CN105451450A - Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow - Google Patents
Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow Download PDFInfo
- Publication number
- CN105451450A CN105451450A CN201510927034.XA CN201510927034A CN105451450A CN 105451450 A CN105451450 A CN 105451450A CN 201510927034 A CN201510927034 A CN 201510927034A CN 105451450 A CN105451450 A CN 105451450A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- glue
- hole
- central layer
- step trough
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
Abstract
The invention discloses a manufacturing method for a high-frequency stepped circuit board for reducing stepped groove glue overflow, and relates to the technical field of circuit board production. The manufacturing method for the high-frequency stepped circuit board comprises the steps that a first core board, a second core board, and a PP sheet positioned between the first core board and the second core board are folded and laminated into a circuit board; a blind hole is formed in one surface, corresponding to the second core board, of the first core board; a through hole is formed in the position, corresponding to the blind hole, in the second core board; a window corresponding to the through hole is formed in the PP sheet; and the window is 0.2-0.8 mm larger than the unilateral edge of the through hole. The manufacturing method can reduce the glue overflow in the stepped groove in the high-frequency circuit board laminating process; and the problem that the circuit board is declared worthless when the blind hole in the stepped groove is filled with the overflowing glue is solved.
Description
Technical field
The present invention relates to board production technical field, particularly relate to a kind of step trough that improves and to overflow the high frequency stairing circuit board manufacturing method of glue.
Background technology
Along with the small-sized diversified development of electronic product, the restriction of space and fail safe makes conventional planar design can not meet the demand of many circuit boards at electronic applications, and therefore the circuit board of step trough structure dominates the market gradually.On the one hand, step trough structure can utilize space in circuit board to greatest extent, for electronic product diversified development provides technical support; On the other hand, client, when welding component, needs during some to carry out superposing or avoid other components and parts, to ensure the fail safe of electric elements, has therefore just more highlighted step trough structural advantages.But the step trough structure in circuit board is formed by pressing, the glue that overflows often melts because of PP sheet in bonding processes under high temperature, high pressure in step trough place, so that is blocked at step trough position, and in step trough, the blind hole glue that overflow is filled, and causes and scraps.
Summary of the invention
For the problems referred to above, the invention provides and a kind ofly improve step trough in high-frequency circuit board bonding processes and to overflow the method for glue problem, concrete scheme is as follows:
Improve step trough to overflow the high frequency stairing circuit board manufacturing method of glue, comprise and be pressed into circuit board by after the first central layer, the second central layer and the PP sheet lamination between the first central layer and the second central layer; The one side of corresponding second central layer of the first described central layer is provided with blind hole, the second described central layer is provided with the through hole of corresponding blind hole position, described PP sheet is provided with the window of corresponding through hole; Described window large 0.2-0.8mm more monolateral than through hole.
Preferably, described window large 0.5mm more monolateral than through hole.
Preferably, the aperture of described through hole is greater than the aperture of blind hole.
Further, improve the overflow high frequency stairing circuit board manufacturing method of glue of step trough and be also included in the outer side covers resistance glue film of the first central layer, then carry out pressing, after pressing, remove resistance glue film; Described resistance glue film is the two-sided epoxy glue layer covering release film.
Manufacture method of the present invention can improve the excessive glue problem in high-frequency circuit board bonding processes step trough, solves the glue that overflow of blind hole in step trough and fills and cause the quality problem of scrapping.
Accompanying drawing explanation
Fig. 1 is the structure chart after embodiment of the present invention resistance glue film, the first central layer, PP sheet and the second central layer lamination.
Fig. 2 is the structure chart of embodiment of the present invention resistance glue film.
Fig. 3 is the structure chart after embodiment of the present invention resistance glue film, the first central layer, PP sheet and the second central layer pressing.
Fig. 4 is the structure chart of embodiment of the present invention high frequency stepped circuit board.
Fig. 5 is the section micrograph of high frequency stepped circuit board step trough position of the present invention.
