CN102802365A - Manufacturing method for embedding copper heat sink into circuit board - Google Patents
Manufacturing method for embedding copper heat sink into circuit board Download PDFInfo
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- CN102802365A CN102802365A CN2012103068276A CN201210306827A CN102802365A CN 102802365 A CN102802365 A CN 102802365A CN 2012103068276 A CN2012103068276 A CN 2012103068276A CN 201210306827 A CN201210306827 A CN 201210306827A CN 102802365 A CN102802365 A CN 102802365A
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- copper
- circuit board
- radiating rib
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- inlaid
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Abstract
The invention discloses a manufacturing method for embedding a copper heat sink into a circuit board, which comprises the following steps of: a drilling process: drilling a copper heat sink embedding hole on a circuit board subjected to pressing treatment, wherein the rotating speed of a drill bit is controlled to be 20000 revolutions/minute, the board inlet speed is controlled to be 10 inches/minutes, and the board withdraw speed is controlled to be 100 inches/minutes; and an embedding process: installing a milling cutter with a cylindrical end on a milling machine, fixing the circuit board with the copper heat sink embedding hole on the milling machine, placing the copper heat sink into the copper heat sink embedding hole, starting the milling machine, and moving the milling cutter to the copper heat sink required to be pressed, so that the milling cutter presses the copper heat sink downwards in a non-rotating speed mode until a copper sheet is completely embedded into the circuit board. According to the invention, the automation of the embedding pressing process of copper heat sinks can be realized, thereby reducing manpower, increasing the productivity and meeting the mass production requirements.
Description
Technical field
The present invention relates to circuit board manufacturing technology field, particularly relate to a kind of manufacture method that copper radiating rib is inlaid into circuit board.
Background technology
The high speed development of modern electronic technology, increasing integrated chip is used on the complex circuit design, and the while circuit board is integrated, and the lot is cast, and this assembles in the circuit board for some high performance components, and how to dispel the heat becomes a bigger problem.Common situation is the surface mount fin at heater element, makes the volume of finished product increase greatly though such design has solved heat dissipation problem, is unfavorable for the design requirement of the integrated and high laminate of product height.Simultaneously can reach great heat radiation effect in order to reduce small product size, a kind of theory that copper sheet is embedded in the circuit board is just arisen at the historic moment.
The patent No. is ZL200910041004.3; The applying date is in the manufacture method of disclosed a kind of circuit board on the 9th July in 2009; The copper sheet pressing flow process of its design is manual operation, and this method is to realize manual pressing through aerostatic press and mould, not only needs a large amount of manpowers; Production capacity is low simultaneously, is difficult to satisfy the volume production demand.
Summary of the invention
Based on this, to the problems referred to above, the present invention proposes a kind of copper radiating rib to be inlaid into the manufacture method of circuit board, can make the process for pressing of inlaying of copper radiating rib realize automation, reduces manpower, increases production capacity and satisfies the volume production demand.
Technical scheme of the present invention is: a kind of copper radiating rib is inlaid into the manufacture method of circuit board, may further comprise the steps:
Drilling operating bores on the circuit board after handling through the pressing plate operation and hits the copper radiating rib embedded hole, and it is 20000 rev/mins that the rotating speed of chewing is bored in control, and entering plate speed is 10 inch per minute clocks, and moving back plate speed is 100 inch per minute clocks;
Mosaic procedure; With the end is that columniform milling cutter is installed on the milling machine; The circuit board that will have the copper radiating rib embedded hole again is fixed on the milling machine, and copper radiating rib is positioned in the copper radiating rib embedded hole, starts milling machine; Milling cutter moves to and needs the copper radiating rib of pressing place, milling cutter not to have the downward pressing copper radiating rib of rotating speed to be inlaid into circuit board fully up to copper sheet.
As a kind of preferred implementation; In drilling operating, said pressing plate operation is meant: through heat pressing process and cold-press process pressing, wherein hot pressing time is 180min with core material, prepreg and outermost layer substrate; System vacuumizes absolute pressure 20000Pa, and the control platen pressure is 5.265Kgf/cm
2-25.207Kgf/cm
2, temperature is 150 ℃-200 ℃, the time of colding pressing is 60min, pressure control 132.6Kgf/cm
2, temperature is 20 ℃.Can make that the precision of circuit board thickness is controlled at behind the pressing plate ± 3% in.
As a kind of preferred implementation, before mosaic procedure, further comprising the steps of:
The copper facing operation; Circuit board to after handling through drilling operating removes glue, electroless copper, electric plating of whole board, figure transfer, graphic plating, etching successively; Wherein, the copper that electric plating of whole board and graphic plating produce is thick to be that to electroplate total copper thick, and to electroplate total copper thick be 30 μ m-40 μ m.Can make the thickness distribution of circuit board even, condition more easily is provided so that follow-up copper radiating rib is inlayed process for pressing.
As a kind of preferred implementation; In mosaic procedure; Further comprising the steps of: it is 0.3MPa-0.6MPa that the control milling cutter does not have the pressure that the downward pressing copper sheet of rotating speed surface integral body receives, and the control time that contact copper sheet to copper sheet is inlaid into circuit board fully from the milling cutter end is no more than 5 seconds.Efficient, stable the inlaying of copper radiating rib got in the circuit board.
In drilling operating, each copper radiating rib embedded hole is chewed branch by brill and is drilled to for three times, and the ratio of three drilling depths is 30%:40%:30%.Defective such as can prevent that when drilling through the large aperture burr, the breaking of rod that occur are easily chewed, the aperture consistency of controlling easily and getting out is high.
The invention has the beneficial effects as follows:
(1) can make the process for pressing of inlaying of copper radiating rib realize automation, reduce manpower, increase production capacity and satisfy the volume production demand;
(2) milling cutter to milling machine improves again, the end of milling cutter is made into cylindrical, just can effectively be integrated in one the function of milling machine and press, reaches the pressing effect;
(3) through the parameter of control pressing plate, boring, copper facing, mosaic procedure, make that the thickness of slab of circuit board is even, make things convenient for the later stage damascene structure; Particularly bigger copper radiating rib is inlayed, can be guaranteed accurate positioning, in conjunction with effective; The plate surface evenness is high, and flexural deformation is little.
Description of drawings
Fig. 1 is the process chart of the embodiment of the invention;
Fig. 2 is a milling cutter construction comparison diagram before and after improving in the embodiment of the invention;
Fig. 3 is the structural representation that is inlaid into copper radiating rib in the circuit board in the embodiment of the invention;
Fig. 4 is the pressing sketch map that in the embodiment of the invention copper radiating rib is inlaid into circuit board;
Fig. 5 is that the position of damascene copper fin in the embodiment of the invention circuit board is divided the boring sketch map three times;
Fig. 6 is the contact resistance test sketch map of the copper radiating rib inlayed in the embodiment of the invention and circuit board internal layer.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated.
Embodiment:
On the thick pcb board of 1.7mm, to inlay diameter is that the copper radiating rib of 8.2 ± 0.005mm and 10.2 ± 0.005mm is as embodiment.Fig. 1 is the technological process that a complete circuit plate of present embodiment employing is made.Fig. 2 is a milling cutter construction comparison diagram before and after improving in the embodiment of the invention.Fig. 3 is the structural representation that is inlaid into copper radiating rib in the circuit board in the embodiment of the invention, and the diameter of copper radiating rib can be between 8mm-12mm.The diameter of the copper radiating rib that uses in the present embodiment is 8.2 ± 0.005mm and two kinds of specifications of 10.2 ± 0.005mm.
Below in conjunction with Fig. 1, specify execution mode of the present invention, wherein core material making, wet green oil, surface treatment are traditional handicraft, only briefly run over employed method in the present embodiment at this, but are not limited to the method that is adopted among this embodiment.
As shown in Figure 1, a kind of manufacture method that copper radiating rib is inlaid into circuit board
Step S101, the production process of core material covers with Copper Foil at the one or both sides of insulating substrate, utilizes film exposure, and the technology that conductive pattern shifts is accomplished in etching.
Step S102, drilling operating bores on the circuit board after handling through the pressing plate operation and hits the copper radiating rib embedded hole, and it is 20000 rev/mins that the rotating speed of chewing is bored in control, and entering plate speed is 10 inch per minute clocks, and moving back plate speed is 100 inch per minute clocks.
In drilling operating, each copper radiating rib embedded hole is chewed branch by brill and is drilled to for three times, and the ratio of three drilling depths is 30%:40%:30%.Defective such as can prevent that when drilling through the large aperture burr, the breaking of rod that occur are easily chewed, the aperture consistency of controlling easily and getting out is high.
The circuit board of band copper sheet heat radiation except that the normally hole, also need be holed in the position that copper sheet is inlaid into wiring board in advance.Be directed to the demanding situation of macropore and aperture precision, the present invention utilizes wammel to chew the mode of three borings of branch, can avoid disposable completion to cause the through hole caloric value too much well, bores and chews the shortcoming of damaging easily with wiring board.1st, the depth scale of 2,3 segmentations brill is 30%:40%:30%.Fig. 5 has provided the boring sketch map of aperture at 8mm-12mm.
In this step, the diameter of the copper radiating rib of use has two kinds, 8.2 ± 0.005mm and 10.2 ± 0.005mm.In the wiring board corresponding position, adopted the wammel of 8.225mm and 10.225mm to chew and holed.Having bored that hole tolerance after the hole requires is in ± 0.05mm.
Step S103, the pressing plate operation, through heat pressing process and cold-press process pressing, wherein hot pressing time is 180min with core material, prepreg and outermost layer substrate, and system vacuumizes absolute pressure 20000Pa, and the control platen pressure is 5.265Kgf/cm
2-25.207Kgf/cm
2, temperature is 150 ℃-200 ℃, the time of colding pressing is 60min, pressure control 132.6Kgf/cm
2, temperature is 20 ℃.Can make that the precision of circuit board thickness is controlled at behind the pressing plate ± 3% in.
When operation, core material, prepreg and outermost layer substrate are folded the completion pressing successively.Wherein corresponding technological parameter need guarantee after the pressing, the thickness of slab precision of wiring board is controlled at ± 3% in.In the present embodiment, the wiring board of made is designed to 1.7mm, and therefore, its thickness of slab should be controlled between the 1.65mm-1.75mm behind the pressing plate.
Step S104; The copper facing operation is removed glue, electroless copper, electric plating of whole board, figure transfer, graphic plating, etching to the circuit board after handling through drilling operating, wherein successively; The copper that electric plating of whole board and graphic plating produce is thick to be that to electroplate total copper thick, and to electroplate total copper thick be 30 μ m-40 μ m.Can make the thickness distribution of circuit board even, condition more easily is provided so that follow-up copper radiating rib is inlayed process for pressing.
In order to add thick copper layer; Certainly not only has only a kind of method cited in this step; But its obvious characteristics is: on the wiring board the thick one-tenth-value thickness 1/10 of the electro-coppering of each position all between 30-40 μ m, the thick thick summation of copper that is meant that electric plating of whole board and graphic plating produce of electro-coppering wherein.
Step S105; Mosaic procedure; With the end is that columniform milling cutter is installed on the milling machine, and the diameter of columniform milling cutter is than the little 2mm-3mm of diameter of copper radiating rib embedded hole, and the circuit board that will have the copper radiating rib embedded hole again is fixed on the milling machine; The plug-in unit face of circuit board (C/S face) applying milling machine, another side are that solder side (S/S face) is placed up.Copper radiating rib is positioned in the copper radiating rib embedded hole, starts milling machine, milling cutter moves to and needs the copper radiating rib of pressing place, milling cutter not to have the downward pressing copper radiating rib of rotating speed to be inlaid into circuit board fully up to copper sheet.
In mosaic procedure, also need controlling milling cutter, not have the pressure that the downward pressing copper sheet of rotating speed surface integral body receives be 0.3MPa-0.6MPa, and the control time that contact copper sheet to copper sheet is inlaid into circuit board fully from the milling cutter end is no more than 5 seconds.Efficient, stable the inlaying of copper radiating rib got in the circuit board.
To inlaying in the pressing working procedure of copper radiating rib, at first need reequip traditional milling machine, make milling cutter that the function of downward pressing arranged, the shape of milling cutter also is designed to shown in Figure 2.In the present embodiment, the milling cutter before the repacking has rotating speed and terminal-velocity design, and does not have the pressing function.The transformation of the function of milling cutter under the so flourishing condition of current automatic technology, to those skilled in the art, is almost had no problem, be very easy to realize, belong to prior art, do not give unnecessary details at this.The topmost degree of depth that presses down that remains the control milling cutter is to confirm according to the thickness of slab of circuit board and press down the degree of depth.Fig. 4 is the pressing sketch map that in the embodiment of the invention copper radiating rib is inlaid into circuit board.Press down depth H and equal milling cutter from milling machine horizontal plane platform height H
1Deduct wiring board thickness of slab h.
Step S106, the operation of follow-up wet green oil, surface treatment, gong plate belongs to conventional means of the prior art, does not give unnecessary details at this.
After accomplishing above-mentioned six operations, just can obtain a circuit board that is inlaid with copper radiating rib.
The inventor has carried out some reliability testings to the wiring board of manufacturing among the embodiment.As shown in Figure 6, Fig. 6 is the contact resistance test sketch map of the copper radiating rib inlayed in the embodiment of the invention and circuit board internal layer.When carrying out reliability testing, the circuit board that adopts the method described in the present invention to make, major part all satisfies qualified requirement.Following table is to adopt the reliability testing data of the circuit board of the method for the invention manufacturing.
The above embodiment has only expressed embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the present invention's design, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (5)
1. one kind is inlaid into the manufacture method of circuit board with copper radiating rib, it is characterized in that, may further comprise the steps:
Drilling operating bores on the circuit board after handling through the pressing plate operation and hits the copper radiating rib embedded hole, and it is 20000 rev/mins that the rotating speed of chewing is bored in control, and entering plate speed is 10 inch per minute clocks, and moving back plate speed is 100 inch per minute clocks;
Mosaic procedure; With the end is that columniform milling cutter is installed on the milling machine; The circuit board that will have the copper radiating rib embedded hole again is fixed on the milling machine, and copper radiating rib is positioned in the copper radiating rib embedded hole, starts milling machine; Milling cutter moves to and needs the copper radiating rib of pressing place, milling cutter not to have the downward pressing copper radiating rib of rotating speed to be inlaid into circuit board fully up to copper sheet.
2. according to claim 1ly a kind of copper radiating rib is inlaid into the manufacture method of circuit board, it is characterized in that in the drilling operating, said pressing plate operation is meant:
Through heat pressing process and cold-press process pressing, wherein hot pressing time is 180min with core material, prepreg and outermost layer substrate, and system vacuumizes absolute pressure 20000Pa, and the control platen pressure is 5.265Kgf/cm
2-25.207Kgf/cm
2, temperature is 150 ℃-200 ℃, the time of colding pressing is 60min, pressure control 132.6Kgf/cm
2, temperature is 20 ℃.
3. according to claim 1 and 2ly a kind of copper radiating rib is inlaid into the manufacture method of circuit board, it is characterized in that, before mosaic procedure, further comprising the steps of:
The copper facing operation; Circuit board to after handling through drilling operating removes glue, electroless copper, electric plating of whole board, figure transfer, graphic plating, etching successively; Wherein, the copper that electric plating of whole board and graphic plating produce is thick to be that to electroplate total copper thick, and to electroplate total copper thick be 30 μ m-40 μ m.
4. according to claim 1 and 2ly a kind of copper radiating rib is inlaid into the manufacture method of circuit board, it is characterized in that, in mosaic procedure, further comprising the steps of:
It is 0.3MPa-0.6MPa that the control milling cutter does not have the pressure that the downward pressing copper sheet of rotating speed surface integral body receives, and the control time that contact copper sheet to copper sheet is inlaid into circuit board fully from the milling cutter end is no more than 5 seconds.
5. according to claim 1ly a kind of copper radiating rib is inlaid into the manufacture method of circuit board, it is characterized in that in drilling operating, each copper radiating rib embedded hole is chewed branch by brill and is drilled to for three times, the ratio of three drilling depths is 30%:40%:30%.
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| CN201210306827.6A CN102802365B (en) | 2012-08-24 | 2012-08-24 | Manufacturing method for embedding copper heat sink into circuit board |
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| CN201210306827.6A CN102802365B (en) | 2012-08-24 | 2012-08-24 | Manufacturing method for embedding copper heat sink into circuit board |
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| CN102802365B CN102802365B (en) | 2014-12-17 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103281860A (en) * | 2013-06-13 | 2013-09-04 | 汕头超声印制板（二厂）有限公司 | Heat dissipation conducting circuit board and manufacturing method thereof |
| CN104105357A (en) * | 2014-07-31 | 2014-10-15 | 开平依利安达电子第三有限公司 | Method of pressing copper block into PCB (Printed Circuit Board) and application thereof |
| CN104159411A (en) * | 2013-07-22 | 2014-11-19 | 皆利士多层线路版(中山)有限公司 | Circuit board with high-current module and manufacturing method thereof |
| CN105407643A (en) * | 2015-12-15 | 2016-03-16 | 皆利士多层线路版(中山)有限公司 | Method for making 6OZ&12OZ thick copper circuit board attached with cooling fins |
| CN105430924A (en) * | 2015-12-23 | 2016-03-23 | 皆利士多层线路版(中山)有限公司 | Manufacture method for high-frequency high-speed circuit board with cooling fins inlaid |
| CN108174513A (en) * | 2017-12-28 | 2018-06-15 | 广州兴森快捷电路科技有限公司 | Wiring board and its processing method, the processing method of power amplifier slot |
| CN112752445A (en) * | 2020-12-15 | 2021-05-04 | 胜宏科技（惠州）股份有限公司 | Drilling method of circuit board with high aspect ratio |
| CN112888181A (en) * | 2020-11-06 | 2021-06-01 | 惠州市盈帆实业有限公司 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103281860A (en) * | 2013-06-13 | 2013-09-04 | 汕头超声印制板（二厂）有限公司 | Heat dissipation conducting circuit board and manufacturing method thereof |
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| CN105430924A (en) * | 2015-12-23 | 2016-03-23 | 皆利士多层线路版(中山)有限公司 | Manufacture method for high-frequency high-speed circuit board with cooling fins inlaid |
| CN108174513A (en) * | 2017-12-28 | 2018-06-15 | 广州兴森快捷电路科技有限公司 | Wiring board and its processing method, the processing method of power amplifier slot |
| WO2019128172A1 (en) * | 2017-12-28 | 2019-07-04 | 广州兴森快捷电路科技有限公司 | Circuit board and method for fabricating same, and method for fabricating power amplifier slot |
| CN108174513B (en) * | 2017-12-28 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | The processing method of wiring board and its processing method, power amplifier slot |
| CN112888181A (en) * | 2020-11-06 | 2021-06-01 | 惠州市盈帆实业有限公司 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
| CN112752445A (en) * | 2020-12-15 | 2021-05-04 | 胜宏科技（惠州）股份有限公司 | Drilling method of circuit board with high aspect ratio |
| CN112752445B (en) * | 2020-12-15 | 2022-04-15 | 胜宏科技（惠州）股份有限公司 | Drilling method of circuit board with high aspect ratio |
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