CN110402025A - Blind slot processing method with insert hole - Google Patents
Blind slot processing method with insert hole Download PDFInfo
- Publication number
- CN110402025A CN110402025A CN201810379170.3A CN201810379170A CN110402025A CN 110402025 A CN110402025 A CN 110402025A CN 201810379170 A CN201810379170 A CN 201810379170A CN 110402025 A CN110402025 A CN 110402025A
- Authority
- CN
- China
- Prior art keywords
- insert hole
- blind slot
- liquid medicine
- processing method
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The blind slot processing method with insert hole that the present invention relates to a kind of, including the following steps: carrying out welding resistance consent to the insert hole in blind slot before S1, pressing influences the quality of wiring board to prevent from leading to liquid medicine of hiding in finishing operations electroplating liquid medicine inlet channel insert hole；S2, resin welding resistance consent is carried out to blind slot；S3, it is taken off using the mode of preboring aperture except the solder mask in insert hole；Plug-in unit bore region is carried out before S4, heavy copper to print blue glue protection, potassium permanganate liquid medicine stings the solder mask in erosion insert hole aperture and is deposited with copper when preventing heavy copper.The invention enables wiring boards to have obtained significant increase in quality and efficiency, has established technical foundation for batch production.
Description
Technical field
The present invention relates to wiring board art, especially a kind of blind slot processing method with insert hole.
Background technique
For the plate that only design surface mounts in step groove, processing technology relative maturity；And for there is insert hole to design
Step blind slot, then technique is relative complex, is easy to face step groove Tibetan medicine water or blue glue enters the hole not puzzlement such as easy-clear.
Routinely technique makes step groove, blue glue protective plug-in unit hole stagnation pressure again is printed before pressing, due to blue in bonding processes
Glue is squeezed into hole by high temperature and pressure, and etching is taken off blue glue in lid metapore and not can be removed；Seriously affect internal surface of hole processing and welding matter
Amount.
After high temperature is laminated, blue glue shrinks to form microgap blue glue in step slot, liquid medicine of hiding in insert hole after heavy copper,
Film is easy when outer-layer circuit, quality not can guarantee.
Using blue glue protective plug-in unit hole is printed before step groove pressing, blue glue is squeezed into hole after high temperature and pressure, after lid is taken off in etching
Blue glue not can be removed in hole；Seriously affect hole wall surface processing and welding quality.
Summary of the invention
Based on this, it is necessary to provide a kind of blind slot processing method with insert hole, including the following steps:
Welding resistance consent is carried out to the insert hole in blind slot before S1, pressing, to prevent finishing operations electroplating liquid medicine inlet channel insert hole
Inside lead to liquid medicine of hiding, influences the quality of wiring board；
S2, resin welding resistance consent is carried out to blind slot；
S3, it is taken off using the mode of preboring aperture except the solder mask in insert hole；
Plug-in unit bore region is carried out before S4, heavy copper to print blue glue protection, potassium permanganate liquid medicine stings erosion insert hole hole when preventing heavy copper
The solder mask of mouth is simultaneously deposited with copper.
Wherein, in internal layer production process, insert hole and outer layer be it is interconnected, when plating, liquid medicine can enter slotting
In part hole, liquid medicine is caused to be hidden in insert hole, cleaning is difficult；Assist side pressing working procedure line of the present invention carries out insert hole
The processing of welding resistance consent, can effectively stop liquid medicine and enters in insert hole, to ensure the quality of wiring board；The prior art is pressing
Preceding multi-purpose blue glue protective plug-in unit hole, after the bonding processes of high temperature and pressure, blue glue can be squeezed into insert hole, after lid is taken off in etching
Blue glue in hole is difficult to remove, and seriously affects hole wall surface processing and welding quality；When to prevent heavy copper, the liquid medicine such as potassium permanganate
Hole hole and the aperture deposited copper metal of erosion insert hole are stung, the present invention is using the blue glue protective plug-in unit porose area of printing.
Preferably, after S1 insert hole carries out welding resistance consent, the pre-baked S2 that carries out again is carried out to the welding resistance plug of blind slot to wiring board
Hole.
Further, pre-baked temperature is 75 DEG C, and the time is 40 minutes.
After carrying out the processing of welding resistance consent to insert hole, then it is pre-baked to wiring board progress, solder mask in insert hole can be accelerated
Setting rate, the welding resistance consent effect of insert hole is influenced when preventing blind slot from carrying out welding resistance consent, while blind slot tree can also be accelerated
The curing rate of resin when rouge consent improves production efficiency.
