CN102933042A - Anti-gluing method for flexible board in groove region of rigid-flexible board - Google Patents
Anti-gluing method for flexible board in groove region of rigid-flexible board Download PDFInfo
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- CN102933042A CN102933042A CN201210396344XA CN201210396344A CN102933042A CN 102933042 A CN102933042 A CN 102933042A CN 201210396344X A CN201210396344X A CN 201210396344XA CN 201210396344 A CN201210396344 A CN 201210396344A CN 102933042 A CN102933042 A CN 102933042A
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Abstract
The invention relates to an anti-gluing method for a flexible board in a groove region of a rigid-flexible board, comprising the following steps of: firstly, arranging an adhesive tape above a flexible board region which is adjacent to a rigid board region of the rigid-flexible board and is provided with a groove between the rigid board region and the flexible board region; secondly, laminating the rigid-flexible board; and thirdly, removing the adhesive tape. According to the anti-gluing method for the flexible board in the groove region of the rigid-flexible board provided by the invention, the adhesive tape is directly pasted on the flexible board region as a protection layer, the protection layer is removed after the rigid-flexible board is laminated, and excessive glue also can be removed with the protection layer even the excessive glue overflows in a laminating process of the rigid-flexible board, so that the protection layer can ensure that no residual excessive glue of prepreg is left on a cover film used for protecting the flexible board in the groove region, and further the complete appearance of the cover film is guaranteed.
Description
Technical field
The present invention relates to field of semiconductor manufacture, more particularly, the present invention relates to the anti-adhesive means of a kind of Rigid Flex groove area soft board.
Background technology
One deck CVL(Coverlayer is generally arranged on the flexible board area of Rigid Flex; coverlay) covering similar soldering-resistance layer equally protects flexible board area; this tunic requires and flexible board area wants closely connected property good; without damaged; flexible board area and hardboard district are relatively far apart during general Rigid Flex design; but flexible board area and hardboard district were excessively near when the design of part Rigid Flex was arranged, and formed a groove area.The Rigid Flex of the fluted design of this class is being taken off when covering blind the milling of flexible board area, and the too much gummosis that overflows is easily pullled coverlay, causes the PI(polyimides on it, and Polyimide) film is damaged, affects outward appearance, and the serious conductor that exposes causes printed board to be scrapped.
More particularly, shown in three kinds of situations of Fig. 1 to Fig. 3, the part Rigid Flex is when design, and soft board and hardboard district are at a distance of too near, between the two first be generally 0.2-1.5mm apart from d, the zone between flexible board area 2 and the hardboard district 1 has formed a groove thus.During the Rigid Flex lamination, according to corresponding test stone (IPC-A-600G), it is 1.5mm that the flexible board area maximum can allow prepreg gummosis amount.Because groove size is little, prepreg gummosis amount is bigger than normal just to be easy to stride across groove area, flows on the soft board.
At present, for this defective two kinds of solutions are arranged:
(1) prepreg neck-in reasonable in design makes the prepreg gummosis just flow out the soft or hard junction but does not overflow to flexible board area;
(2) fill up filler on the flexible board area, such as resistance glue such as hardboard monolithic, high temperature resistant filler, micelles, prevent that prepreg from flowing on the flexible board area.
But, because the excessive glue amount of prepreg has the fluctuation of certain limit (being generally 0.2-1.5mm), be difficult to accurately define suitable prepreg neck-in in the technology (1), and when groove size is too small, be easy to the excessive glue of prepreg to flexible board area.And pad filler application limitation is large on the middle flexible board area of technology (2), and inconvenient operation can only be used in some folded structure.
Summary of the invention
Technical problem to be solved by this invention is for there being defects in the prior art; provide a kind of and directly paste one deck at flexible board area and can protect on the groove area soft board coverlay the not protective layer of the excessive glue of residual prepreg, thereby guarantee the complete anti-adhesive means of Rigid Flex groove area soft board of outward appearance of coverlay.
According to the present invention, provide a kind of Rigid Flex groove area soft board to prevent adhesive means, it comprises: first step: Rigid Flex and hardboard district adjacency and and the hardboard district between the reeded flexible board area of tool zone arrange adhesive tape; Second step: described Rigid Flex is carried out lamination; Third step: remove described adhesive tape.
According to the present invention; in the anti-adhesive means of above-mentioned Rigid Flex groove area soft board; directly paste one layer tape as protective layer at flexible board area; this protective layer is carrying out being removed after the lamination to Rigid Flex; even there is so excessive glue in the lamination process of Rigid Flex, to overflow; excessive glue also can remove along with this protective layer comes along, so this protective layer can be protected on the groove area soft board coverlay the not excessive glue of residual prepreg, thereby the outward appearance of guaranteeing coverlay is complete.
