CN113395842A - Method for manufacturing circuit board with suspended circuit layer - Google Patents
Method for manufacturing circuit board with suspended circuit layer Download PDFInfo
- Publication number
- CN113395842A CN113395842A CN202110629402.8A CN202110629402A CN113395842A CN 113395842 A CN113395842 A CN 113395842A CN 202110629402 A CN202110629402 A CN 202110629402A CN 113395842 A CN113395842 A CN 113395842A
- Authority
- CN
- China
- Prior art keywords
- suspended
- circuit
- layer
- circuit layer
- hollowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing a circuit board with a suspended circuit layer, which sequentially comprises the following steps: cutting, inner-layer circuit, pressing, drilling, electroplating, outer-layer circuit, solder mask, mechanical hollowing, laser hollowing, gold melting, molding and post-processing; the mechanical hollowing is to determine a preset suspended line needing to be suspended in the inner-layer line, wherein hollow grooves are milled on the upper surface and the lower surface of the preset suspended line in a depth-controlled manner by adopting a milling cutter, and the residual thicknesses of media on the upper surface and the lower surface of the preset suspended line are both 0.05 mm-0.12 mm; the laser hollowing is carried out, the excess thickness is ablated through laser, and a suspended circuit layer is formed by presetting a suspended circuit; and the gold melting is carried out on the surface of the suspended circuit layer. The method is easy to operate, can improve the manufacturing precision of the suspended circuit layer, ensures that the upper surface and the lower surface of the suspended circuit layer are hollow, simultaneously ensures the integrity of the suspended circuit layer, is favorable for reducing the cost, and improves the quality and the production efficiency of the circuit board.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for manufacturing a circuit board with a suspended circuit layer.
Background
In the field of circuit boards, in order to reduce signal interference of materials on components and reduce interference of any medium on circuits, partial basic layers of the circuit boards are hollowed out, and inner-layer circuits are exposed. The circuit board is applied to the fields of aviation, military industry and the like, the signal transmission requirement of the circuit board is higher, and therefore the improvement of the quality of the hollowed-out circuit is of great significance.
In the prior art, the inner-layer circuit is exposed through routing grooves by a milling cutter in the manufacturing process of the hollowed-out circuit, but the precision is difficult to control in the manufacturing process, the integrity of the hollowed-out circuit layer is easy to damage, and the qualified product rate of the circuit board is low. In addition, a plurality of process flows are involved in the circuit board manufacturing process, the integrity of the hollowed-out circuit is difficult to ensure, and particularly, the circuit board manufacturing process is used for manufacturing a double-sided hollowed-out suspended circuit layer. Some hollow circuit boards are complicated in manufacturing process, for example, a mode of milling boards for multiple times is adopted to mill a hollow groove, and the improvement of production efficiency is not facilitated.
Disclosure of Invention
The invention provides a method for manufacturing a circuit board with a suspended circuit layer, which aims to solve the problems that the existing suspended circuit layer is complex to manufacture, low in precision and difficult to ensure the integrity of the suspended circuit layer.
A method for manufacturing a circuit board with a suspended circuit layer sequentially comprises the following steps: cutting, inner-layer circuit, pressing, drilling, electroplating, outer-layer circuit, solder mask, mechanical hollowing, laser hollowing, gold melting, molding and post-processing;
the mechanical hollowing is to determine a preset suspended line needing to be suspended in the inner-layer line, wherein hollow grooves are milled on the upper surface and the lower surface of the preset suspended line in a depth-controlled manner by adopting a milling cutter, and the residual thicknesses of media on the upper surface and the lower surface of the preset suspended line are both 0.05 mm-0.12 mm; the depth control milling process has higher precision, and ensures that the residual thickness is not too large to influence the subsequent laser effect.
The laser hollowing is carried out, the excess thickness is ablated through laser, and a suspended circuit layer is formed by presetting a suspended circuit; the two sides of the suspended circuit layer are hollow, so that the inner circuit layer is exposed, the interference of a medium is reduced, and the signal transmission effect is improved. The laser ablation precision of the laser is high, and the suspended circuit layer is ensured not to be damaged.
And the gold melting is carried out on the surface of the suspended circuit layer.
Optionally, before the gold plating, gold plating pretreatment is performed on the suspended circuit layer, and the gold plating pretreatment includes sand blasting and/or chemical microetching of the suspended circuit layer. The chemical pretreatment can improve the effect of gold melting, and the damage to the suspended circuit layer can be avoided by adopting sand blasting and/or chemical microetching.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for manufacturing a circuit board with a suspended circuit layer, and the manufactured suspended circuit layer can improve the signal transmission speed of the circuit board and reduce interference; the method is easy to operate, and through the steps of mechanical hollowing and laser hollowing, the manufacturing precision of the suspended circuit layer can be improved, the upper surface and the lower surface of the suspended circuit layer are guaranteed to be hollow, the integrity of the suspended circuit layer is guaranteed, the cost is reduced, and the quality and the production efficiency of the circuit board are improved.
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below.
A method for manufacturing a circuit board with a suspended circuit layer sequentially comprises the following steps: cutting, inner layer circuit, pressing, drilling, electroplating, outer layer circuit, solder mask, mechanical hollowing, laser hollowing, gold melting, molding and post-processing.
Cutting the multilayer substrate into preset sizes;
the inner layer circuit is used for manufacturing the inner layer circuit of the substrate positioned on the inner layer of the circuit board after being manufactured;
laminating, namely laminating the multilayer substrates, and laminating the multilayer substrates together to form a multilayer board;
drilling, namely drilling the multilayer board to form a positioning hole and a through hole for conducting the circuits of all layers;
electroplating, namely carrying out whole-board electroplating on the multilayer board;
the outer layer circuit is used for manufacturing the outer layer circuit on the surface of the multilayer board;
performing solder mask, namely performing solder mask treatment on the surface of the multilayer board;
mechanical hollowing, namely determining a preset suspended line needing to be suspended in the inner-layer line, deeply milling hollow grooves on the upper surface and the lower surface of the preset suspended line by adopting a milling cutter, and keeping the residual thickness of a medium on the upper surface and the lower surface of the preset suspended line to be 0.05-0.12 mm;
laser hollowing, namely ablating the residual thickness by laser, and presetting a suspended circuit to form a suspended circuit layer;
and mechanical hollowing and laser hollowing are carried out on the circuit board after solder mask, so that damage to the suspended circuit layer in the solder mask process is avoided, and the integrity of the suspended circuit layer is ensured. The thickness of the laser ablation of the existing laser process is limited, the depth control milling is performed firstly, then the laser is performed, the cost is reduced, the precision of the hollow groove can be improved, the upper surface and the lower surface of the suspended circuit layer are hollow, the suspended circuit layer is prevented from being damaged, and the quality of a manufactured circuit board is ensured.
And (4) carrying out gold melting on the surface of the suspended circuit layer. Before the gold plating, the gold plating pretreatment is carried out on the suspended circuit layer, and the gold plating pretreatment comprises sand blasting and/or chemical micro-etching on the suspended circuit layer. Conventional mechanical brush polish can cause the damage to unsettled circuit layer, adopts sandblast and/or chemical microetching, carries out clean and alligatoring to unsettled circuit layer's surface, can improve the effect behind the gold. In one embodiment, the suspended circuit layer is subjected to sand blasting and then chemical microetching.
The invention provides a method for manufacturing a circuit board with a suspended circuit layer, and the manufactured suspended circuit layer can improve the signal transmission speed of the circuit board and reduce interference; the method is easy to operate, and through the steps of mechanical hollowing and laser hollowing, the manufacturing precision of the suspended circuit layer can be improved, the upper surface and the lower surface of the suspended circuit layer are guaranteed to be hollow, the integrity of the suspended circuit layer is guaranteed, the cost is reduced, and the quality and the production efficiency of the circuit board are improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (2)
1. A method for manufacturing a circuit board with a suspended circuit layer is characterized in that: the method sequentially comprises the following steps: cutting, inner-layer circuit, pressing, drilling, electroplating, outer-layer circuit, solder mask, mechanical hollowing, laser hollowing, gold melting, molding and post-processing;
the mechanical hollowing is to determine a preset suspended line needing to be suspended in the inner-layer line, wherein hollow grooves are milled on the upper surface and the lower surface of the preset suspended line in a depth-controlled manner by adopting a milling cutter, and the residual thicknesses of media on the upper surface and the lower surface of the preset suspended line are both 0.05 mm-0.12 mm;
the laser hollowing is carried out, the excess thickness is ablated through laser, and a suspended circuit layer is formed by presetting a suspended circuit;
and the gold melting is carried out on the surface of the suspended circuit layer.
2. A method for fabricating a circuit board having a suspended circuit layer as claimed in claim 1, wherein: the gold plating pretreatment comprises sand blasting and/or chemical micro-etching on the suspended circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110629402.8A CN113395842A (en) | 2021-06-07 | 2021-06-07 | Method for manufacturing circuit board with suspended circuit layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110629402.8A CN113395842A (en) | 2021-06-07 | 2021-06-07 | Method for manufacturing circuit board with suspended circuit layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113395842A true CN113395842A (en) | 2021-09-14 |
Family
ID=77618361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110629402.8A Pending CN113395842A (en) | 2021-06-07 | 2021-06-07 | Method for manufacturing circuit board with suspended circuit layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113395842A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116600485A (en) * | 2023-06-13 | 2023-08-15 | 深南电路股份有限公司 | PCB processing method, controller, medium and equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| CN104661436A (en) * | 2015-02-06 | 2015-05-27 | 深圳市五株科技股份有限公司 | Printed circuit board blind slot processing method |
| US20150257267A1 (en) * | 2014-03-06 | 2015-09-10 | Mutual-Tek Industries Co., Ltd. | Printed circuit board and method thereof |
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN110190389A (en) * | 2019-06-03 | 2019-08-30 | 深圳市景旺电子股份有限公司 | A kind of antenna plate and preparation method thereof |
-
2021
- 2021-06-07 CN CN202110629402.8A patent/CN113395842A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821551A (en) * | 2012-08-28 | 2012-12-12 | 沪士电子股份有限公司 | Manufacturing method for heavy-copper printed circuit boards |
| US20150257267A1 (en) * | 2014-03-06 | 2015-09-10 | Mutual-Tek Industries Co., Ltd. | Printed circuit board and method thereof |
| CN104661436A (en) * | 2015-02-06 | 2015-05-27 | 深圳市五株科技股份有限公司 | Printed circuit board blind slot processing method |
| CN109743846A (en) * | 2018-09-27 | 2019-05-10 | 常州市武进三维电子有限公司 | The manufacture craft of the hollow-out flexible wiring board of new-energy automobile |
| CN110190389A (en) * | 2019-06-03 | 2019-08-30 | 深圳市景旺电子股份有限公司 | A kind of antenna plate and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116600485A (en) * | 2023-06-13 | 2023-08-15 | 深南电路股份有限公司 | PCB processing method, controller, medium and equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210914 |