CN205611065U - Ladder golden finger PCB - Google Patents
Ladder golden finger PCB Download PDFInfo
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- CN205611065U CN205611065U CN201620206237.XU CN201620206237U CN205611065U CN 205611065 U CN205611065 U CN 205611065U CN 201620206237 U CN201620206237 U CN 201620206237U CN 205611065 U CN205611065 U CN 205611065U
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Abstract
The utility model relates to a ladder golden finger PCB, PCB include the inlayer daughter board of compriseing inlayer circuit and prepreg to and set up the first outer circuit and the outer circuit of second in prepreg top and inlayer circuit below respectively and still install including, the inlayer on the layer line golden finger on the road and hinder and weld, prepreg is last to be milled has the slotted hole, and with the inlayer hinder weld with golden finger component ladder groove structure, preparation method: (1 )Preparation inlayer circuit, golden finger, golden finger lead wire and inlayer hinder and weld on the copper foil, (2 )Mill a slotted hole that corresponds the golden finger at prepreg, layer line lamination on the road including placing, (3 )Fill full hindering by the slotted hole on the prepreg, inlayer with silica gel and weld the ladder groove structure of constituteing with the golden finger, (4 )It hinders and welds to make outer circuit and skin, (5 )Take out silica gel, to golden finger electricity gold, (6 )The golden finger lead wire cuts off. Compared with the prior art, the utility model discloses preparation technology is simple, PCB high quality of making etc..
Description
Technical field
This utility model relates to wiring board manufacturing technology field, especially relates to a kind of ladder golden finger PCB and preparation method thereof.
Background technology
Development and multifunction demand along with electronics techniques, communication apparatus and network develop to high-speed high capacity direction the wiring board as electronic device carrier be enhance product performance, the packing density of product, reduce product volume and weight, simultaneously in order to strengthen area of dissipation and strengthen the safety of surface element device, for mounting related components or fixing product, improve integrated or up to signal shielding the effect of overall product.In the face of communication product high speed, the demand of high information quantity, need to design recessed step district and fix vigour part, step trough design is arisen at the historic moment, and needs to install special functional module, or sinking components and parts, it is achieved overall package volume miniaturization in step trough.The differentiation design of difference in functionality module, reduces the cross talk effects of signal transmission, for assurance function module or sinking components and parts installation quality, needs designed lines figure bottom step trough, makes welding resistance and ladder golden finger.
The most conventional production procedure to PCB step trough is low flowing prepreg pressing and controlled depth milling groove, this production procedure limitation is high and stability is very poor, being easily generated bottom land lamination cull, slotted eye deformation, copper on circuit in groove, groove interior lines path loss are bad, the problems such as on solder shorts, golden finger gold is bad in groove.
Chinese patent ZL200910307869.X discloses the preparation method of a kind of pcb board with step trough, and including preparing daughter board one and daughter board two, and motherboard is prepared in daughter board one and daughter board two pressing；Wherein daughter board one is to laminate conjunction through interior-layer layer to be formed, and daughter board two at least forms green oil protective layer after interior-layer layer laminates conjunction on the position of step trough to be formed.The step preparing motherboard is: places pad on the green oil protective layer of daughter board two, is layered on daughter board two by daughter board one, adds dielectric layer between two daughter boards, around pad and green oil protective layer；The daughter board part folded is carried out pressing and forms motherboard；Holes drilled through on motherboard, through heavy copper, plating；Last groove milling on motherboard, the position of milling to pad, unnecessary PCB part is taken out together with pad, forms step trough.
Utility model content
Defect that the purpose of this utility model is contemplated to overcome above-mentioned prior art to exist and a kind of ladder golden finger PCB and preparation method thereof is provided.
The purpose of this utility model can be achieved through the following technical solutions:
A kind of ladder golden finger PCB, including the internal layer daughter board being made up of with the prepreg being arranged on internal layer circuit internal layer circuit, and be separately positioned on above prepreg and the first outer-layer circuit below internal layer circuit and the second outer-layer circuit, internal layer welding resistance it is also equipped with on golden finger on internal layer circuit, mill out grooved hole on described prepreg, and constitute step trough structure with internal layer welding resistance and golden finger；
Also it is coated with in the first described outer-layer circuit in outer layer welding resistance, the first outer-layer circuit and outer layer welding resistance all with the slotted eye exposing step trough structure.
