CN108601226A - A kind of superelevation radius-thickness ratio micropore chisels brill processing method - Google Patents
A kind of superelevation radius-thickness ratio micropore chisels brill processing method Download PDFInfo
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- CN108601226A CN108601226A CN201810381807.2A CN201810381807A CN108601226A CN 108601226 A CN108601226 A CN 108601226A CN 201810381807 A CN201810381807 A CN 201810381807A CN 108601226 A CN108601226 A CN 108601226A
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- time
- pcb board
- thickness ratio
- superelevation
- thickness
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Abstract
Chisel brill processing method the present invention provides a kind of superelevation radius-thickness ratio micropore, including：Select the brills nozzle of suitable sword length to superelevation radius-thickness ratio pcb board part using chisel brill cut step by step and time knife by the way of drill pcb board via hole.The PCB product drilling processing of superelevation radius-thickness ratio may be implemented in the present invention.Compared with existing positive and negative brill technology, the present invention can effectively solve the problem that the offset problem for the overlapping position that drills twice, to ensure that the integrality in aperture, realizing can ensure that copper is uniform on hole wall in hole metallization process, while ensure the integrality of product signal transmission.
Description
Technical field
The present invention relates to wiring board processing technique fields, and in particular to be that a kind of superelevation radius-thickness ratio micropore chisels brill processing
Method.
Background technology
Conventional PCB processing and fabricatings are needed to cut via hole between layers by machine drilling, usually be defined
The apertures below 0.3mm are micropore；Brill nozzle itself designs cutting edge length and determines the product thickness that can be processed, as aperture is
The brill a length of 5.5mm of nozzle sword of 0.3mm, the apertures the 0.25mm a length of 4.5mm of sword, the apertures the 0.2mm a length of 3.5mm of sword, when the plate of PCB
When thickness is more than brill nozzle edge length, plate can not be drilled out.
In order to solve this problem, at present using the method (as shown in Figure 1) of positive countercharge deep drilling, this method is broadly divided into two
A step carries out drilling processing, and first from the brill that faces down of high thickness to diameter ratio pcb board 2, required cutting hole is deep-controlled in plate
Secondly high thickness to diameter ratio pcb board 2 is turned over, is bored downwards from the reverse side of plate by the 3/5 of part overall thickness, deep-controlled total in plate
The 3/5 of thickness, to ensure to have 1/5 registration, to realize the processing of superelevation radius-thickness ratio micropore, wherein from obverse and reverse two
Location hole used in secondary drilling is symmetrical, and plate is made directly to turn over, you can realizes processing.
But the process of this positive countercharge deep drilling, there are larger quality defect (see Fig. 2)：One, positive and negative to bore twice
The offset of hole overlapping position is unable to control within 25 microns, is led to hole extra coarse mark, be cannot be satisfied IPC grade III Standards；Two, pass
Intermediate Aligning degree difference causes pass abnormal, and micropore can be made uneven in the easy upper copper of metallization processes, lead to hole copper resistance
Value is abnormal, seriously affects the integrality of signal transmission.
Invention content
For this purpose, brill processing method is chiseled the purpose of the present invention is to provide a kind of superelevation radius-thickness ratio micropore, to solve twice
The offset problem for the overlapping position that drills, the integrality in the aperture of guarantee realize the PCB product drilling processing of superelevation radius-thickness ratio.
The purpose of the present invention is what is be achieved through the following technical solutions.
A kind of superelevation radius-thickness ratio micropore chisels brill processing method, including：
Select the brill nozzle that suitable sword is grown to superelevation radius-thickness ratio pcb board part by the way of chiseling brill substep and being cut and return knife
Drill pcb board via hole.
Further, the sword length for boring nozzle blade is more than the superelevation radius-thickness ratio pcb board thickness 0.8mm~1.2mm.
Further, the pcb board via hole that drilled by the way of chiseling brill includes before：
Superelevation radius-thickness ratio pcb board part is fixed on by shop bolt on drill bench face；
The brill nozzle that suitable sword is grown is installed on drill spindle, superelevation radius-thickness ratio pcb board part is carried out chiseling brill, it is super to drill
High thickness to diameter ratio pcb board part forms via hole.
