CN103281860A - Heat dissipation conducting circuit board and manufacturing method thereof - Google Patents

Heat dissipation conducting circuit board and manufacturing method thereof Download PDF

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Publication number
CN103281860A
CN103281860A CN2013102334708A CN201310233470A CN103281860A CN 103281860 A CN103281860 A CN 103281860A CN 2013102334708 A CN2013102334708 A CN 2013102334708A CN 201310233470 A CN201310233470 A CN 201310233470A CN 103281860 A CN103281860 A CN 103281860A
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CN
China
Prior art keywords
heat dissipation
circuit board
heat radiation
wiring board
conducting strip
Prior art date
Application number
CN2013102334708A
Other languages
Chinese (zh)
Inventor
刘建生
何润宏
张学东
邱彦佳
Original Assignee
汕头超声印制板(二厂)有限公司
汕头超声印制板公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 汕头超声印制板(二厂)有限公司, 汕头超声印制板公司 filed Critical 汕头超声印制板(二厂)有限公司
Priority to CN2013102334708A priority Critical patent/CN103281860A/en
Publication of CN103281860A publication Critical patent/CN103281860A/en

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Abstract

The invention discloses a heat dissipation conducting circuit board and a manufacturing method of the heat dissipation conducting circuit board. The heat dissipation conducting circuit board comprises a circuit board body and a heat dissipation conducting strip, wherein the circuit board body is provided with at least one through groove or blind groove which enables the heat dissipation conducting strip to be embedded, and the depth of the through groove or the depth of the blind groove meets the requirement that the heat dissipation conducting strip can be completely embedded into the circuit board. The manufacturing method of the heat dissipation conducting circuit board includes the following steps of preparing the circuit board body and the heat dissipation strip according to the design requirements, enabling the circuit board to be vertically fixed on a milling machine platform, milling out a corresponding zone in the thickness direction through a milling machine milling cutter according to a figure of the appearance of the heat dissipation conducting strip, firstly conducting pre-drying process on the circuit board body, and enabling the heat dissipation conducting strip to be extruded into the pre-dried circuit board body in the thickness direction. The technology is simple and the problems that an existing heat dissipation conducting strip is difficult to manufacture and the head dissipation strip is prone to dropping are resolved.

Description

A kind of heat radiation conducting wire plate and manufacture method thereof

Technical field

The present invention relates to a kind of conducting wire plate, more specifically is a kind of heat radiation conducting wire plate and manufacture method thereof.

Background technology

Along with electronic technology develops towards high speed, multi-functional, big capacity and portable low consumption direction, the heat radiation of printed board and low consumption performance also more and more are subjected to extensively, circuit board wiring density is more and more higher at present, signaling rate and data conveying capacity also increase gradually, therefore signal of telecommunication loss be converted into heat energy and cause the situation of electronic product heating also to increase thereupon, therefore need the structure of the corresponding coupling of design to satisfy in this respect functional requirement.

Existing heat radiation conductive circuit board mainly is divided into whole heat radiation and local heat radiation two classes, and wherein whole heat dissipation technology refers generally to use the monoblock fin to be attached to the wiring board outside, or is pressed together on the internal layer of wiring board.Whole heat dissipation technology must be carried out machining in advance to metal fin, runs through the position of via hole with some that avoid in the wiring board design, particularly needs the hole site of crossing of inserting element.Therefore the processing comparison difficulty of getting up, and the machining of metal fin take expensive, and because of whole conduction of fin, it is unusual that short circuit appears in local line design easily.Therefore in recent years, getting more and more uses local heat dissipation technology, namely only places radiating block at wiring board heating local location.But existing local heat radiation is thickness direction and embeds, and radiating block and wiring board binding site have and use bonding sheet to engage, and also has by physics way of contact joint.But because the tactile area of radiating block and wiring board is little, the problem that the heat dissipation metal piece comes off appears easily all in follow-up assembling use, transportation, drop test, thermal shock test.

In addition, existing heat dissipation technology all has difficulty of processing big, need use expensive bonding sheet, uses the pressing curing apparatus, and the process-cycle is long, and product reliability is poor, is easy to generate large tracts of land leak electricity short-circuit or the fin problem that comes off.

