WO2019128172A1

WO2019128172A1 - Circuit board and method for fabricating same, and method for fabricating power amplifier slot

Info

Publication number: WO2019128172A1
Application number: PCT/CN2018/093628
Authority: WO
Inventors: 吴辉; 陈黎阳; 乔书晓
Original assignee: 广州兴森快捷电路科技有限公司; 深圳市兴森快捷电路科技股份有限公司
Priority date: 2017-12-28
Filing date: 2018-06-29
Publication date: 2019-07-04
Also published as: CN108174513B; CN108174513A

Abstract

Disclosed is a method for fabricating a power amplifier slot, the method comprising the following steps: setting fabricating parameters of a power amplifier slot pre-fabricated on a copper block; performing cutting at a pre-set position on the copper block, with a cutting direction of a cutter being the reverse of a turning direction of the cutter, and fabricating a first preform slot; and allowing the cutter to perform cutting in a slot of the first preform slot at least one turn, and obtaining a power amplifier slot. Based on the method for fabricating a power amplifier slot, a method for fabricating a circuit board as well as a circuit board are further disclosed. Firstly, a first preform slot is fabricated on a copper block. Since the cutting direction of the cutter is the reverse of the turning direction of the cutter, copper cuttings or copper particles produced during the fabrication come out of the slot and do not remain in the slot, ensuring the quality of the power amplifier slot. Cutting in a slot of the first preform slot at least one turn further removes burrs produced during the fabrication of the first preform slot, thereby improving the fabricating quality of the power amplifier slot, reducing the rejection rate, and reducing production costs.

Description

Circuit board, processing method thereof, and processing method of power amplifier slot

Technical field

The invention relates to the technical field of circuit board processing, in particular to a circuit board, a processing method thereof and a processing method of a power amplifier slot.

Background technique

With the continuous improvement of the heat dissipation capability of high-power electronic components such as high-frequency radio frequency (RF) and power amplifier (PA), the production process of embedding copper blocks inside the circuit board is introduced in the production of circuit boards, which is called embedding. Copper plate. According to the space utilization of the buried copper block product and the need of different interlayer heat dissipation conduction passages, the copper block is provided with a power amplifier slot for placing electronic components to install a specific functional module or a sinking device, so that the overall circuit board is small in size. Improves thermal performance and reduces crosstalk effects on signal transmission.

The power amplifier slots of the copper block are generally arranged in a stepped slot, and the prior art is mainly manufactured by a numerically controlled milling machine, thereby achieving the flatness of the power amplifier slot required for production. However, CNC milling machines can easily lead to the scrapping of copper blocks when milling grooves on copper blocks, such as the occurrence of notch spurs, copper slabs at the bottom of the groove, etc., which burdens the enterprise.

Summary of the invention

Based on this, it is necessary to solve the problems of blunting and copper scraping when processing the power amplifier slot of the copper block, and provide a circuit board, a processing method thereof, and a processing method of the power amplifier slot.

Its technical solutions are as follows:

A processing method for a power amplifier slot, comprising the following steps:

(1) Setting the processing parameters of the pre-processed power amplifier slot on the copper block;

(2) performing a pass at a preset position of the copper block, so that the direction of the cutter is opposite to that of the cutter, and the first pre-groove is machined;

(3) The cutter passes at least one turn in the groove of the first pre-groove and obtains a power amplifier slot.

The processing method of the above power amplifier slot firstly processes the first pre-groove on the copper block. Since the direction of the cutter is opposite to the steering of the cutter, the copper chips or copper particles generated during the processing are thrown out of the slot, It will stay in the tank to ensure the quality of the power amplifier slot. It will take a turn in the slot of the first pre-groove to further remove the cloak generated in the first pre-groove processing to improve the processing quality of the power amplifier slot and reduce the waste. Rate, reduce production costs.

The technical solution is further explained below:

In one embodiment, before step (2) after step (1), if the power amplifier slot is a single slot depth design, step (a1) is performed; if the power amplifier slot is a multi-slot depth design, step (a2) is performed;

(a1), performing step (2) and step (3), and obtaining a power amplifier slot;

(a2) The power amplifier slot includes a first stepped slot and a second stepped slot. The depth of the first stepped slot is greater than the depth of the second stepped slot, and includes the following steps:

(a21), performing step (2) and step (3), processing a first stepped groove on the copper block;

(a22), including the following steps:

Performing a knife on the basis of the first stepped groove and processing the second pre-groove based on the preset position of the second stepped groove;

The cutter travels at least one turn in the groove of the second pre-groove and obtains a power amplifier slot.

The single-slot deep design of the power amplifier slot can be directly processed. For the multi-slot deep design power amplifier slot, the deep stepped groove is processed first, and the shallow stepped groove is processed to reduce the spurt generated during the processing and improve the power amplifier slot. Quality.

In one embodiment, the second stepped groove is a discontinuous stepped groove. When the second stepped groove is machined, the tool is finished in one pass and the second stepped groove is obtained. When the second step groove is a discontinuous step groove, the tool completes the machining of all the second step grooves in one pass, so that the machining accuracy of the second step groove is higher, and the tool is prevented from being repeatedly lifted and dropped to affect the second step. The processing accuracy of the groove.

In one of the embodiments, when the second stepped groove is machined, the lower knife position of the cutter is disposed at a predetermined interval from the inner wall of the first stepped groove. The lower knife position of the tool is set at a preset distance from the inner wall of the first step groove, and the tool will contact the preset second step groove processing position after the position is stabilized, thereby ensuring the processing precision of the second step groove and avoiding the tool being lifted. The accuracy problem caused by the ups and downs affects the processing accuracy of the second stepped groove, such as the occurrence of knife printing, etc., thereby improving the overall processing level of the power amplifier slot, improving the yield and improving the product quality.

In one of the embodiments, the tool is a milling cutter, and in steps (2) and (3), the tool is machined according to a preset degree of overlap. During processing, the tool is moved according to the preset degree of overlap, and the smoothness and smoothness of the groove wall of the power amplifier slot are improved after the processing to improve the product quality.

In one of the embodiments, the tool has a tool radius of 2 mm or 1.6 mm and the tool overlap is 30% to 40%. The tool radius of the tool can be variously selected, preferably 2mm or 1.6mm. According to the above tool radius, the tool overlap is selected to be 30%-40% to obtain higher groove wall smoothness and smoothness.

A method of processing a circuit board is also provided, including the following steps:

(A) processing a predetermined circuit layer on the substrate and completing the processing;

(B) processing a buried copper groove at a predetermined position of the substrate;

(C) placing the copper block in the buried copper bath and laminating the copper block with the substrate to obtain a pre-formed board;

(D) processing a power amplifier slot on the copper block, the power amplifier slot being processed by the processing method of the power amplifier slot according to any one of the above technical solutions;

(E), the substrate is subjected to copper plating, and a wiring board is obtained.

The processing method of the circuit board described above uses the processing method of the power amplifier slot according to any one of the above technical solutions to process the power amplifier slot, thereby improving the processing precision of the power amplifier slot, thereby improving the quality of the circuit board of the buried copper block and reducing the defective rate.

The technical solution is further explained below:

In one embodiment, before step (D) after step (C), the method further comprises: processing a first positioning portion on the pre-formed plate; and machining a second corresponding to the first positioning portion on the processing table surface of the machine tool a positioning portion; the pre-formed plate and the processing table are positioned and matched by the first positioning portion and the second positioning portion. By the cooperative positioning of the first positioning portion and the second positioning portion, when the copper block is laminated with the pre-formed plate and the power amplifier groove is processed on the copper block, the pre-formed plate is not easy due to the positioning of the first positioning portion and the second positioning portion. Warpage occurs, improving the processing of the power amplifier slot and the processing accuracy of the final circuit board.

In one embodiment, before step (C), the method further comprises: browning the copper block. In order to improve the adhesion between the copper block and the substrate, the degree of lamination of the copper block in the buried copper bath and the substrate is improved, and the quality of the circuit board is improved.

There is further provided a circuit board which is processed by the method of processing a circuit board according to any one of the above aspects.

The above circuit board uses the above-mentioned processing method of the power amplifier slot to process the power amplifier slot, thereby improving the processing precision of the power amplifier slot, thereby improving the yield and processing quality of the circuit board, and improving the economic benefit of the enterprise.

DRAWINGS

Figure 1 is a processing flow chart of the circuit board;

2 is a cross-sectional view of a circuit board structure with a power amplifier slot;

Figure 3 is a plan view of the power amplifier slot structure;

Figure 4 is a schematic diagram of the "back" type counterclockwise movement.

100, substrate, 110, buried copper trough, 200, copper block, 210, first stepped trough, 220, second stepped trough, 230, third stepped trough, 300, cutter.

Detailed ways

The embodiments of the present invention are described in detail below with reference to the accompanying drawings:

It should be noted that when an element is referred to as being "fixed" with another element, it may be directly on the other element or the element may be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or the central element. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right", and the like, as used herein, are for the purpose of illustration and are not intended to be the only embodiment.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.

As shown in the embodiment of FIG. 1, a method for processing a power amplifier slot includes the following steps:

(1) setting the processing parameters of the pre-processed power amplifier slot on the copper block 200;

(2) performing a pass at a preset position of the copper block 200 such that the direction of the cutter 300 is opposite to the turning of the cutter 300 and machining the first pre-groove;

First, the first pre-groove is machined on the copper block 200. Since the direction of the cutter 300 is opposite to the direction of the cutter 300, the copper chips or copper particles generated during the processing are thrown out of the slot and are not retained in the slot. Inside, to ensure the quality of the power amplifier slot, at least one turn in the slot of the first pre-groove, remove the cloak generated in the first pre-groove processing, further improve the processing quality of the power amplifier slot, reduce the reject rate, and reduce production. cost.

At present, the power amplifier slot processing, the copper chips and copper wires generated during the milling process block the power amplifier slot, affecting the smoothness and flatness of the surface of the power amplifier slot after processing, and may damage the components placed therein, thereby causing the circuit board to be scrapped. Thereby reducing the yield and increasing the production cost burden of the enterprise.

In this embodiment, the direction of the cutter 300 is opposite to the steering of the cutter 300, and the problem is avoided, so that the copper chips, copper wires, and the like generated after the machining of the cutter 300 are thrown to the outside of the first pre-groove, and After the machining, the cutter 300 is lapped in the groove of the first pre-groove. Since the cutter is empty, the slot position of the first pre-groove is removed, which further improves the processing of the power amplifier slot. Accuracy, improved yield and lower production costs.

It should be noted that, in the step (3), the cutter 300 moves at least one turn in the groove of the first pre-groove, which may be a predetermined distance between the axis of the cutter 300 and the groove wall of the first pre-groove. For example, the processing portion of the tool 300 is located in the groove wall of the first pre-groove, and the tool 300 is not in contact with the surface of the copper block 200 where the slot of the first pre-groove is located. The block 200 or the first pre-groove is further processed for the purpose of removing the ridges generated during the processing of the first pre-groove.

Further, the cutter 300 is a milling cutter, and the rotation direction of the milling cutter is clockwise steering. When the milling cutter is processed at a preset position of the copper block 200, the cutter is first counterclockwise and the first pre-groove is machined, and then the cutter is made. 300 further runs at least one turn along the slot of the first pre-groove to obtain a power amplifier slot.

Further, after the milling cutter has processed the first pre-groove, the cutter is further moved along the slot of the first pre-groove by at least one turn, and finally the power amplifier slot is obtained, and the milling cutter is in the first pre-groove. When the cutter is used in the slot, the cutter uses the same cutter as its own steering to carry the cutter.

Specifically, the milling machine spindle where the milling cutter is located rotates clockwise, so that the rotating direction of the milling cutter is clockwise, that is, the rotation of the milling cutter is clockwise or the milling cutter is smooth milling, and the milling cutter is pre-cut in the copper block 200. The position is processed by means of counterclockwise movement, and the first pre-groove is obtained, and then a circle is run clockwise in the groove of the first pre-groove, and finally the power amplifier groove is obtained.

When the milling cutter is shun milling, if the traversing method is counterclockwise, the copper swarf will be milled to the outside of the groove; if the traversing method is clockwise, the copper swarf will be milled into the groove, affecting the groove. Processing quality. Therefore, the first pre-groove is machined in a counterclockwise pass. However, the counterclockwise movement method can make the copper chips be milled out of the groove, and avoid the copper chips affecting the processing quality of the power amplifier groove. However, since the copper skin of the lower knife position is subjected to the downward tearing force, the copper skin is torn by the glass. Severe, and produces a blunt, which in turn affects the processing quality of the power amplifier slot. Therefore, after the first pre-groove is processed, a clockwise pass is performed in the slot of the first pre-groove, that is, empty When running a circle and walking in a clockwise manner, the copper skin at the lower knife position is subjected to an upward tearing force, and the force of the copper skin is greatly reduced, and no cloak is generated, thereby avoiding the influence of the cloak. Of course, according to the needs of processing, the cutter 300 can also run multiple times in a clockwise direction to achieve a better processing effect.

In addition, during machining, whether it is clockwise or counterclockwise, the machining process is carried out with a “return” type machining path, and the machining is performed from the inside out, that is, rough milling is performed first, and then the inner wall is finished and finished. The inner wall of the obtained power amplifier slot has higher precision, and the processing precision can be controlled within ±0.1 mm.

Further, before step (1) after step (1), if the power amplifier slot is designed as a single slot depth, step (a1) is performed; if the power amplifier slot is designed with multiple slots, step (a2) is performed;

(a1), performing step (2) and step (3), and obtaining a power amplifier slot;

(a2) The power amplifier slot includes a first stepped slot 210 and a second stepped slot 220. The depth of the first stepped slot 210 is greater than the depth of the second stepped slot 220, and includes the following steps:

(a21), performing step (2) and step (3), processing a first stepped groove 210 on the copper block 200;

(a22), including the following steps:

Based on the preset position of the second stepped groove 220, the cutting is performed on the basis of the first stepped groove 210, and the second pre-groove is processed;

The cutter 300 travels at least one turn in the groove of the second pre-groove and obtains a power amplifier slot.

When the power amplifier slot has only one groove depth, that is, a single groove depth design, only the groove depth can be processed; and when there are multiple groove depths, that is, multiple groove depth designs, there are multiple The groove, that is, the plurality of stepped grooves, adopts a deep and shallow processing method to reduce the generation of the blister and improve the processing quality of the power amplifier groove.

It should be noted that only the first stepped groove 210 and the second stepped groove 220 are written here for convenience of description. According to the needs of the structural arrangement, the third stepped groove 230, the fourth stepped groove, etc. may be added, and the processing method is the same. Rational, using the first deep and shallow processing.

In addition, the first stepped groove 210 and the second stepped groove 220 and the like are combined to form a power amplifier groove as referred to in the present application.

Further, the second stepped groove 220 is a discontinuous stepped groove. When the second stepped groove 220 is machined, the tool 300 is finished in one pass and the second stepped groove 220 is obtained. When the second stepped groove 220 is a discontinuous stepped groove, the cutter 300 completes the machining of all the second stepped grooves 220 in one step, so that the machining accuracy of the second stepped groove 220 is higher, and the cutter 300 is prevented from being repeatedly lifted and dropped. The machining accuracy of the second stepped groove 220 is affected.

When the second stepped groove 220 is a discontinuous stepped groove, that is, the step of forming the second stepped groove 220 is formed as a plurality of blocks, for example, the stepped block which is only at the four corner positions forms a stepped groove, because there is a space in the middle. Therefore, when the stepped groove is processed, since each step block is in a different place, the process of repeatedly lifting, falling, and starting the tool 300 is required during the machining, thereby increasing the possibility of machining deviation. Therefore, in order to avoid the deviation caused by the repeated movement of the cutter 300 affecting the machining accuracy of the second stepped groove 220, the tool 300 is completed in one time, and the repeated lifting and falling processes are not performed, and the second stepped groove 220 is improved. Precision.

Further, when the second stepped groove 220 is processed, the lower knife position of the cutter 300 and the inner wall of the first stepped groove 210 are disposed at a predetermined interval. The lower knife position of the cutter 300 is disposed at a predetermined interval from the inner wall of the first stepped groove 210, and the cutter 300 contacts the preset processing position of the second stepped groove 220 after the position is stabilized, thereby ensuring the machining accuracy of the second stepped groove 220. The accuracy problem caused by the cutter 300 during lifting and falling is prevented from affecting the processing precision of the second stepped groove 220, such as the occurrence of the blade printing, thereby improving the overall processing level of the power amplifier slot, improving the yield, and improving the product quality.

Furthermore, when processing the step block at the four-corner position, the machining accuracy of the lower knife milling is affected by the process of repeatedly lifting the knife and the lower knife. Therefore, the above-mentioned one-time cutting knife processing is completed, and further in the lower knife and the second A stepped groove 210 maintains a certain distance to ensure that the position of the tool 300 has been stabilized during the post-knife machining, and the second stepped groove 220 with higher precision is processed.

Specifically, when processing the power slot of the multi-slot deep design, the processing of the same step groove is completed once after the lower knife, and the distance between the lower knife position and the groove wall of the previous step groove is at least 0.5 mm.

Further, the cutter 300 is a milling cutter, and in the steps (2) and (3), the cutter 300 is processed according to a preset degree of overlap. During processing, the tool is moved according to the preset overlap degree, and the groove wall flatness and smoothness of the power amplifier groove are improved after the processing to improve the product quality.

Since the tool 300 itself has a blade width, if the overlap or overlap ratio is not set, the processed material may not be processed in some places during the processing; if the overlap degree is set, that is, the tightness between each knife, The surface of the processed material can be kept smooth and flat, and the quality of the processed surface after processing can be improved.

Further, the tool 300 has a tool radius of 2 mm or 1.6 mm, and the tool 300 has an overlap of 30% to 40%. The tool diameter of the cutter 300 can be variously selected, preferably 2 mm or 1.6 mm. According to the above tool radius, the degree of overlap of the cutter 300 is selected to be 30% to 40% to obtain higher groove wall flatness and smoothness.

The overlap ratio is set between 30% and 40%, which optimizes the flatness of the groove bottom and controls the accuracy within ±3 mil.

Specifically, the cutter 300 is a milling cutter, and the cutter has a cutter diameter of 2 mm, and the overlap or overlap ratio of the cutter is 30%-40%, and the optimum is 35%.

It should be noted that when the tool radius is selected, if the small tool diameter is selected, the milling efficiency is lowered. In order to improve the productivity, a large-diameter milling cutter is usually selected. Due to the large-diameter setting, the number of overlaps is relatively reduced, and the machining efficiency is higher. The number of times of lifting the knife is also reduced accordingly, and the machining accuracy is further improved. Therefore, a cutter diameter of 20 mm is selected for machining.

The embodiment shown in FIG. 1 also provides a method for processing a circuit board, comprising the following steps:

(A) processing a predetermined circuit layer on the substrate 100 and completing the processing;

(B) processing a buried copper trench 110 at a predetermined position of the substrate 100;

(C) placing the copper block 200 in the buried copper bath 110 and laminating the copper block 200 with the substrate 100 to obtain a pre-formed board;

(D) processing a power amplifier slot on the copper block 200, the power amplifier slot being processed by the processing method of the power amplifier slot according to any of the above embodiments;

(E) The substrate 100 is subjected to copper plating and a wiring board is obtained.

The power amplifier slot is processed by the processing method of the power amplifier slot according to any of the above embodiments, thereby improving the processing precision of the power amplifier slot, thereby improving the quality of the circuit board of the buried copper block 200 and reducing the defective rate.

It should be noted that the step (1) involved in the step (D) may be performed before the step (D), and the circuit layer processing of the substrate 100, the copper block 200 and the substrate involved in the processing method of the circuit board. 100 lamination, copper plating and other techniques can be carried out using existing techniques.

In addition, the circuit layer processing on the substrate 100 in the step (A) may be performed by using a prior art, such as exposure, development, etching, etc., to obtain a circuit layer, and the substrate 100 may be a copper clad layer or a plurality of layers. The copper clad laminate is laminated to form the substrate 100.

Further, before the step (C), the copper block 200 is also subjected to copper pre-bak treatment, including: further processing the surface of the copper block 200 to meet processing requirements, such as improving surface smoothness, flatness, etc.; The thickness is further confirmed to ensure that the thickness of the copper block 200 satisfies the requirement. If the thickness of the copper block 200 is too large, the flatness of the copper block 200 may be poor after the copper block 200 and the substrate 100 are laminated in the step (C). It may also cause the substrate 100 to stratify and foam, which may affect the processing of further processing such as inserts, thereby affecting the processing quality.

Further, before the step (D) after the step (C), the method further includes: processing the first positioning portion on the pre-formed plate; and machining the second positioning portion corresponding to the first positioning portion on the processing table surface of the machine tool; The pre-formed plate and the processing table are positioned and engaged by the first positioning portion and the second positioning portion. By the cooperative positioning of the first positioning portion and the second positioning portion, when the copper block 200 is laminated on the copper block 200 after lamination with the pre-formed plate, the positioning of the first positioning portion and the second positioning portion is pre-formed. The board is less prone to warpage, improving the processing of the power amplifier slot and the processing accuracy of the final circuit board.

Further, the first positioning portion is a first positioning hole disposed on the pre-formed plate, and the second positioning portion is a second positioning hole of the processing table on the machine tool of the milling machine, and the positions of the first positioning hole and the second positioning hole Correspondingly, after the first positioning hole and the second positioning hole are processed, the pre-formed plate is fixed on the processing table by screws, thereby improving the positioning accuracy of the pre-formed plate and the processing table, so as to improve the precision of the subsequent processing of the buried copper groove 110, and avoiding The problem of warpage of the pre-formed plate occurs when the power amplifier slot is processed on the copper block 200.

Specifically, the aperture of the first positioning hole is not less than 2 mm, and the setting of the large aperture is advantageous for the positioning operation, thereby improving the processing efficiency.

In addition, since the second positioning hole is disposed on the processing table, after processing one circuit board, when processing the next circuit board, a new second positioning hole can be processed on the processing surface until the processing table has no spare space. The new location hole can be machined, and the processing table is replaced at this time.

Further, before the step (C), the method further includes: performing browning on the copper block 200. In order to improve the adhesion between the via hole and the substrate 100, the degree of lamination of the copper block 200 with the substrate 100 in the buried copper trench 110 is improved, and the quality of the wiring board is improved.

Further, between step (D) and step (E), through holes and the like may be processed on the substrate 100 as needed to form a desired metallized hole or the like for subsequent electroplating to meet further product requirements.

In addition, the method further includes: performing tin plating, sticking dry film, exposure and development etching, etc. on the copper plate after electroplating to obtain a circuit board that satisfies the needs.

The embodiment shown in FIGS. 2-4 further provides a circuit board which is processed by the processing method of the circuit board according to any of the above embodiments.

The processing method of the above power amplifier slot is used to process the power amplifier slot, thereby improving the processing precision of the power amplifier slot, thereby improving the yield and processing quality of the circuit board, and improving the economic benefit of the enterprise.

The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

A processing method for a power amplifier slot, comprising the steps of:

(1) Setting the processing parameters of the pre-processed power amplifier slot on the copper block;

(2) performing a pass at a preset position of the copper block, so that a direction of the cutter is opposite to that of the cutter, and the first pre-groove is machined;

(3) The cutter passes at least one turn in the groove of the first pre-groove and obtains the power amplifier slot.
The processing method of the power amplifier slot according to claim 1, wherein, before the step (2) after the step (1), if the power amplifier slot is a single-slot deep design, the step (a1) is performed; The power amplifier slot is designed with multiple slots, and step (a2) is performed;

(a1), performing the step (2) and the step (3), and obtaining the power amplifier slot;

(a2) The power amplifier slot includes a first stepped slot and a second stepped slot, the depth of the first stepped slot being greater than the depth of the second stepped slot, including the following steps:

(a21) performing the step (2) and the step (3), processing the first stepped groove on the copper block;

(a22), including the following steps:

Performing a knife on the basis of the first stepped groove and processing a second pre-groove based on the preset position of the second stepped groove;

The cutter passes at least one turn in the groove of the second pre-groove and obtains the power amplifier slot.
The processing method of the power amplifier slot according to claim 2, wherein the second stepped groove is a discontinuous stepped groove, and when the second stepped groove is processed, the tool is finished in one pass and the obtained step is obtained. Second step slot.
The method of processing a power amplifier slot according to claim 3, wherein when the second stepped groove is machined, a position of a lower blade of the cutter and an inner wall of the first stepped groove are disposed at a predetermined interval.
The processing method of a power amplifier slot according to claim 1, wherein the tool is a milling cutter, and in the step (2) and the step (3), the tool is processed according to a preset overlap degree. .
The method of processing a power amplifier slot according to claim 5, wherein the tool has a tool diameter of 2 mm or 1.6 mm, and the tool has an overlap of 30% to 40%.
A method for processing a circuit board, comprising the steps of:

(A) processing a predetermined circuit layer on the substrate and completing the processing;

(B) processing a buried copper groove at a predetermined position of the substrate;

(C) placing a copper block in the buried copper bath, and laminating the copper block with the substrate to obtain a pre-formed plate;

(D) processing a power amplifier slot on the copper block, the power amplifier slot being processed by the processing method of the power amplifier slot according to any one of claims 1-6;

(E), the substrate is subjected to copper plating, and a wiring board is obtained.
The method of processing a circuit board according to claim 7, wherein before the step (D) after the step (C), the method further comprises:

Forming a first positioning portion on the pre-formed plate;

Forming a second positioning portion corresponding to the first positioning portion on a processing table surface of the machine tool;

And positioning the pre-formed plate and the processing table through the first positioning portion and the second positioning portion.
The method of processing a circuit board according to claim 7, wherein before the step (C), the method further comprises: performing a browning process on the copper block.
A circuit board characterized in that the circuit board is processed by the method of processing a circuit board according to any one of claims 7-9.