CN203327375U - Package substrate based on 3D printing - Google Patents
Package substrate based on 3D printing Download PDFInfo
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- CN203327375U CN203327375U CN2013203964194U CN201320396419U CN203327375U CN 203327375 U CN203327375 U CN 203327375U CN 2013203964194 U CN2013203964194 U CN 2013203964194U CN 201320396419 U CN201320396419 U CN 201320396419U CN 203327375 U CN203327375 U CN 203327375U
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Abstract
The utility model proposes a package substrate based on 3D printing. The package substrate includes insulating layers, function layers and package layers. The insulating layers are formed by printing of a 3D printer through adoption of an insulating material. The package layers are poisoned on the insulating layers. The function layers are buried in the package layers. The function layers comprise mutually connected electronic devices. The electronic devices include electronic connecting devices. The electronic connecting devices include horizontal electronic connecting devices. The horizontal electronic connecting devices include wires. The wires connect two or more other electronic devices in the same function layer. The spaces between the electronic devices are filled by printing of a 3D printer through adoption of an insulating material so that the package layers are formed.
Description
Technical field
The application belongs to base plate for packaging (Package Substrate) and wiring board (Printed Circuit Board, PCB) manufacture field, is specifically related to adopt the 3D printing technique to manufacture multilayer circuit board, especially base plate for packaging.
Technical background
Printed substrate or printed wiring board, claim again printed circuit board (PCB) or printed circuit board, and the application is called for short wiring board.
Wiring board is as the installation base plate of electronic device, for electrical connection and the support of electronic device.
Multilayer circuit board has hierarchical structure, wiring layer (top layer, bottom, middle wiring layer), bus plane (Power), ground plane (Ground), auxiliary layer, consists of, and its auxiliary layer comprises solder mask, the icon layer (legend) of top layer.
Wiring layer, for realizing the electric interconnection (Electrical Interconnection) of electronic device, is called for short interconnection.
In multilayer circuit board, so-called wiring layer generally comprises insulated substrate (abbreviation substrate) and wire thereof.For sake of convenience, the application is distinguished the insulated substrate in wiring layer and the wire on it, and insulated substrate is called insulating barrier, and the wire on insulating barrier, the summation of pad are called wiring layer.
Bus plane, ground plane are also a kind of wiring layer in fact, and just the material of substrate is different from the standard of wire.For the purpose of the convenience of narration, the application also is considered as wiring layer by bus plane, ground plane.Bottom, top layer, auxiliary layer all belong to routine techniques, thereby, can be briefly, multilayer circuit board is exactly the stack of various wirings layer, and the manufacturing technology of multilayer circuit board is exactly the manufacturing technology of wiring layer.
The manufacture method of existing multilayer circuit board is generally first done wiring layer, makes single sided board or double sided board with chemical method for etching, and put a layer insulating between every laminate, completes perpendicular interconnection, then presses together.Wire between the various wirings layer is realized perpendicular interconnection by guide hole (via).Guide hole is the duck eye that is full of metal or filled conductive glue in substrate, and wherein, buried via hole (buried via) is for the perpendicular interconnection between the internal wiring layer, and blind hole (blind via) is for the perpendicular interconnection between internal wiring layer and top/bottom.
The main manufacturing process of existing multilayer circuit board manufacturing technology comprises negative film making, figure transfer, boring, hole metallization, vacuum lamination, and its basic technical features is:
1, in shifting, figure adopts art of printing printed wiring figure on substrate;
2, adopt the substrate of copper-clad plate (Copper Clad Laminate) as wiring layer; By on the chemical etching substrate, covering Copper Foil to manufacture wire, the pad on wiring layer;
3, adopt CNC drilling machine or laser to hole on substrate, comprise buried via hole and blind hole;
4, adopt to electroplate buried via hole and blind hole is metallized or filled conductive glue, for the perpendicular interconnection of wiring layer;
5, vacuum pressing-combining insulating barrier, single sided board or double sided board;
6, make auxiliary layer;
7, circuit test.
BGA Package (Ball Grid Array Package, BGA), chip size packages (Chip Scale Package, CSP), multi-chip package (Multi Chip Package, MCP), the encapsulation technology such as system in package (System in a Package, SiP) causes the fusion of wiring board manufacturing technology and Electronic Encapsulating Technology.The extensive use of on a large scale/very lagre scale integrated circuit (VLSIC), many passive/active electronic device, particularly multi-chip and chip module (MCM) directly be embedded in wiring layer, impels multilayer circuit board to develop into base plate for packaging from installation base plate.
Base plate for packaging has become the main flow kind of multilayer circuit board, is guiding the trend of wiring board manufacturing technology, drives whole industry and carries out technological innovation.Therefore, Japan circuit board industrial association (JPCA) renames " printed substrate " of appellation decades, by original double-sided wiring board, multilayer circuit board, and BGA, CSP, MCM, SiP etc. are referred to as electric substrate (Electric substrate), European and American areas and academia are called base plate for packaging, and the application adopts this term of base plate for packaging.
According to statistics, 65% of the worldwide production total value is relevant with integrated circuit.The base plate for packaging industry is most active industry in contemporary electronic device manufacturing industry, accounts for more than 1/4th of the electronic device gross output value, is the industry of proportion maximum in electronic device segmentation industry.
The inside of base plate for packaging embedding passive/the active electronic device.For multilayer circuit board, passive/active electronic device only is arranged on the surface of multilayer circuit board, rather than is embedded in the multilayer line intralamellar part.This is unique difference of multilayer circuit board and base plate for packaging.Thereby the application no longer distinguishes multilayer circuit board and base plate for packaging, but by multilayer circuit board be considered as inner not embedding passive/base plate for packaging of active electronic device.
Base plate for packaging generally is divided three classes: the organic base plate for packaging of rigidity, flexible encapsulating substrate, ceramic packaging substrate.
Follow electronic technology to high-speed, multi-functional, large capacity, small size future development, fine pore, thin wire, thin space, high-precision high density interconnect (High Density Interconnect) base plate for packaging are described as a new technological revolution.Because the live width/distance between centers of tracks of high density interconnect is less than 30 μ m/30 μ m, the diameter of micropore (micro-via) is less than 0.25-0.30mm, has produced all micropore manufacturing technologies (comprising micropore punching technology and micropore metal technology).
For existing base plate for packaging, the technical problem of a key is to adopt what technical scheme to realize the perpendicular interconnection between the various wirings layer, i.e. so-called perpendicular interconnection technology.
