CN112888181A - Production method of copper-embedded mixed-compression circuit board based on PVC material - Google Patents
Production method of copper-embedded mixed-compression circuit board based on PVC material Download PDFInfo
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- CN112888181A CN112888181A CN202011233606.1A CN202011233606A CN112888181A CN 112888181 A CN112888181 A CN 112888181A CN 202011233606 A CN202011233606 A CN 202011233606A CN 112888181 A CN112888181 A CN 112888181A
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- Prior art keywords
- circuit board
- copper
- pvc
- copper block
- embedded
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a production method of a copper-embedded mixed-compression circuit board based on a PVC material, belonging to the field of circuit board production and comprising the following steps: the invention aims to provide a production method of a copper-embedded mixed-compression circuit board based on a PVC material, which is characterized by embedding a copper block into the PVC material circuit board and utilizing the insulativity of the PVC material to insulate the copper blocks from each other. When guaranteeing printed circuit board reliability, on the other hand, because set up and work in the controllable environment of temperature at PVC material circuit board surface electronic component, improve the reliability of component, avoid the impaired poor and the limited defect of life-span of stability that brings of electronic component, improve the holistic job stabilization nature of printed circuit board, prolong its life.
Description
Technical Field
The invention belongs to the technical field of circuit board production, and particularly relates to a production method of a copper-embedded mixed-voltage circuit board based on a PVC material.
Background
The PVC material is polyvinyl chloride which is yellowish, semitransparent and glossy. The transparency is better than that of polyethylene and polypropylene, is different from that of polystyrene, is divided into soft and hard polyvinyl chloride according to different using amounts of additives, soft products are soft and tough and have sticky hand feeling, the hardness of hard products is higher than that of low-density polyethylene and lower than that of polypropylene, whitening phenomenon can occur at the bending part, surface resistance value is 8-th-power ohm of 6-10, and the anti-static performance is excellent, and the anti-impact and chemical solvent resistance performance is outstanding; the appearance is beautiful, and is very flat and smooth; the light transmittance is more than 73%, the PVC is a high polymer material which uses a chlorine atom to replace a hydrogen atom in polyethylene, and the PVC has excellent antistatic function, so that the PVC is favorable for being used on a circuit, and the damage of elements of the circuit caused by static electricity is reduced.
With the smaller and smaller size of electronic products, the size of printed circuit boards is also continuously reduced, and the circuit design is more and more intensive. Therefore, the anti-static function of the circuit board made of the PVC material can well solve the problem, because the power density of components is improved, the explosion event of a certain known mobile phone battery improves the alertness of designers and manufacturers, a plurality of ways are provided for solving the heat dissipation problem of the PCB at present, a metal copper block is directly embedded in the PCB, and the method is one of effective ways for solving the heat dissipation problem, but the problems of insufficient bonding force between the copper block and a substrate, poor heat resistance, difficult removal of glue overflow, low qualified rate of products and the like exist in the existing manufacturing process, the application and popularization of the technical result of the PCB embedded with the copper block are limited, and therefore the prior art needs further research and improvement.
Disclosure of Invention
The invention aims to provide a production method of a copper-embedded mixed-compression circuit board based on a PVC material, which is characterized in that a copper block is embedded into the PVC material circuit board, and the copper blocks can be mutually insulated by utilizing the insulativity of the PVC material, because electronic elements arranged on the surface of the PVC material circuit board work in a temperature-controllable environment, the reliability of the elements is improved, the defects of poor stability and limited service life caused by damage of the electronic elements are avoided, the working stability of the whole printed circuit board is improved, the service life of the printed circuit board is prolonged, and the problems in the background technology are conveniently solved.
