CN103929885A - Machining method capable of protecting printed circuit board (PCB) step board step face line graphs - Google Patents
Machining method capable of protecting printed circuit board (PCB) step board step face line graphs Download PDFInfo
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- CN103929885A CN103929885A CN201310016290.4A CN201310016290A CN103929885A CN 103929885 A CN103929885 A CN 103929885A CN 201310016290 A CN201310016290 A CN 201310016290A CN 103929885 A CN103929885 A CN 103929885A
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- internal layer
- layer circuit
- circuit plate
- line pattern
- protection
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCB step board step face machining methods and discloses a machining method capable of protecting PCB step board step face line graphs. The method comprises the steps of 1) machining a first inner layer line board and a second inner layer line board respectively; 2) overlapping and pressing the first inner layer line board with the second inner layer line board, and putting a gasket and a protection membrane before pressing, wherein the protection membrane is attached to the line graph on the upper surface of the second inner layer line board, the lower end of the gasket is disposed on the protection membrane, and the gasket is disposed at the root of the step structure to be formed; 3) milling off the portion from the outside of the first inner layer line board to the gasket; 4) taking out the gasket and the protection membrane, and performing surface coating on the step face of the formed step structure to form the PCB step board. According to the machining method, the protection membrane is attached to the line graph on the second inner layer line board, and the lower end of the gasket is pressed against the protection membrane, so that the line graph can be prevented from being scratched by the gasket, and resin points are prevented from being formed on the line graph.
Description
Technical field
The present invention relates to the technical field of PCB stepped plate processing method, relate in particular to the processing method of protection PCB stepped plate step surface line pattern.
Background technology
The regional area of pcb board and other region not in one plane, and form step, are called PCB stepped plate.PCB stepped plate of the prior art roughly has two types, and a kind of is that step surface place does not have line pattern; Another kind is that step surface place has line pattern, and need on this step surface, carry out surface-coated, and it is very strict to appearance requirement.
In prior art, as shown in Figure 1, the course of processing of the step surface PCB stepped plate 1 of line pattern " on have " is as follows:
1) process, respectively the first internal layer circuit plate 11 " and second internal layer circuit plate 12 ", and form respectively line pattern; 2), the first internal layer circuit plate 11 " with second internal layer circuit plate 12 " is pressed together, and at the first internal layer circuit plate 11 " and placing pad 13 between the second inner layer circuit board ", the step root place of this pad 13 " corresponding PCB stepped plate 1 "; 3), by the part mill off being placed between the first internal layer circuit plate 11 " outside to pad 13 " of top, thereby make to form ledge structure 14 between the first internal layer circuit plate 11 " side and the second internal layer circuit plate 12 " "; 4), manually remove the remaining glue on step surface, and at the second internal layer circuit plate 12 " on line pattern on do surface-coated, thereby form PCB stepped plate 1 ".
On the line pattern of pad 13 on " being in direct contact with the second internal layer circuit plate 12 ", like this, can make line pattern receive and pollute or scratch, and appear figure and can be stained with remaining glue, it can form resin point after high-temperature laminating, remove get up very trouble, affect whole PCB stepped plate 1 " performance.
Summary of the invention
The object of the present invention is to provide the processing method of protection PCB stepped plate step surface line pattern; be intended to solve easily pollution or the scuffing line pattern of processing method of PCB stepped plate of the prior art, and the easy problem that forms resin point so that affect PCB stepped plate performance on line pattern.
The present invention is achieved in that the processing method of protection PCB stepped plate step surface line pattern, comprises the following steps:
1), make respectively the first internal layer circuit plate and the second internal layer circuit plate with line pattern;
2), by described the first internal layer circuit plate and the overlapping pressing of described the second internal layer circuit plate, before pressing, between described the first internal layer circuit plate and described the second internal layer circuit plate, place pad and protection diaphragm, described protection diaphragm is affixed on the line pattern of described the second internal layer circuit plate upper surface, described pad lower end is placed on described protection diaphragm, is placed in ledge structure root place to be formed;
3), the part at the first internal layer circuit plate outside to described pad place described in mill off, make to form ledge structure between described the first internal layer circuit plate and described the second internal layer circuit plate;
4), take out described pad and described protection diaphragm, on the step surface of the ledge structure forming, do surface-coated, form described PCB stepped plate.
Compared with prior art; in above-mentioned processing method; due to the protection diaphragm that has been sticked on the line pattern on the second internal layer circuit plate; and the lower end of pad is pressed on protection diaphragm; like this, in the manufacturing process of PCB stepped plate, can avoid pad to scratch line pattern; and avoid forming resin point on line pattern, ensure the performance of PCB stepped plate.
Brief description of the drawings
Fig. 1 is the flow process chart of PCB stepped plate of the prior art;
Fig. 2 is the flow process chart of the processing method processing PCB stepped plate that provides of the embodiment of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Below in conjunction with concrete accompanying drawing, realization of the present invention is described in detail.
As shown in Figure 2, be a preferred embodiment provided by the invention.
The processing method that the present embodiment provides is for processing PCB stepped plate 1, and in the process of processing PCB stepped plate 1, it can play the effect of protection circuit figure, and it comprises following operating procedure.
1), make respectively the first internal layer circuit plate 11 and the second internal layer circuit plate 12, and on the first internal layer circuit plate 11 and the second internal layer circuit plate 12, make line pattern respectively, certainly, line pattern is respectively formed on the lower surface of the first internal layer circuit plate 11 and the upper surface of the second internal layer circuit plate 12;
2), the first internal layer circuit plate 11 and the second internal layer circuit plate 12 being to superimposed shape presses together, and the first internal layer circuit plate 11 is placed on the second internal layer circuit plate 12, before pressing, pad 13 and protection diaphragm 15 are set between the first internal layer circuit plate 11 and the second internal layer circuit plate 12, this protection diaphragm 15 is fitted on the line pattern of the second internal layer circuit plate 12, and the lower end of pad 13 is pressed on this protection diaphragm 15, pad 13 is in forming the step root place of PCB stepped plate 1;
3), by the first internal layer circuit plate 11 outsides that are placed on the second internal layer circuit plate 12 tops to the part mill off between pad 13, thereby formed the ledge structure 14 between the first internal layer circuit plate 11 and the second internal layer circuit plate 12;
4), take out pad 13 and tear the protection diaphragm 15 on the second internal layer circuit plate 12 line patterns; thereby the second internal layer circuit plate 12 circuits part plane out forms step surface, has line pattern on this step surface; on this line pattern, do surface-coated, formed PCB stepped plate 1.
In above-mentioned processing method; because the first internal layer circuit plate 11 and the second internal layer circuit plate 12 are before pressing; protected the lip-deep line pattern that can form step surface on the second internal layer circuit plate 12 with protection diaphragm 15; the lower end of pad 13 is pressed on this protection diaphragm 15, like this, can avoid pad 13 to pollute or scratch line pattern; and in the process of pressing; can cut off PP dust adhering on line pattern, thereby avoid forming resin point, and then avoid affecting the performance of PCB stepped plate 1.
In above-mentioned step 1); protection diaphragm 15 is to being sticked on the step surface of ledge structure to be formed 14; do not need to cover the upper surface of whole the second internal layer circuit plate 12; certainly; before being sticked, can calculate according to actual design, be formed on the size of the step surface on the second internal layer circuit plate 12; accordingly, design need to be sticked at protection diaphragm 15.
In the present embodiment, protection diaphragm 15 is high temperature gummed tape, and it can directly be sticked on the second internal layer circuit plate 12, and certainly, this protection diaphragm 15 can be also the material of other form etc.
Particularly, above-mentioned high temperature gummed tape is acid and alkali-resistance and the high temperature gummed tape of cull not.
In the present embodiment, the distance of the protection edge of diaphragm 15 and the root of ledge structure 14 is greater than 0.10mm.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (5)
1. the processing method of protection PCB stepped plate step surface line pattern, is characterized in that, comprises the following steps:
1), make respectively the first internal layer circuit plate and the second internal layer circuit plate with line pattern;
2), by described the first internal layer circuit plate and the overlapping pressing of described the second internal layer circuit plate, before pressing, between described the first internal layer circuit plate and described the second internal layer circuit plate, place pad and protection diaphragm, described protection diaphragm is affixed on the line pattern of described the second internal layer circuit plate upper surface, described pad lower end is placed on described protection diaphragm, is placed in ledge structure root place to be formed;
3), the part at the first internal layer circuit plate outside to described pad place described in mill off, make to form ledge structure between described the first internal layer circuit plate and described the second internal layer circuit plate;
4), take out described pad and described protection diaphragm, on the step surface of the ledge structure forming, do surface-coated, form described PCB stepped plate.
2. the processing method of protection as claimed in claim 1 PCB stepped plate step surface line pattern, is characterized in that, described protection diaphragm be sticked with the step surface of the second internal layer circuit plate of ledge structure to be formed on.
3. the processing method of protection PCB stepped plate step surface line pattern as claimed in claim 1, is characterized in that, described protection diaphragm is high temperature gummed tape.
4. the processing method of protection as claimed in claim 2 PCB stepped plate step surface line pattern, is characterized in that, described protection diaphragm is acid and alkali-resistance and the high temperature gummed tape of cull not.
5. the processing method of the protection PCB stepped plate step surface line pattern as described in claim 1 to 4 any one, is characterized in that, the edge of described protection diaphragm is greater than 0.10mm in the distance at the root place of described ledge structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016290.4A CN103929885B (en) | 2013-01-16 | 2013-01-16 | The processing method for protecting PCB stepped plate step surface line patterns |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310016290.4A CN103929885B (en) | 2013-01-16 | 2013-01-16 | The processing method for protecting PCB stepped plate step surface line patterns |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103929885A true CN103929885A (en) | 2014-07-16 |
| CN103929885B CN103929885B (en) | 2017-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310016290.4A Active CN103929885B (en) | 2013-01-16 | 2013-01-16 | The processing method for protecting PCB stepped plate step surface line patterns |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108207076A (en) * | 2016-12-20 | 2018-06-26 | 无锡深南电路有限公司 | A kind of method of glue more than solution communication IC Metal Substrate support plates |
| CN109348629A (en) * | 2018-10-25 | 2019-02-15 | 东莞康源电子有限公司 | A kind of processing method making projection PCB |
| CN110602882A (en) * | 2019-10-25 | 2019-12-20 | 珠海杰赛科技有限公司 | Blind slot printed circuit board and processing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662888B (en) * | 2009-09-28 | 2011-02-16 | 深南电路有限公司 | Preparation method for PCB plate with step trough |
| CN102548258B (en) * | 2011-12-28 | 2014-11-05 | 东莞生益电子有限公司 | Production method of stepped groove circuit board with through hole, soldermask and circuit graphics at groove bottom |
-
2013
- 2013-01-16 CN CN201310016290.4A patent/CN103929885B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108207076A (en) * | 2016-12-20 | 2018-06-26 | 无锡深南电路有限公司 | A kind of method of glue more than solution communication IC Metal Substrate support plates |
| CN109348629A (en) * | 2018-10-25 | 2019-02-15 | 东莞康源电子有限公司 | A kind of processing method making projection PCB |
| CN109348629B (en) * | 2018-10-25 | 2021-05-04 | 东莞康源电子有限公司 | Processing method for manufacturing boss PCB |
| CN110602882A (en) * | 2019-10-25 | 2019-12-20 | 珠海杰赛科技有限公司 | Blind slot printed circuit board and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103929885B (en) | 2017-07-04 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant before: Shenzhen Shennan Circuits Co., Ltd. |
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