CN112170879A - Thick plate segmented drilling method and drilling machine - Google Patents
Thick plate segmented drilling method and drilling machine Download PDFInfo
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- CN112170879A CN112170879A CN201910586147.6A CN201910586147A CN112170879A CN 112170879 A CN112170879 A CN 112170879A CN 201910586147 A CN201910586147 A CN 201910586147A CN 112170879 A CN112170879 A CN 112170879A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
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Abstract
The invention belongs to the technical field of thick plate drilling, and discloses a thick plate subsection drilling method and a drilling machine, wherein the thick plate drilling method comprises the following steps: step 1: drilling the cutter into the plate for a certain distance at a first rotating speed, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time; step 2: gradually increasing the drilling speed of the cutter while the cutter drills into the plate until the set drilling speed is reached, continuously drilling the cutter into the plate for a certain distance, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time; and (5) circulating the step 2 until the cutter is drilled down to the final depth. The smoothness of the hole wall is ensured by not carrying out tool return in each subsection; by gradually increasing the drilling speed while drilling into the plate, the speed of the cutter for re-feeding and accelerating in the plate is lower, the axial force impact on the cutter when cutting into the plate can be reduced, and the cutter breakage is avoided. The method can realize less segmented processing, not only is not easy to generate broken cutters, but also can achieve the effect of greatly improving the processing efficiency.
Description
Technical Field
The invention relates to the technical field of thick plate drilling, in particular to a thick plate subsection drilling method and a drilling machine.
Background
In the PCB industry, communication boards, radar boards and special boards, such as military boards, have the characteristics of a large number of lamination layers, thick copper foil, high hardness of board substrates, thick total thickness of finished boards and the like.
The difficulties mainly encountered in the current processing of thick plate segmentation are as follows: the cutter is not allowed to be broken or individually not taken out, because the plate is thick, once the cutter is broken in the plate, the cutter can not be taken out and is plugged in the hole, so that the circuit of the whole plate is failed, and the scrap is caused.
Therefore, the number of segments to be drilled is also an important consideration. If the number of the segments is too small, for example, three segments are formed, although the processing efficiency is high, the cutter breakage is serious, and the rejection rate is high. If the segmentation is too much, although the broken cutters are obviously reduced, the efficiency is greatly reduced, and when the segmentation times are more, the drilling stroke is short every time, the drilling times are more, the reciprocating motion of the motor is frequent, the heat generated by the motor is large, and the machining efficiency is low. Therefore, in the current stage of machining, generally, the number of times of segmentation is reduced as much as possible to perform machining on the premise of ensuring the yield without cutting, but the number of times of segmentation is still relatively large, which affects the machining efficiency.
Disclosure of Invention
The invention aims to provide a thick plate subsection drilling method which can improve drilling efficiency and avoid cutter breakage.
In order to achieve the purpose, the invention adopts the following technical scheme:
a thick plate subsection drilling method comprises the following steps:
step 1: drilling the cutter into the plate for a certain distance at a first rotating speed, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time;
step 2: gradually increasing the drilling speed of the cutter while the cutter drills into the plate until the set drilling speed is reached, continuously drilling the cutter into the plate for a certain distance, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time;
and (5) circulating the step 2 until the cutter is drilled down to the final depth.
Preferably, the distance each section of the tool is drilled down is the same.
Preferably, the distance of the next section of the drill bit is smaller than the distance of the previous section of the drill bit.
Preferably, in step 2, before the tool drills into the plate material, the method further comprises:
and reducing the rotating speed of the cutter to a second rotating speed.
Preferably, in step 2, the tool is gradually increased to the first rotation speed while the tool is drilling into the sheet material.
Preferably, the second rotation speed is 50% to 70% of the first rotation speed.
Preferably, after the cutter drills down for a certain distance, the time for keeping the position of the cutter and maintaining the first rotating speed is the same.
Preferably, after the tool is lowered for a certain distance, the time for maintaining the current position and the first rotation speed is gradually increased.
