability is V-0 grades, good properties.
Brief description of the drawings
Fig. 1 is the structural representation of the gained composite flame-proof cardboard of embodiment 1.
Fig. 2 is the structural representation of the gained composite flame-proof cardboard of embodiment 2.
Fig. 3 is the structural representation of the gained composite flame-proof cardboard of embodiment 3.
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from start to finish
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
It is exemplary to scheme the embodiment of description, it is intended to for explaining the present invention, and be not considered as limiting the invention.Embodiment
In unreceipted particular technique or condition person, according to the technology or condition described by document in the art or according to the description of product
Book is carried out.Agents useful for same or the unreceipted production firm person of instrument, be can by city available from conventional products.
Embodiment 1:The preparation of composite flame-proof cardboard
Material prepares:
By 1 layer MP layers, 1 layer CEM1 layers, 1 layer PP layers, CEM1 layers of 2 layers, 1 layer PP layers, 1 layer CEM1 layers, 1 layer MP layers of knot
Sequentially, code is good for structure, sends into laminating machine.
Initial temperature is 30-35 DEG C, and pressing pressure is 60-90bar;Press tonnage 1250T, product wide cut
1050x1250mm, now glue is semi-solid state;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;Now glue is liquid
Body state;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;Now glue is
Liquid condition;
Then pressurize, is warming up to 150 DEG C;Now glue switchs to solid-state for semi-solid preparation state;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;Now glue is solid state, and each layer is tight
Close links together;
It is to obtain composite flame-proof cardboard of the invention to normal temperature state.Structural representation is as shown in Figure 1.
Embodiment 2:The preparation of composite flame-proof cardboard
Material prepares:
By 2 layers MP layers, 1 layer CEM1 layers, 3 layers PP layers, CEM1 layers of 2 layers, 3 layers PP layers, 1 layer CEM1 layers, 2 layers MP layers of knot
Sequentially, code is good for structure, sends into laminating machine.
Initial temperature is 30-35 DEG C, and pressing pressure is 60-90bar;Press tonnage 1250T, product wide cut
1050x1250mm, now glue is semi-solid state;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;Now glue is liquid
Body state;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;Now glue is
Liquid condition;
Then pressurize, is warming up to 150 DEG C;Now glue switchs to solid-state for semi-solid preparation state;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;Now glue is solid state, and each layer is tight
Close links together;
It is to obtain composite flame-proof cardboard of the invention to normal temperature state.Structural representation is as shown in Figure 2.
Embodiment 3:The preparation of composite flame-proof cardboard
Material prepares:
By 1 layer MP layers, 2 layers CEM1 layers, 2 layers PP layers, CEM1 layers of 4 layers, 2 layers PP layers, 2 layers CEM1 layers, 1 layer MP layers of knot
Sequentially, code is good for structure, sends into laminating machine.
Initial temperature is 30-35 DEG C, and pressing pressure is 60-90bar;Press tonnage 1250T, product wide cut
1050x1250mm, now glue is semi-solid state;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;Now glue is liquid
Body state;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;Now glue is
Liquid condition;
Then pressurize, is warming up to 150 DEG C;Now glue switchs to solid-state for semi-solid preparation state;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;Now glue is solid state, and each layer is tight
Close links together;
It is to obtain composite flame-proof cardboard of the invention to normal temperature state.Structural representation is as shown in Figure 3.
Embodiment 4:Performance measurement
To embodiment 1-3 gained composite flame-proof cardboard detections, foundation is detected:IEC 60893-2:2003《Electrically use thermosetting
Property Resin Industry rigid laminate part 2:Test method》Deng.
The results are shown in Table 1.
The embodiment 1-3 of table 1 gained composite flame-proof cardboard testing result tables
As can be seen from Table 1, composite flame-proof cardboard of the present invention has good tensile strength, perpendicular layers strong to bending
(in normality oil, rapid pressure, 25mm/75mm justifies to electrical strength for degree (MPa), comparative tracking index, resistance to electric arc and perpendicular layers
Post electrode) it is excellent, flammability is V-0 grades, reaches demand for commodity.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art is not departing from principle of the invention and objective
In the case of above-described embodiment can be changed within the scope of the invention, change, replace and modification.
Claims (6)
1. a kind of composite flame-proof cardboard, it is characterised in that its structure is followed successively by top layer, secondary top layer and sandwich portion from Wai Dao centers
Point;Wherein top layer is MP layer of 1-2 layers;Secondary top layer is CEM1 layer of minimum 1 layer;Sandwich part is at least one layer of laminboard layer,
Wherein laminboard layer is CEM1 layers of composition of PP layers and 1-2 layers of 1-3 layers.
2. composite flame-proof cardboard described in claim 1, it is characterised in that described MP layers thickness in monolayer is 0.13-0.2mm.
3. composite flame-proof cardboard described in claim 1, it is characterised in that described CEM1 layers thickness in monolayer is 0.15-0.25mm.
4. composite flame-proof cardboard described in claim 1, it is characterised in that described PP layers thickness in monolayer is 0.10--0.20mm.
5. composite flame-proof cardboard described in any one of claim 1-4, it is characterised in that preparation method is, by material requested PP layers,
CEM1 layers, MP layers, according to structural arrangement, is sent into laminating machine,
Initial temperature is 30-35 DEG C, and pressing pressure is 60-90bar, press tonnage 1250T, product wide cut 1050x1250mm;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;
Then pressurize, is warming up to 150 DEG C;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;
To normal temperature state.
6. the preparation method of composite flame-proof cardboard described in a kind of any one of claim 1-5, it is characterised in that by material requested PP
Layer, CEM1 layers, MP layers, according to structural arrangement, is sent into laminating machine,
Initial temperature is 30-35 DEG C, and pressing pressure is 60-90bar;
50-60 DEG C is raised to afterwards, pressing pressure is 140-170bar, heating rate is 1-2 DEG C/min;
Continue to be warmed up to 80-90 DEG C, pressing pressure is 170-210bar, and heating rate is 1-2 DEG C/min;
Then pressurize, is naturally cooling to 150 DEG C;
50-70 DEG C of material, synchronous buck are cooled in 60-90min again;To normal temperature state.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107558306A (en) * | 2017-08-08 | 2018-01-09 | 无锡海特新材料研究院有限公司 | A kind of enhanced fire-retardant cardboard and its manufacture method |
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CN107558306A (en) * | 2017-08-08 | 2018-01-09 | 无锡海特新材料研究院有限公司 | A kind of enhanced fire-retardant cardboard and its manufacture method |
CN108179663A (en) * | 2017-12-21 | 2018-06-19 | 海宁信诚包装有限公司 | A kind of production and processing method of cardboard |
CN108179663B (en) * | 2017-12-21 | 2020-04-24 | 浙江长恒包装有限公司 | Production and processing method of paperboard |
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