CN112752445A - Drilling method of circuit board with high aspect ratio - Google Patents
Drilling method of circuit board with high aspect ratio Download PDFInfo
- Publication number
- CN112752445A CN112752445A CN202011477150.3A CN202011477150A CN112752445A CN 112752445 A CN112752445 A CN 112752445A CN 202011477150 A CN202011477150 A CN 202011477150A CN 112752445 A CN112752445 A CN 112752445A
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- China
- Prior art keywords
- pcb
- drilling
- target
- thickness
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The invention discloses a drilling method of a circuit board with a high aspect ratio, which comprises the following steps: s1: cutting, namely cutting a plurality of substrates; s2: inner layer graph, making inner layer graph; s3: pressing, namely pressing the plurality of substrates to form a PCB; s4: drilling; positioning the PCB, and determining the expansion and contraction coefficient of the laminated PCB; determining the thickness of the PCB and the positions of drilled holes, drilling through holes by a drill in a three-time segmented drilling mode, wherein the depth of the first drilled hole is 2/5 of the thickness of the PCB, the depth of the second drilled hole is 3/10 of the thickness of the PCB, the depth of the third drilled hole is 3/10 of the thickness of the PCB, and the length of a cutting edge of the drill is 1-1.5 mm greater than the thickness of the PCB; s5: copper deposition, performing copper deposition on the through hole, and determining that the backlight grade is more than or equal to 9 after copper deposition; s6: the board electricity is used for conducting board electricity on the PCB in a pulse electroplating mode; s7: and (5) performing a post-process. The drilling method can avoid the problems of stepped holes and poor hole patterns, improve hole pattern abnormity, ensure electroplating effect and improve drilling quality.
Description
Technical Field
The invention relates to the field of PCBs (printed circuit boards), in particular to a drilling method of a circuit board with a high aspect ratio.
Background
At present, the circuit board is developed towards light weight and high density, the hole diameter of the drilled hole is reduced along with the development of an electroplating technology, and under the condition that the electroplating can meet the requirement of hole copper, the technical bottleneck to be overcome is formed by how to manufacture the drilled hole with the high thickness-diameter ratio. The high aspect ratio circuit board means that the ratio of the board thickness to the hole diameter is bigger, and the drilling difficulty is big. The existing drilling process for the circuit board with the high aspect ratio is generally adopted, positioning holes need to be drilled twice, drilling data are called twice, two sides are drilled once respectively, the risk of cutter breaking is increased, the drilling deviation is easy to occur at the butt joint of the drilling holes to form a step-shaped hole pattern, and the problems of poor hole pattern, broken drilling and the like exist.
Disclosure of Invention
The invention provides a drilling method of a high-aspect-ratio circuit board, aiming at solving the problems of poor hole type and stepped hole formation in the existing drilling of the high-aspect-ratio circuit board.
A drilling method for a high aspect ratio circuit board comprises the following steps:
s1: cutting, namely cutting a plurality of substrates;
s2: inner layer graph, making inner layer graph;
s3: pressing, namely pressing the plurality of substrates to form a PCB;
s4: drilling; positioning the PCB, and determining the expansion and contraction coefficient of the laminated PCB; determining the thickness of the PCB and the positions of drilled holes, drilling through holes by a drill in a three-time segmented drilling mode, wherein the depth of the first drilled hole is 2/5 of the thickness of the PCB, the depth of the second drilled hole is 3/10 of the thickness of the PCB, the depth of the third drilled hole is 3/10 of the thickness of the PCB, and the length of a cutting edge of the drill is 1-1.5 mm greater than the thickness of the PCB;
s5: copper deposition, performing copper deposition on the through hole, and determining that the backlight grade is more than or equal to 9 after copper deposition;
s6: the board electricity is used for conducting board electricity on the PCB in a pulse electroplating mode;
s7: and (5) performing a post-process.
Optionally, the determining the expansion and contraction coefficient of the PCB includes the following steps:
the inner layer graph further comprises the following steps: arranging a CCD target on a substrate;
in the drilling, the method further comprises the following steps: and scanning and positioning by adopting a CCD (charge coupled device) machine, and obtaining the expansion and contraction coefficients of the PCB through the positions of the CCD target before and after lamination.
Optionally, before drilling, the method further comprises the steps of performing target shooting and cutting grinding on the PCB, drilling the CCD target by the target shooting so as to further determine the expansion and contraction coefficient of the PCB, and after the target shooting, performing cutting grinding on the PCB.
