CN111836472A - Method for improving burrs of etched half-hole gong board - Google Patents
Method for improving burrs of etched half-hole gong board Download PDFInfo
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- CN111836472A CN111836472A CN202010702720.8A CN202010702720A CN111836472A CN 111836472 A CN111836472 A CN 111836472A CN 202010702720 A CN202010702720 A CN 202010702720A CN 111836472 A CN111836472 A CN 111836472A
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- Prior art keywords
- hole
- etching
- etched
- board
- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention belongs to the field of half-hole plates, in particular to a method for improving the burrs of half-hole gong plates after etching, aiming at the problem that the products are bad and need to be repaired or scrapped due to the burrs or the residual copper wires which are not completely etched in the existing half-hole gong plates after etching, the following scheme is proposed, and the method comprises the following steps: s1: drawing a picture, routing a half hole: plating a layer of tin on the routing board surface, and then performing a routing half-hole procedure; s2: primary etching: carrying out primary etching, attaching the milled half-hole to the hole opening or the copper sheet in the hole to be etched, and etching part of residual copper rolled into the hole during milling, so that the copper sheet can be completely etched by liquid medicine exchange during 2 times of etching; s3: removing the film: the method adjusts the alkaline etching operation mode, can improve the condition that no burrs and copper wire residues are left in the etched semi-hole, achieves the complete semi-hole shape, and is convenient for the normal use of the next process.
Description
Technical Field
The invention relates to the technical field of half-hole plates, in particular to a method for improving burrs of half-hole gongs after etching.
Background
The normal half-hole plate process is to use a plate milling mode to mill a half hole before etching and stripping after pattern electricity, and then to etch the stripping/etching/palladium removing/tin stripping of the line after milling.
After normal etching, burrs exist in the semi-holes or copper wire residues are not completely etched, so that products are poor and need to be repaired or scrapped.
Disclosure of Invention
The invention aims to solve the defect that products are poor and need to be repaired or scrapped due to burrs or residual copper wires which are not completely etched in etched semi-holes in the prior art, and provides a method for improving the burrs of etched semi-hole gongs.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for improving burrs of etched half-hole gongs comprises the following steps:
s1: drawing a picture, routing a half hole: plating a layer of tin on the routing board surface, and then performing a routing half-hole procedure;
s2: primary etching: carrying out primary etching, attaching the milled half-hole to the hole opening or the copper sheet in the hole to be etched, and etching part of residual copper rolled into the hole during milling, so that the copper sheet can be completely etched by liquid medicine exchange during 2 times of etching;
s3: removing the film: removing the film by using a film removing liquid, and after removing the film, mainly checking whether the fine-pitch independent lines are completely removed;
s4: and (3) secondary etching: etching the plate after film stripping to form a circuit pattern, and completely etching the half-hole copper sheet;
s5: removing palladium: placing the board subjected to the secondary etching into a palladium removing groove for palladium removal;
s6: stripping tin: stripping tin at the normal tin stripping speed of-0.5 m/min;
s7: washing and drying: and (4) washing and drying the tin-removed board, so that burrs of the etched half-hole routing board can be improved.
Preferably, in S2, etching is performed at a speed of 1m/min, the milled half holes are attached to the holes or the copper sheets in the holes are etched, and the residual copper rolled into the holes due to milling is etched, so that the copper sheets are completely etched by exchanging the chemical liquid for 2 times of etching.
Preferably, in the step S3, the film stripping speed is not lower than 3.5 m/min.
Preferably, in S6, the first inspection is performed after the tin stripping, and if the tin stripping speed is abnormal, it is necessary to determine whether the copper sheet is completely etched before the tin stripping, otherwise, the residual copper sheet exists in the half-hole after the tin stripping.
Preferably, in S4, the etching process is performed with a first step to check that the copper skin of the half-hole needs to be etched away, and the etching depth of the side surface of the half-hole is checked, and if there is an abnormality, the etching speed needs to be adjusted.
Preferably, in S7, the plate is placed on the grid plate in the cleaning tank, and water is sprayed to the plate through the spray head to clean the plate, and meanwhile, the cleaning water is filtered and collected.
Preferably, in S7, the cleaned board is placed in a drying device, the drying temperature is 55 ℃, and the drying time is 10 min.
Preferably, in S7, the hot and humid air generated by drying is discharged through a duct, the duct is wound around the outside of the water tank, and the hot air heats the water in the water tank to recycle the waste heat.
Compared with the prior art, the invention has the beneficial effects that:
1. an etching flow is added before film stripping etching, parameters and operation are convenient, efficiency and quality are not affected, and residual copper and flash in a half hole can be improved;
2. the addition of the process can improve the quality abnormity of the half-hole plate of a special product, greatly improve the reject ratio and repair and scrap later;
3. the operation is simple, no auxiliary material is added, the existing equipment and liquid medicine are used, and only a small flow is added in the operation process;
the invention adjusts the alkaline etching operation mode, can improve the condition that no flash and copper wire residue are abnormal in the half-hole after etching, achieves the complete half-hole shape and is convenient for the normal use of the next process.
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
A method for improving burrs of etched half-hole gongs comprises the following steps:
s1: drawing a picture, routing a half hole: plating a layer of tin on the routing board surface, and then performing a routing half-hole procedure;
s2: primary etching: etching for one time at the speed of 1m/min, attaching the milled half-hole to the hole opening or copper skin in the hole to be etched, and etching part of residual copper rolled into the hole during milling, so that the copper skin can be completely etched by liquid medicine exchange during 2 times of etching; because the half-hole is electrically protected by tin, the tin resists alkaline etching, if etching is carried out at a normal etching speed, copper sheets with gongs are rolled into the half-hole, the chemical liquid is blocked to etch away all the copper, the copper sheets are left to form burrs, if the etching speed is too slow, the rolled copper sheets can be etched away, but the copper sheets with the gongs can be over-etched, and therefore, the purpose of etching the gongs half-hole copper sheets at one time is to etch away the gongs.
S3: removing the film: removing the film by using the film removing liquid, and after the film is removed, mainly checking whether the fine-pitch independent lines are completely removed or not, wherein the film removing speed is not lower than 3.5 m/min;
s4: and (3) secondary etching: etching the film-removed board to form a circuit pattern, completely etching the half-hole copper sheet, mainly checking that the half-hole copper sheet needs to be etched away when the etching needs to be performed as a first part, checking the etching depth of the side surface of the half-hole, and adjusting the etching speed if the etching is abnormal;
s5: removing palladium: placing the board subjected to the secondary etching into a palladium removing groove for palladium removal;
s6: stripping tin: the tin stripping is carried out at the speed of-0.5 m/min, the first piece of inspection is required after the tin stripping, if the tin stripping speed is abnormal, the tin stripping speed needs to be adjusted, so whether the copper sheet is completely etched or not needs to be confirmed before the tin stripping, otherwise, residual copper sheets exist in the half-hole after the tin stripping;
s7: washing and drying: place the board on the grid board in the cleaning tank, wash to the board water spray through the shower nozzle, filter simultaneously and collect washing water, place the board after will wasing in drying equipment, drying temperature is 55 ℃, and the stoving time is 10min, and the damp and hot air that produces with drying passes through the pipeline and discharges, and the pipeline winding is in the outside of water tank, heats the water in the water tank through steam, carries out recycle to the waste heat, can improve and have the flash after the etching of half hole gong board.
By adopting the method, the defects that no flash and copper wire residue are generated in the etched half-hole can be improved, the complete shape of the half-hole is achieved, and the normal use of the next process is facilitated.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A method for improving burrs of etched half-hole gongs is characterized by comprising the following steps:
s1: drawing a picture, routing a half hole: plating a layer of tin on the routing board surface, and then performing a routing half-hole procedure;
s2: primary etching: carrying out primary etching, attaching the milled half-hole to the hole opening or the copper sheet in the hole to be etched, and etching part of residual copper rolled into the hole during milling, so that the copper sheet can be completely etched by liquid medicine exchange during 2 times of etching;
s3: removing the film: removing the film by using a film removing liquid, and after removing the film, mainly checking whether the fine-pitch independent lines are completely removed;
s4: and (3) secondary etching: etching the plate after film stripping to form a circuit pattern, and completely etching the half-hole copper sheet;
s5: removing palladium: placing the board subjected to the secondary etching into a palladium removing groove for palladium removal;
s6: stripping tin: stripping tin at the normal tin stripping speed of-0.5 m/min;
s7: washing and drying: and (4) washing and drying the tin-removed board, so that burrs of the etched half-hole routing board can be improved.
2. The method for improving flash after etching of a half-hole routing board according to claim 1, wherein in S2, a single etching is performed at a speed of 1m/min to etch away copper sheets attached to the holes or holes of the half-holes that have been routed, and to etch away residual copper partially rolled into the holes during routing, so as to facilitate the complete etching of the copper sheets by using chemical liquid during 2 etching operations.
3. The method of claim 1, wherein in step S3, the film stripping speed is not less than 3.5 m/min.
4. The method as claimed in claim 1, wherein in step S6, after stripping tin, a first inspection is performed, and if the stripping speed is abnormal, it is necessary to adjust the stripping speed, so that before stripping tin, it is necessary to determine whether the copper layer is completely etched, otherwise, the copper layer remains in the half via after stripping tin.
5. The method of claim 1, wherein in step S4, the etching process is performed with a first step to check that the copper layer of the half via is etched away and to check the etching depth of the side of the half via, and if there is an abnormality, the etching speed is adjusted.
6. The method for improving flash after etching of a half-hole gong board as claimed in claim 1, wherein in step S7, the board is placed on the grid plate in the cleaning tank, and water is sprayed to the board through the nozzle for cleaning, and the cleaning water is filtered and collected.
7. The method for improving waviness after etching of a half-hole gong board of claim 1, wherein in step S7, the cleaned board is placed in a drying device, wherein the drying temperature is 55 ℃ and the drying time is 10 min.
8. The method of claim 1, wherein in step S7, the hot and humid air generated by drying is exhausted through a pipe wound around the outside of the water tank, and the hot air heats the water in the water tank to recycle the residual heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010702720.8A CN111836472A (en) | 2020-07-21 | 2020-07-21 | Method for improving burrs of etched half-hole gong board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010702720.8A CN111836472A (en) | 2020-07-21 | 2020-07-21 | Method for improving burrs of etched half-hole gong board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111836472A true CN111836472A (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010702720.8A Pending CN111836472A (en) | 2020-07-21 | 2020-07-21 | Method for improving burrs of etched half-hole gong board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114666988A (en) * | 2022-04-25 | 2022-06-24 | 科惠白井(佛冈)电路有限公司 | Manufacturing method of PTH half-hole of PCB |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2309338B (en) * | 1996-01-17 | 1999-09-08 | Belfield Mfg Ltd | A circuit board production process |
| US6044550A (en) * | 1996-09-23 | 2000-04-04 | Macdermid, Incorporated | Process for the manufacture of printed circuit boards |
| CN101854779A (en) * | 2010-06-04 | 2010-10-06 | 惠州中京电子科技股份有限公司 | Production process of metallized semi-pore |
| CN110248475A (en) * | 2019-06-10 | 2019-09-17 | 江门崇达电路技术有限公司 | A method of removal PCB metallized semi-pore burr |
-
2020
- 2020-07-21 CN CN202010702720.8A patent/CN111836472A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2309338B (en) * | 1996-01-17 | 1999-09-08 | Belfield Mfg Ltd | A circuit board production process |
| US6044550A (en) * | 1996-09-23 | 2000-04-04 | Macdermid, Incorporated | Process for the manufacture of printed circuit boards |
| CN101854779A (en) * | 2010-06-04 | 2010-10-06 | 惠州中京电子科技股份有限公司 | Production process of metallized semi-pore |
| CN110248475A (en) * | 2019-06-10 | 2019-09-17 | 江门崇达电路技术有限公司 | A method of removal PCB metallized semi-pore burr |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114666988A (en) * | 2022-04-25 | 2022-06-24 | 科惠白井(佛冈)电路有限公司 | Manufacturing method of PTH half-hole of PCB |
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Application publication date: 20201027 |