Between described internal layer circuit and the second outer-layer circuit, between the first outer-layer circuit and prepreg, it is equipped with dielectric layer.
Described dielectric layer is the RO4000 substrate medium layer of thickness 160～170 μm.
The thickness of described internal layer welding resistance is 5～10 μm；
The thickness of described prepreg is 85～165 μm.
The end of described golden finger side rounding outwardly.The structure of the rounding of golden finger not only facilitates functional module or sinking components and parts to be fit in ladder golden finger, the most also facilitates the removal completely to gold finger lead in upper gold and subsequent technique.
The gold finger lead being arranged on golden finger end includes that the son lead-in wire of length 0.08～0.1mm and female lead-in wire, one end of described son lead-in wire connect golden finger, and the other end connects mother's lead-in wire；
The junction that described female lead-in wire goes between with son, the exterior angle of female lead-in wire is semi arch structure.Son lead-in wire and the female two-part structure gone between design and the semi arch structure of female lead-in wire of junction, not only further facilitated the upper gold to golden finger, be also convenient for the removal to whole gold finger lead simultaneously.
The preparation method of ladder golden finger PCB, comprises the following steps:
A () makes internal layer circuit, golden finger and gold finger lead on Copper Foil, and arrange internal layer welding resistance on golden finger；
B () uses CNC molding mode to mill out the slotted eye of corresponding golden finger at prepreg, be then placed within internal layer circuit overlaminate；
After (c) prepreg curing molding, by the full step trough structure being made up of the slotted eye on prepreg, internal layer welding resistance and golden finger of silicone filler；
D () continues to make the first outer-layer circuit and the second outer-layer circuit respectively at prepreg and Copper Foil, and arrange outer layer welding resistance in the first outer-layer circuit；
E () takes out the silica gel in step trough structure, to golden finger electricity gold；
F () cuts off gold finger lead with CNC molding mode, i.e. obtain final product.
Internal layer welding resistance described in step (a) is formed by the local of pad without the SMT silk-screen in step trough.The internal layer welding resistance of silk-screen can be effectively protected internal layer circuit, prevents groove interior in SMT solder shorts, and then in protector, SMT components and parts are damaged by outside, reaches components and parts and embeds the effects such as interior.
In step (b): before lamination, the monolateral length of the slotted eye that prepreg mills out is more than the monolateral length of the slotted eye of prepreg in final product.This is in order to, during to lamination, the flowing space reserved by the gummosis of prepreg.
The monolateral 0.5mm that grows up of the slotted eye of prepreg in single side ratio final product of the slotted eye that prepreg mills out before lamination.
Compared with prior art, this utility model has the advantage that
(1) simple to operate, it is not necessary to individually to train, it is not necessary to use controlled depth milling groove, reduce equipment and rely on.
(2) bottom land lamination cull it is prevented effectively from, the problems such as slotted eye deformation, copper on circuit in groove, groove interior lines path loss are bad, gold is bad on golden finger: ibid, being preferably described separately above-mentioned advantage is to be realized by which kind of measure in this utility model.
(3) set up on golden finger by internal layer welding resistance, it is possible to effectively prevent solder shorts.
(4) by toward filling gel in step trough after lamination, silica gel has and realizes seamless filled, good airproof performance at high-temperature and high-pressure conditions, be prone to follow-up taking-up advantage, can effectively stop outer circuit sink the processes such as copper plating time, the generation of the phenomenon of circuit and internal layer welding resistance in liquid medicine infiltration pollution groove, thus guarantee fund's finger quality.
(5) with controlled depth milling groove Comparatively speaking, the mode energy precisely indifference molding of the CNC processing and forming that this utility model uses, thus avoid the problem that the easy milling of controlled depth milling groove is disconnected or scratches line layer.
(6) RO4000 substrate medium layer has the lowest dielectric loss, and its temperature coefficient of permittivity is the lowest, and meanwhile, its low Z axis CTE coefficient of expansion also ensures whole sheet material dimensional stability in the course of processing.