Further, it is described superelevation radius-thickness ratio pcb board part is carried out chiseling brill include：
First, control cuts depth and is cut for the 1/4 of superelevation radius-thickness ratio pcb board thickness for the first time, then controls
Time knife depth carries out back knife for the 1/8 of superelevation radius-thickness ratio pcb board thickness for the first time；
Secondly, control cuts depth and is cut for the 1/4 of superelevation radius-thickness ratio pcb board thickness for the second time, then controls
Second time knife depth carries out back knife for the 1/8 of superelevation radius-thickness ratio pcb board thickness；
Then, control third time cuts depth and is cut for the 1/4 of superelevation radius-thickness ratio pcb board thickness, then controls
Third time goes back to 1/8 that knife depth is superelevation radius-thickness ratio pcb board thickness and carries out back knife；
Finally, it controls and cuts depth for the 4th time to be that the superelevation radius-thickness ratio pcb board is thick 1/4 cut, by superelevation thickness
Diameter is drilled than pcb board part, forms pcb board via hole.
A kind of superelevation radius-thickness ratio micropore chisels brill processing method, including：First, superelevation radius-thickness ratio pcb board part is fixed and is pacified
On work top, control drill spindle is cut downwards for the first time, and it is a that the first time, which cuts depth, when downward from plate face
When drilling depth reaches a, start to return knife for the first time at this time, it is b to return knife distance for the first time；Later knife top position is returned in first time
It cuts for the second time downwards, it is c to cut depth for the second time, when downhole depth reaches c, starts second time knife, for the second time
It is d to return knife distance；Then it is cut for the third time downwards in second time knife top position, it is e to cut depth for the third time, is bored when downward
When hole depth reaches e, starts third time and return knife, it is f that third time, which returns knife distance,；Finally, downward in third time time knife top position
It cuts for 4th time, it is g that the 4th time, which cuts depth, and drills pcb board part after cutting depth g at the 4th time, forms pcb board and leads
Through-hole.
Further, the superelevation radius-thickness ratio pcb board thickness is h, and wherein a, c, e, g is superelevation radius-thickness ratio pcb board thickness h
1/4；B, d, f are the 1/8 of superelevation radius-thickness ratio pcb board thickness h.
Superelevation radius-thickness ratio micropore provided by the invention chisels brill processing method, and the PCB product of superelevation radius-thickness ratio may be implemented
Drilling processing.Compared with existing positive and negative brill technology, the present invention can effectively solve the problem that the offset problem for the overlapping position that drills twice,
To ensure that the integrality in aperture, realizing can ensure that copper is uniform on hole wall in hole metallization process, while ensure production
The integrality of product signal transmission.
Description of the drawings
Fig. 1 is the structural schematic diagram of existing positive countercharge deep drilling technique；
Fig. 2 is the sectional view of the tow sides boring aperture of existing positive countercharge deep drilling technique；
Fig. 3 is that the present invention chisels the structural schematic diagram for boring processing method；
Fig. 4 is cut when chiseling brill processing method drilling for the present invention and withdrawing track schematic diagram.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It please refers to shown in Fig. 3, Fig. 3 is that the present invention chisels the structural schematic diagram for boring processing method.The device that the present invention uses for
Conventional drilling equipment comprising drill spindle 1 and the drill bench face 3 immediately below drill spindle 1.
It needs the superelevation radius-thickness ratio pcb board 2 to drill to process shop bolt 6 by pcb board part and is fixed on drill bench face 3
On.Drill bench face 3 is the work top of drilling device, plays carrying pcb board elaboration.The main work of shop bolt 6
With being that pcb board part is fixed on drill bench face, ensure that process, plate will not deviate.
The lower end of drill spindle 1, which is equipped with, bores nozzle 4, the brill nozzle that nozzle 4 is suitable sword length is bored in the present embodiment, due to superelevation thickness
Diameter is more than 1~1.5 times of routine PCB edge lengths than pcb board thickness, cannot achieve and drills using conventional brill nozzle, therefore is using
When chiseling the making of driller's skill, used brill nozzle is that nozzle is bored in lengthening, and brill nozzle blade sword, which is grown, is more than superelevation radius-thickness ratio pcb board thickness, than
The thickness of superelevation radius-thickness ratio pcb board grows 0.8~1.2mm.
Drill spindle 1 is the core component of drilling device, passes through the brill nozzle of main shaft motor internal transmission main shaft bottom collet
4, so that brill nozzle 4 is formed the cutting device to run at high speed, in the case where coordinating major axis X Y-axis to move to form terminal-velocity, to pcb board part
It cuts for the via hole 5 with brill nozzle same diameter.
The present embodiment drills the mode of pcb board via hole 5 using chiseling, and according to the overall thickness of plate, substep carries out
It cuts, return knife, until plate is completely penetrated through.
