CN112492767B - PCB (printed circuit board) with step groove and processing method thereof - Google Patents
PCB (printed circuit board) with step groove and processing method thereof Download PDFInfo
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- CN112492767B CN112492767B CN202110062666.XA CN202110062666A CN112492767B CN 112492767 B CN112492767 B CN 112492767B CN 202110062666 A CN202110062666 A CN 202110062666A CN 112492767 B CN112492767 B CN 112492767B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
A PCB board containing a step groove and a processing method thereof are characterized in that the method comprises the steps of; preparing a first core plate layer, processing a first step groove in the first core plate layer, and filling ink in the first step groove; preparing a second core plate layer; preparing an adhesive layer, processing a second step groove in the adhesive layer, and filling ink in the second step groove; sequentially laminating the first core plate layer, the bonding layer and the second core plate layer together; and (4) normally processing the through hole and the outer layer circuit after lamination, and removing ink by using strong alkaline solution to expose the bottom circuits of the first step groove and the second step groove after the outer layer circuit is etched. The problem of the infiltration of liquid medicine in the step inslot in outer course of working can effectively be solved, and operation mode is simpler, and production efficiency improves, is fit for the batch production operation of industrialization more.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a PCB with a step groove and a processing method thereof.
Background
With the development of electronic products, the multifunctional requirements of products are higher and higher, and the design of the PCB is also changed in order to improve the performance of the products, the assembly density of the products, and reduce the weight and volume of the products. The current novel processing technology is a step groove technology, and the step groove technology is mainly characterized in that the heat dissipation area is enlarged, or the safety of surface components is improved.
At present, the main step groove processing method is to groove a core board layer and an adhesive layer where the step groove is located, and after lamination, the step groove is filled and laminated; and after pressing, removing the filling in the outer layer processing flow to expose the step groove circuit. In the current method, or gaps between the filling and the groove wall exist, such as the situation of filling of high-temperature-resistant tetrafluoro cloth, the risk that liquid medicine still permeates into the step groove in the outer layer processing process is caused, and the corrosion of the circuits in the groove can cause the defects; or the filling before lamination and the removal after lamination are carried out by complex process means, but the efficiency is low, the filling and/or the removal are complicated, the cost is high, and the method cannot be applied to large-scale production.
Disclosure of Invention
The invention mainly aims at the defects of the related prior art, provides the PCB with the step groove and the processing method thereof, can effectively solve the problem of medicine water infiltration in the step groove in the outer layer processing process, has simpler operation mode and higher production efficiency, and is more suitable for industrialized batch production operation.
In order to achieve the above object, the present invention employs the following techniques:
a PCB board processing method containing step groove, including the step;
preparing a first core plate layer, processing a first step groove in the first core plate layer, and filling ink in the first step groove;
preparing a second core plate layer;
preparing an adhesive layer, processing a second step groove in the adhesive layer, and filling ink in the second step groove;
sequentially laminating the first core plate layer, the bonding layer and the second core plate layer together;
and (4) normally processing the through hole and the outer layer circuit after lamination, and removing ink by using strong alkaline solution to expose the bottom circuits of the first step groove and the second step groove after the outer layer circuit is etched.
Further, the first step groove and the second step groove are correspondingly consistent in position; after lamination, the first step groove and the second step groove are communicated.
Further, the ink filled in the first step groove is liquid ink, the filling is carried out in a silk-screen printing mode, the filling thickness is consistent with the thickness of the first core plate layer, the ink is baked and solidified after the filling is finished, and baking parameters are 60-90 ℃ and 15-35 min. And the ink filled in the second step groove is liquid ink, the filling is carried out in a screen printing mode, the filling thickness is consistent with the thickness of the bonding layer, the ink is baked and solidified after the filling is finished, and the baking parameters are 60-90 ℃ and 15-35 min.
Further, filling the liquid ink by adopting a screen printing mode comprises the following steps:
s1: placing a first core plate layer or an adhesive layer needing to be filled with ink on a supporting and positioning piece of an operating platform, and positioning the first core plate layer or the adhesive layer by adjusting the supporting and positioning piece;
s2: then, by utilizing first linear mechanisms respectively arranged on the convex walls on the two sides of the operating platform, a pair of side frames connected with a first movable part of the first linear mechanism and a screen printing screen frame connected with the side frames through a pair of guide rods and a first vertical cylinder move towards the upper part of a supporting positioning part, and the first linear mechanism is stopped after the side frames move to the right position;
s3: utilizing a first vertical cylinder to move the screen printing plate frame downwards along the guide rod, aligning the screen printing plate frame with a first core plate layer or an adhesive layer on the supporting and positioning part, and stopping the first vertical cylinder;
s4: pouring liquid ink for filling into a pattern silk screen on the silk screen frame;
s5: moving a cross frame integrally formed with a second movable part of a second linear mechanism to the left end or the right end of the screen printing frame by utilizing the second linear mechanism arranged on the front side and the rear side of the screen printing frame;
s6: descending a brush plate connected with a movable part of a second vertical cylinder by using the second vertical cylinder arranged on the straddle to be in contact with a pattern silk screen of the silk screen frame;
s7: and a second linear mechanism acts on the second movable part to make the cross frame move back and forth for a plurality of times from the left end or the right end of the screen printing screen frame to the other end, so that the ink is filled in the first step groove of the first core plate layer or the second step groove of the bonding layer.