Accompanying drawing explanation
Fig. 1 is the making schematic diagram of internal layer daughter board of the present utility model；
Fig. 2 is the filling schematic diagram of this utility model silica gel；
Fig. 3 is structural representation of the present utility model；
Fig. 4 is the structural representation of gold finger lead of the present utility model；
In figure, 1-internal layer welding resistance, 2-internal layer circuit, 3-dielectric layer, 4-Copper Foil, 5-the first outer-layer circuit, 6-outer layer welding resistance, 7-silica gel, 8-prepreg, 9-golden finger, 10-the second outer-layer circuit, 11-goes between, and mother 12-goes between.
Detailed description of the invention
With specific embodiment, this utility model is described in detail below in conjunction with the accompanying drawings.
Embodiment 1
A kind of ladder golden finger PCB, its structure is as shown in Figure 3, including the internal layer daughter board being made up of with the prepreg 8 being arranged on internal layer circuit 2 internal layer circuit 2, dielectric layer 3 it is sequentially provided with above prepreg 8, first outer-layer circuit 5 and outer layer welding resistance 6, dielectric layer 3 and the second outer-layer circuit 10 it is sequentially provided with below internal layer circuit 2, the thickness of dielectric layer 3 is 160 μm, its material is RO4000 base material, the thickness of internal layer welding resistance 1 is 5 μm, the thickness of prepreg 8 is 85 μm, the end of golden finger 9 side rounding outwardly, it is arranged on the gold finger lead of golden finger 9 end, its structure is as shown in Figure 4, son lead-in wire 11 and female lead-in wire 12 including length 0.08mm, one end of son lead-in wire 11 connects golden finger 9, the other end connects mother's lead-in wire 12；Female lead-in wire 12 and the junction of son lead-in wire 11, the exterior angle of female lead-in wire 12 is semi arch structure.
The preparation method of above-mentioned ladder golden finger PCB, comprises the following steps:
(1) on Copper Foil 4, make internal layer circuit 2, golden finger 9 and gold finger lead, and internal layer welding resistance 1 is set on golden finger 9, as shown in Figure 1；
(2) use CNC molding mode to mill out the slotted eye of corresponding golden finger 9 at prepreg 8, be then placed within internal layer circuit 2 overlaminate；
(3), after prepreg 8 curing molding, the full step trough structure being made up of the slotted eye on prepreg 8, internal layer welding resistance 1 and golden finger 9 is filled with silica gel 7, as shown in Figure 2；
(4) continue to make the first outer-layer circuit 5 and the second outer-layer circuit 10 respectively at prepreg 8 and Copper Foil 4, and outer layer welding resistance 6 is set in the first outer-layer circuit 5；
(5) silica gel 7 in step trough structure is taken out, to golden finger 9 electricity gold；
(6) cut off gold finger lead with CNC molding mode, i.e. obtain final product.
In step (1), internal layer welding resistance 1 is formed by the local of pad without the SMT silk-screen in step trough.
In step (2): before lamination, the monolateral length of the slotted eye that prepreg 8 mills out is more than monolateral about the 0.5mm that grows up of the slotted eye of prepreg 8 in final product.
Embodiment 2
A kind of ladder golden finger PCB, its structure is as shown in Figure 3, including the internal layer daughter board being made up of with the prepreg 8 being arranged on internal layer circuit 2 internal layer circuit 2, dielectric layer 3 it is sequentially provided with above prepreg 8, first outer-layer circuit 5 and outer layer welding resistance 6, dielectric layer 3 and the second outer-layer circuit 10 it is sequentially provided with below internal layer circuit 2, the thickness of dielectric layer 3 is 165 μm, its material is RO4000 base material, the thickness of internal layer welding resistance 1 is 7 μm, the thickness of prepreg 8 is 120 μm, the end of golden finger 9 side rounding outwardly, it is arranged on the gold finger lead of golden finger 9 end, its structure is as shown in Figure 4, son lead-in wire 11 and female lead-in wire 12 including length 0.09mm, one end of son lead-in wire 11 connects golden finger 9, the other end connects mother's lead-in wire 12；Female lead-in wire 12 and the junction of son lead-in wire 11, the exterior angle of female lead-in wire 12 is semi arch structure.
The preparation method of above-mentioned ladder golden finger PCB, comprises the following steps:
(1) on Copper Foil 4, make internal layer circuit 2, golden finger 9 and gold finger lead, and internal layer welding resistance 1 is set on golden finger 9, as shown in Figure 1；
(2) use CNC molding mode to mill out the slotted eye of corresponding golden finger 9 at prepreg 8, be then placed within internal layer circuit 2 overlaminate；
(3), after prepreg 8 curing molding, the full step trough structure being made up of the slotted eye on prepreg 8, internal layer welding resistance 1 and golden finger 9 is filled with silica gel 7, as shown in Figure 2；
(4) continue to make the first outer-layer circuit 5 and the second outer-layer circuit 10 respectively at prepreg 8 and Copper Foil 4, and outer layer welding resistance 6 is set in the first outer-layer circuit 5；
(5) silica gel 7 in step trough structure is taken out, to golden finger 9 electricity gold；
(6) cut off gold finger lead with CNC molding mode, i.e. obtain final product.
In step (1), internal layer welding resistance 1 is formed by the local of pad without the SMT silk-screen in step trough.
In step (2): before lamination, the monolateral length of the slotted eye that prepreg 8 mills out is more than monolateral about the 0.5mm that grows up of the slotted eye of prepreg 8 in final product.
Embodiment 3
A kind of ladder golden finger PCB, its structure is as shown in Figure 3, including the internal layer daughter board being made up of with the prepreg 8 being arranged on internal layer circuit 2 internal layer circuit 2, dielectric layer 3 it is sequentially provided with above prepreg 8, first outer-layer circuit 5 and outer layer welding resistance 6, dielectric layer 3 and the second outer-layer circuit 10 it is sequentially provided with below internal layer circuit 2, the thickness of dielectric layer 3 is 170 μm, its material is RO4000 base material, the thickness of internal layer welding resistance 1 is 10 μm, the thickness of prepreg 8 is 165 μm, the end of golden finger 9 side rounding outwardly, it is arranged on the gold finger lead of golden finger 9 end, its structure is as shown in Figure 4, son lead-in wire 11 and female lead-in wire 12 including length 0.1mm, one end of son lead-in wire 11 connects golden finger 9, the other end connects mother's lead-in wire 12；Female lead-in wire 12 and the junction of son lead-in wire 11, the exterior angle of female lead-in wire 12 is semi arch structure.
The preparation method of above-mentioned ladder golden finger PCB, comprises the following steps:
(1) on Copper Foil 4, make internal layer circuit 2, golden finger 9 and gold finger lead, and internal layer welding resistance 1 is set on golden finger 9, as shown in Figure 1；
(2) use CNC molding mode to mill out the slotted eye of corresponding golden finger 9 at prepreg 8, be then placed within internal layer circuit 2 overlaminate；
(3), after prepreg 8 curing molding, the full step trough structure being made up of the slotted eye on prepreg 8, internal layer welding resistance 1 and golden finger 9 is filled with silica gel 7, as shown in Figure 2；
(4) continue to make the first outer-layer circuit 5 and the second outer-layer circuit 10 respectively at prepreg 8 and Copper Foil 4, and outer layer welding resistance 6 is set in the first outer-layer circuit 5；
(5) silica gel 7 in step trough structure is taken out, to golden finger 9 electricity gold；
(6) cut off gold finger lead with CNC molding mode, i.e. obtain final product.
In step (1), internal layer welding resistance 1 is formed by the local of pad without the SMT silk-screen in step trough.
In step (2): before lamination, the monolateral length of the slotted eye that prepreg 8 mills out is more than monolateral about the 0.5mm that grows up of the slotted eye of prepreg 8 in final product.
The above-mentioned description to embodiment is to be understood that for ease of those skilled in the art and use utility model.These embodiments obviously easily can be made various amendment by person skilled in the art, and General Principle described herein is applied in other embodiments without through performing creative labour.Therefore, this utility model is not limited to above-described embodiment, and those skilled in the art should be within protection domain of the present utility model according to announcement of the present utility model, the improvement made without departing from this utility model category and amendment.