In existing base plate for packaging, the wire in the various wirings layer is realized perpendicular interconnection by metallized vias.
First carry out figure transfer and chemical etching, then, through the boring of CNC drilling machine (buried via hole and blind hole) or laser drilling, then by plating, complete hole metallization.This is the basic technical scheme that existing base plate for packaging solves perpendicular interconnection.The desired micropore manufacturing technology of perpendicular interconnection technology, particularly high density interconnect becomes the core manufacturing technology of existing base plate for packaging, and the manufacturing cost of micropore accounts for 30% to 40% of total cost.
For existing base plate for packaging, another crucial technical problem is to adopt the connected condition of what technical scheme detection wiring layer, i.e. the on/off state of perpendicular interconnection and horizontal interconnect.
In existing base plate for packaging, can not in manufacture process, carry out real-time on/off detection for the connected condition of wiring layer, particularly metallized vias, can only implement offline inspection, and the detection technique complexity; Along with the development of Electronic Encapsulating Technology to multi-chip package, the offline inspection of existing base plate for packaging is more difficult.
The inside of base plate for packaging has complicated stereochemical structure, for example, and the configurations of wiring layer, and insulation each other; The buried via hole of feed throughs layer and blind hole and metallization thereof; In wiring layer embedding passive/active electronic device etc.Before the 3D printing technique is born, for subtracting material manufacture (subtractive manufacturing), the product that has complicated stereochemical structure as this inside of base plate for packaging does not have manufacturability, can only be split as the parts that some have manufacturability, i.e. one-sided circuit board or double-sided wiring board.This is to cause existing base plate for packaging manufacturing technology to adopt the basic reason that subtracts the material manufacturing technology, has formed thus huge and complicated technical system and industrial chain.Thereby existing base plate for packaging manufacturing technology must be manufactured at first respectively one-sided circuit board or double-sided wiring board, installs passive/active electronic device, puts a layer insulating between every laminate into, completes perpendicular interconnection, forms base plate for packaging after pressing.
Subtract the material manufacture and adopt computer numerical control (CNC) (Computer Numerical Control, CNC), by layering and successively cutting, remove unnecessary material and generate the 3D entity.The 3D printing technique also adopts computer numerical control (CNC), is but by layering and successively interpolation, solidifies the material added and generates the 3D entity, therefore be called, increases material manufacture (additive manufacturing).
With regard to manufacture method, the spraying technique of moulding material, moulding material is the core technology that 3D prints, and is also to increase material manufacture and the essential distinction that subtracts the material manufacture.
3D printing shaping technology roughly comprises:
1, molded through three-dimensional printing technology (Three Dimensional Printing, 3DP)
The printing shaping process of 3DP: paving one deck powder; Under the control of CNC equipment, to needing the regional spraying binder of moulding, make material powder bonding, form part section; So repeatedly, be layering, obtain the 3D entity.Use dusty material, as ceramic powders, metal dust, plastic powders etc.
2, fuse deposition modeling technology (Fused Deposition Modeling, FDM)
The printing shaping process of FDM: by thread heat-fusible materials heating and melting; Under the control of CNC equipment, the zone that needs moulding is sprayed to the fluent material of hot melt; Quick cooling curing; So constantly repeat spraying, quick cooling curing, be layering, obtain the 3D entity.Use the ABS(engineering plastics), the noncrystal engineering plastics of PC(), the PLA(biodegradable plastic) etc. thread macromolecular material.
3, photoetching forming technique (Stereolithigraphy Apparatus, SLA)
The printing shaping process of SLA: spraying one deck liquid photosensitive resin, under the control of CNC equipment, the laser scanning liquid photosensitive resin, produce photopolymerization reaction and solidify, so constantly repeats spraying, laser scanning is solidified, be layering, acquisition 3D entity.Use photosensitive resin.
4, precinct laser sintering technology (Selecting Laser Sintering, SLS)
The printing shaping process of SLS: spraying one deck dusty material (metal dust or non-metal powder), by material preheater, to approaching melting point, under the control of CNC equipment, the laser scanning sintering, so constantly repeat to spread powder, laser scanning sintering, obtains the 3D entity.Use dusty material (metal dust or non-metal powder).
5, digital light is processed forming technique (Digital Light Procession, DLP)
The printing shaping process of DLP: use high-resolution Digital Light Processor (DLP) projecting apparatus to solidify liquid photopolymer, successively carry out photocuring, obtain the 3D entity.Use photosensitive resin.
6, ultraviolet forming technique (Ultraviolet Light, UV)
The printing shaping process of UV: similar with the printing shaping process of SLA, not to use laser, but irradiate liquid photosensitive resin with ultraviolet ray (Ultraviolet Light), from bottom to top successively stack, obtain the 3D entity.Use photosensitive resin.
The adoptable moulding material of 3D printing technique is necessary for dusty material or fluent material, under the control of CNC equipment, spray and apply into a layer entity by powderject or drop, then, through laser sintered curing molding or ultraviolet ray scanning curing molding, so successively add curing molding.
Adopt the 3D printing technique to come the manufacturing and encapsulation substrate to be paid much attention to, many countries drop into one after another huge fund and research and develop this technology always.For example, with photosensitive resin, make insulating barrier, with photosensitive electrically conductive ink, make wiring layer, adopt ultraviolet forming technique; Make insulating barrier, use the metal powder wiring layer with ceramic powders, adopt the precinct laser sintering technology.
Adopt the key of 3D printing technique manufacturing and encapsulation substrate to be wiring layer.Aspect 3D printing wiring layer, remain at present in following problems:
1, the precision problem of wiring layer
The wiring layer precision that powderject or drop spray manufacturing is low, with the requirement of high density interconnect, differs greatly;
2, the nano material cost is high
The material (conducting particles in photosensitive conducting printing ink, for laser sintered metal dust) of making wiring layer is necessary for nanoscale, and the manufacturing cost of nano material is higher;
3, the electrical property of wiring layer and connection reliability
After printing, the original electric property of nano material descends to some extent;
Adopt electrically conductive ink to connect up and filling perforation, the stress that different materials harmomegathus is irregular produced easily produces the wire cracking, and filling perforation easily produces depression; The edge of wire may produce cavity blemish, affects electrical property and the connection reliability of wiring layer.
4, very high to the requirement of environment cleanliness.
With subtract material manufacturing technology contrast, an outstanding advantages of 3D printing technique is, because inside has the product that complicated stereochemical structure causes losing manufacturability, maybe must split the product that just has manufacturability, available 3D printing technique is directly manufactured.
In itself, base plate for packaging should belong to and increases the material manufacturing technology.Unfortunately, due to history, existing base plate for packaging manufacturing technology adopts and subtracts the material manufacturing technology, has formed thus huge and complicated technical system and industrial chain.
Summary of the invention
The utility model is based on the 3D printing technique, and the internal structure of the existing base plate for packaging of re-examine, propose a kind of base plate for packaging of printing based on 3D.
In present specification, one-sided circuit board, multilayer circuit board are considered as to the special case of base plate for packaging.
The internal structure of the existing base plate for packaging of the application's re-examine, the insulating barrier and the encapsulated layer that the main body of base plate for packaging are considered as having to complicated stereochemical structure, the electronic device that encapsulated layer is inner embedding and electric power connector part form functional layer.
The existing manufacture method of the application's re-examine wiring layer, be considered as the electric power connector part by the sub-assembly of wire, guide pillar, pad and different structure thereof, puts on an equal footing with passive/active electronic device, and give standardization.
The application proposes a kind of direct interconnection technology, adopts sitting posture guide pillar (sitting posture guide pillar array) to realize the perpendicular interconnection between the electronic device in the difference in functionality layer; Adopt wire (line conductor row) to realize the horizontal interconnect between the electronic device in same functional layer.
The technical solution of the utility model is described as follows.
A kind of base plate for packaging of printing based on 3D, comprise insulating barrier, functional layer, encapsulated layer; Described insulating barrier adopts the insulating material printing to form by the 3D printer; Described encapsulated layer is positioned on described insulating barrier, and described functional layer is embedded in described encapsulated layer; Described functional layer consists of the electronic device of interconnection; Described electronic device comprises the electric power connector part; Described electric power connector part comprises horizontal type electric power connector part; Described horizontal type electric power connector part comprises wire, and described wire connects two or more other electronic devices in same functional layer; Thereby the space between described electronic device is adopted insulating material to print and is filled by the 3D printer and forms described encapsulated layer.
Described base plate for packaging comprises multilayer dielectric layer, functional layer, encapsulated layer; Described electric power connector part comprises vertical-type electric power connector part, described vertical-type electric power connector part comprises the sitting posture guide pillar, the lower end of described sitting posture guide pillar is mounted on when the front insulation layer upper surface, and upper end is passed at least through hole of another insulating barrier and arrived another functional layer and be connected with the described electronic device in another functional layer.
Described horizontal type electric power connector part also comprises the line conductor row integrated by multiple conducting wires.
Described vertical-type electric power connector part also comprises by the many sitting posture guide pillar arrays that the sitting posture guide pillar is integrated.
Described electronic device also comprises active electronic device; Described active electronic device comprises transistor, integrated circuit, chip and chip module.
Described electronic device also comprises passive electronic; Described passive electronic comprises resistance, electric capacity, inductance.
The insulating material of described insulating barrier, described encapsulated layer is ABS, PC, PLA or photosensitive resin.
Be provided with test point on the pin of described electronic device.
The manufacture method of this base plate for packaging of printing based on 3D comprises the following steps: step (1), write the layering print routine: according to function and the structure of electronic device in functional layer, determine the stereochemical structure of insulating barrier, functional layer, encapsulated layer, write the layering print routine for described insulating barrier, described encapsulated layer; Step (2), printing insulating barrier: use the 3D printer to print described insulating barrier; Step (3), dress paste functional layer: the upper surface dress at described insulating barrier pastes electronic device; Described electronic device comprises the electric power connector part; Described electric power connector part comprises horizontal type electric power connector part, and described horizontal type electric power connector part comprises wire; Step (4), horizontal interconnect: adopt the horizontal interconnect technology, with described wire by other electronic device level connection joints in same functional layer; Step (5), printing encapsulated layer: use the 3D printer to print the described encapsulated layer that the space between described electric power connector part forms; Step (6), the described insulating barrier of pressing, described encapsulated layer.
In described step (1), described base plate for packaging comprises multilayer dielectric layer, functional layer, encapsulated layer; In described step (3), described electric power connector part comprises vertical-type electric power connector part, and described vertical-type electric power connector part comprises the sitting posture guide pillar; In described step (4), also with described wire, other electronic devices in same functional layer are connected with the sitting posture guide pillar in other layers; Repeat described step (2) to described step (6) to obtain definite number of plies in described step (1).
Vertical-type electric power connector part in described step (3) adopts by the many sitting posture guide pillar arrays that the sitting posture guide pillar is integrated, and described horizontal type electric power connector part adopts the line conductor row integrated by multiple conducting wires.
Be provided with test point on the pin of the described electronic device in step (3); In described step (4), wire adopts welding with being connected of other electronic devices in same functional layer, after welding, with two test probes, with two test points before and after pad, is connected respectively, detects the connection state of described pad; If the discovery weld defect, carry out repair welding in real time to described pad.
The utility model is compared with the prior art had beneficial effect:
1, in existing base plate for packaging, by metallized vias, realize the perpendicular interconnection between wiring layer; Form wiring layer through chemical etching in copper-clad plate, adopt the lead-in wire interconnection technique to realize the I/O pin of passive/active electronic device and the horizontal interconnect between the pad on wiring layer, this is that existing base plate for packaging solves the basic fundamental means of interconnection.
The manufacture of wiring layer relates to many complex technologys such as photoimaging, figure transfer, chemical etching, digital control hole drilling/laser drilling, brown, hole metallization, plating, cleaning, drying, pressing, on off test, its manufacture process has the thirty or forty procedure, and many operations have comprised again ten or twenty line operation.The equipment of large amount of complex is configured to streamline, in the chained job mode, completes these operations.
So numerous operations needs much valuable High Precision CNC equipment, for example, and laser drawing machine, CNC drilling machine/milling machine, fully automatic electric plate wire, Full-automatic optical detecting system, multilayer navigation system, various special test equipments etc.
So numerous operations also relates to numerous auxiliary equipment, for example, and a plurality of auxiliary equipment systems such as pure water, Sewage Disposal, fire-fighting.These auxiliary equipment account for 30% of gross investment.