Preferably, described adhesive tape is a kind of adhesive tape of high-temperature plastic belt type.
Thus, the glue of can guaranteeing better to overflow also can come along along with the described adhesive tape as protective layer and removes.
Preferably, described adhesive tape is PI adhesive tape or PTFE adhesive tape.
Preferably, described adhesive tape covers the coverlay of described flexible board area.
Preferably, described adhesive tape is 0.2-1.0mm apart from the scope of the distance at the edge of the groove side in hardboard district.
In this distance range, can prevent preferably the excessive glue of prepreg on groove area soft board coverlay, and can guarantee that described adhesive tape does not hinder the hardboard district.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 to Fig. 3 schematically shows Rigid Flex groove schematic diagram.
Fig. 4 schematically shows the flow chart according to the anti-adhesive means of Rigid Flex groove area soft board of the present invention.
Fig. 5 schematically shows the schematic diagram according to the anti-adhesive means of Rigid Flex groove area soft board of the present invention.
Need to prove, accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Note, the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
The embodiment of the invention is by pasting the resistant to elevated temperatures adhesive tape of one deck at flexible board area; when the rigid-flex pressing because the HTHP high vacuum environment; this adhesive tape can fit tightly on coverlay; thereby there is not gummosis remaining (if exist gummosis to flow on the adhesive tape on the protection coverlay; then can at the follow-up adhesive tape of taking off, can remove gummosis).
Specifically describe according to the anti-adhesive means of the Rigid Flex groove area soft board of the embodiment of the invention below in conjunction with accompanying drawing.
Fig. 4 schematically shows the flow chart according to the anti-adhesive means of Rigid Flex groove area soft board of the present invention.
As described in Figure 4, comprise according to the anti-adhesive means of Rigid Flex groove area soft board of the present invention:
First step S1: Rigid Flex and hardboard district 1 adjacency and and hardboard district 1 between the reeded flexible board area of tool 2 zones arrange adhesive tape 3, as shown in Figure 5.
Second step S2: described Rigid Flex is carried out lamination;
Third step S3: remove described adhesive tape 3.
In the anti-adhesive means of above-mentioned Rigid Flex groove area soft board; directly paste one layer tape as protective layer at flexible board area; this protective layer is carrying out being removed after the lamination to Rigid Flex; even there is so excessive glue in the lamination process of Rigid Flex, to overflow; excessive glue also can remove along with this protective layer comes along; so this protective layer can be protected on the groove area soft board coverlay the not excessive glue of residual prepreg, thereby the outward appearance of guaranteeing coverlay is complete.
Wherein, preferably, in concrete preferred embodiment, described adhesive tape 3 is adhesive tapes of a kind of high-temperature plastic belt type; Thus, the glue of can guaranteeing better to overflow also can come along along with the described adhesive tape as protective layer and removes.
More particularly, for example, in concrete preferred embodiment, described adhesive tape 3 is selected from PI adhesive tape, PTFE(polytetrafluoroethylene, Poly tetra fluoro ethylene) adhesive tape, and other adhesive tape that can meet the demands.And in specification, " high temperature resistant " in the term " high temperature resistant adhesive tape " refers to " being higher than indeformable decomposition under 200 ℃ the temperature, pollution-free to the plate face ".
And preferably, in concrete preferred embodiment, described adhesive tape 3 covers the coverlay of described flexible board area 2.
In addition, preferably, in concrete preferred embodiment, described adhesive tape 3 apart from the second distance h(at the edge of the groove side in hardboard district referring to Fig. 5) scope be 0.2-1.0mm.In this distance range, can prevent preferably the excessive glue of prepreg on groove area soft board coverlay, and can guarantee that described adhesive tape does not hinder the hardboard district.
In addition, need to prove, term in the specification " first ", " second ", " the 3rd " etc. describe each assembly of only being used for distinguishing specification, element, step etc., rather than are used for logical relation between each assembly of expression, element, the step or ordinal relation etc.
Be understandable that, although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (5)
1. a Rigid Flex groove area soft board is prevented adhesive means, it is characterized in that comprising:
First step: Rigid Flex and hardboard district adjacency and and the hardboard district between the reeded flexible board area of tool zone arrange adhesive tape;
Second step: described Rigid Flex is carried out lamination;
Third step: remove described adhesive tape.
