CN103929885B - The processing method for protecting PCB stepped plate step surface line patterns - Google Patents
The processing method for protecting PCB stepped plate step surface line patterns Download PDFInfo
- Publication number
- CN103929885B CN103929885B CN201310016290.4A CN201310016290A CN103929885B CN 103929885 B CN103929885 B CN 103929885B CN 201310016290 A CN201310016290 A CN 201310016290A CN 103929885 B CN103929885 B CN 103929885B
- Authority
- CN
- China
- Prior art keywords
- internal layer
- layer circuit
- circuit plate
- step surface
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention relates to the technical field of PCB stepped plate processing methods, the processing method for disclosing protection PCB stepped plate step surface line patterns is comprised the following steps：1）, respectively the first internal layer circuit plate and the second internal layer circuit plate；2）, by the first internal layer circuit plate it is Chong Die with the second internal layer circuit plate pressing; before pressing, pad and protection diaphragm are placed, protection diaphragm is affixed on the line pattern of the second internal layer circuit plate upper surface; pad lower end is placed on protection diaphragm, is placed at ledge structure root to be formed；3）, the first internal layer circuit of mill off plate outside is to the part at pad；4）, take out pad and protection diaphragm, in formed ledge structure step surface on do surface coating, formed PCB stepped plates.There is protection diaphragm due to being sticked on the line pattern on the second internal layer circuit plate, and the lower end of pad is pressed on protection diaphragm, pad can be avoided to scratch line pattern, and from avoiding forming resin point on line pattern.
Description
Technical field
The present invention relates to the technical field of PCB stepped plate processing methods, more particularly to protection PCB stepped plate step surface circuits
The processing method of figure.
Background technology
The regional area of pcb board and other regions not in one plane, and form step, referred to as PCB stepped plates.It is existing
Having the PCB stepped plates in technology substantially has two types, and a kind of is do not have line pattern at step surface；Another kind is step surface
There is line pattern at place, and needs carry out surface coating on the step surface, and it is very strict to appearance requirement.
In the prior art, the process of the PCB stepped plates 1 of line pattern " on have " is as follows as shown in figure 1, step surface：
1）, process the first internal layer circuit plate 11 " and second internal layer circuit plate 12 " respectively, and form line pattern respectively；
2）, the first internal layer circuit plate 11 " with the second internal layer circuit plate 12 " pressed together, and in the first internal layer circuit plate 11 " with the
Pad 13 is placed between two inner layer circuit boards ", at the step root of the pad 13 " correspondence PCB stepped plates 1 "；3）, will be placed on
Part mill off between first internal layer circuit plate 11 " outside to pad 13 " of side the, so that " side of the first internal layer circuit plate 11
Side and the second internal layer circuit plate 12 " between form ledge structure 14 "；4）, the artificial remaining glue removed on step surface, and in second
Surface coating is done on line pattern on sandwich circuit board 12 ", so as to form PCB stepped plates 1 ".
Due on the line pattern on pad 13 " being in direct contact with the second internal layer circuit plate 12 ", so, line map can be made
Shape receives pollution or scratches, and appears figure and can be stained with remaining glue, after it is through high-temperature laminating, can form resin point, removes non-
The performance of normal trouble, the whole PCB stepped plates 1 of influence ".
The content of the invention
It is an object of the invention to provide the processing method of protection PCB stepped plate step surface line patterns, it is intended to solve existing
Have the processing method easily pollution of PCB stepped plates in technology or scratch easily formed on line pattern, and line pattern resin point with
Cause the problem of influence PCB stepped plate performances.
The processing method that the present invention is achieved in that protection PCB stepped plate step surface line patterns, including following step
Suddenly：
1）, respectively make with line pattern the first internal layer circuit plate and the second internal layer circuit plate；
2）, by the first internal layer circuit plate pressing Chong Die with the second internal layer circuit plate, before pressing, in described the
Pad and protection diaphragm are placed between one internal layer circuit plate and the second internal layer circuit plate, the protection diaphragm is affixed on described the
On the line pattern of two internal layer circuit plate upper surfaces, the pad lower end is placed on the protection diaphragm, is placed in platform to be formed
At stage structure root；
3）, described in mill off the first internal layer circuit plate outside to the part at the pad, make the first internal layer circuit plate
Ledge structure is formed between the second internal layer circuit plate；
4）, take out the pad and the protection diaphragm, in formed ledge structure step surface on do surface coating, shape
Into the PCB stepped plates.