As shown in figure 4, Fig. 4 is cut when chiseling brill processing method drilling for the present invention and withdrawing track schematic diagram.
The thickness of superelevation radius-thickness ratio pcb board part is set in the present embodiment as h, then bore nozzle blade sword length than h long 0.8~
1.2mm。
It is of the present invention chisel bore processing method specifically include：
First, superelevation radius-thickness ratio pcb board part is fixedly mounted on work top, then controls drill spindle downward first
Secondary to cut, it is a (a is the 1/4 of superelevation radius-thickness ratio pcb board thickness h) to cut depth for the first time, is reached when from plate face downhole depth
When a, start to return knife for the first time at this time, it is b (b is the 1/2 of a) to return knife distance for the first time, in order to the scrap generated when will drill
It can smoothly take out of；
It returns knife top position in first time later to cut for the second time downwards, it is that (c is superelevation thickness diameter to c to cut depth for the second time
The 1/4 of h thicker than pcb board, identical as a), when downhole depth reaches c, start second time knife, second time knife distance
For d (d is the 1/2 of c, identical as b), the scrap generated when in order to by drilling can smoothly be taken out of；
Then it is cut for the third time downwards in second time knife top position, it is that (e is superelevation thickness diameter to e to cut depth for the third time
The 1/4 of h thicker than pcb board, with a c it is identical), when downhole depth reaches e, start third time return knife, third time return knife away from
From for f (f is the 1/2 of e, with b d it is identical), in order to which the scrap that generates when drilling can smoothly be taken out of；
Finally, it returns knife top position in third time to cut for downward 4th time, it is that (g is superelevation thickness diameter to g that the 4th time, which cuts depth,
The 1/4 of h thicker than pcb board, identical as a c e), and finally drill pcb board part, form pcb board via hole.
It should be noted that after cutting drilling a certain distance downwards every time, it is necessary to upwards according to cutting the one of distance
Half carries out withdrawing, then repeats the above steps, the scrap of formation can be discharged for withdrawing each time, and can ensure simultaneously
A part for nozzle is bored positioned at being formed by drilling, this also not only can guarantee to be not in each drilling not correspondence problem, but also can
It prevents disposal pore-forming and damages the problem of boring nozzle.
In conclusion the present invention, which in drilling process, uses substep, chisels drill method, multistep is cut, returns knife,
Therefore it can effectively alleviate the bad problem of going down process chip removal, greatly reduce the breaking probability of process.And this
Invention substep chisels driller's process, additionally it is possible to and ensure extraordinary pass, compares existing positive and negative driller's process, it can be thorough
Solve various defects existing for positive and negative driller's process.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement etc., should all be included in the protection scope of the present invention made by within refreshing and principle.
Claims (6)
1. a kind of superelevation radius-thickness ratio micropore chisels brill processing method, which is characterized in that including：
Select the brills nozzle of suitable sword length to superelevation radius-thickness ratio pcb board part using chisel brill cut step by step and time knife by the way of drill
Pcb board via hole.
2. superelevation radius-thickness ratio micropore as described in right wants 1 chisels brill processing method, which is characterized in that the sword for boring nozzle blade
It is long to be more than the superelevation radius-thickness ratio pcb board thickness 0.8mm~1.2mm.
3. superelevation radius-thickness ratio micropore as described in right wants 2 chisels brill processing method, which is characterized in that described using the side for chiseling brill
Formula drills pcb board via hole：
Superelevation radius-thickness ratio pcb board part is fixed on by shop bolt on drill bench face；
The brill nozzle that suitable sword is grown is installed on drill spindle, superelevation radius-thickness ratio pcb board part is carried out chiseling brill, to drill superelevation thickness
Diameter forms via hole than pcb board part.
4. superelevation radius-thickness ratio micropore as described in right wants 3 chisels brill processing method, which is characterized in that described to superelevation radius-thickness ratio
Pcb board part carries out chiseling brill：
First, control cuts depth and is cut for the 1/4 of superelevation radius-thickness ratio pcb board thickness for the first time, then controls first
Secondary time knife depth carries out back knife for the 1/8 of superelevation radius-thickness ratio pcb board thickness；
Secondly, control cuts depth and is cut for the 1/4 of superelevation radius-thickness ratio pcb board thickness for the second time, then controls second
Secondary time knife depth carries out back knife for the 1/8 of superelevation radius-thickness ratio pcb board thickness；
Then, control third time cuts depth and is cut for the 1/4 of superelevation radius-thickness ratio pcb board thickness, then controls third
Secondary time knife depth carries out back knife for the 1/8 of superelevation radius-thickness ratio pcb board thickness；
Finally, it controls and cuts depth for the 4th time to be that the superelevation radius-thickness ratio pcb board is thick 1/4 cut, by superelevation radius-thickness ratio
Pcb board part drills, and forms pcb board via hole.
