CN113395839A - Efficient forming method for improving half-hole burrs of printed circuit board - Google Patents
Efficient forming method for improving half-hole burrs of printed circuit board Download PDFInfo
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- CN113395839A CN113395839A CN202110666351.6A CN202110666351A CN113395839A CN 113395839 A CN113395839 A CN 113395839A CN 202110666351 A CN202110666351 A CN 202110666351A CN 113395839 A CN113395839 A CN 113395839A
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- circuit board
- hole
- forming method
- routing
- drilling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a high-efficiency forming method for improving half-hole burrs of a printed circuit board, which relates to the technical field of circuit boards, and mainly changes the programming of a traditional numerical control forming main shaft into clockwise and anticlockwise rotation by improving the shape of a routing knife, so that the rotation direction of the routing knife can be changed according to the advancing direction of the routing knife, thereby achieving the purposes of improving the burrs, improving the cutting effect of the routing knife, routing the half-hole groove and the shape together, thoroughly improving the phenomena of copper wire rolling, burr, upwarping and peeling on the hole wall, producing the half-hole groove and the shape together, reducing the deviation problem caused by the difference of drilling and forming precision, effectively ensuring the relative consistency of the left half-hole and the right half-hole on the same unit, ensuring the accuracy and the precision of the drilling, removing films and impurities by one-time processing forming, thoroughly improving the problem of the half-hole ink residue blocking of the half-hole, and further avoiding the need of stop point solder mask or secondary solder mask process, greatly improves the solder resist production efficiency, shortens the flow and the processing period, improves the production efficiency and reduces the variation of the production flow.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an efficient forming method for improving half-hole burrs of a printed circuit board.
Background
Printed circuit board metal half-hole (slot) definition: the PCB is characterized in that the hole diameter is smaller and is generally more than or equal to 0.6mm, the plate thickness is thin and is generally between 0.6 and 1.2mm, most of the PCB is used on a carrier plate and is used as a daughter board of a mother board, the PCB is welded with the mother board and pins of components through the semi-metallized holes, and if the semi-metallized holes are poor, when a plug-in manufacturer welds, weak welding pins and false welding can be caused, and even bridging short circuit between two pins can be caused.
Traditional circuit board surface drilling half-hole is handled, because no matter be brill or gong processing, the direction of rotation of its main shaft is clockwise, when the cutter processing is to the point that is close to the pore wall, because of porous wall supports, can prevent effectively that production copper thorn perk, remain, and when the cutter processing is to the point of keeping away from the pore wall, pore wall copper does not have any adhesive force to support, when the cutter moves forward, influenced by external force, downthehole metallization layer will curl along with cutter direction of rotation, produce copper thorn perk, remain, traditional handicraft adopts the secondary operation shaping simultaneously, make circuit board flow cycle increase, the possibility of damage increases, be unfavorable for in-service use.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an efficient forming method for improving half-hole burrs of a printed circuit board, and solves the problems that the traditional circuit board routing tool is single in rotation direction and the surface of the circuit board is easy to damage due to long processing period.
In order to achieve the purpose, the invention is realized by the following technical scheme: a high-efficiency forming method for improving half-hole burrs of a printed circuit board comprises the following steps:
sp 1: drilling, namely cutting the surface of the circuit board through a milling cutter, wherein the rotation direction of the milling cutter is consistent with the advancing direction of the milling cutter;
sp 2: performing full-board electroplating, namely performing comprehensive electroplating on metal copper on the surface of the circuit board after drilling, so that copper films cover the inner wall and the back surface of the circuit board after drilling;
sp 3: transferring and electroplating the outer layer pattern, aligning the target pattern on the surface of the circuit board with the surface of the circuit board, and attaching the pattern to the surface of the circuit board through electroplating;
sp 4: secondary drilling, namely drilling and removing burring holes in the positions of the drill holes on the surface of the circuit board;
sp 5: stripping and etching, namely removing the exposed surface copper layer on the surface of the circuit board by adopting an etching process;
sp 6: removing tin and welding resistance, and carrying out adhesion of a green welding resistance film on the surface of the circuit board by adopting current;
sp 7: surface treatment, namely processing the lines on the surface of the circuit board by adopting laser recording;
sp 8: routing the appearance, removing the copper layer and the solder mask on the surface of the drilled hole once, and carrying out rotary routing production by routing a half-hole groove and the appearance together.
Preferably, the rotation direction of the gong knife is anticlockwise and clockwise, the rotation direction of the gong knife is changed into clockwise and anticlockwise rotation from programming of the numerical control forming spindle, and the rotation direction of the gong knife is adjusted according to the advancing direction of the gong knife.
Preferably, the bore diameter of the drill hole is 0.8 +/-0.02 mm, and the thickness of the circuit board is 1.0 +/-0.1 mm.
Preferably, during the routing, the copper layer on the surface of the drilled hole is subjected to rough routing, the copper sheet in the drilled hole 1/2 is removed, and the fine routing of the copper sheet in the drilled hole is performed by a fine-tooth routing knife.
Preferably, the surface of the circuit board is subjected to dust removal and cleaning before the solder mask, the surface of the circuit board is kept dry and clean, and the thickness of the green solder mask of the solder mask is 20 μm.
Preferably, the rotation direction of the gong shape entering the gong knife is the same as the advancing direction of the gong knife, and the outer wall of the gong knife is abutted against the inner wall of the drilled hole.
Preferably, the length of the burr hole of the secondary drilling is 1/2 of the hole diameter of the drilling, and the offset angle of the burr hole is 3 degrees.
The invention provides an efficient forming method for improving half-hole burrs of a printed circuit board, which has the following beneficial effects:
1. according to the invention, the shape of the gong-cutter is improved, the programming of the traditional numerical control forming main shaft is changed into clockwise and anticlockwise rotation, and the rotation direction of the gong-cutter can be changed according to the advancing direction of the gong-cutter, so that the burr is improved, the cutting effect of the gong-cutter is improved, the half-hole groove and the appearance of the gong-cutter are gong out together, and the phenomena of copper wire coiling, burr, tilting and peeling of the hole wall are thoroughly improved.
2. According to the invention, the gong half-hole groove and the shape are produced together, so that the deviation problem caused by the difference of drilling and forming precision is reduced, the relative consistency of the left half-hole and the right half-hole of the same unit can be effectively ensured, and the drilling precision and accuracy are ensured.
3. The invention adopts one-step processing and forming to remove the film and impurities, thoroughly improves the problem of hole blocking caused by residual half-hole solder resist ink, does not need a point screen printing or secondary solder resist flow, greatly improves the solder resist production efficiency, shortens the flow and the processing period, improves the production efficiency and reduces the production flow variation.
Drawings
FIG. 1 is a drawing of the molding method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
as shown in fig. 1, a high-efficiency forming method for improving half-hole burrs of a printed circuit board includes the following steps:
sp 1: drilling, namely cutting the surface of the circuit board through a milling cutter, wherein the rotation direction of the milling cutter is consistent with the advancing direction of the milling cutter;
sp 2: performing full-board electroplating, namely performing comprehensive electroplating on metal copper on the surface of the circuit board after drilling, so that copper films cover the inner wall and the back surface of the circuit board after drilling;
sp 3: transferring and electroplating the outer layer pattern, aligning the target pattern on the surface of the circuit board with the surface of the circuit board, and attaching the pattern to the surface of the circuit board through electroplating;
sp 4: secondary drilling, namely drilling and removing burring holes in the positions of the drill holes on the surface of the circuit board;
sp 5: stripping and etching, namely removing the exposed surface copper layer on the surface of the circuit board by adopting an etching process;
sp 6: removing tin and welding resistance, and carrying out adhesion of a green welding resistance film on the surface of the circuit board by adopting current;
sp 7: surface treatment, namely processing the lines on the surface of the circuit board by adopting laser recording;
sp 8: routing the appearance, removing the copper layer and the solder mask on the surface of the drilled hole once, and carrying out rotary routing production by routing a half-hole groove and the appearance together.
The rotation direction of the routing knife is anticlockwise and clockwise, the rotation direction of the routing knife is changed into clockwise and anticlockwise rotation from programming of a numerical control forming main shaft, the rotation direction of the routing knife is adjusted according to the advancing direction of the routing knife, the traditional half-hole manufacturing mode is that the routing knife always rotates clockwise, but the advancing direction of the routing knife has clockwise and anticlockwise minutes, when the rotation direction of the routing knife is consistent with the advancing direction of the routing knife, stress can be counteracted and burrs cannot be generated by cutting due to the fact that the routing knife has contact points with the half-hole, but when the rotation direction of the routing knife is inconsistent with the advancing direction of the routing knife, the routing knife does not have contact points with the half-hole, burrs are generated by cutting due to the effect of the stress, the rotation direction of the routing knife can be changed according to the advancing direction of the routing knife mainly by improving the routing knife shape, programming of the traditional numerical control forming main shaft is changed into clockwise and anticlockwise rotation, thereby achieving the purposes of improving burr generation and improving the cutting effect of the gong cutter, leading a half-hole groove and the shape of the gong to be gong out together, thoroughly improving the phenomena of copper wire rolling, burr, upwarping and peeling of a hole wall, leading the hole diameter of a drilled hole to be 0.8 +/-0.02 mm and leading the thickness of a circuit board to be 1.0 +/-0.1 mm, firstly carrying out rough gong treatment on a copper layer on the surface of the drilled hole during the gong shape, removing a copper sheet in 1/2 in the drilled hole, carrying out fine gong treatment on the copper sheet in the drilled hole through a fine-tooth gong cutter, carrying out dust removal and cleaning on the surface of the circuit board before resistance welding, keeping the surface of the circuit board dry and clean, leading the thickness of a green resistance welding film to be 20 mu m, leading the rotation direction of the gong shape entering the gong cutter to be the same as the advancing direction of the gong cutter, leading the outer wall of the gong cutter to be abutted against the inner wall of the drilled hole, leading the length of a burr hole of the burr to be 1/2 of the burr hole diameter, leading the burr hole offset angle to be 3 degrees, leading the burr to the burr when the existing gong cutter to be over-half-hole, the left and right sides of the same unit have large size deviation of the residual half holes due to expansion and contraction of the plate, large deviation of the size of the left and right half holes of the same unit and large influence of the hole position precision of the drilled hole when the half-hole groove is milled once by etching, the structural strength of the plate is insufficient after the flow of the milling half-hole groove is increased, the plate is easy to break, the processing difficulty of the working procedure after etching is increased, when the half-hole groove is milled, a milling cutter directly processes a copper surface, copper sheets are easy to wind, dry film sol is caused, the problem of residual copper caused by incomplete film removal is solved, the semi-hole cloak of the milling before forming is too large, the milling cannot be completely etched while etching, the milling half-hole groove and the appearance are produced together, the deviation problem caused by the difference of the drilling and forming precision is reduced, the relative consistency of the left and right half holes of the same unit can be effectively ensured, the precision and the accuracy of the drilled hole are ensured, the existing flow is long and the low efficiency are brought due to the flow of the semi-hole groove, the quality, the cost and the delivery period are not competitive, the problem of hole blocking caused by residual printing ink in half-hole solder resistance is thoroughly solved by adopting one-step processing and forming to remove films and impurities, the point screen printing or secondary solder resistance process is not needed, the solder resistance production efficiency is greatly improved, the process and the processing period are shortened, the production efficiency is improved, the production process variation is reduced, centralized transportation is carried out after the one-step gong appearance processing, the number of times of operation preservation and transportation among the processes in the traditional process is reduced, the risk of scratching the surface of the circuit board is reduced, and the surface of the circuit board is effectively protected.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. However, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a reference structure" does not exclude the presence of other similar elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A high-efficiency forming method for improving half-hole burrs of a printed circuit board is characterized by comprising the following steps:
sp 1: drilling, namely cutting the surface of the circuit board through a milling cutter, wherein the rotation direction of the milling cutter is consistent with the advancing direction of the milling cutter;
sp 2: performing full-board electroplating, namely performing comprehensive electroplating on metal copper on the surface of the circuit board after drilling, so that copper films cover the inner wall and the back surface of the circuit board after drilling;
sp 3: transferring and electroplating the outer layer pattern, aligning the target pattern on the surface of the circuit board with the surface of the circuit board, and attaching the pattern to the surface of the circuit board through electroplating;
sp 4: secondary drilling, namely drilling and removing burring holes in the positions of the drill holes on the surface of the circuit board;
sp 5: stripping and etching, namely removing the exposed surface copper layer on the surface of the circuit board by adopting an etching process;
sp 6: removing tin and welding resistance, and carrying out adhesion of a green welding resistance film on the surface of the circuit board by adopting current;
sp 7: surface treatment, namely processing the lines on the surface of the circuit board by adopting laser recording;
sp 8: routing the appearance, removing the copper layer and the solder mask on the surface of the drilled hole once, and carrying out rotary routing production by routing a half-hole groove and the appearance together.
2. The efficient forming method for improving half-hole burrs of the printed circuit board according to claim 1, wherein the efficient forming method comprises the following steps: the rotation direction of the gong knife is anticlockwise and clockwise, the rotation direction of the gong knife is changed into clockwise and anticlockwise rotation from programming of the numerical control forming spindle, and the rotation direction of the gong knife is adjusted according to the advancing direction of the gong knife.
3. The efficient forming method for improving half-hole burrs of the printed circuit board according to claim 1, wherein the efficient forming method comprises the following steps: the aperture of the drilling hole is 0.8 +/-0.02 mm, and the thickness of the circuit board is 1.0 +/-0.1 mm.
4. The efficient forming method for improving half-hole burrs of the printed circuit board according to claim 1, wherein the efficient forming method comprises the following steps: during routing, firstly, rough routing treatment is carried out on a copper layer on the surface of a drilled hole, a copper sheet at 1/2 inside the drilled hole is removed, and fine routing treatment of the copper sheet inside the drilled hole is carried out through a fine-tooth routing knife.
5. The efficient forming method for improving half-hole burrs of the printed circuit board according to claim 1, wherein the efficient forming method comprises the following steps: and before resistance welding, the surface of the circuit board is subjected to dust removal and cleaning, the surface of the circuit board is kept dry and clean, and the thickness of the green resistance welding film for resistance welding is 20 micrometers.
6. The efficient forming method for improving half-hole burrs of the printed circuit board according to claim 1, wherein the efficient forming method comprises the following steps: the rotation direction of the gong shape entering the gong cutter is the same as the advancing direction of the gong cutter, and the outer wall of the gong cutter is abutted to the inner wall of the drilled hole.
7. The efficient forming method for improving half-hole burrs of the printed circuit board according to claim 1, wherein the efficient forming method comprises the following steps: the length of the flash hole of the secondary drilling is 1/2 of the hole diameter of the drilling, and the offset angle of the flash hole is 3 degrees.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110666351.6A CN113395839A (en) | 2021-06-16 | 2021-06-16 | Efficient forming method for improving half-hole burrs of printed circuit board |
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| CN202110666351.6A CN113395839A (en) | 2021-06-16 | 2021-06-16 | Efficient forming method for improving half-hole burrs of printed circuit board |
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| CN113395839A true CN113395839A (en) | 2021-09-14 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466530A (en) * | 2021-12-30 | 2022-05-10 | 鹤山市中富兴业电路有限公司 | Method for improving PCB metallized semi-hole flash |
| CN114666988A (en) * | 2022-04-25 | 2022-06-24 | 科惠白井(佛冈)电路有限公司 | Manufacturing method of PTH half-hole of PCB |
| CN114900968A (en) * | 2022-05-25 | 2022-08-12 | 奥士康科技股份有限公司 | Method for improving gong and flash burrs of TRX power amplifier groove of base station |
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| US20080251386A1 (en) * | 2007-04-12 | 2008-10-16 | Ting-Hao Lin | Manufacturing Method Of Non-Etched Circuit Board |
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN209627787U (en) * | 2018-09-30 | 2019-11-12 | 广州弘高科技股份有限公司 | A kind of anti-flash structure of metallized semi orifice plate |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
-
2021
- 2021-06-16 CN CN202110666351.6A patent/CN113395839A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080251386A1 (en) * | 2007-04-12 | 2008-10-16 | Ting-Hao Lin | Manufacturing Method Of Non-Etched Circuit Board |
| CN104768338A (en) * | 2015-04-28 | 2015-07-08 | 清远市富盈电子有限公司 | PCB edge semi-hole metallization manufacturing process |
| CN209627787U (en) * | 2018-09-30 | 2019-11-12 | 广州弘高科技股份有限公司 | A kind of anti-flash structure of metallized semi orifice plate |
| CN112752437A (en) * | 2020-12-11 | 2021-05-04 | 深圳市景旺电子股份有限公司 | Forming method of metallized half hole and PCB (printed circuit board) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114466530A (en) * | 2021-12-30 | 2022-05-10 | 鹤山市中富兴业电路有限公司 | Method for improving PCB metallized semi-hole flash |
| CN114666988A (en) * | 2022-04-25 | 2022-06-24 | 科惠白井(佛冈)电路有限公司 | Manufacturing method of PTH half-hole of PCB |
| CN114900968A (en) * | 2022-05-25 | 2022-08-12 | 奥士康科技股份有限公司 | Method for improving gong and flash burrs of TRX power amplifier groove of base station |
| CN114900968B (en) * | 2022-05-25 | 2024-05-14 | 奥士康科技股份有限公司 | Method for improving milling burr of TRX power amplification groove of base station |
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