Preferably, the method further comprises completely withdrawing the plate after the cutter is drilled down to the final depth.
An object of the present invention is to provide a drilling machine capable of improving drilling efficiency and preventing a cutter from being broken.
In order to achieve the purpose, the invention adopts the following technical scheme:
a drilling machine employing the thick plate sectional drilling method as described above.
The invention has the beneficial effects that:
the invention provides a thick plate subsection drilling method, which comprises the following steps: step 1: drilling the cutter into the plate for a certain distance at a first rotating speed, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time; step 2: gradually increasing the drilling speed of the cutter while the cutter drills into the plate until the set drilling speed is reached, continuously drilling the cutter into the plate for a certain distance, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time; and (5) circulating the step 2 until the cutter is drilled down to the final depth. The smoothness of the hole wall is ensured by not carrying out tool return in each subsection; by gradually increasing the drilling speed while drilling into the plate, the speed of the cutter for re-feeding and accelerating in the plate is lower, the axial force impact on the cutter when cutting into the plate can be reduced, and the cutter breakage is avoided. The thick plate subsection drilling method can realize few subsection processing, not only is not easy to generate broken cutters, but also can achieve the effect of greatly improving the processing efficiency.
Drawings
FIG. 1 is a schematic structural diagram of the position of a tool at multiple moments according to the sectional thick plate drilling method provided by the present invention;
FIG. 2 is a graph of the relationship between the drilling distance and the time in the slab section drilling method provided by the present invention.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The embodiment provides a thick plate subsection drilling method, which comprises the following steps:
step 1: drilling the cutter into the plate for a certain distance at a first rotating speed, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time;
step 2:
reducing the rotating speed of the cutter to a second rotating speed;
gradually increasing the drilling speed of the cutter until the drilling speed reaches a set drilling speed while the cutter drills into the plate, gradually increasing the rotating speed of the cutter to a first rotating speed, continuously drilling the cutter into the plate for a certain distance, keeping the position of the cutter and maintaining the first rotating speed for a certain time;
and (5) circulating the step 2 until the cutter is drilled down to the final depth.
And after the cutter drills down to the final depth, the plate is completely withdrawn.
As shown in fig. 1 and 2, the present embodiment is processed in three stages, and the sectional drilling method of the slab will be described in detail. In the time period of 0-t 1, the cutter drills into the plate at a first rotating speed, the drilling speed is kept at a set speed at the moment, and the drilling depth is d 1; in the time period from t1 to t2, the cutter is kept at the depth of d1 at the first rotating speed; in the time period from t2 to t3, the rotating speed of the cutter is reduced from the first rotating speed to the second rotating speed; in the time period from t3 to t4, the rotating speed of the cutter is gradually increased from the second rotating speed to the first rotating speed, meanwhile, the cutter continues to drill into the plate, the drilling speed is gradually increased from zero to the set drilling speed, and the plate is drilled to the depth d 2; in the time period from t4 to t5, the cutter is kept at the depth of d2 at the first rotating speed; in the time period from t5 to t6, the rotating speed of the cutter is reduced from the first rotating speed to the second rotating speed; in the time period from t6 to t7, the rotating speed of the cutter is gradually increased from the second rotating speed to the first rotating speed, the drilling speed is gradually increased from zero to the set drilling speed, and meanwhile, the cutter continues to drill into the plate to the depth d 3; in the time period from t7 to t8, the cutter is kept at the depth of d3 at the first rotating speed; after time t8, the knife is withdrawn from the sheet.
Wherein, in the time interval of 0-t 1, the cutter drills into the plate in a normal drilling mode; and in the time periods of t 1-t 2, t 3-t 4 and t 5-t 6, the cutter is kept at the corresponding depth, the cutter is not turned back, the smoothness of the hole wall can be ensured, and the first rotating speed is kept unchanged and is used for finishing chip removal and cutter cooling.
Because when drilling down for the first time, the panel top is covered with aluminum plate usually, ensure that the face flattens, the material of aluminium is softer, there is certain buffering when can help the cutting edge contact, help chip removal and heat dissipation, and from the second time of drilling down, the cutter if directly cut into panel with the speed of drilling down and the first rotational speed of setting for, the hardness of panel is higher, simultaneously in order to keep invariable cut-in speed, the impact can lead to cutter axial atress sudden change in the twinkling of an eye of the interior material of cutter contact plate, slight can lead to the cutter to produce little deformation, produce the error of drilling precision, serious cutter can't bear the impact and cut off in panel. Therefore, referring to fig. 2, after each section of drilling and chip removal is completed and before the next section of drilling, such as the time period from t2 to t3, the time period from t4 to t5 and the time period from t6 to t7, the rotating speed of the cutter is reduced from the first rotating speed to the second rotating speed, so that the speed of next feed acceleration of the cutter in the plate can be reduced, the impact of the axial force applied when the cutter cuts into the plate is reduced, and the cutter breakage is avoided. Through the arrangement of slowing and accelerating, the speed of cutting the cutter into the plate is reduced from slow to block, the cutter is gradually stressed, sudden change is avoided, and the probability of cutter deformation and cutter breakage is reduced.
The second rotating speed is 50% -70% of the first rotating speed. For example, the second rotational speed is 50%, 55%, 60%, 65%, 70% of the first rotational speed, and in this range, the tool receives a small axial impact force every time it cuts into the plate material at the second rotational speed, and at the same time, a constant cutting speed is ensured, and drilling can be performed efficiently.
In this embodiment, the distance of drilling down each section of the tool may be the same. Before drilling, the drilling stroke of the cutter is segmented according to the required drilling depth, and the distances of a plurality of segments can be the same, namely d 1-0-d 2-d 1-d 3-d 2.
The distance each section of the tool is drilled down may also be different. Because the cutter is influenced by factors such as hole depth, plate thickness and the like when drilling, the loads applied to the cutter at different depths are different. Generally, the deeper the tool is drilled, the greater the load it is subjected to, and the more likely the tool will break, so that the distance a subsequent section of the tool is drilled is less than the distance a previous section is drilled.
In this embodiment, after the tool drills down for a certain distance each time, the time for keeping the position of the tool and maintaining the first rotating speed may be the same.
The time for holding the position of the tool and maintaining the first rotational speed after each drill-down of the tool for a certain distance may also be different. Because the cutter is influenced by the hole depth when drilling into a deeper hole, the heat dissipation and chip removal of the cutter are slow, and therefore, after the cutter drills down for a certain distance each time, the time for keeping the current position and maintaining the first rotating speed is gradually increased. By increasing the time one by one, the cutter can be guaranteed to radiate heat effectively and remove chips effectively.
According to the thick plate subsection drilling method, the smooth finish of the hole wall is ensured by not carrying out tool returning in each subsection, and chip removal and tool cooling are completed by keeping the position of the tool and maintaining the first rotating speed for a period of time; the speed of the cutter for re-feeding and accelerating in the plate is reduced by reducing the rotating speed of the cutter to the second rotating speed, the impact of the axial force applied when the cutter cuts into the plate is reduced, and the cutter breakage is avoided. The thick plate subsection drilling method can realize few subsection processing, not only is not easy to generate broken cutters, but also can achieve the effect of greatly improving the processing efficiency.
Another object of the present invention is to provide a drilling machine, which can improve the drilling efficiency and avoid the breakage of the tool by using the above thick plate subsection drilling method.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A thick plate subsection drilling method is characterized by comprising the following steps:
step 1: drilling the cutter into the plate for a certain distance at a first rotating speed, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time;
step 2: gradually increasing the drilling speed of the cutter while the cutter drills into the plate until the set drilling speed is reached, continuously drilling the cutter into the plate for a certain distance, keeping the position of the cutter and maintaining the first rotating speed for a certain period of time;
and (5) circulating the step 2 until the cutter is drilled down to the final depth.
2. The method of claim 1 wherein the cutter drills each section down the same distance.
3. The method of claim 1, wherein the distance of the subsequent drill down of the tool is less than the distance of the previous drill down of the plank.
