CN107846792A - A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board - Google Patents

A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board Download PDF

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Publication number
CN107846792A
CN107846792A CN201711042734.6A CN201711042734A CN107846792A CN 107846792 A CN107846792 A CN 107846792A CN 201711042734 A CN201711042734 A CN 201711042734A CN 107846792 A CN107846792 A CN 107846792A
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CN
China
Prior art keywords
layer
soft board
copper foil
hardboard
rigid flex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711042734.6A
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Chinese (zh)
Inventor
华福德
张志敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
High Tak (jiangsu) Electronic Technology Co Ltd
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High Tak (jiangsu) Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by High Tak (jiangsu) Electronic Technology Co Ltd filed Critical High Tak (jiangsu) Electronic Technology Co Ltd
Priority to CN201711042734.6A priority Critical patent/CN107846792A/en
Publication of CN107846792A publication Critical patent/CN107846792A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a kind of processing technology for reducing Rigid Flex and taking off lid damage soft board, previously prepared soft board layer is set into cover layer respectively up and down first, then opened a window in first medium layer prepreg corresponding position, and prepare upper hardboard layer and lower hardboard layer, soft board position paving copper is being corresponded to for outer-layer circuit after laying pressing in order, finally when preforming, the cutting area both ends above soft board are reserved respectively takes off cap；Lid will be taken off control instrument and choose and remove cover plate on cap is taken off, and obtain Rigid Flex.The inventive method is simple, and step is easily operated, takes off the setting of cap and can effectively reduce personnel and damages soft board when taking off lid, reduces scrapping for finished product in production process, lifts the qualification rate of product.

Description

A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board
Technical field
The processing technology for covering damage soft board is taken off the present invention relates to a kind of reduction Rigid Flex, belongs to the system of printed circuit board (PCB) Standby technical field.
Background technology
With lightening, integrated, multifunction the development trend of consumption electronic product, its making to printed circuit board (PCB) Technological requirement more and more higher.This trend is complied with, soft or hard combination printed substrate can be increasingly becoming the important portion of printed circuit board (PCB) Point.Rigid Flex is on one or more rigid printed substrate as its name suggests, and it is essential to include the overall institute of composition One or more flexible printed wiring board, its act on cause electronic product assembling when reduce uses connector, considerably increase The advantages that reliability, signal transmission are faster, finished size is smaller.Rigid Flex is uncapped before typically having and uncaps two kinds substantially with after Processing technology.Soft board is easily damaged when lid is taken off in the processing technology uncapped after and causes product rejection.
The content of the invention
The invention aims to solve the above problems, there is provided one kind can reduce production cost, lifting production effect The reduction Rigid Flex of rate takes off the processing technology of lid damage soft board.
The present invention adopts the following technical scheme that：A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board, including Following steps：
（1）The soft board layer of previously prepared Rigid Flex is taken, the soft board layer is three-decker, includes middle soft board respectively And the first copper foil layer and the second copper foil layer that soft board is setting up and down；
（2）The first cover layer is set in the upper surface of soft board layer, the second cover layer is set in the lower surface of soft board layer；
（3）First medium layer prepreg is taken, and windowing is set in corresponding soft zone position；
（4）Previously prepared upper hardboard layer and lower hardboard layer are taken, the upper hardboard layer and lower hardboard layer are three-decker,
（5）Take previously prepared second dielectric layer prepreg, upper copper foil layer and lower copper foil layer；
（7）Each layer is pressed in the following order from top to bottom：Upper copper foil layer, second dielectric layer prepreg, upper hardboard layer, first Dielectric layer prepreg, soft board layer, first medium layer prepreg, lower hardboard layer, second dielectric layer cured sheets, lower copper foil layer, Soft board position paving copper is corresponded to after pressing for outer-layer circuit, soft or hard handing-over line 0.3-0.5mm is avoided when spreading copper；
（8）When preforming, the cutting area both ends above soft board are reserved respectively takes off cap（16）, obtain preparing figure circuit Rigid Flex semi-finished product；
（9）In the plate face of Rigid Flex semi-finished product, along cutting area edge control and profoundly cut；
（10）Lid tool will be taken off choose and take off cap（16）On cover plate is removed, expose the exposed area on soft board, obtain soft or hard combination Plate.Further, the length for taking off cap is 4.75mm, and the both sides for taking off cap differ milling cutter knife footpath with soft board Distance.
Further, the upper hardboard layer is followed successively by the 3rd copper foil layer, the first hardboard, the 4th copper foil layer from top to bottom.
Further, the lower hardboard layer is followed successively by the 5th copper foil layer, the second hardboard, the 6th copper foil layer from top to bottom.
Further, the step（7）During middle increasing layer pressing, set on the prepreg between increasing layer and drag for groove, groove width The depth in 0.8-1.2mm, Lao Caojin hardboard area is 0.125-0.3mm.
The inventive method is simple, and step is easily operated, takes off the setting of cap and can effectively reduce personnel and is damaged when taking off lid Soft board, scrapping for finished product in production process is reduced, lifts the qualification rate of product.
Brief description of the drawings
Fig. 1 is the structural representation of the soft board layer of the present invention.
Fig. 2 is the first cover layer of the present invention and the structural representation of the second cover layer.
Fig. 3 is the structural representation of the first medium layer semi-solid preparation synusia of the present invention.
Fig. 4 is the structural representation of the upper hardboard layer of the present invention.
Fig. 5 is the structural representation of the lower hardboard layer of the present invention.
Fig. 6 is the structural representation of the second dielectric layer semi-solid preparation synusia of the present invention.
Fig. 7 is the structural representation of the upper copper foil layer of the present invention.
Fig. 8 is the semi-finished product structure schematic diagram of the Rigid Flex of the present invention.
Fig. 9 takes off cap schematic diagram for the Rigid Flex of the present invention.
Reference：Soft board 1, the first copper foil layer 2, the second copper foil layer 3, the first cover layer 4, the second cover layer 5, first are situated between Matter layer prepreg 6, the first hardboard 7, the 3rd copper foil layer 8, the 4th copper foil layer 9, the second hardboard 10, the 5th copper foil layer the 11, the 6th Copper foil layer 12, second dielectric layer prepreg 13, upper copper foil layer 14, lower copper foil layer 15, take off cap 16.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board, such as Fig. 1-9, comprises the following steps：
（1）The soft board layer of previously prepared Rigid Flex is taken, the soft board layer is three-decker, includes middle soft board respectively 1 and soft board the first copper foil layer 2 and the second copper foil layer 3 setting up and down；
（2）The first cover layer 4 is set in the upper surface of soft board layer, the second cover layer 5 is set in the lower surface of soft board layer；
（3）First medium layer prepreg 6 is taken, and windowing is set in corresponding soft zone position；
（4）Previously prepared upper hardboard layer and lower hardboard layer are taken, the upper hardboard layer and lower hardboard layer are three-decker, upper hard Flaggy is followed successively by the 3rd copper foil layer 8, the first hardboard 7, the 4th copper foil layer 9 from top to bottom, and lower hardboard layer is followed successively by from top to bottom Five copper foil layers 11, the second hardboard 10, the 6th copper foil layer 12；
（5）Take previously prepared second dielectric layer prepreg 13, upper copper foil layer 14 and lower copper foil layer 15；
（7）Each layer is pressed in the following order from top to bottom：Upper copper foil layer 14, second dielectric layer prepreg 13, upper hardboard layer, First medium layer prepreg 6, soft board layer, first medium layer prepreg 6, lower hardboard layer, second dielectric layer cured sheets 13, under Copper foil layer 15, soft board position paving copper is corresponded to after pressing for outer-layer circuit, soft or hard handing-over line 0.3-0.5mm is avoided when spreading copper；When Set when needing the increasing layer to press, on the prepreg between increasing layer and drag for groove, the depth in groove width 0.8-1.2mm, Lao Caojin hardboard area For 0.125-0.3mm.
（8）When preforming, the cutting area both ends above soft board are reserved respectively takes off cap（16）, obtain preparing figure line The Rigid Flex semi-finished product on road；
（9）In the plate face of Rigid Flex semi-finished product, along cutting area edge control and profoundly cut；
（10）Lid tool will be taken off choose and take off cap（16）On cover plate is removed, expose the exposed area on soft board, obtain soft or hard combination Plate.