5. a kind of superelevation radius-thickness ratio micropore chisels brill processing method, which is characterized in that including：First, by superelevation radius-thickness ratio pcb board
Part is fixedly mounted on work top, control drill spindle cut for the first time downwards, the first time cut depth be a, when from
When plate face downhole depth reaches a, start to return knife for the first time at this time, it is b to return knife distance for the first time；Later knife is returned in first time
Top position is cut downwards for the second time, and it is c to cut depth for the second time, when downhole depth reaches c, is started second time
Knife, second time knife distance is d；Then it is cut for the third time downwards in second time knife top position, cutting depth for the third time is
E starts third time and returns knife, it is f that third time, which returns knife distance, when downhole depth reaches e；Finally, knife top is gone back in third time
Portion position is cut for downward 4th time, and it is g that the 4th time, which cuts depth, and drills pcb board part after cutting depth g at the 4th time,
Form pcb board via hole.
6. superelevation radius-thickness ratio micropore as claimed in claim 5 chisels brill processing method, which is characterized in that the superelevation radius-thickness ratio
Pcb board thickness is h, and wherein a, c, e, g is the 1/4 of superelevation radius-thickness ratio pcb board thickness h；B, d, f are superelevation radius-thickness ratio pcb board thickness h
1/8.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191581A (en) * | 2019-04-18 | 2019-08-30 | 奥士康精密电路（惠州）有限公司 | A method of prevent ink plug-hole PCB from scrapping |
| CN112170879A (en) * | 2019-07-01 | 2021-01-05 | 维嘉数控科技（苏州）有限公司 | Thick plate segmented drilling method and drilling machine |
| CN112752445A (en) * | 2020-12-15 | 2021-05-04 | 胜宏科技（惠州）股份有限公司 | Drilling method of circuit board with high aspect ratio |
| CN112752404A (en) * | 2020-11-09 | 2021-05-04 | 奥士康科技股份有限公司 | Manufacturing method of high-aspect-ratio step back drill |
| CN113438812A (en) * | 2021-06-15 | 2021-09-24 | 江西景旺精密电路有限公司 | Processing method for forming multiple parallel overlong grooves of PCB |
| CN114682814A (en) * | 2020-12-29 | 2022-07-01 | 博世华域转向系统有限公司 | Drilling process for steering column input shaft |
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| CN102984892A (en) * | 2012-11-15 | 2013-03-20 | 华为机器有限公司 | Hole metallization method of circuit board with high thickness-to-radius ratio, circuit board and electronic product |
| CN103249253A (en) * | 2013-05-17 | 2013-08-14 | 梅州华盛电路板有限公司 | High precision aluminium base material circuit board manufacturing process and system |
| CN105772796A (en) * | 2016-03-31 | 2016-07-20 | 东莞市连威电子有限公司 | Micro-diameter through hole machining technology |
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| JPH01258487A (en) * | 1987-11-10 | 1989-10-16 | General Electric Co <Ge> | Supporter of drill vsed for drilling small diameter hole in circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191581A (en) * | 2019-04-18 | 2019-08-30 | 奥士康精密电路（惠州）有限公司 | A method of prevent ink plug-hole PCB from scrapping |
| CN112170879A (en) * | 2019-07-01 | 2021-01-05 | 维嘉数控科技（苏州）有限公司 | Thick plate segmented drilling method and drilling machine |
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| CN112752404A (en) * | 2020-11-09 | 2021-05-04 | 奥士康科技股份有限公司 | Manufacturing method of high-aspect-ratio step back drill |
| CN112752445A (en) * | 2020-12-15 | 2021-05-04 | 胜宏科技（惠州）股份有限公司 | Drilling method of circuit board with high aspect ratio |
| CN112752445B (en) * | 2020-12-15 | 2022-04-15 | 胜宏科技（惠州）股份有限公司 | Drilling method of circuit board with high aspect ratio |
| CN114682814A (en) * | 2020-12-29 | 2022-07-01 | 博世华域转向系统有限公司 | Drilling process for steering column input shaft |
| CN113438812A (en) * | 2021-06-15 | 2021-09-24 | 江西景旺精密电路有限公司 | Processing method for forming multiple parallel overlong grooves of PCB |
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