CN113453434A - Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board - Google Patents
Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board Download PDFInfo
- Publication number
- CN113453434A CN113453434A CN202110774635.7A CN202110774635A CN113453434A CN 113453434 A CN113453434 A CN 113453434A CN 202110774635 A CN202110774635 A CN 202110774635A CN 113453434 A CN113453434 A CN 113453434A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper block
- copper
- manufacturing
- groove body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 30
- 230000005540 biological transmission Effects 0.000 title claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 216
- 239000010949 copper Substances 0.000 claims abstract description 216
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 215
- 238000003801 milling Methods 0.000 claims abstract description 35
- 238000005553 drilling Methods 0.000 claims abstract description 32
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
- 238000003825 pressing Methods 0.000 claims abstract description 31
- 238000013461 design Methods 0.000 claims abstract description 19
- 239000002002 slurry Substances 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 238000005498 polishing Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 48
- 238000012545 processing Methods 0.000 claims description 47
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 2
- 238000005111 flow chemistry technique Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 15
- 238000009826 distribution Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a method for manufacturing a high-heat-dissipation special printed circuit board for video transmission and the circuit board, comprising the following steps: manufacturing a thick copper layer on the first surface of the circuit board, wherein the thick copper layer is a copper layer with the thickness larger than the thickness of design data to finish copper thickness, manufacturing a step copper block, manufacturing a step groove body, positioning the step copper block in the step groove body, plugging copper slurry into the residual groove, baking at low temperature, pressing, baking, performing depth-controlled drilling, depth-controlled milling and etching to remove the residual part, and polishing to form the circuit board; according to the method, the copper block is subjected to finish machining, the copper block is reinforced and fixed by adopting the aluminum sheet plug copper paste, and parts are removed by means of depth control drilling, depth control milling and etching, so that a clear flow processing method can be provided for a special printed circuit board with mixed pressure and high heat dissipation characteristics, and the problems of inclination, deflection, poor pressing and the like of the stepped copper block are effectively avoided.
Description
Technical Field
The invention relates to the technical field of special printed circuit board manufacturing, in particular to a method for manufacturing a high-heat-dissipation special printed circuit board for video transmission and the circuit board.
Background
With the rapid development of high-speed networks such as a 5G network and an optical fiber, the video industry also comes up to a peak development period again, and the requirements of video transmission on hardware equipment are higher and higher under the promotion of video related industries such as network education, a live broadcast industry and a short video industry; at present, a large-capacity and high-speed transmission video industry is formed, and a circuit board, which is the most basic component of an electronic product, needs to be updated accordingly.
The video electronic equipment with large capacity and high-speed transmission shows the trend that the functions are increasingly powerful and the volume is increasingly reduced, the electronic products generally need to be distributed with more electronic components in a limited space, for a circuit board, the circuit board type with good support performance and electrical performance can be realized in a smaller space, and the design of a rigid-flex printed circuit board is generally adopted; high-speed video transmission undoubtedly increases data processing capacity, so that a circuit board generates more heat and is faster, therefore, in order to meet installation requirements, the design of a rigid-flex board is needed, in order to meet high-speed and high-capacity video transmission requirements, the design of a high-frequency dielectric layer is needed, in order to meet high-heat dissipation requirements, the design of embedding a copper block is generally adopted, and therefore, for the circuit board for high-speed and high-capacity video transmission, a rigid-flex combined special printed circuit board product with a high-frequency dielectric embedded in the copper block is produced at present; for electronic products which are developed more and more finely, the design of the special printed circuit board is also refined gradually, and if different layers have different heat dissipation efficiency requirements, an asymmetric stepped copper block design can be adopted to meet the heat dissipation requirements of different layers.
For the complicated special printed circuit board, when the stepped copper block is embedded, the circuit board is generally manufactured by pressing the circuit board, milling a groove body needing to be embedded with the copper block, filling the copper block, and pressing for the second time. However, the manufacturing method aims at the problems that the adaptability of the complicated special printed circuit board is poor, the adaptability of the stepped copper block is poor during processing, the copper block is inclined, inclined and infirm in pressing and the like.
Because the special printed circuit board is internally provided with the high-frequency dielectric layer and the polyimide dielectric layer, the expansion and shrinkage of the two materials in the hot pressing process are inconsistent, even if the compensation of the expansion and shrinkage is carried out, if the copper block is embedded, the expansion and shrinkage performances of the two materials are affected again due to the high heat conduction and the high hardness of the copper block, so that the copper block can not be pressed into the special printed circuit board in an aligned mode due to the large difference of the expansion and shrinkage.