Summary of the invention

The object of the present invention is to provide a kind of heat radiation conducting wire plate and manufacture method thereof, described method has solved existing heat radiation conducting strip and has made problems such as difficulty and fin come off easily.

For achieving the above object, the invention provides following technical scheme:

A kind of heat radiation conducting wire plate comprises wiring board and heat radiation conducting strip, and described wiring board is provided with at least one groove or blind groove of embedding for the heat radiation conducting strip, and described groove or blind groove depth satisfy the heat radiation conducting strip and can all embed in the wiring board.

As the further scheme of the present invention: described groove or blind groove are provided with 1~3.

A kind of manufacture method of the conducting wire plate that dispels the heat may further comprise the steps:

(1) is ready to wiring board and heat radiation conducting strip by designing requirement earlier;

(2) wiring board is vertically fixed on the gong machine board;

(3) according to the figure of heat radiation conducting strip profile, go out corresponding zone by gong machine gong cutter gong on thickness direction;

(4) earlier wiring board is carried out preliminary drying and handle, the treatment temperature of described preliminary drying is 100~150 ℃, and the processing time is 30~60 minutes;

(5) conducting strip that will dispel the heat is squeezed in the wiring board of preliminary drying along thickness direction.

As the further scheme of the present invention: the treatment temperature of described preliminary drying is 120 ℃, and the processing time is 40 minutes.

Compared with prior art, the invention has the beneficial effects as follows: technology of the present invention is simple, has solved problems such as existing heat radiation conducting strip making difficulty and fin come off easily.

Description of drawings

In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.

Fig. 1 looks cutaway view for the master of heat radiation conducting wire plate in the embodiment of the invention.

Fig. 2 is the side view cutaway drawing of blind grooved heat radiation conducting wire plate in the embodiment of the invention.

Fig. 3 is the side view cutaway drawing of groove type heat radiation conducting wire plate in the embodiment of the invention.

Embodiment

The invention provides a kind of heat radiation conducting wire plate and manufacture method thereof, described method has solved existing heat radiation conducting strip and has made problems such as difficulty and fin come off easily.

Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.

See also Fig. 1~3, in the embodiment of the invention, a kind of heat radiation conducting wire plate comprises wiring board 1 and heat radiation conducting strip 2, and described wiring board 1 is provided with at least one groove or blind groove of embedding for heat radiation conducting strip 2.

As the further scheme of the present invention: described groove or blind groove depth satisfy heat radiation conducting strip 2 and can all embed in the wiring board 1.

As the further scheme of the present invention: described groove or blind groove are provided with 1~3.

A kind of manufacture method of the conducting wire plate that dispels the heat may further comprise the steps:

(1) is ready to wiring board 1 and heat radiation conducting strip 2 by designing requirement earlier;

(2) wiring board 1 is vertically fixed on the gong machine board;

(3) according to the figure of heat radiation conducting strip 2 profiles, go out corresponding zone by gong machine gong cutter gong on thickness direction;

(4) earlier wiring board 1 is carried out preliminary drying and handle, the treatment temperature of described preliminary drying is 100~150 ℃, and the processing time is 30~60 minutes.

(5) conducting strip 2 that will dispel the heat is squeezed in the wiring board 1 of preliminary drying along thickness direction.

As the further scheme of the present invention: the treatment temperature of described preliminary drying is 120 ℃, and the processing time is 40 minutes.

To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and under the situation that does not deviate from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, no matter from which point, all should regard embodiment as exemplary, and be nonrestrictive, scope of the present invention is limited by claims rather than above-mentioned explanation, therefore is intended to include in the present invention dropping on the implication that is equal to important document of claim and all changes in the scope.Any Reference numeral in the claim should be considered as limit related claim.

In addition, be to be understood that, though this specification is described according to execution mode, but be not that each execution mode only comprises an independently technical scheme, this narrating mode of specification only is for clarity sake, those skilled in the art should make specification as a whole, and the technical scheme among each embodiment also can form other execution modes that it will be appreciated by those skilled in the art that through appropriate combination.