Embodiment
In order to more fully understand technology contents of the present invention, below in conjunction with specific embodiment technical scheme of the present invention being introduced further and illustrating.
Embodiment
As shown in Figure 1, high frequency stepped circuit board comprises the first central layer 1, PP sheet 2, second central layer 3 that stack gradually.High frequency stepped circuit board is provided with step trough 5.
The manufacture method of this high frequency stepped circuit board is as follows:
As shown in Figure 2, the first central layer 1 is provided with blind hole 11, PP sheet 2 and is provided with window 21, and the second central layer 3 is provided with through hole 31.Window 21 on blind hole 11, PP sheet 2 on first central layer 1 and the correspondence of through hole 31 position on the second central layer 3.The monolateral large 0.5mm of through hole 31 on window 21 to the second central layer 3 on PP sheet 2.On second central layer 3, the aperture of through hole 31 is greater than the aperture of blind hole 11 on the first central layer 1.
First central layer 1 and the second central layer 3 preferably adopt the central layer of PTFE (polytetrafluoroethylene) material.
Resistance glue film 4, first central layer 1, PP sheet 2 and the second central layer 3 are stacked gradually from top to bottom (as shown in Figure 2) row plate, make blind hole 11, window 21 and through hole 31 position corresponding.As shown in Figure 3, hindering glue film 4 is the two-sided epoxy glue layer 41 covering release film 42.
After row's plate, be placed in press and carry out pressing, after pressing, structure as shown in Figure 4, and resistance glue film 4 is filled in through hole 31 and window 21, and the window 21 on PP sheet 2 is contracted to through hole 31 grade large.Then remove resistance glue film 4, complete the making of high frequency stepped circuit board, through hole 31, window 21 and blind hole 11 form required step trough 5.
Check excessive glue situation in step trough 5 and cut into slices, as shown in Figure 5, can find out from slice map, step trough 5 edge overflows without obvious glue mark, meets the quality requirements of outward appearance examination criteria completely.
Manufacture method of the present invention considers the factor that PP glue mobility is strong, glue amount of overflowing is large, so before pressing, PP sheet 2 is windowed and carries out pre-large process, inside contract 0.5mm by PP sheet window size, after ensureing pressing, PP gummosis just flows to linking edge, makes PP sheet window and through hole 31 etc. large.
In order to better prevent the PP sheet of step trough position to overflow glue, during pressing, design resistance glue film enters the pressing of press HTHP in the lump.This resistance glue film is divided into two parts, is release film up and down, and centre is epoxy glue layer.Release film, for isolating the first central layer and steel plate (steel plate is press structure), prevents epoxy glue layer and the first central layer or steel plate from bonding together.Epoxy glue layer plays the effect of main resistance glue, in pressing temperature-rise period, along with the rising of pressure, temperature, first low-melting epoxide-resin glue starts to melt and produces flowing, under the effect of the pressure, epoxide-resin glue around step trough starts to continue flowing in through hole 31 and window 21, and through hole 31 and window 21 is filled up.The tg value of PP is then higher, just starts to produce flowing 188 DEG C time, so when PP starts to flow, fills completely in through hole 31 and window 21, causes PP glue cannot flow in through hole 31 and window 21, finally reaches resistance glue effect.In addition, resistance glue thin film exterior layer is all release film, after pressing, can ensure this resistance glue film and the first central layer and steel plate delamination, not have epoxide-resin glue and be bonded in the first central layer plate face or surface of steel plate.
This manufacture method can improve the excessive glue problem in high-frequency circuit board bonding processes step trough, solves the glue that overflow of blind hole in step trough and fills and cause scrap Geological Problems.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (4)
1. improve step trough to overflow the high frequency stairing circuit board manufacturing method of glue, comprise and be pressed into circuit board by after the first central layer, the second central layer and the PP sheet lamination between the first central layer and the second central layer; It is characterized in that, the one side of corresponding second central layer of the first described central layer is provided with blind hole, the second described central layer is provided with the through hole of corresponding blind hole position, described PP sheet is provided with the window of corresponding through hole; Described window large 0.2-0.8mm more monolateral than through hole.
2. improve step trough according to claim 1 to overflow the high frequency stairing circuit board manufacturing method of glue, it is characterized in that, described window large 0.5mm more monolateral than through hole.
3. improve step trough according to claim 2 to overflow the high frequency stairing circuit board manufacturing method of glue, it is characterized in that, the aperture of described through hole is greater than the aperture of blind hole.
4. improve step trough according to claim 1 to overflow the high frequency stairing circuit board manufacturing method of glue, it is characterized in that, be also included in the outer side covers resistance glue film of the first central layer, then carry out described pressing; Described resistance glue film is made up of the two-sided epoxy glue layer covering release film; After pressing, remove resistance glue film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510927034.XA CN105451450A (en) | 2015-12-14 | 2015-12-14 | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510927034.XA CN105451450A (en) | 2015-12-14 | 2015-12-14 | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105451450A true CN105451450A (en) | 2016-03-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510927034.XA Pending CN105451450A (en) | 2015-12-14 | 2015-12-14 | Manufacturing method for high-frequency stepped circuit board for reducing stepped groove glue overflow |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105451450A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| WO2019014956A1 (en) * | 2017-07-20 | 2019-01-24 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing high-frequency board by mixing and pressing different board materials |
| CN110351964A (en) * | 2019-07-05 | 2019-10-18 | 信泰电子（西安）有限公司 | Groove PCB circuit board processing technology |
| CN111182732A (en) * | 2020-02-28 | 2020-05-19 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN114025486A (en) * | 2021-10-21 | 2022-02-08 | 深圳明阳电路科技股份有限公司 | Printed circuit board blind slot, printed circuit board, electronic equipment and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN202435716U (en) * | 2011-11-15 | 2012-09-12 | 景旺电子（深圳）有限公司 | Novel board-arranging structure for middle-step PCB blind channel board |
| CN202721895U (en) * | 2012-08-27 | 2013-02-06 | 深圳市迅捷兴电路技术有限公司 | Stepped structure of high-frequency stepped plate |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
-
2015
- 2015-12-14 CN CN201510927034.XA patent/CN105451450A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291940A (en) * | 2011-08-01 | 2011-12-21 | 东莞生益电子有限公司 | Method for making printed circuit board (PCB) with step groove |
| CN202435716U (en) * | 2011-11-15 | 2012-09-12 | 景旺电子（深圳）有限公司 | Novel board-arranging structure for middle-step PCB blind channel board |
| CN202721895U (en) * | 2012-08-27 | 2013-02-06 | 深圳市迅捷兴电路技术有限公司 | Stepped structure of high-frequency stepped plate |
| CN103179792A (en) * | 2013-03-08 | 2013-06-26 | 深圳崇达多层线路板有限公司 | Stepped slot lateral side evenness improving method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107318232A (en) * | 2017-07-06 | 2017-11-03 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of PCB mechanical blind holes |
| WO2019014956A1 (en) * | 2017-07-20 | 2019-01-24 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing high-frequency board by mixing and pressing different board materials |
| CN110351964A (en) * | 2019-07-05 | 2019-10-18 | 信泰电子（西安）有限公司 | Groove PCB circuit board processing technology |
| CN111182732A (en) * | 2020-02-28 | 2020-05-19 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN111182732B (en) * | 2020-02-28 | 2023-01-10 | 四川锐宏电子科技有限公司 | High-frequency mixing and laminating process |
| CN114025486A (en) * | 2021-10-21 | 2022-02-08 | 深圳明阳电路科技股份有限公司 | Printed circuit board blind slot, printed circuit board, electronic equipment and manufacturing method thereof |
| CN114025486B (en) * | 2021-10-21 | 2024-02-23 | 深圳明阳电路科技股份有限公司 | Blind groove of printed circuit board, electronic equipment and manufacturing method of blind groove |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160330 |