4. The method of claim 1, wherein the step 2 of drilling the slab with the tool further comprises:
and reducing the rotating speed of the cutter to a second rotating speed.
5. The method of claim 4, wherein the rotational speed of the tool is gradually increased to the first rotational speed while the tool is driven into the slab in the step 2.
6. The slab segment drilling method according to claim 1, wherein the second rotation speed is 50 to 70% of the first rotation speed.
7. The method of claim 1, wherein the time for maintaining the position of the tool and the first rotational speed is the same after each down-drilling of the tool for a certain distance.
8. The method for drilling a thick plate by sections according to claim 1, wherein the time for keeping the current position and maintaining the first rotation speed is gradually increased after the cutter drills down a certain distance each time.
9. The method of claim 1 further comprising completely withdrawing the plank after the tool is run down to a final depth.
10. A drill, characterized in that it employs the slab segment drilling method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910586147.6A CN112170879B (en) | 2019-07-01 | 2019-07-01 | Thick plate segmented drilling method and drilling machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910586147.6A CN112170879B (en) | 2019-07-01 | 2019-07-01 | Thick plate segmented drilling method and drilling machine |
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| CN112170879A true CN112170879A (en) | 2021-01-05 |
| CN112170879B CN112170879B (en) | 2021-10-26 |
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| JP2005026549A (en) * | 2003-07-04 | 2005-01-27 | Hitachi Chem Co Ltd | Manufacturing method of high-speed signal stubless through-hole multilayer printed wiring board, and multilayer printed wiring board |
| CN102294499A (en) * | 2011-07-19 | 2011-12-28 | 深圳市大族激光科技股份有限公司 | Drilling processing method of PCB board drilling machine |
| CN106944647A (en) * | 2017-04-19 | 2017-07-14 | 广东工业大学 | A kind of high multi-layer PCB board deep hole drilling method |
| CN108541145A (en) * | 2018-04-16 | 2018-09-14 | 生益电子股份有限公司 | A kind of method to drill on PCB |
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| CN109922603A (en) * | 2019-04-18 | 2019-06-21 | 生益电子股份有限公司 | A kind of boring method of PCB |
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2019
- 2019-07-01 CN CN201910586147.6A patent/CN112170879B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1500234A (en) * | 2001-01-09 | 2004-05-26 | Զ���� | Incremental setp drilling system and method |
| JP2005026549A (en) * | 2003-07-04 | 2005-01-27 | Hitachi Chem Co Ltd | Manufacturing method of high-speed signal stubless through-hole multilayer printed wiring board, and multilayer printed wiring board |
| CN102294499A (en) * | 2011-07-19 | 2011-12-28 | 深圳市大族激光科技股份有限公司 | Drilling processing method of PCB board drilling machine |
| CN106944647A (en) * | 2017-04-19 | 2017-07-14 | 广东工业大学 | A kind of high multi-layer PCB board deep hole drilling method |
| CN109561583A (en) * | 2017-09-27 | 2019-04-02 | 深圳市博敏电子有限公司 | A kind of multi-layer PCB board efficient drilling method |
| CN108541145A (en) * | 2018-04-16 | 2018-09-14 | 生益电子股份有限公司 | A kind of method to drill on PCB |
| CN108601226A (en) * | 2018-04-25 | 2018-09-28 | 星河电路（福建）有限公司 | A kind of superelevation radius-thickness ratio micropore chisels brill processing method |
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| CN109922603A (en) * | 2019-04-18 | 2019-06-21 | 生益电子股份有限公司 | A kind of boring method of PCB |
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| CN112170879B (en) | 2021-10-26 |
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Address after: 215000 No.188 Chuangyuan Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Applicant after: Suzhou Weijia Technology Co.,Ltd. Address before: 215000 No.188 Chuangyuan Road, Suzhou Industrial Park, Suzhou City, Jiangsu Province Applicant before: VEGA CNC TECHNOLOGY (SUZHOU) Co.,Ltd. |
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