Disclosure of Invention
The invention aims to solve the technical problems that the current special printed circuit board comprising a material mixed pressing design and a high-heat-dissipation embedded stepped copper block design is easy to incline, incline and have unfirm pressing when the stepped copper block is embedded, and the invention provides the following solutions based on the technical problems that:
on one hand, the invention provides a method for manufacturing a high-heat-dissipation special printed circuit board for video transmission, which is characterized in that the circuit board comprises a rigid support area, and a dielectric layer of the rigid support area comprises a high-frequency material dielectric layer and a polyimide dielectric layer; the manufacturing method comprises the following steps:
s10: manufacturing a thick copper layer on the first surface of the circuit board, wherein the thick copper layer is a copper layer with the thickness larger than the thickness of the design data finished copper;
s20: manufacturing a stepped copper block: taking a copper block, and milling and etching the copper block to form a stepped copper block comprising an extension area, a vent hole, a coarse copper block end and a fine copper block end; the extended area extends to the periphery of the end of the coarse copper block, the vent holes are distributed on the extended area and are positioned at the joint of the extended area and the end of the coarse copper block, and the end of the coarse copper block and the end of the fine copper block are in a stepped structure;
s30: carrying out groove milling processing on the circuit board to form a groove body: the structure of the groove body corresponds to that of the stepped copper block; the width single side of the groove body is larger than a certain size of the stepped copper block, and the certain size is equal to the diameter of the vent hole;
s40: the step copper block is placed in the groove body in an alignment mode: placing the stepped copper block into the groove body corresponding to the structure of the groove body; the space of the groove body for placing the stepped copper block is a placing groove, and the space left after the groove body is placed with the stepped copper block is a remaining groove; the extension area is arranged on the surface of the circuit board;
s50: and (3) plugging the copper slurry into the residual groove: adopting a plug hole aluminum sheet as a plug hole tool, and carrying out plug copper paste processing on the residual groove in a screen printing mode to form a circuit board to be baked;
s60: carrying out low-temperature baking processing on the circuit board to be baked to form a circuit board to be pressed;
s70: carrying out pressing processing on the circuit board to be pressed, and carrying out post-baking processing to form a circuit board to be milled;
s80: carrying out deep drilling control first and then deep milling control on the circuit board to be milled, and then carrying out etching processing to form a circuit board to be polished;
s90: and polishing the circuit board to be polished to form the circuit board.
According to the invention, the stepped copper block is improved and designed to be the stepped copper block comprising the extension area, the vent hole, the coarse copper block end and the fine copper block end, and can be effectively attached to the surface of the circuit board by virtue of the extension area, so that a good effect of assisting in fixing the stepped copper block is formed, and the problems of inclination, deflection and the like of the stepped copper block in the processing process are avoided; the groove body is provided with the residual groove, then copper paste is filled, after pressing, on one hand, copper paste can effectively fix the copper block, on the other hand, the copper block can slightly move in the copper paste in the pressing process, and the end of the copper block is right and not inclined by utilizing the pressing and stacking structure and the extension area; and through the mode of controlling deep drilling before controlling deep milling, redundant copper thickness can be effectively removed, the problems of excessive vibration, local overheating and the like caused by the fact that the milling cutter directly mills the plate can not be generated, and the correction and firmness of the step copper block can be effectively ensured.
As an optional mode, the high-frequency material dielectric layer is a ceramic powder composite epoxy resin layer or a polytetrafluoroethylene composite glass fiber material layer; the thickness of the thick copper layer is greater than the thickness of the design data finished copper by 10 μm to 30 μm.
As an optional mode, the stepped copper block further includes a limiting edge, the limiting edge is distributed on each side surface of the coarse copper block end or the fine copper block end, the limiting edge is a rib protruding from the side surface, the length of the limiting edge extending to the side surface is equal to the length of the remaining groove, and the width of the limiting edge is less than or equal to 1/5 of the side surface of the fine copper block end.
As an alternative, the extension region has a thickness of 30 μm to 50 μm; the extension length of the extension zone is 1 to 2 times of the length of the end of the raw copper block.
As an optional mode, the positioning the stepped copper block in the groove body further includes: coating an adhesive layer on one side of the thick copper layer of the circuit board, wherein the adhesive layer is coated around the opening position of the groove body and is away from the opening position of the groove body by a certain distance; placing the step copper block in the groove body, and aligning the vent hole with the residual groove; the extension region is arranged on the adhesive layer, and the coating area of the adhesive layer is smaller than or equal to the area of the extension region.
As an alternative, the adhesive layer is an epoxy adhesive layer or a polyolefin adhesive layer, and the thickness of the adhesive layer is 10 μm to 15 μm.