Claims (5)

  1. A kind of 1. processing technology for reducing Rigid Flex and taking off lid damage soft board, it is characterised in that：Comprise the following steps：
    （1）The soft board layer of previously prepared Rigid Flex is taken, the soft board layer is three-decker, includes middle soft board respectively （1）And soft board（1）First copper foil layer setting up and down（2）With the second copper foil layer（3）；
    （2）In the upper surface of soft board layer, the first cover layer is set（4）, in the lower surface of soft board layer, the second cover layer is set（5）；
    （3）Take first medium layer prepreg（6）, and windowing is set in corresponding soft zone position；
    （4）Previously prepared upper hardboard layer and lower hardboard layer are taken, the upper hardboard layer and lower hardboard layer are three-decker；
    （5）Take previously prepared second dielectric layer prepreg（13）, upper copper foil layer（14）With lower copper foil layer（15）, second medium Layer prepreg（13）Do not open a window as monolithic structure；
    （7）Each layer is pressed in the following order from top to bottom：Upper copper foil layer（14）, second dielectric layer prepreg（13）, it is upper hard Flaggy, first medium layer prepreg（6）, soft board layer, first medium layer prepreg（6）, lower hardboard layer, second dielectric layer it is solid Change piece（13）, lower copper foil layer（15）, soft board position paving copper is corresponded to after pressing for outer-layer circuit, soft or hard handing-over line is avoided when spreading copper 0.3-0.5mm；
    （8）When preforming, the cutting area both ends above soft board are reserved respectively takes off cap（16）, obtain preparing figure circuit Rigid Flex semi-finished product；
    （9）In the plate face of Rigid Flex semi-finished product, cut along cutting area edge；
    （10）Lid tool will be taken off choose and take off cap（16）On cover plate is removed, expose the exposed area on soft board, obtain soft or hard combination Plate.
  2. 2. the processing technology that Rigid Flex takes off lid damage soft board is reduced as claimed in claim 1, it is characterised in that：It is described to take off Cap（16）Length be 4.75mm, it is described to take off cap（16）Both sides the distance in a milling cutter knife footpath is differed with soft board.
  3. 3. the processing technology that Rigid Flex takes off lid damage soft board is reduced as claimed in claim 1, it is characterised in that：On described Hardboard layer is followed successively by the 3rd copper foil layer from top to bottom（8）, the first hardboard（7）, the 4th copper foil layer（9）.
  4. 4. the processing technology that Rigid Flex takes off lid damage soft board is reduced as claimed in claim 1, it is characterised in that：Under described Hardboard layer is followed successively by the 5th copper foil layer from top to bottom（11）, the second hardboard（10）, the 6th copper foil layer（12）.
  5. 5. the processing technology that Rigid Flex takes off lid damage soft board is reduced as claimed in claim 1, it is characterised in that：The step Suddenly（7）During middle increasing layer pressing, set on the prepreg between increasing layer and drag for groove, the depth in groove width 0.8-1.2mm, Lao Caojin hardboard area Spend for 0.125-0.3mm.
CN201711042734.6A 2017-10-30 2017-10-30 A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board Pending CN107846792A (en)

Priority Applications (1)

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CN201711042734.6A CN107846792A (en) 2017-10-30 2017-10-30 A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board

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Application Number Priority Date Filing Date Title
CN201711042734.6A CN107846792A (en) 2017-10-30 2017-10-30 A kind of processing technology for reducing Rigid Flex and taking off lid damage soft board