Claims (4)

1. heat radiation conducting wire plate, comprise wiring board and heat radiation conducting strip, it is characterized in that described wiring board is provided with at least one groove or blind groove of embedding for the heat radiation conducting strip, described groove or blind groove depth satisfy the heat radiation conducting strip and can all embed in the wiring board.
2. heat radiation according to claim 1 conducting wire plate is characterized in that described groove or blind groove are provided with 1~3.
3. manufacture method of conducting wire plate of dispelling the heat is characterized in that may further comprise the steps:
Be ready to wiring board and heat radiation conducting strip by designing requirement earlier;
Wiring board is vertically fixed on the gong machine board;
Figure according to heat radiation conducting strip profile goes out corresponding zone by gong machine gong cutter gong on thickness direction;
Earlier wiring board is carried out preliminary drying and handle, the treatment temperature of described preliminary drying is 100~150 ℃, and the processing time is 30~60 minutes;
The heat radiation conducting strip is squeezed in the wiring board of preliminary drying along thickness direction.
4. the manufacture method of heat radiation according to claim 1 conducting wire plate is characterized in that the treatment temperature of described preliminary drying is 120 ℃, and the processing time is 40 minutes.
CN2013102334708A 2013-06-13 2013-06-13 Heat dissipation conducting circuit board and manufacturing method thereof CN103281860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013102334708A CN103281860A (en) 2013-06-13 2013-06-13 Heat dissipation conducting circuit board and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013102334708A CN103281860A (en) 2013-06-13 2013-06-13 Heat dissipation conducting circuit board and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN103281860A true CN103281860A (en) 2013-09-04

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Family Applications (1)

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CN2013102334708A CN103281860A (en) 2013-06-13 2013-06-13 Heat dissipation conducting circuit board and manufacturing method thereof

Country Status (1)

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CN (1) CN103281860A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004007010A (en) * 2003-09-19 2004-01-08 Mitsubishi Electric Corp Circuit board and its producing method
JP2006318986A (en) * 2005-05-10 2006-11-24 Sumitomo Electric Printed Circuit Inc Flexible printed circuit board and its manufacturing method
CN201213333Y (en) * 2008-07-07 2009-03-25 华为技术有限公司 Combined apparatus for heat radiating device and circuit board, and communication apparatus
CN101784160A (en) * 2010-01-22 2010-07-21 东莞生益电子有限公司 Method for manufacturing press in type printed circuit board with high thermal conductivity
KR20100125082A (en) * 2009-05-20 2010-11-30 한국단자공업 주식회사 Metal core pcb
CN102781158A (en) * 2011-05-09 2012-11-14 代芳 PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect
CN102802365A (en) * 2012-08-24 2012-11-28 皆利士多层线路版(中山)有限公司 Manufacturing method for embedding copper heat sink into circuit board
CN103079356A (en) * 2012-12-27 2013-05-01 深圳市五株科技股份有限公司 Manufacturing process for copper-based printed circuit board with embedded circuits

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004007010A (en) * 2003-09-19 2004-01-08 Mitsubishi Electric Corp Circuit board and its producing method
JP2006318986A (en) * 2005-05-10 2006-11-24 Sumitomo Electric Printed Circuit Inc Flexible printed circuit board and its manufacturing method
CN201213333Y (en) * 2008-07-07 2009-03-25 华为技术有限公司 Combined apparatus for heat radiating device and circuit board, and communication apparatus
KR20100125082A (en) * 2009-05-20 2010-11-30 한국단자공업 주식회사 Metal core pcb
CN101784160A (en) * 2010-01-22 2010-07-21 东莞生益电子有限公司 Method for manufacturing press in type printed circuit board with high thermal conductivity
CN102781158A (en) * 2011-05-09 2012-11-14 代芳 PCB (Printed Circuit Board) technology capable of increasing heat dissipation effect
CN102802365A (en) * 2012-08-24 2012-11-28 皆利士多层线路版(中山)有限公司 Manufacturing method for embedding copper heat sink into circuit board
CN103079356A (en) * 2012-12-27 2013-05-01 深圳市五株科技股份有限公司 Manufacturing process for copper-based printed circuit board with embedded circuits

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Application publication date: 20130904