Preferably, in step S3, solder mask is drilled through using the drilling tool that cutter diameter is less than plug-in unit bore dia, it, will after drilling through
It is immersed in liquid medicine to take off and remove solder mask.
Further, the diameter of the drilling tool is 0.45mm smaller than insert hole.
Since insert hole has carried out the protection of welding resistance consent before pressing, outer layer needs stripping hole internal resistance solder paste after taking off lid
Ink；To accelerate solder mask in hole to strip effect, spy uses preboring aperture technique, i.e., cutter diameter will be used to be less than insert hole aperture
The drilling tool of 0.45mm drills through solder mask, and the contact area for drilling through rear solder mask and liquid medicine increases, and takes off and removes conducive to liquid medicine immersion
Solder mask.
Preferably, heavy copper process is transferred in step S4, after blue adhesive curing again and carries out heavy copper and plate electricity.
Further, the time of blue adhesive curing is 30 minutes.
Plug-in unit bore region is carried out before heavy copper to print blue glue protection, potassium permanganate liquid medicine stings erosion insert hole hole when preventing heavy copper
The solder mask of mouth is simultaneously deposited with copper, carries out heavy copper after blue adhesive curing again, and blue glue is avoided to be destroyed in heavy copper process.
The principle of the present invention, effect are further illustrated below with reference to above-mentioned technical proposal:
The present invention is protected before pressing using welding resistance consent by optimizing to the step blind slot processing technology designed with insert hole
Shield, preboring aperture strips welding resistance again after outer layer takes off lid, and the technique processing of step groove plug-in part blind hole, effectively solution hole may be implemented
Film exception is fallen in built-in liquid medicine and outside line, while evading blue glue and entering the problems such as hole not can be removed, and obtains in quality and efficiency
Significant increase has established technical foundation for batch production.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, below in conjunction with embodiment, the invention will be described in further detail:
Embodiment 1
Welding resistance consent is carried out to the insert hole in blind slot before S1, pressing, to prevent finishing operations electroplating liquid medicine inlet channel insert hole
Inside lead to liquid medicine of hiding, influences the quality of wiring board；
S2, resin welding resistance consent is carried out to blind slot；
S3, it is taken off using the mode of preboring aperture except the solder mask in insert hole；
Plug-in unit bore region is carried out before S4, heavy copper to print blue glue protection, potassium permanganate liquid medicine stings erosion insert hole hole when preventing heavy copper
The solder mask of mouth is simultaneously deposited with copper.
Embodiment 2
Welding resistance consent is carried out to the insert hole in blind slot before S1, pressing, to prevent finishing operations electroplating liquid medicine inlet channel insert hole
Inside lead to liquid medicine of hiding, influences the quality of wiring board；
S2, wiring board is carried out pre-baked, pre-baked temperature is 75 DEG C, and the time is 40 minutes.；
S3, resin welding resistance consent is carried out to blind slot；
S4, it is taken off using the mode of preboring aperture except the solder mask in insert hole；
Plug-in unit bore region is carried out before S5, heavy copper to print blue glue protection, potassium permanganate liquid medicine stings erosion insert hole hole when preventing heavy copper
The solder mask of mouth is simultaneously deposited with copper.
Embodiment 3
Welding resistance consent is carried out to the insert hole in blind slot before S1, pressing, to prevent finishing operations electroplating liquid medicine inlet channel insert hole
Inside lead to liquid medicine of hiding, influences the quality of wiring board；
S2, wiring board is carried out pre-baked, pre-baked temperature is 75 DEG C, and the time is 40 minutes.；
S3, resin welding resistance consent is carried out to blind slot；
S4, solder mask is drilled through using the drilling tool that cutter diameter is less than plug-in unit bore dia, after drilling through, is immersed in liquid medicine to take off
Except solder mask, the diameter of the drilling tool is 0.45mm smaller than insert hole；
Plug-in unit bore region is carried out before S5, heavy copper to print blue glue protection, potassium permanganate liquid medicine stings erosion insert hole hole when preventing heavy copper
The solder mask of mouth is simultaneously deposited with copper.