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513455A (en) * 2018-05-23 2018-09-07 高德（无锡）电子有限公司 A kind of Rigid Flex processing technology using high frequency material
CN108882566A (en) * 2018-08-27 2018-11-23 生益电子股份有限公司 A kind of production method of PCB
CN109688734A (en) * 2018-12-06 2019-04-26 高德（无锡）电子有限公司 A kind of processing technology preventing Rigid Flex bending tearing soft board
CN110446371A (en) * 2019-09-05 2019-11-12 高德（江苏）电子科技有限公司 A kind of processing method that Rigid Flex is pressed using pure glue half
CN111447726A (en) * 2020-03-31 2020-07-24 深圳市景旺电子股份有限公司 Rigid-flex board for suit and manufacturing method
CN111556656A (en) * 2020-04-28 2020-08-18 高德（江苏）电子科技有限公司 Process for uncovering rigid-flex board by using common PCB board forming machine
CN111970858A (en) * 2020-07-14 2020-11-20 深圳崇达多层线路板有限公司 High-offset rigid-flex PCB and manufacturing method thereof
CN112165761A (en) * 2020-08-24 2021-01-01 Oppo（重庆）智能科技有限公司 Rigid-flex board, circuit board, electronic equipment and method for preparing rigid-flex board
CN113891585A (en) * 2021-12-09 2022-01-04 四川英创力电子科技股份有限公司 Manufacturing method of rigid-flex board
CN115023068A (en) * 2022-05-25 2022-09-06 景旺电子科技(龙川)有限公司 Method for uncovering rigid-flex board and rigid-flex board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1168312A (en) * 1997-08-08 1999-03-09 Sharp Corp Manufacture of flex rigid wiring board
CN103384444A (en) * 2013-07-30 2013-11-06 博敏电子股份有限公司 Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof
US20130341075A1 (en) * 2012-06-25 2013-12-26 Honeywell International Inc. Printed circuit board
CN205793733U (en) * 2016-05-18 2016-12-07 深圳市景旺电子股份有限公司 A kind of rigid-flex combined board take off lid structure
CN107041066A (en) * 2017-06-13 2017-08-11 高德（无锡）电子有限公司 The processing method that a kind of radium-shine cutting docking of UV are uncapped

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1168312A (en) * 1997-08-08 1999-03-09 Sharp Corp Manufacture of flex rigid wiring board
US20130341075A1 (en) * 2012-06-25 2013-12-26 Honeywell International Inc. Printed circuit board
CN103384444A (en) * 2013-07-30 2013-11-06 博敏电子股份有限公司 Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof
CN205793733U (en) * 2016-05-18 2016-12-07 深圳市景旺电子股份有限公司 A kind of rigid-flex combined board take off lid structure
CN107041066A (en) * 2017-06-13 2017-08-11 高德（无锡）电子有限公司 The processing method that a kind of radium-shine cutting docking of UV are uncapped

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108513455A (en) * 2018-05-23 2018-09-07 高德（无锡）电子有限公司 A kind of Rigid Flex processing technology using high frequency material
CN108882566A (en) * 2018-08-27 2018-11-23 生益电子股份有限公司 A kind of production method of PCB
CN108882566B (en) * 2018-08-27 2020-03-27 生益电子股份有限公司 Manufacturing method of PCB
CN109688734A (en) * 2018-12-06 2019-04-26 高德（无锡）电子有限公司 A kind of processing technology preventing Rigid Flex bending tearing soft board
CN109688734B (en) * 2018-12-06 2021-07-13 高德（无锡）电子有限公司 Processing technology for preventing soft and hard combined plate from being bent and torn
CN110446371A (en) * 2019-09-05 2019-11-12 高德（江苏）电子科技有限公司 A kind of processing method that Rigid Flex is pressed using pure glue half
CN111447726A (en) * 2020-03-31 2020-07-24 深圳市景旺电子股份有限公司 Rigid-flex board for suit and manufacturing method
CN111447726B (en) * 2020-03-31 2021-10-08 深圳市景旺电子股份有限公司 Rigid-flex board for suit and manufacturing method
CN111556656A (en) * 2020-04-28 2020-08-18 高德（江苏）电子科技有限公司 Process for uncovering rigid-flex board by using common PCB board forming machine
CN111970858B (en) * 2020-07-14 2022-04-15 深圳崇达多层线路板有限公司 High-offset rigid-flex PCB and manufacturing method thereof
CN111970858A (en) * 2020-07-14 2020-11-20 深圳崇达多层线路板有限公司 High-offset rigid-flex PCB and manufacturing method thereof
CN112165761A (en) * 2020-08-24 2021-01-01 Oppo（重庆）智能科技有限公司 Rigid-flex board, circuit board, electronic equipment and method for preparing rigid-flex board
CN113891585B (en) * 2021-12-09 2022-03-01 四川英创力电子科技股份有限公司 Manufacturing method of rigid-flex board
CN113891585A (en) * 2021-12-09 2022-01-04 四川英创力电子科技股份有限公司 Manufacturing method of rigid-flex board
CN115023068A (en) * 2022-05-25 2022-09-06 景旺电子科技(龙川)有限公司 Method for uncovering rigid-flex board and rigid-flex board
CN115023068B (en) * 2022-05-25 2024-01-30 景旺电子科技(龙川)有限公司 Soft and hard combined plate uncovering method and soft and hard combined plate

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Application publication date: 20180327