Further, the supporting and positioning member used in step S1 has a structure including:
the supporting plate is arranged on the operating table through a plurality of stand columns;
the cross-shaped supporting platform is arranged in the middle of the supporting plate;
the transverse adjusting mechanism comprises a pair of transverse adjusting components which are oppositely arranged, each transverse adjusting component comprises a transverse guide rail arranged on the supporting plate, a transverse fixing block connected with the outer end of the transverse guide rail and a transverse screw rod arranged in parallel with the transverse guide rail, the inner end of the transverse guide rail is connected with a cross-shaped supporting table, one end of the transverse screw rod is rotatably matched with the cross-shaped supporting table, the other end of the transverse screw rod is rotatably penetrated through the transverse fixing block, a transverse moving part is slidably penetrated through the transverse guide rail, and the transverse screw rod penetrates through the transverse moving part and is in threaded fit with the transverse moving;
two groups of longitudinal adjusting mechanisms which are perpendicular to the transverse adjusting mechanisms and symmetrically arranged at two sides of the cross-shaped supporting platform, wherein each group of longitudinal adjusting mechanisms is arranged on two transverse moving parts at one side of the cross-shaped supporting platform, each group of longitudinal adjusting mechanisms comprises a longitudinal bottom plate arranged on the two transverse moving parts at one side of the cross-shaped supporting platform, a longitudinal middle fixed block fixed at the middle part in the length direction of the longitudinal bottom plate, and a pair of longitudinal adjusting components arranged at the front side and the rear side of the longitudinal middle fixed block relatively, each longitudinal adjusting component comprises a longitudinal guide rail arranged on the longitudinal bottom plate, a longitudinal fixed block connected with the outer end of the longitudinal guide rail, and a longitudinal screw rod arranged in parallel with the longitudinal guide rail, the inner end of the longitudinal guide rail is connected with the longitudinal middle fixed block, one end of the longitudinal screw rod is rotatably, the longitudinal screw rod penetrates through the longitudinal moving part and is in threaded fit with the longitudinal moving part;
the bottom of the positioning disc is connected with the top of the longitudinal moving part, a positioning column is arranged on the positioning disc, and the positioning column is used for being matched with a positioning hole of the first core plate layer or the bonding layer.
Further, the step S1 of placing the first core layer or the adhesive layer to be filled with ink on the supporting and positioning member of the operation table, and adjusting the supporting and positioning member to position the first core layer or the adhesive layer includes the following steps:
s11: adjusting two groups of transverse adjusting mechanisms according to the positions of the positioning holes of the first core plate layer or the bonding layer in the length direction, enabling the transverse moving part to move along the transverse guide rail by rotating the transverse lead screw, and stopping when the position of the positioning column along the length direction of the transverse guide rail is matched with the positions of the positioning holes of the first core plate layer or the bonding layer in the length direction;
s12: adjusting two groups of longitudinal adjusting mechanisms according to the position of the positioning hole of the first core plate layer or the bonding layer in the width direction, enabling the longitudinal moving part to move along the longitudinal guide rail by rotating the longitudinal lead screw, and stopping when the position of the positioning column along the length direction of the longitudinal guide rail is matched with the position of the positioning hole of the first core plate layer or the bonding layer in the width direction;
s13: the first core plate layer or the bonding layer is placed on the positioning disc through the matching of the positioning holes and the positioning columns, after the first core plate layer or the bonding layer is placed, the first core plate layer or the bonding layer is supported by the cross-shaped supporting table at the same time, and the positioning of the first core plate layer or the bonding layer is completed through four-point positioning.
Further, the step of preparing the first core layer includes: cutting a material, providing a first core plate medium, drilling and routing a first step groove, wherein the first step groove penetrates through the first core plate layer, filling ink into the first step groove, processing a first circuit layer as an inner layer circuit, and etching and browning the inner layer.
Further, the step of preparing a second core layer includes: cutting, providing a second core plate medium, processing a second circuit layer as an inner layer circuit, etching the inner layer, and browning.
Further, the step of preparing the adhesive layer includes: providing a semi-cured sheet material layer, drilling and routing a second step groove on the semi-cured sheet material layer, and filling ink into the second step groove.
Further, the prepreg material layer is a PP material layer.
Further, the first core plate layer, the bonding layer and the second core plate layer are sequentially laminated, are subjected to hot melting and are then riveted and fixed, and then the first core plate layer, the bonding layer and the second core plate layer are laminated together.
Further, the strongly alkaline solution is a sodium hydroxide solution.
A PCB with a step groove is obtained by adopting a circuit board preparation process comprising a PCB processing method with the step groove.
A PCB board that contains step groove includes that the stromatolite sets up in proper order:
the first core plate layer comprises a first core plate medium and a first circuit layer positioned on one side of the first core plate medium, and the first core plate layer is provided with a first step groove in a penetrating mode;
the bonding layer is provided with a second step groove in a penetrating way; and
the second core board layer comprises a second core board medium and a second circuit layer positioned on one side of the second core board medium;
the first circuit layer and the second circuit layer are both positioned on one surface facing the bonding layer;
the positions of the second step groove and the first step groove are correspondingly consistent, and the second step groove is communicated with the first step groove;
before lamination and lamination, the second step groove and the first step groove are respectively filled with printing ink for seamlessly filling the step grooves and keeping the second step groove area and other areas of the second core plate layer, the first step groove area and other areas of the first core plate layer flat;
after lamination and lamination are carried out and the outer layer circuit is etched, ink filled in the second step groove and the first step groove respectively is removed through strong alkaline solution to expose the bottom circuits of the first step groove and the second step groove.
The invention has the beneficial effects that:
1. the step groove is filled with ink before lamination, so that the flatness of the step groove area and other areas of the PCB in the lamination process is ensured;
2. the filled ink is liquid ink, and the uneven positions of the wall of the step groove can be completely filled in the filling process, so that no gap is formed between the ink and the wall of the step groove, and the risk that the traditional Chinese medicine water permeates into the step groove in the outer layer processing flow is effectively avoided;
3. the printing ink filling is carried out by adopting a screen printing device, the first core plate layer or the bonding layer is effectively positioned, then the filling effect can be ensured by a back-and-forth printing mode, the thickness after filling is ensured, the printing is automatically finished by utilizing the device after the feeding positioning, and the screen printing is finished at a high speed by the action of a plurality of strokes to fill the printing ink into the first step groove or the second step groove;
4. when the supporting positioning piece is used for positioning, the supporting positioning piece is matched and positioned with the positioning hole through the four point positions, the fixing effect is good, meanwhile, the supporting positioning piece is also provided with a cross-shaped support, the supporting effect on the first core plate layer or the bonding layer is effectively ensured by matching with the positioning discs at the four point positions, and the local deformation possibly caused in the silk screen is avoided;
5. the supporting positioning piece adopted by the method has the advantages that the supporting positioning piece has the transverse adjustment and the longitudinal adjustment simultaneously, so that the positioning disc and the positioning column can be effectively matched with the condition that the first core plate layers or the bonding layers of different batches have size differences, the effective matching adjustment can be carried out according to the specific positioning hole positions of different batches, and the applicability in silk-screen filling is improved;
6. after the outer layer circuit is etched, the ink can be removed by using strong alkaline sodium hydroxide solution, the removing mode is simple, and the production efficiency is high.
Drawings
Fig. 1 is a schematic flow chart of a processing method according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a first core layer structure according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a second core board layer according to an embodiment of the present application.
Fig. 4 is a schematic view of a bonding layer structure according to an embodiment of the present application.
FIG. 5 is a schematic diagram of the overall structure of the laminated stack of the present application after lamination and before de-inking.
Fig. 6 is a schematic view of the entire structure of the laminated layer after being degreased after lamination according to the embodiment of the present application.
Fig. 7 is a schematic structural diagram of a screen printing device used for filling liquid ink in a screen printing manner according to an embodiment of the present application.
Fig. 8 is a schematic view of another structure of a screen printing device used for filling liquid ink in a screen printing manner according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of a supporting and positioning element used for filling liquid ink by using a silk-screen printing method according to an embodiment of the present application.
Reference numerals:
1-a first core board layer, 10-a first step groove, 11-a first core board medium, 12-a first circuit layer, 2-a second core board layer, 21-a second core board medium, 22-a second circuit layer, 3-a bonding layer, 30-a second step groove, 4-ink, 100-an operation table, 101-a convex wall, 200-a supporting positioning member, 210-a column, 211-a supporting plate, 220-a transverse adjusting mechanism, 221-a transverse guide rail, 222-a transverse screw rod, 223-a transverse fixing block, 230-a cross supporting table, 240-a longitudinal adjusting mechanism, 241-a longitudinal bottom plate, 242-a longitudinal fixing block, 243-a longitudinal guide rail, 244-a longitudinal screw rod, 245-a longitudinal intermediate fixing block, 246-a transverse moving part, 250-a positioning disc, 260-a positioning column, 300-a first linear mechanism, 301-a first movable part, 400-a side frame, 500-a first vertical cylinder, 501-a guide rod, 600-a screen plate frame, 601-a second linear mechanism, 602-a second movable part, 603-a spanning frame, 604-a second vertical cylinder and 700-a brush board.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
Example one
As shown in fig. 1, the present embodiment provides a method for processing a PCB board having a step groove, including the following steps:
step one, preparing a first core layer 1, processing a first step groove 10 in the first core layer 1, and filling ink 4 in the first step groove 10.
Specifically, the step of preparing the first core layer 1 includes: cutting, providing a first core plate medium 11, drilling and routing a first step groove 10, wherein the first step groove 10 penetrates through the first core plate layer 1, filling ink 4 in the first step groove 10, and processing a first circuit layer 12 as an inner layer circuit, wherein the inner layer is etched and browned.
Specifically, the ink 4 filled in the first stepped groove 10 is liquid ink, and is filled in a silk-screen printing manner, and the filling thickness is consistent with the thickness of the first core board layer 1.
Specifically, the screen printing device shown in fig. 7 to 8 is used for filling liquid ink by adopting a screen printing manner, and the screen printing device includes an operating table 100, a supporting positioning member 200, a first linear mechanism 300 respectively arranged on the convex walls 101 at two sides of the operating table 100, a pair of side frames 400 connected with the first movable portion 301 of the first linear mechanism 300, a screen printing screen frame 600 connected with the side frames 400 through a pair of guide rods 501 and a first vertical cylinder 500, a second linear mechanism 601 arranged at the front and rear sides of the screen printing screen frame 600, a second movable portion 602 connected with the second linear mechanism 601, a cross frame 603 integrally formed with the second movable portion 602, a second vertical cylinder 604 arranged on the cross frame 603, and a brush board 700 connected with the movable portion of the second vertical cylinder 604.
The filling of liquid ink by using a screen printing device comprises the following steps:
s1: the first core plate layer 1 to be filled with the ink 4 is placed on the supporting and positioning member 200 of the operation table 100, and the first core plate layer 1 is positioned by adjusting the supporting and positioning member 200.
S2: then, the pair of side frames 400 connected to the first movable portion 301 of the first linear mechanism 300 and the stencil frame 600 connected to the side frames 400 through the pair of guide rods 501 and the first vertical cylinder 500 are moved upward above the support positioning member 200 by the first linear mechanisms 300 respectively provided on the convex walls 101 on both sides of the console 100, and the first linear mechanisms 300 are stopped after the pair of side frames 400 and the stencil frame 600 are moved into position.
S3: the screen frame 600 is moved down along the guide rods 501 by the first vertical cylinder 500, so that the screen frame 600 is aligned and positioned with the first core plate layer 1 on the supporting and positioning member 200, and the first vertical cylinder 500 is stopped.
S4: liquid ink for filling is poured onto the pattern screen on the screen printing frame 600.
S5: the second linear mechanism 601 provided on the front and rear sides of the screen frame 600 is used to move the straddle 603 integrally formed with the second movable portion 602 of the second linear mechanism 601 to the left end or the right end of the screen frame 600.
S6: the brush plate 700 connected to the movable portion of the second vertical cylinder 604 is lowered by the second vertical cylinder 604 provided in the straddle 603 to be in contact with the patterned screen of the screen frame 600.
S7: the second linear mechanism 601 acts on the second movable portion 602 to move the straddle 603 back and forth several times from the left end or the right end of the screen printing frame 600 to the other end, thereby completing the filling of the ink 4 into the first step groove 10 of the first core plate layer 1.
Carry out 4 packings of printing ink of silk screen printing mode through above-mentioned silk screen printing device, only need to be located first core plate layer 1 behind supporting positioning piece 200, promptly through first linear mechanism 300, first vertical cylinder 500, second linear mechanism 601, the joint action of second vertical cylinder 604 and brush board 700, the silk screen printing is filled to high-efficient completion, printing ink 4's filling efficiency has greatly been improved, and through the location of first core plate layer 1, first linear mechanism 300 and first vertical cylinder 500 are to the location of silk screen printing plate frame 600, and the control of second linear mechanism 601 and the vertical cylinder 604 of second to brush board 700 stroke, can make the filling effect satisfy abundant and the even demand of thickness.
As shown in fig. 9, the supporting and positioning member 200 used in step S1 includes: the supporting plate 211, the cross supporting platform 230, two sets of transverse adjusting mechanisms 220, two sets of longitudinal adjusting mechanisms 240 and the positioning plate 250.
The support plate 211 is provided to the operation table 100 by a plurality of columns 210.
The cross-shaped support platform 230 is disposed in the middle of the support plate 211.
Each group of transverse adjusting mechanisms 220 comprises a pair of transverse adjusting components which are oppositely arranged, each transverse adjusting component comprises a transverse guide rail 221 arranged on the supporting plate 211, a transverse fixing block 223 connected with the outer end of the transverse guide rail 221 and a transverse screw rod 222 arranged in parallel with the transverse guide rail 221, the inner end of the transverse guide rail 221 is connected with a cross-shaped supporting table 230, one end of each transverse screw rod 222 is rotatably matched with the cross-shaped supporting table 230, the other end of each transverse screw rod 222 is rotatably penetrated through the transverse fixing block 223, a transverse moving part 246 is slidably penetrated through the transverse guide rail 221, and the transverse screw rods 222 penetrate through the transverse moving parts 246 and are in. The transverse screws 222 of a pair of transverse adjusting assemblies in the same group are oppositely threaded.
Two sets of longitudinal adjusting mechanisms 240 are perpendicular to the transverse adjusting mechanisms 220 and symmetrically arranged at two sides of the cross-shaped supporting platform 230, each set of longitudinal adjusting mechanisms 240 is arranged on two transverse moving parts 246 at one side of the cross-shaped supporting platform 230, each set of longitudinal adjusting mechanisms 240 comprises a longitudinal bottom plate 241 arranged on the two transverse moving parts 246 at one side of the cross-shaped supporting platform 230, a longitudinal middle fixing block 245 fixed at the middle part of the longitudinal bottom plate 241 in the length direction, and a pair of longitudinal adjusting components arranged at the front side and the rear side of the longitudinal middle fixing block 245 oppositely, each longitudinal adjusting component comprises a longitudinal guide rail 243 arranged on the longitudinal bottom plate 241, a longitudinal fixing block 242 connected with the outer end of the longitudinal guide rail 243, and a longitudinal screw 244 arranged in parallel with the longitudinal guide rail 243, the inner end of the longitudinal guide rail 243 is connected with the, the other end of the longitudinal screw rod passes through the longitudinal fixing block 242 in a rotating mode, a longitudinal moving portion penetrates through the longitudinal guide rail 243 in a sliding mode, and the longitudinal screw rod 244 passes through the longitudinal moving portion and is in threaded fit with the longitudinal moving portion. The longitudinal screw 244 of the longitudinal adjusting mechanism 240 in the same group is oppositely threaded.
The bottom of the positioning plate 250 is connected with the top of the longitudinal moving part, a positioning column 260 is arranged on the positioning plate 250, and the positioning column 260 is used for being matched with the positioning hole of the first core plate layer 1.
Based on the supporting and positioning member 200 as shown in fig. 9, the first core board layer 1 to be filled with the ink 4 is placed on the supporting and positioning member 200 of the operation table 100 in step S1, and the first core board layer 1 is positioned by adjusting the supporting and positioning member 200, including the following detailed steps:
s11: according to the position of the positioning hole of the first core plate layer 1 in the length direction, the two sets of lateral adjustment mechanisms 220 are adjusted, the lateral moving part 246 is moved along the lateral guide rail 221 by rotating the lateral lead screw 222, and the movement is stopped until the position of the positioning column 260 along the length direction of the lateral guide rail 221 matches with the position of the positioning hole of the first core plate layer 1 in the length direction.
S12: the two sets of longitudinal adjustment mechanisms 240 are adjusted according to the position of the positioning hole of the first core layer 1 in the width direction, the longitudinal moving part is moved along the longitudinal guide 243 by rotating the longitudinal lead screw 244, and the longitudinal moving part is moved until the position of the positioning column 260 in the length direction of the longitudinal guide 243 is matched with the position of the positioning hole of the first core layer 1 in the width direction and is stopped.
S13: the first core plate layer 1 is placed on the positioning disc 250 through the matching of the positioning holes and the positioning columns 260, and after the first core plate layer 1 is placed, the first core plate layer 1 is supported by the cross-shaped supporting table 230 at the same time, and the positioning of the first core plate layer 1 is completed through four-point positioning.
When the sizes of the first core plate layers 1 facing another batch are different, the corresponding positioning holes may also have position differences, and the supporting and positioning member 200 in this example can be adopted to perform positioning and matching by adjusting the two sets of transverse adjusting mechanisms 220 and the two sets of longitudinal adjusting mechanisms 240, so that the conditions of more sizes can be well matched.
After the filling is completed, the ink 4 filled in the first step groove 10 is baked and cured.
In one embodiment of the present example, the baking parameters for baking and curing the ink 4 filled in the first step groove 10 are 60 ℃ and 15 min.
In another embodiment of this example, the baking parameters for baking and curing the ink 4 filled in the first step groove 10 are 75 ℃ and 20 min.
In another embodiment of the present example, the baking parameters for baking and curing the ink 4 filled in the first step groove 10 are 82 ℃ and 25 min.
In another embodiment of the present example, the baking parameters for baking and curing the ink 4 filled in the first step groove 10 are 90 ℃ and 35 min.
The obtained first core layer 1 is prepared as shown in fig. 2.
Step two, preparing a second core plate layer 2: cutting, providing a second core plate medium 21, processing a second circuit layer 22 as an inner layer circuit, etching the inner layer, and browning.
The obtained second core layer 2 is prepared as shown in fig. 3.
And step three, preparing the bonding layer 3. Processing a second step groove 30 in the bonding layer 3, wherein the positions of the first step groove 10 and the second step groove 30 are correspondingly consistent, and filling the second step groove 30 with ink 4;
specifically, the method comprises the following steps: providing a semi-solidified sheet material layer, such as a PP material layer, drilling and routing a second step groove 30 thereon, and filling the second step groove 30 with ink 4.
The ink 4 filled in the second stepped groove 30 is liquid ink, and is filled in a silk-screen printing mode, the filling thickness is consistent with the thickness of the bonding layer 3, and the specific silk-screen printing filling mode can also be completed by adopting a silk-screen printing device shown in fig. 7-9.
After the filling is completed, the ink 4 filled in the second step groove 30 is baked and cured.
In one embodiment of the present example, the baking parameters for baking and curing the ink 4 filled in the second step groove 30 are 60 ℃ and 15 min.
In another embodiment of this example, the baking parameters for baking and curing the ink 4 filled in the second step groove 30 are 75 ℃ and 20 min.
In another embodiment of the present example, the baking parameters for baking and curing the ink 4 filled in the second step groove 30 are 80 ℃ and 28 min.
In another embodiment of the present example, the baking parameters for baking and curing the ink 4 filled in the second step groove 30 are 90 ℃ and 35 min.
The obtained adhesive layer 3 was prepared as shown in fig. 4.
Step four, laminating and pressing: the first core plate layer 1, the adhesive layer 3 and the second core plate layer 2 are sequentially stacked, are subjected to hot melting and are then riveted and fixed, and then the first core plate layer 1, the adhesive layer 3 and the second core plate layer 2 are stacked together, as shown in fig. 5, after the stacking, the first step groove 10 and the second step groove 30 are communicated.
Step five, removing the printing ink: after lamination, through hole and outer layer circuit processing is normally performed, and then the ink 4 is removed by using a strong alkaline solution, so that the circuits at the bottoms of the first stepped groove 10 and the second stepped groove 30 are exposed. Specifically, the strongly alkaline solution may be a sodium hydroxide solution.
It should be noted that the ink 4 in the tank must be removed after the circuit etching is completed, and before the removal, the ink 4 in the tank blocks the liquid medicine from entering the tank, so as to prevent the circuit in the tank from being corroded by the liquid medicine.
After completion, as shown in fig. 6.
And step six, continuing to perform solder mask and subsequent processes to complete the manufacture, and obtaining the PCB with the step groove.
Example two
The embodiment provides a PCB board with a step groove, as shown in fig. 5 to 6, including the following stacked layers: a first core layer 1, an adhesive layer 3, a second core layer 2.
Specifically, as shown in fig. 2, the first core layer 1 includes a first core dielectric 11 and a first circuit layer 12 located on one side of the first core dielectric 11, the first core layer 1 is provided with a first step groove 10 in a penetrating manner, and the first step groove 10 is filled with ink 4 for filling the step groove without a gap and keeping the area of the first step groove 10 and other areas of the first core layer 1 flat.
Specifically, as shown in fig. 4, a second step groove 30 is provided through the adhesive layer 3, the second step groove 30 corresponds to and coincides with the first step groove 10, the second step groove 30 communicates with the first step groove 10, and the second step groove 30 is filled with ink 4 for filling the step groove without a gap and keeping the second step groove 30 area and other areas of the second core plate layer 2 flat.
Specifically, as shown in fig. 2, the second core layer 2 includes a second core dielectric 21 and a second circuit layer 22 on one side of the second core dielectric 21.
The first wiring layer 12 and the second wiring layer 22 are both located on the surface facing the adhesive layer 3.
After lamination and lamination are carried out and etching of the outer layer circuit is completed, the ink 4 filled in the second step groove 30 and the first step groove 10 respectively is removed through a strong alkaline solution to expose the circuits at the bottoms of the first step groove 10 and the second step groove 30, and the PCB board containing the step grooves as shown in fig. 6 is formed.
The above is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A PCB board processing method containing step groove, including the step;
preparing a first core plate layer (1), processing a first step groove (10) in the first core plate layer (1), and filling ink (4) in the first step groove (10);
preparing a second core layer (2);
preparing an adhesive layer (3), processing a second step groove (30) in the adhesive layer (3), and filling ink (4) in the second step groove (30);
sequentially laminating the first core plate layer (1), the bonding layer (3) and the second core plate layer (2) together;
processing the through hole and the outer layer circuit normally after lamination, and removing the ink (4) by using strong alkaline solution after the outer layer circuit is etched to expose the circuits at the bottoms of the first step groove (10) and the second step groove (30);
the method is characterized in that the ink (4) filled in the first stepped groove (10) and the second stepped groove (30) is liquid ink, the liquid ink is filled in a silk-screen printing mode, and the liquid ink is filled in the silk-screen printing mode, and the method comprises the following steps:
s1: placing a first core plate layer (1) or an adhesive layer (3) needing to be filled with ink (4) on a supporting and positioning piece (200) of an operating platform (100), and positioning the first core plate layer (1) or the adhesive layer (3) by adjusting the supporting and positioning piece (200);
s2: then, a pair of side frames (400) connected with a first movable part (301) of the first linear mechanism (300) and a screen printing plate frame (600) connected with the side frames (400) through a pair of guide rods (501) and a first vertical cylinder (500) are moved to the upper part of a supporting positioning piece (200) by utilizing the first linear mechanisms (300) respectively arranged on the convex walls (101) at the two sides of the operating platform (100), and the first linear mechanism (300) is stopped after the side frames (400) are moved to the right position;
s3: the screen printing plate frame (600) is moved downwards along the guide rod (501) by using the first vertical air cylinder (500), so that the screen printing plate frame (600) is aligned with the first core plate layer (1) or the bonding layer (3) on the supporting and positioning part (200) and is in place, and the first vertical air cylinder (500) is stopped;
s4: pouring liquid ink for filling onto a graphic screen on the screen printing plate frame (600);
s5: a second linear mechanism (601) arranged on the front side and the rear side of the screen printing plate frame (600) is utilized to move a cross frame (603) integrally formed with a second movable part (602) of the second linear mechanism (601) to the left end or the right end of the screen printing plate frame (600);
s6: descending a brush plate (700) connected with a movable part of a second vertical cylinder (604) to be in contact with a graphic screen of the screen plate frame (600) by using the second vertical cylinder (604) arranged on the spanning frame (603);
s7: and (3) acting on the second movable part (602) by using a second linear mechanism (601), so that the straddle (603) moves to and fro for a plurality of times from the left end or the right end of the screen printing frame (600) to the other end, and the filling of the ink (4) into the first step groove (10) of the first core plate layer (1) or the second step groove (30) of the bonding layer (3) is completed.
2. The method for processing the PCB board with the step groove as recited in claim 1, wherein the first step groove (10) and the second step groove (30) are correspondingly consistent in position; after lamination, the first step groove (10) and the second step groove (30) are communicated.
3. The method for processing the PCB board with the step groove as claimed in claim 1, wherein the filling thickness of the ink (4) filled in the first step groove (10) is consistent with the thickness of the first core board layer (1), and the ink is baked and cured after the filling is completed, wherein the baking parameters are 60 ℃ to 90 ℃ and 15min to 35 min.
4. The method for processing the PCB board with the step groove as claimed in claim 3, wherein the filling thickness of the ink (4) filled in the second step groove (30) is consistent with the thickness of the bonding layer (3), and the ink is baked and cured after the filling is completed, wherein the baking parameter is 60 ℃ to 90 ℃ and 15min to 35 min.
5. The method for processing the PCB board with the step groove as recited in claim 1, wherein:
the step of preparing the first core layer (1) comprises: cutting, providing a first core medium (11), drilling and routing a first step groove (10), enabling the first step groove (10) to penetrate through the first core layer (1), filling ink (4) into the first step groove (10), processing a first circuit layer (12) to serve as an inner layer circuit, and etching and browning the inner layer;
the step of preparing the second core layer (2) comprises: cutting, providing a second core plate medium (21), processing a second circuit layer (22) as an inner layer circuit, and etching and browning the inner layer;
the step of preparing the adhesive layer (3) comprises: providing a prepreg material layer, drilling and routing a second step groove (30) on the prepreg material layer, filling ink (4) in the second step groove (30), wherein the prepreg material layer is a PP material layer.
6. The method for processing the PCB board with the step groove as claimed in claim 1, wherein the first core board layer (1), the adhesive layer (3) and the second core board layer (2) are sequentially laminated, are hot-melted and then are riveted and fixed, and then the first core board layer (1), the adhesive layer (3) and the second core board layer (2) are laminated together.
7. The method for processing a PCB including a stepped groove as claimed in claim 1, wherein the supporting and positioning member (200) used in step S1 has a structure including:
a support plate (211) provided on the console (100) via a plurality of columns (210);
the cross-shaped support platform (230) is arranged in the middle of the support plate (211);
two groups of transverse adjusting mechanisms (220), each group of transverse adjusting mechanisms (220) comprises a pair of transverse adjusting components which are arranged oppositely, each transverse adjusting component comprises a transverse guide rail (221) arranged on the supporting plate (211), a transverse fixing block (223) connected with the outer end of the transverse guide rail (221), and a transverse screw rod (222) arranged in parallel with the transverse guide rail (221), the inner end of the transverse guide rail (221) is connected with a cross supporting platform (230), one end of the transverse screw rod (222) is rotatably matched with the cross supporting platform (230), the other end of the transverse screw rod is rotatably penetrated through the transverse fixing block (223), a transverse moving part (246) is slidably penetrated on the transverse guide rail (221), and the transverse screw rod (222) penetrates through the transverse moving part (246) and is in threaded fit with;
two groups of longitudinal adjusting mechanisms (240) which are perpendicular to the transverse adjusting mechanisms (220) and symmetrically arranged at two sides of the cross supporting platform (230), wherein each group of longitudinal adjusting mechanisms (240) is arranged on two transverse moving parts (246) at one side of the cross supporting platform (230), each group of longitudinal adjusting mechanisms (240) comprises a longitudinal bottom plate (241) arranged on the two transverse moving parts (246) at one side of the cross supporting platform (230), a longitudinal middle fixing block (245) fixed at the middle part of the longitudinal bottom plate (241) in the length direction, and a pair of longitudinal adjusting components arranged at the front side and the rear side of the longitudinal middle fixing block (245) relatively, each longitudinal adjusting component comprises a longitudinal guide rail (243) arranged on the longitudinal bottom plate (241), a longitudinal fixing block (242) connected with the outer end of the longitudinal guide rail (243), and a longitudinal screw rod (244) arranged in parallel with the longitudinal, the inner end of the longitudinal guide rail (243) is connected with a longitudinal middle fixed block (245), one end of a longitudinal screw rod (244) is rotatably matched with the longitudinal middle fixed block (245), the other end of the longitudinal screw rod is rotatably penetrated through the longitudinal fixed block (242), a longitudinal moving part is slidably penetrated through the longitudinal guide rail (243), and the longitudinal screw rod (244) penetrates through the longitudinal moving part and is in threaded fit with the longitudinal moving part;
the bottom of the positioning disc (250) is connected with the top of the longitudinal moving portion, a positioning column (260) is arranged on the positioning disc (250), and the positioning column (260) is used for being matched with a positioning hole of the first core plate layer (1) or the bonding layer (3).
8. The method for processing a PCB including a step groove as claimed in claim 7, wherein the step S1 of placing the first core layer (1) or the adhesive layer (3) to be filled with the ink (4) on the supporting and positioning member (200) of the operation table (100) and positioning the first core layer (1) or the adhesive layer (3) by adjusting the supporting and positioning member (200) comprises the steps of:
s11: according to the position of the positioning hole of the first core plate layer (1) or the bonding layer (3) in the length direction, two groups of transverse adjusting mechanisms (220) are adjusted, a transverse moving part (246) moves along a transverse guide rail (221) by rotating a transverse screw rod (222), and the transverse adjusting mechanisms stop moving until the position of a positioning column (260) in the length direction of the transverse guide rail (221) is matched with the position of the positioning hole of the first core plate layer (1) or the bonding layer (3) in the length direction;
s12: adjusting two sets of longitudinal adjusting mechanisms (240) according to the position of the positioning hole of the first core plate layer (1) or the adhesive layer (3) in the width direction, moving the longitudinal moving part along the longitudinal guide rail (243) by rotating the longitudinal lead screw (244) until the position of the positioning column (260) along the length direction of the longitudinal guide rail (243) is matched with the position of the positioning hole of the first core plate layer (1) or the adhesive layer (3) in the width direction, and stopping;
s13: the first core plate layer (1) or the bonding layer (3) is placed on the positioning disc (250) through the matching of the positioning holes and the positioning columns (260), after the first core plate layer (1) or the bonding layer (3) is placed, the first core plate layer (1) or the bonding layer (3) is supported by the cross-shaped supporting table (230) at the same time, and the positioning of the first core plate layer (1) or the bonding layer (3) is completed through four-point positioning.
9. A PCB board with a step groove is characterized by being obtained by the processing method of the PCB board with the step groove as claimed in any one of claims 1 to 8.
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| CN202110062666.XA CN112492767B (en) | 2021-01-18 | 2021-01-18 | PCB (printed circuit board) with step groove and processing method thereof |
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| CN202110062666.XA CN112492767B (en) | 2021-01-18 | 2021-01-18 | PCB (printed circuit board) with step groove and processing method thereof |
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| CN112492767B true CN112492767B (en) | 2021-04-20 |
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| CN104827752A (en) * | 2015-05-22 | 2015-08-12 | 际华三五三四制衣有限公司 | Screen printing machine |
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| JPH0852872A (en) * | 1994-08-15 | 1996-02-27 | Citizen Watch Co Ltd | Ink jet head and manufacture thereof |
| JP2009039984A (en) * | 2007-08-10 | 2009-02-26 | Toyo Seikan Kaisha Ltd | Manufacturing method of intaglio, and intaglio |
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| CN112492767A (en) | 2021-03-12 |
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