So numerous operations also needs to use hundreds of materials and auxiliary material, as dry film, copper-clad plate, various chemicals, chemical addition agent, drill bit, milling cutter, extraordinary adhesive tape etc.
Thereby the technical system of existing base plate for packaging is " more than five " (a plurality of subjects, multiple technologies, multiple working procedure, plurality of devices, various materials), its industrial chain is costly, and environment is produced to severe contamination.The enterprise of existing base plate for packaging becomes fund rich and influential family, technology rich and influential family, labour rich and influential family, heavy polluter, big power consumer, water rich and influential family especially.
As can be seen here, in the manufacturing technology of existing base plate for packaging, production process is many, chained job and repeat that labor content is large, high material consumption, discharging of waste liquid are high, the environmental protection pressure weight, make existing base plate for packaging become an industry that investment is large, efficiency is low, pollution is heavy, resource consumption is high.
2, the application has changed the existing mode of production and the manufacturing technology of base plate for packaging (multilayer circuit board).
The 3D printing technique has been started the new concept of design, manufacture.
An outstanding advantages of 3D printing technique is, can realize the parts that consist of Functionally Graded Materials, can directly manufacture the parts of any labyrinth.Particularly, because inside has the product that complicated stereochemical structure causes losing manufacturability, maybe must split the product that just has manufacturability, available 3D printing technique is directly manufactured.Base plate for packaging (multilayer circuit board) is such product just.
The application is based on the 3D printing technique, from the internal structure of the existing base plate for packaging of two aspect re-examines and the manufacture method of wiring layer.
The one, re-examine has the internal structure of base plate for packaging (multilayer circuit board) now, the main body of base plate for packaging (multilayer circuit board) is considered as having to insulating barrier and the encapsulated layer of complicated stereochemical structure, and the inner embedding electronic device of encapsulated layer forms functional layer; The 2nd, the manufacture method of the existing wiring layer of re-examine, be considered as the electric power connector part by the sub-assembly of wire, guide pillar, pad and different structure thereof, and give standardization, by the third party with the several different methods manufacture.
These new concepts have changed the existing mode of production and the manufacturing technology of base plate for packaging (multilayer circuit board).
1), the application has changed the existing mode of production of base plate for packaging (multilayer circuit board)
In existing base plate for packaging (multilayer circuit board), manufacture nearly all operation of wiring layer, comprise wiring layer design, photoimaging, figure transfer, chemical etching, punching, hole metallization, plating, cleaning, drying etc., all be scattered in each enterprise, and each enterprise adopts the streamline of nonstandardized technique to carry out chained job.From macroscopic view, it is workshop-based that the mode of production of whole industry remains in fact.This workshop-based serial mode of production is implemented its whole development histories.
The application is defined as the sub-assembly of wire, guide pillar, pad and different structure thereof standardized electric power connector part first.
These electric power connector parts can be by the third party with the several different methods manufacture, thereby the workshop-based serial mode of production that will have base plate for packaging (multilayer circuit board) now changes specialization, standardized parallel production mode into, reduce invest, raise the efficiency, reduce pollution, the aspect such as economize on resources produces remarkable benefit.
2), the application has thoroughly changed existing manufacturing technology and the industrial chain thereof of base plate for packaging (multilayer circuit board)
Interconnection is the basis that builds electronic product with encapsulation.Base plate for packaging is interconnection and the fusion encapsulated.
From the 3D printing technique, base plate for packaging (multilayer circuit board) can be considered the electric function parts that successively are formed by stacking successively by insulating barrier, functional layer, encapsulated layer, the core of its manufacturing technology is exactly two kinds of interconnection techniques, the one, the perpendicular interconnection between the electronic device in the difference in functionality layer, the 2nd, the horizontal interconnect between the electronic device in same functional layer.
As everyone knows, perpendicular interconnection technology, particularly micropore manufacturing technology are the core manufacturing technologies of existing base plate for packaging (multilayer circuit board).
The application adopts the 3D printing technique to manufacture insulating barrier and encapsulated layer, does not need the copper-clad plate manufacturing technology.The application proposes a kind of direct interconnection technology, adopt standardized electric power connector part sitting posture guide pillar (sitting posture guide pillar array) to realize the perpendicular interconnection between the electronic device in the difference in functionality layer, adopt standardized electric power connector part wire (line conductor row) to realize the horizontal interconnect between the electronic device in same functional layer.
Thereby the application has cancelled of the prior art nearly all operation of manufacturing wiring layer, does not need the copper-clad plate manufacturing technology, does not also need the micropore manufacturing technology, has thoroughly changed existing manufacturing technology and the industrial chain thereof of base plate for packaging (multilayer circuit board).
3, in this application, the 3D printing technique is only for the manufacture of insulating barrier and encapsulated layer.The application will have the wiring layer manufacturing technology now and be reduced to the horizontal interconnect between the electronic device in same functional layer, thereby avoided employing 3D printing technique to manufacture thin wire, thin space, the existing problem of high-precision wiring layer, there is good industrial usability.
4, increasing the number of plies is the microminiaturized optimum way of base plate for packaging (multilayer circuit board).Yet, in the prior art system of base plate for packaging (multilayer circuit board), owing to manufacturing respectively wiring layer, increasing the number of plies causes qualification rate significantly to reduce with cost and significantly promote, force fine pore, thin wire, thin space, high-precision high density interconnect to become the mainstream development direction of base plate for packaging, live width, aperture etc. become the representative of technical merit, and the micropore manufacturing technology becomes key technology.
The application proposes a kind of direct interconnection technology, the micropore manufacturing technology is no longer the microminiaturized technical bottleneck of restriction base plate for packaging (multilayer circuit board), increase the number of plies and become the microminiaturized basic fundamental means of base plate for packaging (multilayer circuit board), can significantly reduce the manufacturing cost of base plate for packaging (multilayer circuit board).
5, the electric power connector part in the application adopts specialized, standardized industrial production, by technological measures such as aging, vibration, detections, and the height of its reliability, being far from existing wiring layer can ratio.
With the wiring of chemical etching in copper-clad plate, the existing wiring layers such as metallized vias of plating, compare, the electric power connector part in the application can adopt all materials with good electrical performance and manufacturability, thereby reduces circuit loss and signal transmission delay.
6, the existing manufacturing technology of base plate for packaging (multilayer circuit board) can not detect the on off operating mode of electric interconnection in real time, can only implement offline inspection, and the detection technique complexity, and cost is very high.