In order to achieve the purpose, the invention adopts the following technical scheme: a production method of a copper-embedded mixed-compression circuit board based on a PVC material comprises the following steps:
s1, cutting, namely cutting the PVC circuit board to be embedded with copper into the required size by a cutting machine, wherein the number of the PVC circuit boards is preferably the same as the required processing amount on the same day, and simultaneously cutting the embedded copper block and keeping the cut copper block in a dust-free environment;
s2, milling a board on the inner layer, namely slotting the inner part of the PVC circuit board in a slotting mode, wherein the size of the slot is 0.009mm larger than that of a single side of a copper block, and the side face of the slot depth and the bottom face form an included angle of 90 degrees;
s3, laminating, namely laminating the copper block in a groove of the PVC circuit board, placing the copper block in an auxiliary manner by adopting an auxiliary tool, and performing brown oxidation treatment on the exposed copper block, wherein in the process of brown oxidation treatment, attention needs to be paid to whether a copper leakage phenomenon exists or not;
s4, carrying out plate grinding treatment, namely grinding resin around the copper block on the PVC circuit board to the full extent, and controlling the thickness of the copper block to be 0.1 mm;
s5, punching, namely punching the PVC circuit board and connecting the PVC circuit board with the embedded copper block;
s6, performing laser drilling treatment, namely burning off the resin in the hole diameter by adopting a laser drilling mode to enable the copper block to leak out;
and S7, detecting a finished product, namely detecting the processed PVC circuit board to judge whether the product meets the requirement of the finished product.
Preferably, the PVC circuit board in S1 is a multilayer core board, and the middle portion is a 2-layer sandwich core board, and the arrangement is performed by copper etching.
Preferably, the copper block in S3 is required to be upward during the lamination process.
Preferably, the laser drilling and resin burning process in S6 ensures that no void, crack, delamination, etc. exist in the gap between the copper block and the plate.
Preferably, in the process of embedding the copper block in S3, the milling cutter is controlled to press the entire surface of the copper sheet downward without rotating speed, the pressure applied to the entire surface is 0.2MPa to 0.5MPa, and the time from the end of the milling cutter contacting the copper sheet to the time when the copper sheet is completely embedded in the circuit board is controlled to be not more than 4 seconds.
Preferably, in S2, when the PVC circuit board is cut, the cutting platform needs to be inspected for the presence of foreign matter, and if so, the cutting platform needs to be cleaned.
Preferably, in the process of drilling the PVC circuit board in S6, it is required to note whether the drilling position is accurate, so as to avoid damaging the copper block in the PVC circuit board.
Compared with the prior art, the production method of the copper-embedded mixed-compression circuit board based on the PVC material has the beneficial effects that:
in the circuit board manufacturing process, the copper blocks are embedded into the PVC circuit board, and the copper blocks can be mutually insulated by utilizing the insulativity of the PVC material. When guaranteeing printed circuit board reliability, on the other hand, because set up and work in the controllable environment of temperature at PVC material circuit board surface electronic component, improve the reliability of component, avoid the impaired stability that brings of electronic component not good and the limited shortcoming of life-span, improve the holistic job stabilization nature of printed circuit board, prolong its life.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. The embodiments described herein
Example 1
The invention provides a production method of a copper-embedded mixed-compression circuit board based on a PVC material, which comprises the following steps:
s1, cutting, namely cutting the PVC circuit board to be embedded with copper into the required size by a cutting machine, wherein the number of the PVC circuit boards is preferably the same as the required processing amount in the same day, simultaneously cutting the embedded copper block, and enabling the cut copper block to be in a dust-free environment, wherein the PVC circuit board is a multilayer core board, the middle part of the PVC circuit board is a 2-layer interlayer core board, and the PVC circuit board is arranged in a copper etching manner;
s2, milling the inner layer, namely slotting the inner part of the PVC circuit board in a slotting mode by the PVC circuit board, wherein the size of the slot is 0.009mm larger than the size of the single side of the copper block, and the side surface of the slot depth and the bottom surface form a vertical 90-degree included angle;
s3, laminating, namely laminating a copper block in a groove of a PVC circuit board, placing the copper block in an auxiliary manner by adopting an auxiliary tool, performing brown oxidation treatment on the exposed copper block, wherein in the process of brown oxidation treatment, whether a copper leakage phenomenon exists needs to be noticed, the copper block is required to be upward in the laminating process, in the process of embedding the copper block, a milling cutter is controlled to press the whole surface of a copper sheet downwards without rotating speed, the pressure applied to the whole surface of the copper sheet is 0.2-0.5 MPa, and the time from the end part of the milling cutter contacting the copper sheet to the time from the end part of the copper sheet being completely embedded into the circuit board is controlled not;
s4, carrying out plate grinding treatment, namely grinding resin around the copper block on the PVC circuit board to the full extent, and controlling the thickness of the copper block to be 0.1 mm;
s5, punching, namely punching the PVC circuit board and connecting the PVC circuit board with the embedded copper block;
s6, performing laser drilling treatment, namely burning off resin in the hole diameter by adopting a laser drilling mode to enable the copper block to leak out, ensuring that no holes, cracks, layering and the like exist in gaps between the copper block and a board in the resin burning process of laser drilling, and paying attention to whether the drilling position is accurate or not in the drilling treatment process of the PVC circuit board to avoid damaging the copper block in the PVC circuit board;
and S7, detecting a finished product, namely detecting the processed PVC circuit board to judge whether the product meets the requirement of the finished product.