As an alternative, the copper slurry plugging processing on the residual groove comprises: manufacturing the hole plugging aluminum sheet, taking a thick aluminum sheet with the thickness of 0.3mm to 0.45mm, drilling the thick aluminum sheet by adopting a conical pointed drill cutter according to the drilling pattern of the vent hole to form the hole plugging aluminum sheet with a circular truncated cone-shaped hole, wherein the diameter of the small circular top surface of the circular truncated cone-shaped hole is equal to that of the vent hole, and the diameter of the large circular bottom surface of the circular truncated cone-shaped hole is 1.3 times to 3.6 times that of the vent hole; positioning the hole plugging aluminum sheet on the extension area, positioning the bottom surface of the large circle towards the vent hole, and positioning the top surface of the small circle and the vent hole; and carrying out silk-screen printing plug copper paste processing on the residual groove through the plug hole aluminum sheet.
As an optional mode, the pre-baking is performed by using a parameter of 75 ℃ multiplied by 45min or 100 ℃ multiplied by 30 min; the pressing process is carried out by adopting a rapid pressing machine, and the pressure of the pressing process is 15kg/cm2To 20kg/cm2The temperature and time of the pressing processing are 180 ℃ multiplied by 60 min; the post-baking processing adopts the baking at the temperature of 150 ℃ for 60 min.
As an optional mode, the processing of the circuit board to be milled by performing depth-controlled drilling before depth-controlled milling comprises: drilling the extension area and part of the coarse copper block end by adopting the depth control drilling mode to form a blind hole matrix, performing depth control milling on the blind hole matrix, and milling the extension area and part of the coarse copper block end; the depth control of the depth control drill and the depth control of the depth control milling is based on that the bottom end reaches the surface of the thick copper layer.
On the other hand, the invention provides a high-heat-dissipation special printed circuit board which is characterized by being manufactured by adopting the manufacturing method of the high-heat-dissipation special printed circuit board for video transmission.
The invention has the advantages that when the circuit board with the high-frequency dielectric plate and the polyimide plate which are blended and pressed is embedded into the stepped copper block, the extension area is designed for the stepped copper block, so that the copper block can be effectively drawn by using the extension area, the copper block can be more accurately aligned, the problems of serious inclination, deflection and the like of the copper block in the subsequent processing process can be avoided, and the thickness compensation is made for the subsequent removal of the extension area by increasing the surface copper thickness of one surface of the circuit board; the residual groove is filled by designing the residual groove and adopting a copper paste hole filling mode, so that the heat conduction and the electric conduction performance of the copper paste can be utilized, the performance of a circuit board is not influenced, the stepped copper block can be filled and fixed again by utilizing the fluidity of the copper paste, and the stepped copper block can be processed by baking and pressing, so that the stepped copper block is more firmly and exactly fixed by the copper paste; finally, the modes of depth-controlled drilling, depth-controlled milling and etching are adopted, the surface layer of the copper block to be removed is effectively not damaged, and the effect of accurately removing the redundant processing part is achieved; the integrated manufacturing method has the advantages that the integrated manufacturing method is matched with the whole process, the design of the stepped copper block and the extension area is adopted, the groove body is enlarged to form the residual groove, the thick aluminum sheet is processed in a copper paste filling mode to form the reliable copper block embedding manufacturing effect, the extension area and the thick copper layer are required to be removed, the redundant parts are removed in the modes of depth control drilling, depth control milling and etching, the processing process is high in matching degree, and finally the high-heat-dissipation special printed circuit board product embedded into the stepped copper block and high in reliability can be formed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a flow chart of the special printed circuit board according to the embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a stepped copper block according to an embodiment of the present invention;
FIG. 3 is a schematic view of the special PCB lamination process according to the embodiment of the present invention;
FIG. 4 is a schematic view of an aluminum plug copper paste lamination structure for plugging holes in the embodiment of the present invention;
FIG. 5 is a schematic view of a partial structure of an aluminum plug hole according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a circular truncated cone-shaped hole distribution plane structure of the end of the hole plugging aluminum sheet corresponding to the coarse copper block in the embodiment of the invention;
FIG. 7 is a schematic diagram of a circular truncated cone-shaped hole distribution plane structure of an end of the thin copper block corresponding to another hole plugging aluminum sheet in the embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view of the special PCB to be baked after filling copper paste in the embodiment of the present invention;
FIG. 9 is a schematic cross-sectional view of a special printed circuit board after depth control drilling according to an embodiment of the present invention;
FIG. 10 is a schematic cross-sectional view of a blind via matrix formed after depth control drilling according to an embodiment of the present invention;
FIG. 11 is a schematic plane structure diagram of a blind hole matrix formed after depth control drilling according to an embodiment of the present invention;
FIG. 12 is a schematic cross-sectional view of a special printed circuit board after depth-controlled milling according to an embodiment of the present invention;
fig. 13 is a schematic cross-sectional structure diagram of a finished special printed circuit board according to an embodiment of the present invention.
The reference numbers are as follows:
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1:
referring to fig. 1 and fig. 3, fig. 1 is a flow chart of processing a special printed circuit board according to an embodiment of the invention, and fig. 3 is a schematic view of processing a special printed circuit board stack according to an embodiment of the invention; in this embodiment, the special printed circuit board 10 includes a rigid support area 100, and the dielectric layer of the rigid support area 100 includes a high-frequency material dielectric layer 110 and a polyimide dielectric layer 120; for a video transmission circuit board, a high-frequency circuit board is generally required to meet high-speed and large-volume transmission of signals, where the high-frequency material dielectric layer 110 is optionally a ceramic powder composite epoxy resin layer or a polytetrafluoroethylene composite glass fiber material layer, both of which have good high-frequency characteristics and can effectively meet the use requirement of video transmission.
The manufacturing method of the special printed circuit board 10 comprises the following steps:
s10: the first surface of the circuit board 10 is made into a thick copper layer 130, and the thick copper layer 130 is a copper layer with a thickness greater than the design data to complete the copper thickness.
The thickness of the thick copper layer 130 is greater than the thickness of the copper layer 10 μm to 30 μm after completing the design data, it should be noted that each circuit board has a layout design data, the processing of the circuit board is performed according to the design data, and the thickness of the copper layer after completing the design data generally gives a definite thickness value; it should be further noted that, the first surface layer is designed as a thick copper layer, so that a certain margin of the thickness of the surface copper layer can be reserved for subsequent processing of removing excess copper thickness, and the problem of insufficient surface copper thickness caused by processing errors is prevented.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a stepped copper block according to an embodiment of the present invention;
s20: manufacturing the stepped copper block 20: taking a copper block, and processing the copper block into a stepped copper block 20 comprising an extension area 210, a vent hole 220, a coarse copper block end 230 and a fine copper block end 240 by milling and etching; the extension region 210 extends around the coarse copper block end 230, the vent holes 220 are distributed on the extension region 210 and located at the connection position of the extension region 210 and the coarse copper block end 230, and the coarse copper block end 230 and the fine copper block end 240 are in a step structure.
The ventilation holes 220 are not shown in fig. 2, and the positions of the ventilation holes 220 can be correspondingly understood by referring to the schematic structural view of the circular truncated cone-shaped hole distribution plane of fig. 6 or 7.
The copper billet is first selected through numerically controlled fraise machine, processes into ladder copper billet major structure shape, and the meticulous shape such as extension zone 210, air vent 220 is formed to the mode of rethread subsides dry film, etching, wherein, sets up extension zone 210, can play the effect of supplementary fixed copper billet to carry out accurate spacing to the copper billet.
The thickness of the extension region 210 may be set to 30 μm to 50 μm; the extension length may be set to 1 to 2 times the length of the end of the raw copper block; the extension area 210 plays an auxiliary role, the proper copper thickness enables the subsequent processing when the extension area 210 is milled to be more convenient and feasible, the proper length can effectively play an auxiliary fixing role of the extension area 210, and the processing of a normal circuit pattern cannot be hindered.
The stepped copper block 20 can also be designed with a limiting edge 250, the limiting edge 250 is distributed on each side surface of the coarse copper block end 230 or the fine copper block end 240, the limiting edge 250 is a rib protruding from the side surface, and the width of the limiting edge is less than or equal to 1/5 of the side surface of the fine copper block end; the limiting edge 250 is provided, and the width of the limiting edge 250 plus the width of the stepped copper block 20 can be effectively and firmly clamped into the groove body 30 to be described below, so that the copper block is self-aligned.
S30: performing groove milling on the circuit board 10 to form a groove body 30; the structure of the groove body 30 is manufactured corresponding to the structure of the stepped copper block 20 to form a stepped groove body; the width of the groove body 30 is larger than the stepped copper block 20 by a certain size on one side, and the certain size is equal to the diameter of the vent hole 220.
The stepped groove body is used for placing the stepped copper block 20, in the embodiment, the width single side of the stepped groove body is larger than the stepped copper block 20, and the remaining size is the size for remaining copper slurry for subsequent plugging; the width of the step groove body can be set to be equal to the size of the step copper block 20 and the limiting edge 250, so that the step copper block 20 can be effectively clamped in the groove body.
S40: the step copper block 20 is arranged in the groove body 30 in an aligned mode; placing the structure of the stepped copper block 20 corresponding to the groove body into the groove body 30, and performing alignment placement through an alignment pattern arranged on the extension area 210; the space of the groove body 30 for placing the stepped copper block 20 is a placing groove 310, and the space left after the groove body 30 for placing the stepped copper block 20 is a remaining groove 320; the extension region 210 is disposed on the surface of the circuit board 10.
It should be noted that, the extension region 210 may be provided with an alignment pattern for aligning the copper step block 20 into the slot 30, and the extension region 210 may be fixed on the surface of the circuit board by pre-pressing or gluing; if the stepped copper block 20 includes a limiting rib, no additional alignment is required.
The step further comprises the steps of coating an adhesive layer 140 on one side of the thick copper layer 130 of the special printed circuit board 10, wherein the adhesive layer 140 is coated around the opening position of the slot body 30 and is away from the opening position of the slot body 30 by a certain distance; placing the stepped copper block 20 in the tank body 30, and aligning the vent hole 220 with the residual tank 320; the extension region 210 is arranged on the glue layer 140, and the coating area of the glue layer 140 is less than or equal to the area of the extension region 210; the adhesive layer 210 may be an epoxy adhesive layer or a polyolefin adhesive layer, and has a thickness of 10 μm to 15 μm; through setting up glue film 210, can be more firm make the extension region fix on the circuit board surface, further fixed to the copper billet.
The length of the limit rib 250 extending to the side is equal to the length of the residual groove 320, and the width of the limit rib is less than or equal to 1/5 of the side of the end of the thin copper block.
Referring to fig. 4 to 8, fig. 4 is a schematic diagram of an overlapping structure of a copper paste processing of an aluminum plug with holes according to an embodiment of the present invention, and fig. 5 is a schematic diagram of a local structure of an aluminum plug with holes according to an embodiment of the present invention; FIG. 6 is a schematic diagram of a circular truncated cone-shaped hole distribution plane structure of the end of the hole plugging aluminum sheet corresponding to the coarse copper block in the embodiment of the invention; FIG. 7 is a schematic diagram of a circular truncated cone-shaped hole distribution plane structure of an end of the thin copper block corresponding to another hole plugging aluminum sheet in the embodiment of the present invention; FIG. 8 is a schematic cross-sectional view of the special printed circuit board to be baked after the copper paste is filled therein according to the embodiment of the present invention.
S50: and (3) carrying out copper paste filling processing on the residual groove 320, adopting the plug hole aluminum sheet 40 as a plug hole tool, and carrying out copper paste filling processing on the residual groove 320 in a screen printing mode to form the circuit board 10A to be baked.
The method further comprises the steps of manufacturing the hole plugging aluminum sheet 40, drilling the thick aluminum sheet 410 with the thickness of 0.3mm to 0.45mm by using a conical pointed drill, according to the drilling pattern of the vent holes 220, wherein the thick aluminum sheet 410 is provided with holes which correspond to the vent holes 220 one by one, and the hole plugging aluminum sheet 40 with a circular truncated cone-shaped hole 420 is formed, the diameter of the small circular top surface of the circular truncated cone-shaped hole 420 is equal to the diameter of the vent holes 220, the diameter of the large circular bottom surface of the circular truncated cone-shaped hole 420 is 1.3 times to 3.6 times of the diameter of the vent holes 220, when the diameter is 1.3 times, the cutter head angle of the conical pointed drill is about 30 degrees, and when the diameter is 3.6 times, the cutter head angle of the conical pointed drill is about 60 degrees; aligning the hole plugging aluminum sheet 40 on the extension area 210, facing the large circular bottom surface to the vent hole 220, and aligning the small circular top surface with the vent hole 220; and (4) carrying out silk-screen printing copper paste processing on the residual groove 320 through the plug hole aluminum sheet 40.
The cone-shaped pointed drill is used for drilling the circular truncated cone-shaped hole 420 and plugging the hole, the fluidity of copper slurry is low during plugging, the circular truncated cone-shaped hole 420 can effectively form a buffer area of the copper slurry, namely after the copper slurry is plugged in, a buffer area is formed in the circular truncated cone-shaped hole 420, and then the buffer area is further extruded into the vent hole 220 and the residual groove 320, so that the problems of plugging holes, copper slurry blockage and the like caused by the fact that the copper slurry is directly plugged in the vent hole 220 and the residual groove 320 are effectively solved.
Referring to fig. 6 and 7 again, the copper paste is filled from one end of the vent hole 220 corresponding to the coarse copper block end 230, from one end of the vent hole corresponding to the fine copper block end 240, or from one end and then from the other end, so that the copper paste in the remaining slots can be filled uniformly and sufficiently.
S60: carrying out low-temperature baking processing on the circuit board to be baked 10A to form a circuit board to be pressed 10B; the low-temperature baking can be performed at 75 ℃ for 45min or 100 ℃ for 30 min; the baking forms the primary solidification, but not the complete solidification, and the copper slurry can fix the copper block in the groove body, but can further adjust the position under the pressing condition.
S70: carrying out pressing processing on the circuit board to be pressed 10B, and carrying out post-baking processing to form a circuit board to be milled 10C; the pressing process adopts a rapid pressing machine to carry out pressing, and the pressing processPressure of 15kg/cm2To 20kg/cm2The temperature and time of the pressing processing are 180 ℃ multiplied by 60 min.
The fast press is generally used for pressing flexible circuit boards, and the fast press is used for pressing high-heat-dissipation special printed circuit boards for high-speed video transmission, so that the position and the shape of a copper block are mainly adjusted, the problems of inclination and deflection of the copper block after the copper paste hole plugging is completed are solved, the fast press temperature is lower than the traditional press temperature, the time is higher, the pressure is lower, and the correction degree of the copper block can be effectively improved; and (3) baking at 150 ℃ for 60min, and completely solidifying the copper slurry by post-baking to completely fix the copper block.
Referring to fig. 9 to 12, fig. 9 is a schematic cross-sectional structure diagram of a special printed circuit board after depth control drilling according to an embodiment of the present invention, fig. 10 is a schematic cross-sectional structure diagram of a blind hole matrix formed after depth control drilling according to an embodiment of the present invention, fig. 11 is a schematic plane structure diagram of a blind hole matrix formed after depth control drilling according to an embodiment of the present invention, and fig. 12 is a schematic cross-sectional structure diagram of a special printed circuit board after depth control milling according to an embodiment of the present invention.
S80: and carrying out deep drilling control first and then deep milling control on the circuit board 10C to be milled, and then carrying out etching processing to form a circuit board 10D to be polished.
The step also comprises the steps of firstly drilling an extension area and part of the rough copper block end in a depth control drilling mode to form a blind hole matrix 510, carrying out depth control milling processing on the blind hole matrix, and milling off the extension area and part of the rough copper block end; the depth control of the depth control drill and the depth control of the depth control milling is based on that the bottom end reaches the surface of the thick copper layer. It should be noted that in the present embodiment, the depth-controlled drilling is performed first, that is, the depth-controlled drilling is performed, and the matrix blind hole 510 is formed by using the drill 50 to drill a thickness hole to be removed, so as to provide a board shape convenient for subsequent depth-controlled milling, and prevent the copper block from being vibrated and pulled by directly milling the board; through depth-controlled milling processing and depth-controlled plate milling by adopting a milling cutter, the thickness to be removed is removed, and a relatively smooth plate surface is formed; the processing method of firstly controlling the deep drilling and then controlling the deep milling can effectively improve the processing reliability of the plate surface and effectively ensure the stability of the stepped copper block 20.
S90: polishing the circuit board 10D to be polished to form a circuit board 10; the polishing can be performed by selecting a volcanic ash polishing plate, a ceramic membrane brushing polishing plate, a sand belt polishing plate and the like; it should be noted that the flatness of the physically polished board surface has limitations, and if the machining allows, the board surface can be corrected by microetching.
Example 2:
referring to fig. 13, fig. 13 is a schematic cross-sectional structure diagram of a finished special printed circuit board according to an embodiment of the present invention.
The high-heat-dissipation special printed circuit board is manufactured by the manufacturing method of the high-heat-dissipation special printed circuit board for video transmission in embodiment 1.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (10)
1. A method for manufacturing a special high-heat-dissipation printed circuit board for video transmission is characterized in that,
the circuit board comprises a rigid support area, wherein a dielectric layer of the rigid support area comprises a high-frequency material dielectric layer and a polyimide dielectric layer;
the manufacturing method comprises the following steps:
s10: manufacturing a thick copper layer on the first surface of the circuit board, wherein the thick copper layer is a copper layer with the thickness larger than the thickness of the design data finished copper;
s20: manufacturing a stepped copper block: taking a copper block, and milling and etching the copper block to form a stepped copper block comprising an extension area, a vent hole, a coarse copper block end and a fine copper block end; the extended area extends to the periphery of the end of the coarse copper block, the vent holes are distributed on the extended area and are positioned at the joint of the extended area and the end of the coarse copper block, and the end of the coarse copper block and the end of the fine copper block are in a stepped structure;
s30: carrying out groove milling processing on the circuit board to form a groove body: the structure of the groove body corresponds to that of the stepped copper block; the single side of the width of the groove body is larger than the step copper block in a certain size, and the certain size is equal to the diameter of the vent hole.
S40: the step copper block is placed in the groove body in an alignment mode: placing the stepped copper block into the groove body corresponding to the structure of the groove body; the space of the groove body for placing the stepped copper block is a placing groove, and the space left after the groove body is placed with the stepped copper block is a remaining groove; the extension area is arranged on the surface of the circuit board;
s50: and (3) plugging the copper slurry into the residual groove: adopting a plug hole aluminum sheet as a plug hole tool, and carrying out plug copper paste processing on the residual groove in a screen printing mode to form a circuit board to be baked;
s60: carrying out low-temperature baking processing on the circuit board to be baked to form a circuit board to be pressed;
s70: carrying out pressing processing on the circuit board to be pressed, and carrying out post-baking processing to form a circuit board to be milled;
s80: carrying out deep drilling control first and then deep milling control on the circuit board to be milled, and then carrying out etching processing to form a circuit board to be polished;
s90: and polishing the circuit board to be polished to form the circuit board.
2. The method for manufacturing the special high-heat-dissipation printed circuit board for video transmission according to claim 1, wherein the high-frequency material dielectric layer is a ceramic powder composite epoxy resin layer or a polytetrafluoroethylene composite glass fiber material layer; the thickness of the thick copper layer is greater than the thickness of the design data finished copper by 10 μm to 30 μm.
3. The method as claimed in claim 1, wherein the step copper block further comprises a limiting rib, the limiting rib is disposed on each side of the coarse copper block end or the fine copper block end, the limiting rib is a rib protruding from the side, the length of the limiting rib extending to the side is equal to the length of the remaining groove, and the width of the limiting rib is less than or equal to 1/5 of the side of the fine copper block end.
4. The method for manufacturing a special printed circuit board with high heat dissipation for video transmission as claimed in claim 1, wherein the thickness of the extension region is 30 μm to 50 μm; the extension length of the extension zone is 1 to 2 times of the length of the end of the raw copper block.
5. The method for manufacturing a special printed circuit board with high heat dissipation for video transmission according to claim 1, wherein the positioning of the stepped copper block in the groove body further comprises: coating an adhesive layer on one side of the thick copper layer of the circuit board, wherein the adhesive layer is coated around the opening position of the groove body and is away from the opening position of the groove body by a certain distance; placing the step copper block in the groove body, and aligning the vent hole with the residual groove; the extension region is arranged on the adhesive layer, and the coating area of the adhesive layer is smaller than or equal to the area of the extension region.
6. The method for manufacturing a special printed circuit board with high heat dissipation for video transmission according to claim 5, wherein the adhesive layer is an epoxy resin adhesive layer or a polyolefin adhesive layer, and the thickness of the adhesive layer is 10 μm to 15 μm.
7. The method for manufacturing the special high-heat-dissipation printed circuit board for video transmission according to claim 1, wherein the step of filling the remaining groove with copper paste comprises the steps of: manufacturing the hole plugging aluminum sheet, taking a thick aluminum sheet with the thickness of 0.3mm to 0.45mm, drilling the thick aluminum sheet by adopting a conical pointed drill cutter according to the drilling pattern of the vent hole to form the hole plugging aluminum sheet with a circular truncated cone-shaped hole, wherein the diameter of the small circular top surface of the circular truncated cone-shaped hole is equal to that of the vent hole, and the diameter of the large circular bottom surface of the circular truncated cone-shaped hole is 1.3 times to 3.6 times that of the vent hole; positioning the hole plugging aluminum sheet on the extension area, positioning the bottom surface of the large circle towards the vent hole, and positioning the top surface of the small circle and the vent hole; and carrying out silk-screen printing plug copper paste processing on the residual groove through the plug hole aluminum sheet.
8. The method for manufacturing a special printed circuit board with high heat dissipation for video transmission according to claim 1, wherein the pre-baking is performed at a temperature of 75 ℃ for 45min or at a temperature of 100 ℃ for 30 min; the pressing process is carried out by adopting a rapid pressing machine, and the pressure of the pressing process is 15kg/cm2To 20kg/cm2The temperature and time of the pressing processing are 180 ℃ multiplied by 60 min; the post-baking processing adopts the baking at the temperature of 150 ℃ for 60 min.
9. The method for manufacturing the special high-heat-dissipation printed circuit board for video transmission according to claim 1, wherein the processing of the circuit board to be milled in a manner of depth-controlled drilling before depth-controlled milling comprises: drilling the extension area and part of the coarse copper block end by adopting the depth control drilling mode to form a blind hole matrix, performing depth control milling on the blind hole matrix, and milling the extension area and part of the coarse copper block end; the depth control of the depth control drill and the depth control of the depth control milling is based on that the bottom end reaches the surface of the thick copper layer.
10. A special printed circuit board with high heat dissipation performance, which is manufactured by the manufacturing method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110774635.7A CN113453434B (en) | 2021-07-08 | 2021-07-08 | Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110774635.7A CN113453434B (en) | 2021-07-08 | 2021-07-08 | Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113453434A true CN113453434A (en) | 2021-09-28 |
| CN113453434B CN113453434B (en) | 2022-05-31 |
Family
ID=77815530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110774635.7A Active CN113453434B (en) | 2021-07-08 | 2021-07-08 | Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113453434B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340231A (en) * | 2022-03-14 | 2022-04-12 | 四川英创力电子科技股份有限公司 | Manufacturing device and method for PCB with thick copper stepped copper guide pillar |
| CN116193765A (en) * | 2022-12-19 | 2023-05-30 | 胜宏科技（惠州）股份有限公司 | A kind of manufacturing method of heat-dissipating PCB board |
| CN117812832A (en) * | 2023-12-29 | 2024-04-02 | 珠海和进兆丰电子科技有限公司 | Eight-layer HDI copper-embedded substrate for vehicle-mounted smart headlights and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| US20200214120A1 (en) * | 2018-12-27 | 2020-07-02 | Unimicron Technology Corp. | Circuit board having heat-dissipation block and method of manufacturing the same |
| CN111565523A (en) * | 2020-05-14 | 2020-08-21 | 广德牧泰莱电路技术有限公司 | Manufacturing method of second-order copper block-buried circuit board |
| CN112689380A (en) * | 2021-01-15 | 2021-04-20 | 深圳市鼎盛电路技术有限公司 | Manufacturing method of embedded copper block circuit board structure and circuit board |
-
2021
- 2021-07-08 CN CN202110774635.7A patent/CN113453434B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200214120A1 (en) * | 2018-12-27 | 2020-07-02 | Unimicron Technology Corp. | Circuit board having heat-dissipation block and method of manufacturing the same |
| CN110933875A (en) * | 2019-11-18 | 2020-03-27 | 深圳崇达多层线路板有限公司 | Manufacturing method of copper-embedded PCB |
| CN111565523A (en) * | 2020-05-14 | 2020-08-21 | 广德牧泰莱电路技术有限公司 | Manufacturing method of second-order copper block-buried circuit board |
| CN112689380A (en) * | 2021-01-15 | 2021-04-20 | 深圳市鼎盛电路技术有限公司 | Manufacturing method of embedded copper block circuit board structure and circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114340231A (en) * | 2022-03-14 | 2022-04-12 | 四川英创力电子科技股份有限公司 | Manufacturing device and method for PCB with thick copper stepped copper guide pillar |
| CN114340231B (en) * | 2022-03-14 | 2022-05-13 | 四川英创力电子科技股份有限公司 | A manufacturing device and method for a PCB board with thick copper ladder copper guide posts |
| CN116193765A (en) * | 2022-12-19 | 2023-05-30 | 胜宏科技（惠州）股份有限公司 | A kind of manufacturing method of heat-dissipating PCB board |
| CN117812832A (en) * | 2023-12-29 | 2024-04-02 | 珠海和进兆丰电子科技有限公司 | Eight-layer HDI copper-embedded substrate for vehicle-mounted smart headlights and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113453434B (en) | 2022-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113453434B (en) | Method for manufacturing high-heat-dissipation special printed circuit board for video transmission and circuit board | |
| CN103648240B (en) | A kind of preparation method of symmetric form rigid-flex combined board | |
| CN112040631B (en) | Copper block embedding method and tool for circuit board | |
| WO2017107535A1 (en) | Rigid-flex board and preparation method therefor | |
| CN119725107B (en) | Chip packaging structure and method | |
| CN116075055A (en) | A kind of manufacturing method of solid hole circuit board | |
| CN108834335A (en) | PCB manufacturing method and PCB | |
| CN103841762B (en) | The manufacture method of a kind of pcb board and a kind of pcb board | |
| CN110621118B (en) | Circuit board hole plugging method and circuit board | |
| CN114096055B (en) | Manufacturing method of thick double-sided pluggable finger double-sided FPC board and double-sided FPC board | |
| CN112384009A (en) | Manufacturing method of embedded cavity and PCB | |
| CN120129158A (en) | A method for manufacturing a multi-layer thermoelectric separation buried copper plate | |
| KR20200009360A (en) | Method for forming cavity in pcb using laminating film | |
| CN108282969A (en) | PCB manufacturing method for realizing inner layer communication and PCB | |
| CN112601367A (en) | Manufacturing method of secondary drilling circuit board | |
| CN111295049A (en) | POFV hole plugging method and circuit board | |
| CN114945253A (en) | PCB copper block burying method and PCB | |
| CN118678565B (en) | A buried magnetic PCB and its manufacturing method | |
| CN112105150B (en) | A method for making a buried cavity and a PCB | |
| CN112839453B (en) | Rigid-flexible combined circuit board and preparation method thereof | |
| CN118368832A (en) | Production and manufacturing process of multilayer PCB embedded buried copper | |
| WO2021088336A1 (en) | Fabrication method for pcb having internally embedded ceramic piece, and pcb thereof | |
| JP3325903B2 (en) | Manufacturing method of wiring board | |
| WO2023024212A1 (en) | Resistor-buried circuit board and processing method | |
| CN112261802A (en) | A method for making a buried cavity and a PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |