CN114666988A - Manufacturing method of PTH half-hole of PCB - Google Patents
Manufacturing method of PTH half-hole of PCB Download PDFInfo
- Publication number
- CN114666988A CN114666988A CN202210437947.3A CN202210437947A CN114666988A CN 114666988 A CN114666988 A CN 114666988A CN 202210437947 A CN202210437947 A CN 202210437947A CN 114666988 A CN114666988 A CN 114666988A
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- pth
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The embodiment of the invention provides a manufacturing method of a PTH half hole of a PCB, which comprises the steps of taking a semi-finished PCB, setting milling cutter parameters by taking a boundary line between a reserved region and a removed region of the PTH hole as a reference line to carry out primary routing processing on the PTH hole, enabling a cutter entry point of a milling cutter positioned on a first side hole wall of the PTH hole to be away from the reference line by a first preset distance, enabling a rotary cutter to travel along the reference line until the milling cutter moves out of the PTH hole by a third preset distance at an intersection point of a second side hole wall opposite to the first side hole wall on the PTH hole and the reference line on an orthographic projection distance from a reference line to a milling cutter axis on the reference line, turning upper and lower board surfaces to carry out secondary routing processing on the PCB, enabling the milling cutter to travel along the reference line from the outer side of the second side hole wall until the PTH hole is moved out through the first side hole wall, and enabling the turning direction of the milling cutter to rotate from the inside to the outside of the hole at the first side hole wall and the second side hole wall. According to the embodiment of the invention, the high-quality PTH half-hole is obtained by scientifically setting the distance position of the embedded cutter point relative to the datum line and the rotation direction of the milling cutter.
Description
Technical Field
The embodiment of the invention relates to the technical field of PCB processing, in particular to a manufacturing method of a PTH half hole of a PCB.
Background
In a PTH half-hole manufacturing process of an existing PCB, a burr copper wire is easy to remain on a hole wall after a PTH half-hole is formed, and burrs are not removed completely or even can cause bridge junction short circuit. The common method comprises the steps of drilling a PTH half hole for the second time, then carrying out dry film pasting for the second time, and finally removing burrs by etching again, wherein three additional treatment procedures are required in the PTH half hole manufacturing process, so that the processing time and cost are increased; and during etching, the copper sheet of the wall of the PTH half hole is easy to be damaged again due to side etching, so that the phenomena of infirm welding spots and insufficient welding appear in the subsequent welding process.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide a method for manufacturing a PTH half-hole of a PCB, which can reduce the generation of burrs on the hole wall and improve the quality of the prepared PTH half-hole.
In order to solve the above technical problem, an embodiment of the present invention provides the following technical solutions: a manufacturing method of a PTH half-hole of a PCB comprises the following steps:
obtaining a semi-finished PCB with PTH holes by adopting a traditional PCB manufacturing process, wherein the surface of the semi-finished PCB is removed of a dry film, redundant metal copper except a circuit on the semi-finished PCB is etched, and a tin-plated layer covering the circuit on the surface of the PCB is reserved;
the side plate of the PCB is faced upwards, milling cutter parameters are set by taking the straight line of the boundary line of the PTH hole area needing to be reserved and the PTH hole area needing to be removed as a datum line to carry out primary milling processing on the PTH hole area needing to be removed, the milling cutter is advanced into the PTH hole from an entry point outside a first sidewall wall of the PTH hole along an initial boundary at a first predetermined distance from the datum line, turning the milling cutter to the direction of the datum line at a position where a second preset distance is formed between an orthographic projection of the milling cutter to the axis of the milling cutter on the datum line and an intersection point of a second side hole wall opposite to the first side hole wall on the PTH hole and the datum line until a milled boundary of the milling cutter is overlapped with the datum line, turning the milling cutter to the direction of the datum line until the milling cutter moves out of the PTH hole by a third preset distance, and setting the turning direction of the milling cutter to enable the milling cutter to rotate from inside to outside of the PTH hole at the intersection point of the second side hole wall and the datum line;
turning the upper and lower board surfaces of the semi-finished PCB subjected to primary routing processing and then performing secondary routing processing, wherein when the secondary routing processing is performed, a milling cutter starts to move along the reference line from the outer side of the second side hole wall until the milling cutter moves out of the PTH hole through the first side hole wall, and the turning direction of the milling cutter is set so that the milling cutter rotates from inside to outside of the PTH hole at the intersection point of the first side hole wall and the reference line; and
and carrying out tin stripping treatment to remove the tin coating so as to obtain the PCB with the PTH half-hole.
Further, the first predetermined distance is 8mil to 12 mil.
Further, the second predetermined distance is 4 mils or more.
Further, the third distance is 2mil or more.
Further, when possess a plurality of hole centers and be in the PTH hole of collinear on the semi-manufactured goods PCB board, milling cutter every accomplishes one the first parallel sword of gong board processing of PTH hole is to shifting out corresponding PTH hole to third predetermined distance after, milling cutter orientation is kept away from the reference line direction turns to the line sword and is gone up to the border that milling cutter milled and remove with the reference line is repeated at a first distance again to with accomplish the first next adjacent next lateral hole wall of PTH hole that gong board processing was handled for the PTH hole carries out first gong board processing, until milling cutter accomplishes right the first gong board processing of all PTH holes on the semi-manufactured goods PCB board.
Further, the board upset carries out the secondary and gongs board processing about the semi-manufactured goods PCB board that possesses a plurality of hole centers and be in the PTH hole of collinear through the first gong board is handled, when carrying out the secondary and gong board processing, milling cutter follow each the second side pore wall outside in PTH hole begins to follow the reference line sword passes through each in proper order PTH hole until from each on the semi-manufactured goods PCB board the first side pore wall in PTH hole shifts out, accomplishes promptly right the secondary gong board processing in all PTH holes on the semi-manufactured goods PCB board.
Further, the tin stripping treatment adopts hydrogen ion concentration of 3.4-4.2mol/L and density of 1.24-1.4g/cm3The moving speed of the PCB in the tin stripping solution is 3.0-4.0 m/min.
And further, washing and drying the PCB subjected to the tin stripping treatment.
After the technical scheme is adopted, the embodiment of the invention at least has the following beneficial effects: according to the embodiment of the invention, firstly, a semi-finished PCB with a PTH hole is prepared through a traditional process, a dry film covered on the semi-finished PCB is removed, redundant copper on the surface of the PCB is etched away, and a tin-plated layer covered on a circuit is reserved, wherein the tin-plated layer has a certain protection effect on a copper sheet on the surface of the circuit, so that the copper sheet defect of the wall of the PTH hole caused by side etching is avoided, and the subsequent electrification of the circuit is influenced; and then setting milling cutter parameters by taking a straight line of a boundary line of the region needing to be reserved and the region needing to be removed of the PTH hole as a reference line to carry out primary routing treatment on the region needing to be removed of the PTH hole: firstly, the side plate of the PCB is faced upwards, a milling cutter starts to perform row cutting from a cutting point outside a first side hole wall of the PTH hole along an initial boundary which is away from a datum line by a first preset distance to enter the PTH hole, so that cutting burrs are prevented from remaining on the datum line and the forming quality of a PTH half hole is influenced, the row cutting is turned towards the datum line direction until the milling cutter moves out of the PTH hole by a third preset distance along the datum line when the orthographic projection of the axis of the milling cutter on the datum line is away from the intersection point of a second side hole wall opposite to the first side hole wall on the PTH hole and the datum line by a second preset distance until the milled boundary of the milling cutter is superposed with the datum line, and the turning of the milling cutter is set to rotate from inside to outside the PTH hole at the intersection point of the second side hole wall and the datum line, and milling cutter parameters are set by taking a boundary line as the datum line, the size control is more accurate, the first reserved distance is set on the first side wall, and burrs are prevented from being left on the boundary line; when secondary routing processing is carried out, the upper board surface and the lower board surface of the semi-finished PCB are turned over, a milling cutter starts to move along the datum line from the outer side of the second side hole wall until the milling cutter moves out of the PTH hole through the first side hole wall, and the turning direction of the milling cutter is set so that the milling cutter rotates from inside to outside of the PTH hole at the intersection point of the first side hole wall and the datum line, so that burrs are effectively prevented from being left on the inner wall of the PTH half hole; and finally, carrying out tin stripping treatment on the semi-finished PCB, and stripping the tin coating to obtain the PTH half-hole with no burr on the hole wall and complete copper coating.
Drawings
FIG. 1 is a schematic flow chart illustrating steps of an alternative embodiment of a method for fabricating PTH half holes of a PCB according to the present invention.
Fig. 2 is a schematic diagram of an initial board routing processing operation of an alternative embodiment of the method for manufacturing PTH half-holes of a PCB according to the present invention.
Fig. 3 is a schematic diagram of a secondary routing processing operation according to an alternative embodiment of the method for manufacturing PTH half holes of a PCB of the present invention.
Detailed Description
The present application will now be described in further detail with reference to the accompanying drawings and specific examples. It should be understood that the following illustrative embodiments and description are only intended to explain the present invention, and are not intended to limit the present invention, and features of the embodiments and examples in the present application may be combined with each other without conflict.
As shown in fig. 1-3, an alternative embodiment of the present invention provides a method for fabricating a PTH half-hole of a PCB, comprising the steps of:
s1: obtaining a semi-finished PCB with a PTH hole 1 by adopting a traditional PCB manufacturing process, wherein the surface of the semi-finished PCB is removed of a dry film, redundant metal copper except a circuit on the semi-finished PCB is etched, and a tin-plated layer covering the circuit on the surface of the PCB is reserved;
s2: the PCB board side plate faces upwards, milling cutter 3 parameters are set by taking a straight line of a boundary 2 of a PTH hole 1 area to be reserved 10 and an area to be removed 12 as a reference line, the area to be removed of the PTH hole 1 is subjected to primary milling, when primary milling is carried out, the milling cutter 3 enters the PTH hole 1 along an initial boundary 5 which is a first preset distance D1 away from the reference line 2 from a cutter entering point 4 outside a first side hole wall 14 of the PTH hole 1, and turns to a row cutter towards the direction of the reference line 2 at a second preset distance D2 from an intersection 6 of a second side hole wall 16 which is opposite to the first side hole wall 14 on the PTH hole 1 and the reference line 2 on an orthographic projection of an axle center 30 of the milling cutter 3 on the reference line 2 until the milling boundary of the milling cutter 3 is overlapped with the reference line 2, the milling cutter turns to move along the reference line 2 until the milling cutter 3 moves out of the PTH hole 1 by a third preset distance D3, setting the turning of the milling cutter 3 such that the milling cutter 3 is rotated from inside the hole to outside the hole at the intersection of the second side hole wall 16 and the reference line 2;
s3: turning the upper and lower board surfaces of the semi-finished PCB subjected to primary routing processing, and then performing secondary routing processing, wherein when the secondary routing processing is performed, a milling cutter 3 starts to move along the datum line 2 from the outer side of the second side hole wall 16 until the milling cutter moves out of the PTH hole 1 through the first side hole wall 14, and the turning direction of the milling cutter 3 is set so that the milling cutter 3 rotates from inside to outside of the PTH hole at the intersection point 7 of the first side hole wall 14 and the datum line 2; and;
s4: and carrying out tin stripping treatment to remove the tin coating so as to obtain the PCB with the PTH half-hole.
According to the embodiment of the invention, the semi-finished PCB with the PTH 1 is prepared by the traditional process, the dry film covered on the semi-finished PCB is removed, the redundant copper on the surface of the PCB is etched away, and the tin-plated layer covered on the circuit is reserved, so that the tin-plated layer has a certain protection effect on the copper sheet on the surface of the circuit, and the phenomenon that the copper sheet on the hole wall of the PTH 1 is damaged due to side etching to influence the subsequent electrification of the circuit is avoided; and then setting parameters of a milling cutter 3 by taking a straight line of a boundary line 2 between the PTH hole 1 to-be-reserved area 10 and the area 12 to be removed as a reference line to perform primary milling processing on the area 12 to be removed of the PTH hole 1: firstly, the side plate of the PCB is faced upwards, the milling cutter 3 enters the PTH hole 1 from a cutting point 4 outside a first side hole wall 14 of the PTH hole 1 along an initial boundary 5 which is a first preset distance D1 away from the reference line 2, cutting burrs are prevented from remaining on the reference line 2, and PTH half-hole forming quality is influenced, the forward projection of the axis 30 of the milling cutter 3 on the reference line 2 is turned towards the reference line 2 at a second preset distance D2 from an intersection 6 of a second side hole wall 16 opposite to the first side hole wall 14 on the PTH hole 1 and the reference line 2 until the milled boundary of the milling cutter 3 is coincident with the reference line 2, the milling cutter is turned along the reference line 2 until the milling cutter 3 is moved out of the PTH hole 1 by a third preset distance D3, and the turning direction of the milling cutter 3 is rotated from the inside of the hole to the outside of the hole at the intersection 6 of the second side hole wall 16 and the reference line 2, setting parameters of the milling cutter 3 by taking the boundary line 2 as a reference line, so that the size control is more accurate, and setting a first reserved distance D1 on the first side wall 14 for avoiding burrs from remaining on the boundary line 2; when secondary routing processing is carried out, the upper plate surface and the lower plate surface of the semi-finished PCB are turned, the milling cutter 3 starts to move along the datum line 2 from the outer side of the second side hole wall 16 until the milling cutter moves out of the PTH hole 1 through the first side hole wall 14, and the turning direction of the milling cutter 3 is set so that the milling cutter 3 rotates from inside to outside of the hole at the intersection point 7 of the first side hole wall 14 and the datum line 2, and burrs are effectively prevented from being left on the inner wall of the PTH half hole; and finally, carrying out tin stripping treatment on the semi-finished PCB, and stripping the tin coating to obtain the PTH half-hole with no burr on the hole wall and complete copper coating.
In an alternative embodiment of the present invention, as shown in FIG. 3, the first predetermined distance D1 is between 8 mils and 12 mils. This embodiment is through with original boundary 5 with distance between 2 is set to 8mil-12mil, makes the income knife point 4 that easily produces the burr fully keep away from 2 reference line avoids the burr to remain in the pore wall of PTH half-hole, and reserves sufficient workable face for the second time gong board processing design, reduces the operation degree of difficulty.
In an alternative embodiment of the present invention, as shown in FIG. 3, the second predetermined distance D2 is greater than 4 mils. This embodiment is through 3 axle centers 30 of milling cutter are in orthographic projection distance on the datum line 2 second side pore wall 16 of PTH hole 1 with when 6 distance at the crossing of datum line 2 is greater than or equal to 4mil, towards 2 directions on the datum line turn to the line sword until 3 mill the border that removes with datum line 2 coincidence are removed for the gong the longer line sword distance is reserved to PTH hole 1 second side pore wall 16, avoids changing the cutter that the line sword direction brought and rocks and cause gong board incision coarse, promotes the stability when milling cutter gong cuts second side pore wall 16, reduces the burr and produces the possibility.
In an alternative embodiment of the present invention, the third distance D3 is greater than 2 mils. In the embodiment, the milling cutter 3 mills the boundary removed and the reference line 2 coincides with each other and then follows the reference line 2 to the cutter until the milling cutter 3 moves out of the PTH hole more than 12mil, the initial board milling processing of one PTH complete hole is completed, and the board surface with the third distance D3 can avoid burrs remaining on the hole wall of the PTH half hole when the cutter stops.
In an alternative embodiment of the present invention, as shown in fig. 3, when a plurality of PTH holes 1 having the same straight hole center are provided on the semi-finished PCB, after the milling cutter 3 completes the primary routing processing of each PTH hole 1 and performs parallel cutting until the PTH holes 1 corresponding to the same straight line are moved out by a third predetermined distance D3, the milling cutter 3 turns to the direction away from the reference line 2 until the boundary milled by the milling cutter 3 is separated from the reference line 2 by a first distance D1, and then the primary routing processing is repeated for the next PTH hole 1 adjacent to the second side hole wall 16 of the PTH hole 1 on which the primary routing processing is completed until the milling cutter 3 completes the primary routing processing of all PTH holes 1 on the semi-finished PCB.
This embodiment is through after every 1 first time gong board in completion PTH hole handles, milling cutter 3 shifts out correspondingly PTH hole 1 is outer until third predetermined distance D3, and the orientation is kept away from 2 direction adjustments of datum line 3 line sword direction of milling cutter until 3 mill the border that removes with datum line 2 is apart from first distance D1, and then repeated right with accomplish the next that second side pore wall 16 of PTH hole 1 that first gong board handled is adjacent PTH hole 1 carries out first gong board and handles, and milling cutter 3 can accomplish in proper order right the first gong board of all PTH holes 1 on the semi-manufactured goods PCB board is handled, promotes machining efficiency.
In an alternative embodiment of the present invention, as shown in fig. 3, the upper and lower board surfaces of the semi-finished PCB board having a plurality of PTH holes 1 with the same straight line at the center of the hole are turned over for performing a secondary routing process, and when performing the secondary routing process, the milling cutter 3 performs the secondary routing process on all the PTH holes 1 on the semi-finished PCB board by moving along the reference line 2 from the outer side of the second side hole wall 16 of each PTH hole 1 and sequentially passing through each PTH hole 1 until moving out from the first side hole wall 14 of each PTH hole 1 on the semi-finished PCB board. In the embodiment, a milling cutter 3 is milled to remove a boundary and is attached to the reference line 2, the milling cutter sequentially penetrates through each PTH 1 from the outer side of the second side hole wall 16 of each PTH 1 along the reference line 2 until the milling cutter is moved out of the first side hole wall 14 of each PTH 1 on the semi-finished PCB, once linear feeding is performed, secondary routing processing of all PTH holes 1 is completed, and the operation is simple and rapid.
In an optional embodiment of the invention, the tin stripping treatment adopts hydrogen ion concentration of 3.4-4.2mol/L and density of 1.24-1.4g/cm3The moving speed of the PCB in the tin stripping solution is 3.0-4.0 m/min. This example was carried out by using a hydrogen ion concentration of 3.4 to 4.2M and a density of 1.24 to 1.4g/cm3The tin stripping solution is used for stripping tin of the PCB, the moving speed of the PCB in the tin stripping solution is set to be 3.0-4.0m/min, the tin stripping effect is guaranteed, meanwhile, the corrosion effect on a circuit copper layer is reduced, the defect of copper sheets on the wall of a PTH half hole due to over etching is avoided, in the specific implementation process, the moving speed is preferably 3.5m/min, and the tin stripping effect is optimal.
In an optional embodiment of the invention, the PCB subjected to the tin stripping treatment is washed by water and dried. This embodiment carries out washing and stoving to the PCB board after the tin removal is handled, in time washs the remaining tin removal water on the PCB board, and the copper layer on the protection circuit avoids tin removal water oxidative corrosion.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A method for manufacturing a PTH half-hole of a PCB is characterized by comprising the following steps:
obtaining a semi-finished PCB with a PTH hole by adopting a traditional PCB manufacturing process, wherein a dry film on the surface of the semi-finished PCB is removed, redundant metal copper except a circuit on the semi-finished PCB is etched, and a tin-plated layer covering the circuit on the surface of the PCB is reserved;
the side plate of the PCB is faced upwards, milling cutter parameters are set by taking the straight line of the boundary line of the PTH hole area needing to be reserved and the PTH hole area needing to be removed as a datum line to carry out primary milling processing on the PTH hole area needing to be removed, the milling cutter is advanced into the PTH hole from an entry point outside a first sidewall wall of the PTH hole along an initial boundary at a first predetermined distance from the datum line, turning the milling cutter to the direction of the reference line at a position where a second preset distance is formed between the orthographic projection of the milling cutter to the axis of the milling cutter on the reference line and the intersection point of a second side hole wall opposite to the first side hole wall on the PTH hole and the reference line until the milled boundary of the milling cutter is overlapped with the reference line, turning the milling cutter to the direction of the reference line until the milling cutter moves out of the PTH hole to a third preset distance, and setting the turning direction of the milling cutter to enable the milling cutter to rotate from inside to outside of the PTH hole at the intersection point of the second side hole wall and the reference line;
turning the upper and lower board surfaces of the semi-finished PCB subjected to primary routing processing and then performing secondary routing processing, wherein when the secondary routing processing is performed, a milling cutter starts to move along the reference line from the outer side of the second side hole wall until the milling cutter moves out of the PTH hole through the first side hole wall, and the turning direction of the milling cutter is set so that the milling cutter rotates from inside to outside of the PTH hole at the intersection point of the first side hole wall and the reference line; and
and carrying out tin stripping treatment to remove the tin coating so as to obtain the PCB with the PTH half-hole.
2. The method of claim 1, wherein the first predetermined distance is 8mil to 12 mil.
3. The method of claim 1, wherein the second predetermined distance is greater than or equal to 4 mils.
4. The method of claim 1, wherein the third distance is greater than 2 mils.
5. The method of claim 1, wherein when the semi-finished PCB board has a plurality of PTH holes having the same straight centers, after the milling cutter performs the primary routing process for each PTH hole and moves out of the corresponding PTH hole to a third predetermined distance, the milling cutter turns to the traveling direction away from the reference line until the milling cutter removes the boundary of the PTH hole and the reference line at a first distance, and then repeats the primary routing process for the next PTH hole adjacent to the second side hole wall of the PTH hole on which the primary routing process is performed until the milling cutter completes the primary routing process for all PTH holes on the semi-finished PCB board.
6. The method of claim 5, wherein the primary routing process is performed by turning upside down the upper and lower surfaces of the semi-finished PCB having a plurality of PTH holes with aligned hole centers to perform a secondary routing process, and when performing the secondary routing process, the milling cutter passes through each of the PTH holes in sequence from the outside of the second side hole wall of each of the PTH holes along the reference line until moving out of the first side hole wall of each of the PTH holes on the semi-finished PCB, thereby completing the secondary routing process for all the PTH holes on the semi-finished PCB.
7. The method of claim 1, wherein the tin stripping process uses a hydrogen ion concentration of 3.4-4.2mol/L and a density of 1.24-1.4g/cm3The moving speed of the PCB in the tin stripping solution is 3.0-4.0 m/min.
8. The method of claim 7, wherein the PCB after the tin stripping treatment is washed with water and dried.
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| CN202210437947.3A CN114666988A (en) | 2022-04-25 | 2022-04-25 | Manufacturing method of PTH half-hole of PCB |
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| CN202210437947.3A CN114666988A (en) | 2022-04-25 | 2022-04-25 | Manufacturing method of PTH half-hole of PCB |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
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| CN113395839A (en) * | 2021-06-16 | 2021-09-14 | 珠海中京电子电路有限公司 | Efficient forming method for improving half-hole burrs of printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
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