Embodiment 4
Welding resistance consent is carried out to the insert hole in blind slot before S1, pressing, to prevent finishing operations electroplating liquid medicine inlet channel insert hole
Inside lead to liquid medicine of hiding, influences the quality of wiring board；
S2, wiring board is carried out pre-baked, pre-baked temperature is 75 DEG C, and the time is 40 minutes.；
S3, resin welding resistance consent is carried out to blind slot；
S4, solder mask is drilled through using the drilling tool that cutter diameter is less than plug-in unit bore dia, after drilling through, is immersed in liquid medicine to take off
Except solder mask, the diameter of the drilling tool is 0.45mm smaller than insert hole；
Plug-in unit bore region is carried out before S5, heavy copper to print blue glue protection, potassium permanganate liquid medicine stings erosion insert hole hole when preventing heavy copper
The solder mask of mouth is simultaneously deposited with copper, wherein is transferred to heavy copper process after blue adhesive curing again and carries out heavy copper and plate electricity.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (7)
1. a kind of blind slot processing method with insert hole, characterized in that it comprises the following steps:
Welding resistance consent is carried out to the insert hole in blind slot before S1, pressing, to prevent finishing operations electroplating liquid medicine inlet channel insert hole
Inside lead to liquid medicine of hiding, influences the quality of wiring board；
S2, resin welding resistance consent is carried out to blind slot；
S3, it is taken off using the mode of preboring aperture except the solder mask in insert hole；
Plug-in unit bore region is carried out before S4, heavy copper to print blue glue protection, potassium permanganate liquid medicine stings erosion insert hole hole when preventing heavy copper
The solder mask of mouth is simultaneously deposited with copper.
2. the blind slot processing method according to claim 1 with insert hole, which is characterized in that S1 insert hole carries out welding resistance
After consent, the pre-baked S2 that carries out again is carried out to the welding resistance consent of blind slot to wiring board.
3. the blind slot processing method according to claim 2 with insert hole, which is characterized in that pre-baked temperature is 75
DEG C, the time is 40 minutes.
4. the blind slot processing method according to claim 1 with insert hole, which is characterized in that in step S3, using knife
The drilling tool that diameter is less than plug-in unit bore dia drills through solder mask, after drilling through, is immersed in liquid medicine to take off and remove solder mask.
5. the blind slot processing method according to claim 4 with insert hole, which is characterized in that the drilling tool it is straight
Diameter is 0.45mm smaller than insert hole.
6. the blind slot processing method according to claim 1 with insert hole, which is characterized in that in step S4, blue glue is solid
Heavy copper process is transferred to after change again and carries out heavy copper and plate electricity.
7. the blind slot processing method according to claim 6 with insert hole, which is characterized in that the time of blue adhesive curing is
30 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810379170.3A CN110402025A (en) | 2018-04-25 | 2018-04-25 | Blind slot processing method with insert hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810379170.3A CN110402025A (en) | 2018-04-25 | 2018-04-25 | Blind slot processing method with insert hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110402025A true CN110402025A (en) | 2019-11-01 |
Family
ID=68322146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810379170.3A Pending CN110402025A (en) | 2018-04-25 | 2018-04-25 | Blind slot processing method with insert hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110402025A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573504A (en) * | 2021-07-23 | 2021-10-29 | 深圳市牧泰莱电路技术有限公司 | Manufacturing method for protecting stepped groove device hole in PCB production process |
| CN114340179A (en) * | 2022-01-20 | 2022-04-12 | 江西中络电子有限公司 | Novel processing method of smart handheld education printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196703A (en) * | 2000-01-14 | 2001-07-19 | Sony Corp | Printed wiring board and manufacturing method for the same |
| CN101697660A (en) * | 2009-10-28 | 2010-04-21 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN107466170A (en) * | 2017-07-24 | 2017-12-12 | 惠州市金百泽电路科技有限公司 | There is the printed circuit board processing method that insert hole designs in a kind of step groove |
-
2018
- 2018-04-25 CN CN201810379170.3A patent/CN110402025A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196703A (en) * | 2000-01-14 | 2001-07-19 | Sony Corp | Printed wiring board and manufacturing method for the same |
| CN101697660A (en) * | 2009-10-28 | 2010-04-21 | 深南电路有限公司 | Method for processing stepped groove bottom patterned circuit board |
| CN107466170A (en) * | 2017-07-24 | 2017-12-12 | 惠州市金百泽电路科技有限公司 | There is the printed circuit board processing method that insert hole designs in a kind of step groove |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573504A (en) * | 2021-07-23 | 2021-10-29 | 深圳市牧泰莱电路技术有限公司 | Manufacturing method for protecting stepped groove device hole in PCB production process |
| CN114340179A (en) * | 2022-01-20 | 2022-04-12 | 江西中络电子有限公司 | Novel processing method of smart handheld education printed circuit board |
| CN114340179B (en) * | 2022-01-20 | 2024-01-30 | 江西中络电子有限公司 | Processing method of intelligent palm education printed circuit board |
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Legal Events
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Applicant after: Guangzhou Guanghe Technology Co.,Ltd. Address before: 510730 22 BAOYING South Road, Guangzhou bonded area, Guangdong Applicant before: DELTON TECHNOLOGY (GUANGZHOU) Inc. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191101 |