Claims (6)
1. a ladder golden finger PCB, it is characterized in that, including the internal layer daughter board being made up of internal layer circuit (2) and the prepreg (8) that is arranged on internal layer circuit (2), and it is separately positioned on prepreg (8) top and first outer-layer circuit (5) of internal layer circuit (2) lower section and the second outer-layer circuit (10), it is also equipped with internal layer welding resistance (1) on golden finger (9) on internal layer circuit (2), grooved hole is milled out on described prepreg (8), and constitute step trough structure with internal layer welding resistance (1) and golden finger (9)；
Outer layer welding resistance (6), the first outer-layer circuit (5) and outer layer welding resistance (6) also it is coated with upper all with the slotted eye exposing step trough structure in described the first outer-layer circuit (5).
A kind of ladder golden finger PCB the most according to claim 1, it is characterized in that, between described internal layer circuit (2) and the second outer-layer circuit (10), between the first outer-layer circuit (5) and prepreg (8), be equipped with dielectric layer (3).
A kind of ladder golden finger PCB the most according to claim 2, it is characterised in that described dielectric layer (3) is the RO4000 substrate medium layer of thickness 160～170 μm.
A kind of ladder golden finger PCB the most according to claim 1, it is characterised in that the thickness of described internal layer welding resistance (1) is 5～10 μm；
The thickness of described prepreg (8) is 85～165 μm.
A kind of ladder golden finger PCB the most according to claim 1, it is characterised in that the end side rounding outwardly of described golden finger (9).
A kind of ladder golden finger PCB the most according to claim 5, it is characterized in that, the gold finger lead being arranged on golden finger (9) end includes son lead-in wire (11) of length 0.08～0.1mm and female lead-in wire (12), one end of described son lead-in wire (11) connects golden finger (9), and the other end connects mother's lead-in wire (12)；
Described female lead-in wire (12) and the junction of son lead-in wire (11), the exterior angle of female lead-in wire (12) is semi arch structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620206237.XU CN205611065U (en) | 2016-03-17 | 2016-03-17 | Ladder golden finger PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620206237.XU CN205611065U (en) | 2016-03-17 | 2016-03-17 | Ladder golden finger PCB |
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| CN205611065U true CN205611065U (en) | 2016-09-28 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107205314A (en) * | 2016-03-17 | 2017-09-26 | 上海嘉捷通电路科技股份有限公司 | A kind of ladder golden finger PCB and preparation method thereof |
| CN107484354A (en) * | 2017-08-15 | 2017-12-15 | 胜宏科技（惠州）股份有限公司 | A kind of method for manufacturing gold finger of no lead residual |
| CN108271315A (en) * | 2017-01-04 | 2018-07-10 | 北大方正集团有限公司 | The production method of stepped circuit board and stepped circuit board |
| CN108323037A (en) * | 2018-01-17 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of PCB processing technologys of two-sided ladder position electricity gold |
| CN109991451A (en) * | 2019-04-19 | 2019-07-09 | 南京微桥检测技术有限公司 | Display module Precision measurement crimps probe |
-
2016
- 2016-03-17 CN CN201620206237.XU patent/CN205611065U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107205314A (en) * | 2016-03-17 | 2017-09-26 | 上海嘉捷通电路科技股份有限公司 | A kind of ladder golden finger PCB and preparation method thereof |
| CN108271315A (en) * | 2017-01-04 | 2018-07-10 | 北大方正集团有限公司 | The production method of stepped circuit board and stepped circuit board |
| CN108271315B (en) * | 2017-01-04 | 2019-12-31 | 北大方正集团有限公司 | Stepped circuit board and manufacturing method thereof |
| CN107484354A (en) * | 2017-08-15 | 2017-12-15 | 胜宏科技（惠州）股份有限公司 | A kind of method for manufacturing gold finger of no lead residual |
| CN108323037A (en) * | 2018-01-17 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of PCB processing technologys of two-sided ladder position electricity gold |
| CN109991451A (en) * | 2019-04-19 | 2019-07-09 | 南京微桥检测技术有限公司 | Display module Precision measurement crimps probe |
| CN109991451B (en) * | 2019-04-19 | 2022-01-18 | 南京微桥检测技术有限公司 | Display module precision detection crimping testing device |
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