CN105307399A - Processing method for small, thin and pure ceramic circuit board - Google Patents
Processing method for small, thin and pure ceramic circuit board Download PDFInfo
- Publication number
- CN105307399A CN105307399A CN201510691253.2A CN201510691253A CN105307399A CN 105307399 A CN105307399 A CN 105307399A CN 201510691253 A CN201510691253 A CN 201510691253A CN 105307399 A CN105307399 A CN 105307399A
- Authority
- CN
- China
- Prior art keywords
- potsherd
- size
- insulating substrate
- inside groove
- ceramic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a processing method for a small, thin and pure ceramic circuit board. The processing method comprises the steps that 1) tools are prepared; 2) according to the thicknesses of ceramic chips, insulated base materials of different thicknesses are selected, and the size of inner grooves in the insulated base materials is determined; 3) the ceramic chips are placed into riveted inner grooves of the insulated base materials, and fixed by adhesive tapes or red glue, and the adhesive tapes or red glue are/is removed before lamination; 4) post-procedure is carried out on the laminated board; and 5) the patterned ceramic chips are milled. The processing has the advantages that a spilled glue laminated or inlaid manner is used to solve the problem that the small, thin and pure ceramic circuit board is fragile in the processing process, and the processing efficiency and working efficiency are improved.
Description
Technical field
The present invention relates to printed circuit, relate to the method for the manufacture of printed circuit, the processing method of espespecially a kind of small size, thin pure ceramic circuit-board.
Background technology
Pottery, because of the diversity of its composition, structure, can produce the functionality ceramic that various performance is totally different.The ceramic baseplate material as wiring board has to be applied very widely, can using ceramic powder as fillers dispersed in the dielectric of wiring board to regulate electrical property and machining property, also have and directly the dielectric of pottery as wiring board is used, be referred to as ceramic circuit-board, or ceramic wafer, but pure potsherd is because of its fragility, quite difficult to the processing of small size, thin pure ceramic circuit-board, particularly thickness only has the rectangle of 0.5-0.8, long 10mm-100mm square or irregularly shaped, or diameter is the circle of 10mm-100mm.This type of thin potsherd cannot adopt the large scale jigsaw of traditional circuit plate to process.
Summary of the invention
For the shortcoming of prior art, the object of the present invention is to provide the processing method of a kind of small size, thin pure ceramic circuit-board.
The technical solution adopted for the present invention to solve the technical problems is: the processing method providing a kind of small size, thin pure ceramic circuit-board, is characterized in that comprising the steps:
The first step: instrument prepares, described instrument by FR-4 substrate manufacture, described for ceramic circuit board instrument from top to bottom respectively, FR4 central layer, PP, FR4 central layer, FR4 central layer does target hole pattern;
Second step: according to the size of the thickness of potsherd, selects the insulating substrate of different-thickness and the size determining the inside groove on insulating substrate, and inside groove requires that large 0.1mm, PP more overall than potsherd size open inside groove requirement large 0.2mm more monolateral than insulating substrate inside groove size; Insulating substrate+PP gross thickness about 0.05mm larger than potsherd maximum ga(u)ge;
3rd step: inside groove potsherd being put into the insulating substrate that riveted is good, blend compounds band or red glue are fixed, and adhesive tape or red glue are removed before laminated stacked plate;
4th step: to the plate after pressing, carries out rear operation processing;
5th step: shaping gong profile, water jacket taken away by gong, and size 0.3mm larger than potsherd, goes out the potsherd gong carrying out figure.
The invention has the beneficial effects as follows: the mode of glue (inlaying) of being overflow by pressing, the method forming large jigsaw solves the fragility problem in small size, the thin pure ceramic circuit-board course of processing, improves working (machining) efficiency and working efficiency.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the invention will be further described.
Fig. 1 is that inventive article prepares schematic diagram;
Fig. 2 lamination of the present invention schematic diagram to be inlayed;
Fig. 3 the present invention instrument schematic diagram to be inlayed;
Schematic diagram inlayed by Fig. 4 potsherd of the present invention;
Schematic diagram after Fig. 5 pressing of the present invention;
In figure: 1 be central layer one, 11 be wad cutter, 2 be rivet hole, 13 be gong groove, 14 be silk-screen location hole, 2 be rivet, 4 be potsherd, 5 be FR4 central layer for central layer two, 3.
Embodiment
See accompanying drawing, the processing method of a kind of small size of the present invention, thin pure ceramic circuit-board, is characterized in that comprising the steps:
The first step: instrument prepares, described instrument by FR-4 substrate manufacture, described for ceramic circuit board instrument from top to bottom respectively, FR4 central layer, PP, FR4 central layer, FR4 central layer does target hole pattern;
Second step: according to the size of the inside groove on the size design insulating substrate of potsherd, consider the tolerance of potsherd, inside groove requires that large 0.1mm, PP more overall than potsherd size open inside groove requirement large 0.2mm more monolateral than insulating substrate inside groove size; According to the size of the thickness of potsherd, select the insulating substrate of different-thickness;
General Requirements: insulating substrate+PP gross thickness about 0.05mm larger than potsherd maximum ga(u)ge, can prevent from being crushed by potsherd during lamination, can avoid again dry film press mold bad and exposure time ill-exposed;
3rd step: inside groove potsherd being put into the insulating substrate that riveted is good, fixes with wrinkle adhesive tape or red adhesive tape, in order to avoid transport process potsherd drops, wrinkle adhesive tape or red glue is removed before laminated stacked plate;
4th step: be stock size plate after pressing, can normally carry out rear operation processing: boring, the heavy flow process such as copper, Graphic transitions;
5th step: during shaping gong profile, water jacket taken away by gong, size large 0.15mm more monolateral than the large 0.3mm(of potsherd), the potsherd gong carrying out figure is gone out.
Claims (1)
1. a processing method for small size, thin pure ceramic circuit-board, is characterized in that comprising the steps:
The first step: instrument prepares, described instrument by FR-4 substrate manufacture, described for ceramic circuit board instrument from top to bottom respectively, FR4 central layer, PP, FR4 central layer, FR4 central layer does target hole pattern;
Second step: according to the size of the thickness of potsherd, selects the insulating substrate of different-thickness and the size determining the inside groove on insulating substrate, and inside groove requires that large 0.1mm, PP more overall than potsherd size open inside groove requirement large 0.2mm more monolateral than insulating substrate inside groove size; Insulating substrate+PP gross thickness about 0.05mm larger than potsherd maximum ga(u)ge;
3rd step: inside groove potsherd being put into the insulating substrate that riveted is good, blend compounds band or red glue are fixed, and adhesive tape or red glue are removed before laminated stacked plate;
4th step: to the plate after pressing, carries out rear operation processing;
5th step: shaping gong profile, water jacket taken away by gong, and size 0.3mm larger than potsherd, goes out the potsherd gong carrying out figure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510691253.2A CN105307399B (en) | 2015-10-23 | 2015-10-23 | A kind of processing method of small size, thin pure ceramic circuit-board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510691253.2A CN105307399B (en) | 2015-10-23 | 2015-10-23 | A kind of processing method of small size, thin pure ceramic circuit-board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105307399A true CN105307399A (en) | 2016-02-03 |
| CN105307399B CN105307399B (en) | 2017-11-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510691253.2A Active CN105307399B (en) | 2015-10-23 | 2015-10-23 | A kind of processing method of small size, thin pure ceramic circuit-board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105307399B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550544A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of manufacture method of small size ceramics pcb board |
| CN107484342A (en) * | 2017-08-22 | 2017-12-15 | 长沙牧泰莱电路技术有限公司 | A kind of ceramic PCB support plates preparation method of the materials of FR 4 |
| CN108601206A (en) * | 2018-06-08 | 2018-09-28 | 深圳市景旺电子股份有限公司 | A kind of embedding aluminium nitride PCB substrate and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5605719A (en) * | 1995-03-03 | 1997-02-25 | Rockwell International Corporation | Method of transporting and applying a surface treatment liquid using gas bubbles |
| CN101742821A (en) * | 2008-11-24 | 2010-06-16 | 华通电脑股份有限公司 | Circuit board bearing device and application method thereof |
| CN102368890A (en) * | 2011-10-09 | 2012-03-07 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
| CN102548236A (en) * | 2011-12-26 | 2012-07-04 | 东莞生益电子有限公司 | Combined tray for surface brown oxidation of copper blocks and manufacturing method thereof |
| CN203574948U (en) * | 2013-11-07 | 2014-04-30 | 广州杰赛科技股份有限公司 | Horizontal line clamp for copper block coarsening |
-
2015
- 2015-10-23 CN CN201510691253.2A patent/CN105307399B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5605719A (en) * | 1995-03-03 | 1997-02-25 | Rockwell International Corporation | Method of transporting and applying a surface treatment liquid using gas bubbles |
| CN101742821A (en) * | 2008-11-24 | 2010-06-16 | 华通电脑股份有限公司 | Circuit board bearing device and application method thereof |
| CN102368890A (en) * | 2011-10-09 | 2012-03-07 | 东莞生益电子有限公司 | Manufacturing method of PCB with embedded assembly |
| CN102523684A (en) * | 2011-12-02 | 2012-06-27 | 东莞生益电子有限公司 | Manufacture method for printed circuit board (PCB) with step groove |
| CN102548236A (en) * | 2011-12-26 | 2012-07-04 | 东莞生益电子有限公司 | Combined tray for surface brown oxidation of copper blocks and manufacturing method thereof |
| CN203574948U (en) * | 2013-11-07 | 2014-04-30 | 广州杰赛科技股份有限公司 | Horizontal line clamp for copper block coarsening |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106550544A (en) * | 2016-12-06 | 2017-03-29 | 深圳市深联电路有限公司 | A kind of manufacture method of small size ceramics pcb board |
| CN107484342A (en) * | 2017-08-22 | 2017-12-15 | 长沙牧泰莱电路技术有限公司 | A kind of ceramic PCB support plates preparation method of the materials of FR 4 |
| CN108601206A (en) * | 2018-06-08 | 2018-09-28 | 深圳市景旺电子股份有限公司 | A kind of embedding aluminium nitride PCB substrate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105307399B (en) | 2017-11-28 |
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Address after: 518000 101-401, building A-1, Fufa Industrial Park, No.3, Fuyuan 1st Road, Heping community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Qiangda circuit Co.,Ltd. Address before: 518103 building A1, Fufa Industrial Park, high tech Industrial Zone, Fuyuan 1st Road, Fuyong Town, Bao'an District, Shenzhen, Guangdong Province Patentee before: Q&D CIRCUITS Co.,Ltd. |