Example 2
The invention provides a production method of a copper-embedded mixed-compression circuit board based on a PVC material, which further comprises the following steps:
s1, cutting, namely cutting the PVC circuit board to be embedded with copper into the required size by a cutting machine, wherein the number of the PVC circuit boards is preferably the same as the required processing amount in the same day, simultaneously cutting the embedded copper block, and enabling the cut copper block to be in a dust-free environment, wherein the PVC circuit board is a multilayer core board, the middle part of the PVC circuit board is 4 layers of interlayer core boards, and the PVC circuit board is arranged in a copper etching manner;
s2, inner layer board milling, namely, carrying out slotting treatment on the inner part of the PVC circuit board in a slotting mode, wherein the size of each slot is 0.007mm larger than the size of a single side of a copper block, and the side surface of the depth of each slot and the bottom surface form a vertical included angle of 75 degrees;
s3, laminating, namely laminating a copper block in a groove of a PVC circuit board, placing the copper block in an auxiliary manner by adopting an auxiliary tool, performing brown oxidation treatment on the exposed copper block, wherein in the process of brown oxidation treatment, attention needs to be paid to whether a copper leakage phenomenon exists, the copper block is required to be upward in the laminating process, in the process of embedding the copper block, a milling cutter is controlled to press the surface of a copper sheet downwards at a non-rotating speed, the pressure on the whole surface of the copper sheet is 0.5MPa, and the time from the end part of the milling cutter contacting the copper sheet to the time from the time when the copper sheet is completely embedded into the circuit board is;
s4, carrying out plate grinding treatment, namely grinding resin around the copper block on the PVC circuit board to the full extent, and controlling the thickness of the copper block to be 0.2 mm;
s5, punching, namely punching the PVC circuit board and connecting the PVC circuit board with the embedded copper block;
s6, performing laser drilling treatment, namely burning off resin in the hole diameter by adopting a laser drilling mode to enable the copper block to leak out, ensuring that no holes, cracks, layering and the like exist in gaps between the copper block and a board in the resin burning process of laser drilling, and paying attention to whether the drilling position is accurate or not in the drilling treatment process of the PVC circuit board to avoid damaging the copper block in the PVC circuit board;
and S7, detecting a finished product, namely detecting the processed PVC circuit board to judge whether the product meets the requirement of the finished product.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalent substitutions and modifications may be made to some features of the embodiments described above, and any modifications, equivalents, improvements, etc. within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. A production method of a copper-embedded mixed-compression circuit board based on a PVC material is characterized by comprising the following steps:
s1, cutting, namely cutting the PVC circuit board to be embedded with copper into a required size by a cutting machine, wherein the number of the PVC circuit boards is preferably the same as the required processing amount on the same day, and simultaneously cutting the embedded copper block and keeping the cut copper block in a dust-free environment;
s2, milling a board on the inner layer, namely slotting the PVC circuit board in a slotting mode, wherein the slotting size is 0.009mm larger than the size of a single side of a copper block, and the side face of the slot depth and the bottom face form an included angle of 90 degrees;
s3, laminating, namely laminating the copper block in a groove of the PVC circuit board, placing the copper block in an auxiliary way by using an auxiliary tool, and performing brown oxidation treatment on the exposed copper block, wherein in the brown oxidation treatment process, attention needs to be paid to whether a copper leakage phenomenon exists or not;
s4, carrying out plate grinding treatment, namely grinding resin around the copper block on the PVC circuit board to the full extent, and controlling the thickness of the copper block to be 0.1 mm;
s5, punching, namely punching the PVC circuit board and connecting the PVC circuit board with the embedded copper block;
s6, performing laser drilling treatment, namely burning off the resin in the hole diameter by adopting a laser drilling mode to enable the copper block to leak;
and S7, detecting a finished product, namely detecting the processed PVC circuit board to judge whether the product meets the requirement of the finished product.
2. The production method of the copper-embedded mixed-compression circuit board based on the PVC material as claimed in claim 1, is characterized in that: the PVC circuit board in S1 is a multilayer core board, and the middle part is a 2-layer sandwich core board, and the arrangement is carried out in a copper etching mode.
3. The production method of the copper-embedded mixed-compression circuit board based on the PVC material as claimed in claim 1, is characterized in that: the copper block in S3 requires the copper block to be up during lamination.
4. The production method of the copper-embedded mixed-compression circuit board based on the PVC material as claimed in claim 1, is characterized in that: and in the laser drilling and resin burning process in the S6, no void, crack, delamination and the like are caused in the gap between the copper block and the plate.
5. The production method of the copper-embedded mixed-compression circuit board based on the PVC material as claimed in claim 1, is characterized in that: in the process of embedding the copper block in the S3, the milling cutter is controlled to press the surface of the copper sheet downwards without rotating speed, the whole pressure on the surface of the copper sheet is 0.2-0.5 MPa, and the time from the end part of the milling cutter to the copper sheet being completely embedded into the circuit board is controlled to be not more than 4 seconds.
6. The production method of the copper-embedded mixed-compression circuit board based on the PVC material as claimed in claim 1, is characterized in that: when the PVC circuit board is cut in the S2, the cutting and placing platform needs to be inspected to check whether foreign matters exist or not, and if so, the cutting and placing platform needs to be cleaned.
7. The production method of the copper-embedded mixed-compression circuit board based on the PVC material as claimed in claim 1, is characterized in that: in S6, in the drilling treatment process of the PVC circuit board, whether the position of the drilled hole is accurate needs to be noticed, so that the copper block in the PVC circuit board is prevented from being damaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011233606.1A CN112888181A (en) | 2020-11-06 | 2020-11-06 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011233606.1A CN112888181A (en) | 2020-11-06 | 2020-11-06 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
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| Publication Number | Publication Date |
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| CN112888181A true CN112888181A (en) | 2021-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011233606.1A Pending CN112888181A (en) | 2020-11-06 | 2020-11-06 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
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| KR20140119517A (en) * | 2013-04-01 | 2014-10-10 | 대덕전자 주식회사 | Method of manufacturing a printed circuit board |
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| CN108289376A (en) * | 2018-01-22 | 2018-07-17 | 奥士康精密电路（惠州）有限公司 | Bury copper coin copper billet control depth method |
| CN108419361A (en) * | 2018-05-15 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | Bury copper billet printed circuit board and preparation method thereof |
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2020
- 2020-11-06 CN CN202011233606.1A patent/CN112888181A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102802365A (en) * | 2012-08-24 | 2012-11-28 | 皆利士多层线路版(中山)有限公司 | Manufacturing method for embedding copper heat sink into circuit board |
| CN103152987A (en) * | 2013-02-17 | 2013-06-12 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
| KR20140119517A (en) * | 2013-04-01 | 2014-10-10 | 대덕전자 주식회사 | Method of manufacturing a printed circuit board |
| CN104853523A (en) * | 2015-05-18 | 2015-08-19 | 惠州市金百泽电路科技有限公司 | Buried and embedded copper block PCB manufacturing method |
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| CN207039995U (en) * | 2017-07-26 | 2018-02-23 | 上海和辉光电有限公司 | A kind of flexible circuit board structure |
| CN108135070A (en) * | 2017-11-28 | 2018-06-08 | 广州兴森快捷电路科技有限公司 | Bury metal derby PCB and preparation method thereof |
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Application publication date: 20210601 |
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