Optionally, the drill knife and the PCB board form an included angle of 90 degrees in the target shooting process.
Optionally, the positioning the PCB board includes the following steps:
the inner layer graph further comprises the following steps: providing an L-target on a substrate;
before drilling, the PCB is subjected to target shooting and cutting grinding, the L target is drilled out through target shooting, and the PCB is cut and ground after target shooting;
the drilling further comprises the following steps:
preparing a base plate, and drilling a positioning hole on the base plate at a position corresponding to the L target;
and placing the PCB on the base plate, and fixing the PCB on the base plate by penetrating the L target through a pin.
Optionally, before drilling, an aluminum sheet is covered on the PCB.
Optionally, glue removal is performed before the copper deposition, and the glue removal is performed at least twice.
Optionally, the inner layer pattern further includes a target hole disposed on the substrate.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a drilling method of a circuit board with a high aspect ratio, which can avoid the problems of stepped holes and poor hole patterns; the thickness of a drill used for drilling is 1-1.5 mm larger than that of a PCB (printed circuit board), and a through hole is drilled in a three-time sectional drilling mode, so that hole pattern abnormity is improved, the condition of drilling deviation cannot occur, a better hole pattern is provided for a subsequent electroplating process, electroplating is facilitated, and the electroplating effect is ensured; the method reduces time cost and improves the drilling quality.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
A drilling method for a high aspect ratio circuit board comprises the following steps:
s1: and cutting the plurality of substrates into preset sizes.
S2: and (3) inner layer patterning, namely performing inner layer patterning on the substrate positioned in the inner layer in the subsequent substrate stacking position, and in some embodiments, further comprising arranging target holes, CCD targets and L targets on the substrate, for example, arranging 7 target holes, 4 CCD targets and 3L targets on the substrate.
S3: and pressing, namely laminating the plurality of substrates to form the PCB.
S4: drilling; positioning the PCB, and determining the expansion and contraction coefficient of the laminated PCB;
in some embodiments, determining the shrinkage factor of the PCB comprises the steps of: in the inner layer pattern, a CCD target is arranged on a substrate; and scanning and positioning by adopting a CCD (charge coupled device) machine, and obtaining the expansion and contraction coefficients of the PCB through the positions of the CCD target before and after lamination. In some embodiments, before drilling, the PCB board is subjected to target hitting and cutting, the CCD drill tape is called to identify the CCD target, the target hitting drills the CCD target to further determine the expansion and contraction coefficient of the PCB board, if the target hitting is performed, the expansion and contraction coefficient is based on the expansion and contraction coefficient determined after the target hitting, and after the target hitting, the PCB board is cut and ground. The drill knife and the PCB are at an included angle of 90 degrees in the target shooting process, so that front drilling is ensured, and burrs are avoided.
In some embodiments, positioning the PCB board comprises the steps of: the inner layer graph further comprises the following steps: providing an L-target on a substrate; before drilling, the PCB is subjected to target shooting and cutting grinding, the L target is drilled out through target shooting, and the PCB is cut and ground after target shooting; preparing a base plate, and drilling a positioning hole on the base plate at a position corresponding to the L target; place the PCB board on the backing plate, adopt the pin to pass the L target and fix the PCB board on the backing plate, this backing plate and the size phase-match of PCB board, drill hole again after the PCB board location, can ensure the accuracy of drilling.
The thickness of the PCB and the positions of the drilled holes are determined, the PCB is covered with an aluminum sheet, the aluminum sheet can buffer the impact force applied when the PCB is contacted with a drill, the drilling effect is improved, the drill drills out through holes in a three-time segmented drilling mode, the depth of the first drilled hole is 2/5 of the thickness of the PCB, the depth of the second drilled hole is 3/10 of the thickness of the PCB, the depth of the third drilled hole is 3/10 of the thickness of the PCB, and the length of the cutting edge of the drill is 1-1.5 mm greater than the thickness of the PCB. The problems of stepped holes and poor hole patterns can be avoided by adopting a drill tool with the thickness larger than that of the PCB and a sectional drilling mode.
S5: and (4) copper deposition, performing copper deposition on the through hole, and determining that the backlight grade is more than or equal to 9 after copper deposition.
And removing glue before copper deposition, wherein the glue removal is carried out at least twice because the aspect ratio of the PCB is large.