2. the anti-adhesive means of Rigid Flex groove area soft board according to claim 1 is characterized in that, described adhesive tape is a kind of adhesive tape of high-temperature plastic belt type.
3. the anti-adhesive means of Rigid Flex groove area soft board according to claim 1 and 2 is characterized in that, described adhesive tape is PI adhesive tape or PTFE adhesive tape.
4. the anti-adhesive means of Rigid Flex groove area soft board according to claim 1 and 2 is characterized in that, described adhesive tape covers the coverlay of described flexible board area.
5. the anti-adhesive means of Rigid Flex groove area soft board according to claim 1 and 2 is characterized in that, described adhesive tape is 0.2-1.0mm apart from the scope of the distance at the edge of the groove side in hardboard district.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210396344.XA CN102933042B (en) | 2012-10-17 | 2012-10-17 | Anti-gluing method for flexible board in groove region of rigid-flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210396344.XA CN102933042B (en) | 2012-10-17 | 2012-10-17 | Anti-gluing method for flexible board in groove region of rigid-flexible board |
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| Publication Number | Publication Date |
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| CN102933042A true CN102933042A (en) | 2013-02-13 |
| CN102933042B CN102933042B (en) | 2015-01-14 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682364A (en) * | 2016-03-14 | 2016-06-15 | 江苏普诺威电子股份有限公司 | Copper foil choke-based processing method for stepped slot |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN109688704A (en) * | 2018-12-03 | 2019-04-26 | 上海展华电子有限公司 | A kind of method of Rigid Flex control excessive glue and solderability |
| CN113382536A (en) * | 2021-07-27 | 2021-09-10 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN114916157A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Method for protecting fingers or PAD (PAD application program) in soft area of rigid-flex board |
| WO2023015692A1 (en) * | 2021-08-12 | 2023-02-16 | 深南电路股份有限公司 | Battery protection circuit board and soldering method therefor |
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| JP2006319197A (en) * | 2005-05-13 | 2006-11-24 | Mitsubishi Electric Corp | Flex-rigid substrate |
| CN101610645A (en) * | 2008-06-17 | 2009-12-23 | 欣兴电子股份有限公司 | The manufacture method of rigid-flex |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| CN102573328A (en) * | 2012-01-08 | 2012-07-11 | 上海美维电子有限公司 | Manufacturing method for flexible and hard combined thin PCB |
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2012
- 2012-10-17 CN CN201210396344.XA patent/CN102933042B/en active Active
Patent Citations (4)
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| JP2006319197A (en) * | 2005-05-13 | 2006-11-24 | Mitsubishi Electric Corp | Flex-rigid substrate |
| CN101610645A (en) * | 2008-06-17 | 2009-12-23 | 欣兴电子股份有限公司 | The manufacture method of rigid-flex |
| CN102487577A (en) * | 2010-12-01 | 2012-06-06 | 富葵精密组件(深圳)有限公司 | Manufacturing method of circuit board with combination of flexible circuit board and hard circuit board |
| CN102573328A (en) * | 2012-01-08 | 2012-07-11 | 上海美维电子有限公司 | Manufacturing method for flexible and hard combined thin PCB |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682364A (en) * | 2016-03-14 | 2016-06-15 | 江苏普诺威电子股份有限公司 | Copper foil choke-based processing method for stepped slot |
| CN105682364B (en) * | 2016-03-14 | 2018-07-03 | 江苏普诺威电子股份有限公司 | The processing method of stepped groove based on copper foil choked flow |
| CN107683031A (en) * | 2017-11-07 | 2018-02-09 | 珠海杰赛科技有限公司 | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film |
| CN109688704A (en) * | 2018-12-03 | 2019-04-26 | 上海展华电子有限公司 | A kind of method of Rigid Flex control excessive glue and solderability |
| CN109688704B (en) * | 2018-12-03 | 2021-04-30 | 上海展华电子有限公司 | Method for controlling glue overflow and soldering tin performance of rigid-flex board |
| CN113382536A (en) * | 2021-07-27 | 2021-09-10 | 生益电子股份有限公司 | PCB preparation method and PCB |
| WO2023015692A1 (en) * | 2021-08-12 | 2023-02-16 | 深南电路股份有限公司 | Battery protection circuit board and soldering method therefor |
| CN114916157A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Method for protecting fingers or PAD (PAD application program) in soft area of rigid-flex board |
| CN114916157B (en) * | 2022-06-01 | 2024-04-12 | 东莞森玛仕格里菲电路有限公司 | Soft region finger or PAD protection method for soft and hard combined plate |
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| CN102933042B (en) | 2015-01-14 |
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