The application has solved the real-time test problems of electric interconnection with extremely simple technological means, reduced cost, has improved reliability.
7, the application adopts the 3D printing technique, can manufacture insulating barrier and encapsulated layer with complicated stereochemical structure, to adapt to the development of three-dimension packaging.
8, the application adopts 3D printing technique manufacturing and encapsulation substrate (multilayer circuit board), has outstanding advantage aspect single-piece, small lot.On the other hand, with many valuable high precision apparatus in the existing manufacturing technology of base plate for packaging (multilayer circuit board), compare, technical grade 3D printer is very cheap, thereby can form large-scale manufacturing array, to base plate for packaging (multilayer circuit board) carry out on a large scale, suitability for industrialized production cheaply.
The accompanying drawing explanation
The structure chart that Fig. 1 is a kind of embodiment of the utility model;
The flow chart that Fig. 2 is the utility model embodiment manufacture method.
Embodiment
The application illustrates in technical background, no longer distinguishes multilayer circuit board and base plate for packaging.The application by multilayer circuit board be considered as inner not embedding passive/base plate for packaging of active electronic device.Thereby in this application, base plate for packaging comprises wiring board, particularly multilayer circuit board.Passive electronic comprises resistance, electric capacity, inductance etc., and the active electronic device comprises transistor, integrated circuit, chip and chip module etc.
The 3D printing technique has been started the new concept of design, manufacture.
An outstanding advantages of 3D printing technique is, can realize the parts that consist of Functionally Graded Materials, can directly manufacture the parts of any labyrinth.Particularly, because inside has the product that complicated stereochemical structure causes losing manufacturability, maybe must split the product that just has manufacturability, available 3D printing technique is directly manufactured.Base plate for packaging is such product just.
From the viewpoint of 3D printing technique, the insulating barrier that the agent structure of base plate for packaging is stereochemical structure and encapsulated layer.The embedding functional layer formed by electronic device in encapsulated layer.Adopt the 3D printing technique to manufacture insulating barrier, do not need the copper-clad plate manufacturing technology.
Be full of the guide hole of metal or filled conductive glue in insulating barrier, the application is referred to as conductive pole, is called for short guide pillar.Guide pillar is for the perpendicular interconnection between the electronic device of difference in functionality layer.
In same encapsulated layer passive/the active electronic device, realize horizontal interconnect by wire, pad.
The application and then the sub-assembly of wire, guide pillar, pad and different structure thereof is referred to as to the electric power connector part.The I/O lead-in wire is a kind of and electric power connector part external interconnect.
In this definition, the electric power connector part is a kind of electronic device of realizing interconnection.In this application, the passive/active electronic devices such as electric power connector part and resistance, electric capacity, inductance, transistor, integrated circuit, chip and chip module, in par, are the function difference.
As standardization mechanical connection parts such as plug/socket, bolt/nut, and the standardization passive electronic such as resistance, electric capacity are the same, and the electric power connector parts such as wire, guide pillar, pad can standardization, and adopts specialized production to create in advance.For example, the material of electric power connector part (gold, copper, aluminium), wire diameter, all standardization of line length, select during for the design base plate for packaging.Equally, the size of guide pillar, pad also gives standardization.
Wire, guide pillar, pad etc. are defined as independently standardized electric power connector part, thereby separate fully with existing wiring layer and manufacturing technology thereof.Thereby, be different from the continuous productive process of manufacturing wire, pad, metallized vias in copper-clad plate by photoetching, chemical etching, punching, hole metallization, plating, can adopt other technologies (for example, machining, laser-induced thermal etching) to manufacture the electric power connector parts such as wire, guide pillar, pad by specialization production.
With the wiring of chemical etching in copper-clad plate, the existing wiring layers such as metallized vias of plating, compare, the electric power connector part in the application can adopt all materials with good electrical performance and manufacturability, thereby reduces circuit loss and signal transmission delay.These electric power connector parts also can, by technological measures such as aging, vibration, detections, improve its reliability high.
Wire, guide pillar, pad one-tenth capable of being combined have the electric power connector part of different structure.
For example, guide pillar and pad can be combined to a kind of sitting posture guide pillar.Guide pillar is up-small and down-big circular cone, and bottom is with pad; Pad both had been conducive to the location of guide pillar/dress and had pasted, and provided solder side for wire again.The size of sitting posture guide pillar, for example, material, highly, diameter and the equal standardization of thickness of up/down diameter, pad.
But a plurality of sitting posture guide pillars are forming array or the encapsulation of employing carrier band also, its array pattern, the equal standardization of spacing.
Sitting posture guide pillar, sitting posture guide pillar array, for the perpendicular interconnection between the electronic device of difference in functionality layer, can be referred to as vertical-type electric power connector part.
Corresponding to sitting posture guide pillar array, stranded conductor one-tenth line conductor row capable of being combined, wherein, the two ends of wire can be with pad or be with pad, can adopt winding or carrier band encapsulation.Wire can be silk material or sheet material, and wire diameter or live width/line are thick, line length, number of share of stock and all standardization of spacing.
Wire, line conductor row, for the horizontal interconnect between the electronic device of same functional layer, can be referred to as horizontal type electric power connector part.
The electronic device that the application will be embedded in encapsulated layer is referred to as functional layer.Functional layer, encapsulated layer, insulating barrier form the core of base plate for packaging.The number of plies of base plate for packaging refers to the number of plies of functional layer.In general, the number of plies of base plate for packaging is more than 2 layers or 2 layers.
Thereby, based on the 3D printing technique, the application is defined as follows base plate for packaging:
So-called base plate for packaging is the electric function parts that are formed by stacking successively by insulating barrier, functional layer, encapsulated layer.
Encapsulated layer is positioned on insulating barrier, and functional layer is embedded in encapsulated layer and the upper surface in insulating barrier.
Functional layer consists of the electronic device of interconnection; Electronic device comprises passive electronic, active electronic device, electric power connector part.Passive electronic comprises resistance, electric capacity, inductance; The active electronic interface unit comprises transistor, integrated circuit, chip and chip module; The electric power connector part comprises horizontal type electric power connector part, vertical-type electric power connector part; Horizontal type electric power connector part is for the horizontal interconnect between the electronic device of same functional layer, and vertical-type electric power connector part is for the perpendicular interconnection between the electronic device of difference in functionality layer.
The insulating material of encapsulated layer in being filled in functional layer forms, for the electric insulation between electronic device and support.
Insulating barrier consists of insulating material, for the electric insulation between functional layer; Through hole is set, embedding vertical-type electric power connector part in through hole in insulating barrier.
In addition, base plate for packaging also has bottom, top layer.
Above-mentioned defined declaration, if the top layer of base plate for packaging is installed passive/active electronic device, and all do not have passive/active electronic device in functional layer, the electric power connector part is only arranged, and base plate for packaging deteriorates to multilayer circuit board; And then, if only have an one functional layer in multilayer circuit board, multilayer circuit board deteriorates to one-sided circuit board.
The top layer of base plate for packaging can be installed also can not install passive/active electronic device.If the top layer of base plate for packaging is installed passive/active electronic device, while printing top layer, can not print insulating material for the I/O pin of passive/active electronic device and the connecting portion between the electric power connector part, and should leave perforate, so that user installation welding electronic device.In addition, also should make one deck icon layer on top layer is one deck word and symbol ,/active electronic device installation site on top layer passive to indicate.
In the conventional line plate, air has been played the part of the role of encapsulated layer, and wiring layer depends primarily on the copper-clad plate manufacturing technology with reliable connection the between insulated substrate.For one-sided circuit board and multilayer circuit board, the application, based on the 3D printing technique, does not need the copper-clad plate manufacturing technology, thereby the electric power connector part of top layer provided with reliable the connection by encapsulated layer between insulating barrier.
Bottom, top layer all belong to routine techniques.
In existing base plate for packaging, bottom, top layer, insulating barrier are generally slab construction.Adopt the outstanding advantages of 3D printing technique to be, can manufacture bottom, top layer, insulating barrier and encapsulated layer with complicated stereochemical structure, also printable function difference, the different gradient-structure of material, to adapt to the development of three-dimension packaging.For example, in insulating barrier, the through hole of embedding sitting posture guide pillar is up-small and down-big conical bore, in print procedure, around the sitting posture guide pillar, successively generate, to the requirement of precision with manufacture complexity far below the micropore manufacturing technology in existing base plate for packaging; The upper surface of insulating barrier is complex-curved with fluted, projection, step, etc.These complicated stereochemical structures are conducive to process electromagnetic compatibility and heat dissipation problem, also help the location of electronic device/dress and paste, and needn't carry out extra bottom and fill.
Above-mentioned definition discloses, and the stereochemical structure of insulating barrier and encapsulated layer and manufacture method thereof are one of key technologies of base plate for packaging.This is the advantage of 3D printing technique just.Thereby, for this base plate for packaging of printing based on 3D, the basic task of manufacturing insulating barrier and encapsulated layer is, according to function and the structure of electronic device in the number of plies of base plate for packaging and functional layer, determine the stereochemical structure of insulating barrier and encapsulated layer, write the layering print routine of insulating barrier and encapsulated layer.
As everyone knows, the 3D of insulating barrier and encapsulated layer prints, the picking up/locate of passive/active electronic device, electric power connector part/fill subsides/connection etc. to be routine techniques.Thereby, for the 3D printing technique, the core of base plate for packaging manufacturing technology is exactly two kinds of interconnection techniques, the one, the perpendicular interconnection between the electronic device in the difference in functionality layer; The 2nd, the horizontal interconnect between the electronic device in same functional layer.
In existing base plate for packaging, by metallized vias, realize the perpendicular interconnection between wiring layer; Form wiring layer through chemical etching in copper-clad plate, adopt the lead-in wire interconnection technique to realize the I/O pin of passive/active electronic device and the horizontal interconnect between the pad on wiring layer, this is that existing base plate for packaging solves the basic fundamental means of interconnection.
In existing base plate for packaging, in wiring layer embedding passive/the I/O pin of active electronic device and the horizontal interconnect technology between the pad on wiring layer, generally be referred to as the interconnection technique that goes between.Lead-in wire interconnection technique commonly used has a material bonding (Wire Bonding, WB) technology, tape automated bonding (Tape Automated Bonding, TAB), beam lead technology (Beam Lead Bonding, BLB), these lead-in wire interconnection techniques must also can only be carried out horizontal interconnect with lead-in wire (gold thread, copper cash, aluminum steel).Flip chip technology (fct) (Flip Chip Bonding, FCB) adopts bump interconnect (bump interconnection), for the perpendicular interconnection of hundreds of I/O pins of flip-chip and substrate.Wherein, copper post (Cu-pillar Bump) interconnection has become the main flow of projection interconnection technique.So-called copper pole interconnection refers to, and the copper post that is greater than 1: 1 with depth-width ratio replaces Solder Bumps (Solder Bump), realizes the perpendicular interconnection between chip and substrate.
In present embodiment, bump interconnect is promoted, adopted sitting posture guide pillar (sitting posture guide pillar array) for the perpendicular interconnection between the electronic device of difference in functionality layer, particularly the perpendicular interconnection between the electronic device in the adjacent functional layer.
Present embodiment is defined as independently standardized electric power connector part by sitting posture guide pillar (sitting posture guide pillar array), thereby provides the new visual field of close examination base plate for packaging manufacturing technology for the 3D printing technique.
So, interconnection problems in base plate for packaging just is reduced to the horizontal interconnect problem between the electronic device in same functional layer, its pattern only has two kinds: the one, and the horizontal interconnect between the I/O pin of passive/active electronic device and sitting posture guide pillar (sitting posture guide pillar array), the 2nd, the horizontal interconnect between the I/O pin of passive/active electronic device.
The application's interconnection technique that will go between is promoted, and is not the wiring by chemical etching, but realizes above-mentioned two kinds of horizontal interconnect patterns by standardized electric power connector part wire (line conductor row).
The application is referred to as the direct interconnection technology by above-mentioned interconnecting method.
Increasing the number of plies is the optimum way of base plate for packaging microminiaturization.Yet, in the technical system of existing base plate for packaging, owing to manufacturing respectively wiring layer, increasing the number of plies causes qualification rate significantly to reduce with cost and significantly promote, force fine pore, thin wire, thin space, high-precision high density interconnect to become the mainstream development direction of base plate for packaging, live width, aperture etc. become the representative of technical merit, and the micropore manufacturing technology becomes key technology.
The direct interconnection technology that the application proposes does not need the micropore manufacturing technology.Thereby the micropore manufacturing technology is no longer the technical bottleneck of restriction base plate for packaging microminiaturization, increases the basic fundamental means that the number of plies becomes the base plate for packaging microminiaturization.
The sitting posture guide pillar of present embodiment, the copper post in its structure and flip chip technology (fct) is similar.Sitting posture guide pillar (sitting posture guide pillar array) can adopt copper or copper alloy.Particularly, with the copper post in flip chip technology (fct), compare, copper alloy sitting posture guide pillar (sitting posture guide pillar array) is more easily manufactured, and combination property is better, thereby reduces circuit loss and signal transmission delay.As standardized electric power connector part independently, sitting posture guide pillar (sitting posture guide pillar array), wire (line conductor row) can be by the third party with the several different methods manufactures.
Welding is to realize the modal technological means of horizontal interconnect.Laser microwelding (Laser Micro Welder) is fast with accurate, and flexible and convenient, do not need vacuum environment, "dead", pollution-free, is a kind of contactless electrical connection technology, belongs to revolutionary welding technology.The wavelength of industrial lasers commonly used is 1064nm, and its reflectivity to copper, up to 90%, is difficult to realize the connection of copper.And the laser of 532nm wavelength (green laser) can continue to infiltrate in copper, stably realize the connection of copper.
For different base plate for packaging (the organic base plate for packaging of rigidity, flexible encapsulating substrate, ceramic packaging substrate etc.), the material difference of insulating barrier, the 3D printing technique is also different.For example, for flexible encapsulating substrate, the material of insulating barrier is ABS, PC, PLA or photosensitive resin, and the 3D printing technique can select fuse deposition modeling technology or photoetching forming technique, digital light to process forming technique, ultraviolet forming technique.For ceramic packaging substrate, the material of insulating barrier is ceramic powders, and the 3D printing technique can be selected molded through three-dimensional printing technology, precinct laser sintering technology.
In concrete preferred implementation, the application adopts technical grade 3D printer; Using ABS, PC, PLA as the material of insulating barrier and encapsulated layer, using fuse deposition modeling technology as 3D printing shaping technology, or using photosensitive resin as the material of insulating barrier and encapsulated layer, using ultraviolet forming technique as 3D printing shaping technology; Using copper or copper alloy sitting posture guide pillar (sitting posture guide pillar array) as the electric power connector part of perpendicular interconnection, using the electric power connector part of wire (line conductor row) as horizontal interconnect; The horizontal interconnect technology adopts green laser welding technology.
Fig. 1 is a kind of generalized section that the base plate for packaging internal structure of printing based on 3D of two one functional layer is arranged.
A kind of base plate for packaging as shown in Figure 1, comprise three-layer insulated layer 1, two-layer encapsulated layer 2, two one functional layer; The functional layer of ground floor includes ground floor active/passive electronic device 3, as the ground floor wire 61 of horizontal type electric power connector part, as the sitting posture guide pillar (or sitting posture guide pillar array) 5 of vertical-type electric power connector part; Second layer functional layer comprises second layer active/passive electronic device 4, second layer wire 62.Sitting posture guide pillar 5 lower ends are mounted on the lower surface of the insulating barrier of ground floor, and upper end is through the through hole of second layer insulating barrier.In the ground floor functional layer, the I/O pin 31 of active/passive electronic device 3 is by the first wire 61 and the 5 lower end welding of sitting posture guide pillar; In the second functional layer, the I/O pin 41 of active/passive electronic device 4 is the upper end welding with sitting posture guide pillar 5 by the second wire 62.The insulating barrier of bottom one deck can be used as the bottom of base plate for packaging.Topmost the insulating barrier of one deck can be used as the top layer of base plate for packaging.
Shown in Fig. 2, the manufacture method of above-mentioned base plate for packaging comprises the following steps:
Step (1), write the layering print routine: according to function and the structure of electronic device in the number of plies of base plate for packaging and functional layer, determine the stereochemical structure of each insulating barrier, each functional layer, each encapsulated layer, write the layering print routine for each insulating barrier, encapsulated layer.
Step (2), use 3D printer are printed the ground floor insulating barrier.
Step (3), dress paste the ground floor functional layer: the upper surface dress at the ground floor insulating barrier pastes ground floor active/passive electronic device 3, sitting posture guide pillar 5, wire 61.
Step (4), ground floor functional layer horizontal interconnect: adopt the horizontal interconnect technology, use wire 61 by the active/passive electronic device 3 in the ground floor functional layer and the lower end level connection joint of sitting posture guide pillar 5.
Step (5), printing ground floor encapsulated layer: use the 3D printer to print and fill the space between each electric power connector part in the ground floor functional layer, form the ground floor encapsulated layer.
Step (6), the above-mentioned ground floor insulating barrier of pressing, ground floor functional layer, ground floor encapsulated layer.
Step (7), use 3D printer are printed second layer insulating barrier.
Step (8), dress paste second layer functional layer: the upper surface dress at second layer insulating barrier pastes second layer active/passive electronic device 4, wire 62.
Step (9), second layer functional layer horizontal interconnect: adopt the horizontal interconnect technology, use wire 62 by the active/passive electronic device 4 in second layer functional layer and the upper end level connection joint of sitting posture guide pillar 5.
Step (10), printing second layer encapsulated layer: use the 3D printer to print and fill the space between each electric power connector part in second layer functional layer, form second layer encapsulated layer.
Step (11), use 3D printer are printed the top layer of three-layer insulated layer as base plate for packaging.
Step (12), pressing the second insulating barrier, second layer functional layer, second layer encapsulated layer.
Sitting posture guide pillar (sitting posture guide pillar array) adopts copper or copper alloy, and the horizontal interconnect technology adopts green laser welding technology.
During other are implemented, if the number of plies of base plate for packaging more than 2 layers, step (2) to step (6) repeatedly, until the desired number of plies.
In existing base plate for packaging, adopt metallized vias to realize the perpendicular interconnection between wiring layer.Manufacture metallized vias by plating, its manufacture process has been totally enclosed, can not in manufacture process, carry out real-time on/off detection.
From above-mentioned steps, in the manufacture method proposed in the application, first on insulating barrier, dress pastes electronic device, then adopts green laser welding, realizes the horizontal interconnect between the I/O pin of sitting posture guide pillar (sitting posture guide pillar array) and passive/active electronic device.Thereby the application's manufacture process is wide-open.This just carries out detecting in real time the condition of having created for the connected condition of base plate for packaging.
Thereby, for the connected condition between the electronic device in same functional layer, the manufacture method that the application proposes can adopt very simple technological means to realize the real-time detection of on/off state, its technical scheme is as follows.
1 test point is set on the pin of each electronic device; When level is welded to connect electronic device, carry out real-time on/off detection.The real-time detection of on/off state is as common universal instrument detects break-make, 2 test probes are connected with 2 test points before and after pad respectively, detect the resistance value of the welding between 2 test points, thereby judge its on/off, and judge connection status according to the size of resistance value.If tie point opens circuit or resistance value is excessive, can carry out in real time repair welding to tie point by green laser, thereby improve rate of finished products.
Obviously, if two test probes are controlled by the 3D printer, while writing the layering print routine, write the control program of test probe, above-mentioned real-time testing process is carried out automatically simultaneously.
In the application's above-mentioned concrete preferred implementation, using the electric power connector part of sitting posture guide pillar/sitting posture guide pillar array as perpendicular interconnection, using the electric power connector part of wire/line conductor row as horizontal interconnect, using ABS, PC, PLA or the photosensitive resin material as insulating barrier and encapsulated layer, using fuse deposition modeling technology or ultraviolet forming technique as 3D printing shaping technology, the green laser welding of usining understands the application's technical scheme in detail as the horizontal interconnect technology, can not assert that the application's concrete enforcement is confined to these explanations.Particularly; for the application person of an ordinary skill in the technical field; under the prerequisite that does not break away from the application's design; electric power connector part for different structure; the insulating barrier of different materials and encapsulated layer and corresponding 3D printing shaping technology thereof; can also make some simple deduction or replace, all should be considered as belonging to the application's protection range.
Claims (10)
1. a base plate for packaging of printing based on 3D, is characterized in that: comprise insulating barrier, functional layer, encapsulated layer;
Described insulating barrier adopts the insulating material printing to form by the 3D printer;
Described encapsulated layer is positioned on described insulating barrier, and described functional layer is embedded in described encapsulated layer;
Described functional layer consists of the electronic device of interconnection; Described electronic device comprises the electric power connector part; Described electric power connector part comprises horizontal type electric power connector part; Described horizontal type electric power connector part comprises wire, and described wire connects two or more other electronic devices in same functional layer;
Thereby the space between described electronic device is adopted insulating material to print and is filled by the 3D printer and forms described encapsulated layer.
2. the base plate for packaging of printing based on 3D as claimed in claim 1, it is characterized in that: described base plate for packaging comprises multilayer dielectric layer, functional layer, encapsulated layer; Described electric power connector part comprises vertical-type electric power connector part, described vertical-type electric power connector part comprises the sitting posture guide pillar, the lower end of described sitting posture guide pillar is mounted on when the front insulation layer upper surface, and upper end is passed at least through hole of another insulating barrier and arrived another functional layer and be connected with the described electronic device in another functional layer.
3. the base plate for packaging of printing based on 3D as claimed in claim 2, it is characterized in that: described horizontal type electric power connector part also comprises the line conductor row integrated by multiple conducting wires.
4. the base plate for packaging of printing based on 3D as claimed in claim 2, it is characterized in that: described vertical-type electric power connector part also comprises by the many sitting posture guide pillar arrays that the sitting posture guide pillar is integrated.
5. the base plate for packaging of printing based on 3D as described as any one in claim 2 to 4, it is characterized in that: described electronic device also comprises active electronic device; Described active electronic device comprises transistor, integrated circuit, chip or chip module.
6. the base plate for packaging of printing based on 3D as described as any one in claim 2 to 4, it is characterized in that: described electronic device also comprises passive electronic; Described passive electronic comprises resistance, electric capacity or inductance.
7. the base plate for packaging of printing based on 3D as described as any one in claim 1 to 4, it is characterized in that: the insulating material of described insulating barrier, described encapsulated layer is ABS, PC, PLA or photosensitive resin.
8. the base plate for packaging of printing based on 3D as described as any one in claim 1 to 4, is characterized in that: on the pin of described electronic device, be provided with test point.
9. the base plate for packaging of printing based on 3D as claimed in claim 5, is characterized in that: on the pin of described electronic device, be provided with test point.
10. the base plate for packaging of printing based on 3D as claimed in claim 6, is characterized in that: on the pin of described electronic device, be provided with test point.
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| CN2013203964194U CN203327375U (en) | 2013-07-04 | 2013-07-04 | Package substrate based on 3D printing |
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| CN2013203964194U CN203327375U (en) | 2013-07-04 | 2013-07-04 | Package substrate based on 3D printing |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327741A (en) * | 2013-07-04 | 2013-09-25 | 江俊逢 | 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof |
| CN106507579A (en) * | 2016-11-30 | 2017-03-15 | 上海摩软通讯技术有限公司 | Integrated circuit board manufacturing method and device based on 3D printing technique |
| TWI608927B (en) * | 2016-08-26 | 2017-12-21 | 綠點高新科技股份有限公司 | Method of forming conductive traces in a 3d object and a 3d printing device |
| TWI675927B (en) * | 2018-06-14 | 2019-11-01 | 大陸商環旭電子股份有限公司 | Sip module and method of producing the sip module |
| CN111823575A (en) * | 2020-06-30 | 2020-10-27 | 东南大学 | Multifunctional 3D printer |
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2013
- 2013-07-04 CN CN2013203964194U patent/CN203327375U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103327741A (en) * | 2013-07-04 | 2013-09-25 | 江俊逢 | 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof |
| WO2015000197A1 (en) * | 2013-07-04 | 2015-01-08 | Jiang Junfeng | Package substrate based on 3d printing, and manufacturing method thereof |
| CN103327741B (en) * | 2013-07-04 | 2016-03-02 | 江俊逢 | A kind of base plate for packaging based on 3D printing and manufacture method thereof |
| TWI608927B (en) * | 2016-08-26 | 2017-12-21 | 綠點高新科技股份有限公司 | Method of forming conductive traces in a 3d object and a 3d printing device |
| CN106507579A (en) * | 2016-11-30 | 2017-03-15 | 上海摩软通讯技术有限公司 | Integrated circuit board manufacturing method and device based on 3D printing technique |
| TWI675927B (en) * | 2018-06-14 | 2019-11-01 | 大陸商環旭電子股份有限公司 | Sip module and method of producing the sip module |
| CN111823575A (en) * | 2020-06-30 | 2020-10-27 | 东南大学 | Multifunctional 3D printer |
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