S6: the board electricity adopts the pulse plating mode to carry out the board electricity to the PCB board, can adopt board electricity many times as required so that hole copper thickness satisfies the requirement.
S7: and (5) performing a post-process.
The invention provides a drilling method of a circuit board with a high aspect ratio, which can avoid the problems of stepped holes and poor hole patterns; the thickness of a drill used for drilling is 1-1.5 mm larger than that of a PCB (printed circuit board), and a through hole is drilled in a three-time sectional drilling mode, so that hole pattern abnormity is improved, the condition of drilling deviation cannot occur, a better hole pattern is provided for a subsequent electroplating process, electroplating is facilitated, and the electroplating effect is ensured; the method reduces time cost and improves the drilling quality.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (8)
1. A drilling method for a circuit board with a high aspect ratio is characterized in that: the method comprises the following steps:
s1: cutting, namely cutting a plurality of substrates;
s2: inner layer graph, making inner layer graph;
s3: pressing, namely pressing the plurality of substrates to form a PCB;
s4: drilling; positioning the PCB, and determining the expansion and contraction coefficient of the laminated PCB; determining the thickness of the PCB and the positions of drilled holes, drilling through holes by a drill in a three-time segmented drilling mode, wherein the depth of the first drilled hole is 2/5 of the thickness of the PCB, the depth of the second drilled hole is 3/10 of the thickness of the PCB, the depth of the third drilled hole is 3/10 of the thickness of the PCB, and the length of a cutting edge of the drill is 1-1.5 mm greater than the thickness of the PCB;
s5: copper deposition, performing copper deposition on the through hole, and determining that the backlight grade is more than or equal to 9 after copper deposition;
s6: the board electricity is used for conducting board electricity on the PCB in a pulse electroplating mode;
s7: and (5) performing a post-process.
2. A method of drilling a high aspect ratio circuit board according to claim 1, wherein: the method for determining the expansion and contraction coefficient of the PCB comprises the following steps:
the inner layer graph further comprises the following steps: arranging a CCD target on a substrate;
in the drilling, the method further comprises the following steps: and scanning and positioning by adopting a CCD (charge coupled device) machine, and obtaining the expansion and contraction coefficients of the PCB through the positions of the CCD target before and after lamination.
3. A method of drilling a high aspect ratio circuit board according to claim 2, wherein: and before drilling, the PCB is subjected to target shooting and cutting, the CCD target is drilled out by the target shooting so as to further determine the expansion and shrinkage coefficient of the PCB, and the PCB is cut and ground after the target shooting.
4. A method of drilling a high aspect ratio circuit board according to claim 3, wherein: the drill knife and the PCB form an included angle of 90 degrees in the target shooting process.
5. A method of drilling a high aspect ratio circuit board according to claim 1, wherein: the positioning of the PCB comprises the following steps:
the inner layer graph further comprises the following steps: providing an L-target on a substrate;
before drilling, the PCB is subjected to target shooting and cutting grinding, the L target is drilled out through target shooting, and the PCB is cut and ground after target shooting;
the drilling further comprises the following steps:
preparing a base plate, and drilling a positioning hole on the base plate at a position corresponding to the L target;
and placing the PCB on the base plate, and fixing the PCB on the base plate by penetrating the L target through a pin.
6. The method for drilling the high aspect ratio circuit board according to claim 1 or 5, wherein: and covering an aluminum sheet on the PCB before drilling.
7. A method of drilling a high aspect ratio circuit board according to claim 1, wherein: and removing glue before the copper deposition, wherein the glue removal is carried out at least twice.
8. A method of drilling a high aspect ratio circuit board according to claim 1, wherein: the inner layer pattern also comprises a target hole arranged on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011477150.3A CN112752445B (en) | 2020-12-15 | 2020-12-15 | Drilling method of circuit board with high aspect ratio |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011477150.3A CN112752445B (en) | 2020-12-15 | 2020-12-15 | Drilling method of circuit board with high aspect ratio |
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| CN112752445A true CN112752445A (en) | 2021-05-04 |
| CN112752445B CN112752445B (en) | 2022-04-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114340223A (en) * | 2021-12-08 | 2022-04-12 | 江苏普诺威电子股份有限公司 | Manufacturing method of multilayer board based on high aspect ratio selective semiconductor through hole |
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| CN112752445B (en) | 2022-04-15 |
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