Compared with prior art, in above-mentioned processing method, due to being pasted on the line pattern on the second internal layer circuit plate
Protection diaphragm is provided with, and the lower end of pad is pressed on protection diaphragm, so, in the manufacturing process of PCB stepped plates, can be avoided
Pad scratches line pattern, and avoids forming resin point on line pattern, it is ensured that the performance of PCB stepped plates.
Brief description of the drawings
Fig. 1 is the flow process chart of PCB stepped plates of the prior art；
Fig. 2 is the flow process chart of processing method processing PCB stepped plate provided in an embodiment of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Realization of the invention is described in detail below in conjunction with specific accompanying drawing.
As shown in Fig. 2 being the preferred embodiment for providing of the invention.
The processing method that the present embodiment is provided is used for processing PCB stepped plate 1, during processing PCB stepped plate 1, its
Protection circuit figure can be played a part of, it includes following operating procedure.
1）, the first internal layer circuit plate 11 and the second internal layer circuit plate 12 are made respectively, and respectively in the first internal layer circuit plate
11 and second line pattern is made on internal layer circuit plate 12, certainly, line pattern is respectively formed at the first internal layer circuit plate 11
On the upper surface of lower surface and the second internal layer circuit plate 12；
2）, the first internal layer circuit plate 11 and the second internal layer circuit plate 12 pressed together in overlapping shape, and the first internal layer
Wiring board 11 is placed on the second internal layer circuit plate 12, before pressing, in the first internal layer circuit plate 11 and the second internal layer circuit plate
Pad 13 and protection diaphragm 15 are set between 12, and the protection diaphragm 15 is fitted in the line pattern of the second internal layer circuit plate 12
On, and the lower end of pad 13 is pressed on the protection diaphragm 15, pad 13 is in and is formed at the step root of PCB stepped plates 1；
3）, the outside of the first internal layer circuit plate 11 to the portion between pad 13 of the top of the second internal layer circuit plate 12 will be placed on
Divide mill off, so as to form the ledge structure 14 between the first internal layer circuit plate 11 and the second internal layer circuit plate 12；
4）, take out pad 13 and tear protection diaphragm 15 on the line pattern of the second internal layer circuit plate 12 so that, second
The circuit of internal layer circuit plate 12 part planar out forms step surface, has line pattern on the step surface, in the line pattern
On do surface coating, form PCB stepped plates 1.
In above-mentioned processing method, because the first internal layer circuit plate 11 and the second internal layer circuit plate 12 are before pressing,
The line pattern that can be formed on the second internal layer circuit plate 12 on the surface of step surface is protected with protection diaphragm 15, under pad 13
End is pressed on the protection diaphragm 15, so, pad 13 can be avoided to pollute or scratch line pattern, and during pressing,
PP dust can be separated to be bonded on line pattern, so as to avoid the formation of resin point, and then avoid influenceing the performance of PCB stepped plates 1.
In above-mentioned step 1）In, protection diaphragm 15 is not required to being sticked on the step surface of ledge structure 14 to be formed
Complete to cover the upper surface of whole second internal layer circuit plate 12, certainly, before being sticked, then can be calculated according to actual design,
The size of the step surface being formed on the second internal layer circuit plate 12, accordingly, design needs are sticked in protection diaphragm 15.
In the present embodiment, protection diaphragm 15 is high temperature gummed tape, its can directly against being located on the second internal layer circuit plate 12, when
So, the protection diaphragm 15 can also be material of other forms etc..
Specifically, above-mentioned high temperature gummed tape is acid and alkali-resistance and the not high temperature gummed tape of cull.
In the present embodiment, the distance of the edge of diaphragm 15 and the root of ledge structure 14 is protected to be more than 0.10mm.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (5)
1. the processing method for protecting PCB stepped plate step surface line patterns, it is characterised in that comprise the following steps：
1) the first internal layer circuit plate and the second internal layer circuit plate with line pattern, are made respectively；
2), by the first internal layer circuit plate pressing Chong Die with the second internal layer circuit plate, before pressing, in described first
Pad and protection diaphragm are placed between sandwich circuit board and the second internal layer circuit plate, the protection diaphragm is affixed in described second
On the line pattern of sandwich circuit board upper surface, and the protection diaphragm covers the step surface on the second internal layer circuit plate completely
Lid is pasted on the line pattern with separating dust, and the pad lower end is placed on the protection diaphragm, is placed in be formed
At ledge structure root；
3), the first internal layer circuit plate outside, to the part at the pad, makes the first internal layer circuit plate and institute described in mill off
State and form ledge structure between the second internal layer circuit plate；
4) pad and the protection diaphragm, are taken out, in surface coating is done on the step surface of the ledge structure for being formed, institute is formed
State PCB stepped plates.
2. the processing method for protecting PCB stepped plate step surface line patterns as claimed in claim 1, it is characterised in that described
Protection diaphragm be sticked with the step surface of the second internal layer circuit plate of ledge structure to be formed.
3. the processing method for protecting PCB stepped plate step surface line patterns as claimed in claim 1, it is characterised in that described
Protection diaphragm is high temperature gummed tape.
4. the processing method for protecting PCB stepped plate step surface line patterns as claimed in claim 2, it is characterised in that described
It is acid and alkali-resistance and the not high temperature gummed tape of cull to protect diaphragm.
5. the processing method of the protection PCB stepped plate step surface line patterns as described in any one of Claims 1-4, its feature
It is that the distance for protecting the edge of diaphragm at the root of the ledge structure is more than 0.10mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016290.4A CN103929885B (en) | 2013-01-16 | 2013-01-16 | The processing method for protecting PCB stepped plate step surface line patterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016290.4A CN103929885B (en) | 2013-01-16 | 2013-01-16 | The processing method for protecting PCB stepped plate step surface line patterns |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103929885A CN103929885A (en) | 2014-07-16 |
| CN103929885B true CN103929885B (en) | 2017-07-04 |
Family
ID=51147910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310016290.4A Active CN103929885B (en) | 2013-01-16 | 2013-01-16 | The processing method for protecting PCB stepped plate step surface line patterns |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103929885B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108207076A (en) * | 2016-12-20 | 2018-06-26 | 无锡深南电路有限公司 | A kind of method of glue more than solution communication IC Metal Substrate support plates |
| CN109348629B (en) * | 2018-10-25 | 2021-05-04 | 东莞康源电子有限公司 | Processing method for manufacturing boss PCB |
| CN110602882B (en) * | 2019-10-25 | 2022-02-22 | 珠海杰赛科技有限公司 | Blind slot printed circuit board and processing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
-
2013
- 2013-01-16 CN CN201310016290.4A patent/CN103929885B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888A (en) * | 2009-09-28 | 2010-03-03 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102548258A (en) * | 2011-12-28 | 2012-07-04 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103929885A (en) | 2014-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9340003B2 (en) | Manufacturing method of circuit board | |
| CN203077741U (en) | Component packet for installing screen protection device of electronic equipment | |
| CN102548225B (en) | Manufacturing method for printed circuit board (PCB) | |
| CN104394643B (en) | Non-layered rigid-flex board and preparation method thereof | |
| CN103929885B (en) | The processing method for protecting PCB stepped plate step surface line patterns | |
| CN104349613A (en) | PCB (Printed Circuit Board) and manufacturing method thereof | |
| CN104735924B (en) | Technique of uncapping for multi-step shape Rigid Flex | |
| WO2012150817A3 (en) | Printed circuit board and method for manufacturing the same | |
| CN105430884B (en) | The preparation method of flexible PCB, terminal and flexible PCB | |
| CN102497749A (en) | Method for embedding capacitor into PCB (printed circuit board) multilayer board | |
| CN108323039A (en) | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed | |
| CN106231814A (en) | The process for pressing of the multilamellar Rigid Flex that a kind of light-sensitive surface thickens | |
| CN204377257U (en) | The circuit board of the metal forming making of die-cut band glue | |
| CN206596161U (en) | Protecting film | |
| CN104427790B (en) | A kind of local dent printed circuit board (PCB) and preparation method thereof | |
| TWI494861B (en) | Chip card combination structure and method thereof | |
| CN102556532B (en) | Circuit board packaging structure and packaging method | |
| CN203301599U (en) | Lens seat glue-spilling-preventing structure | |
| CN105742257A (en) | Electronic Devices and Methods of Manufacturing Electronic Devices | |
| CN104159396B (en) | A kind of novel base plate for packaging manufacture method | |
| CN106503690B (en) | Layered fingerprint identification module | |
| CN107172810A (en) | A kind of orthopedic FPC of thick copper foil with hollow out golden finger and its manufacture craft | |
| CN208395093U (en) | A kind of release film that fissility is excellent | |
| TWI738545B (en) | Processing technology to improve the convenience of emi removal film | |
| TWI445467B (en) | Printed circuit board assembly and method for making the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant before: Shenzhen Shennan Circuits Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |