JP5350085B2 - Via filling apparatus and via filling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a via-hole filling device and method which relate to a via-hole filling method into via-holes formed in a green sheet in manufacture of a multilayer ceramic substrate, and are simplified more than a conventional thick film printing technology. <P>SOLUTION: This via-hole filling device 10 has from the lower part, so as to process and fill the holes of the green sheet 11: a pressing cylinder 25; a bottom cast 12 which forms microscopic holes in the green sheet 11; guide pins 22, 23; a release mask 13; a thick film paste sheet 30; a back plate 21; an upper cast 14; a press head 16; a delivery roller 18 for delivering an adhesive tape 17 for removing punch debris punched by the bottom cast 12; and a winding roller 19 which winds the adhesive tape 17. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a method for manufacturing a multilayer ceramic substrate, and more particularly to a via filling apparatus and a via filling method for filling a via hole in a circuit pattern of a substrate.

  2. Description of the Related Art Conventionally, in order to reduce the size of an electronic device substrate, a multilayer ceramic substrate is used as a substrate on which electronic components are mounted, and wiring layers are multilayered and wiring pitches are narrowed. The multilayer ceramic substrate is a via hole forming process (drilling) for forming vias such as through holes and via (VIA) holes in the substrate, a via filling process for filling the via with a conductive material, a pattern printing process, a laminating process, and a pressing process. , And a baking process.

  As a via filling method, a method such as depositing a metal such as copper in the via by plating, or generally a thick film paste dispersed in an organic vehicle or thinner using a conductive material as a powder, a screen printing method, etc. There are methods using the thick film printing technology.

  However, in the method of filling the via with the thick film paste using the thick film printing technique, an unfilled region remains in the via, and if this region is large, the layers may not be electrically connected. In addition, when there is an unfilled region, there was a problem that, although the electrical connection was possible in the initial state, the electrical connection was lost due to a change over time and the wire was disconnected.

  In order to solve such a problem, Patent Document 1 discloses a technique in which a step of securing a certain amount of paste and a step of filling the vias of the substrate with the paste are separate steps.

  FIG. 9 shows the via filling process of Patent Document 1. 9A and 9B, the paste 51 placed on one side of the metal mask 52 in the through opening 53 of the metal mask 52 having the through opening 53 formed in the same pattern as the via arrangement of the substrate 60. And paste 51 with squeegee 54. In addition, when the paste is not filled in all of the through openings 53, the filling of the paste into the through openings 53 is repeated again.

  In FIG. 9C, a metal mask 52 in which all the through openings 53 are filled with the paste 51 is brought into close contact with the substrate 60 in a reduced pressure atmosphere. Further, in FIG. 9D, the pressure of the atmosphere is increased in a state where the metal mask 52 and the substrate 60 are in close contact, and the paste 51 filled in the through opening 53 is filled in the via 67 with a differential pressure. Reference numeral 66 denotes a solder resist film. By filling the paste 51, conduction between the copper wiring 61 on the glass epoxy substrate 62 and the copper polyimide tape 63 and the copper layer 65 on the thermoplastic polyimide 64 is ensured. By such a filling step, filling is completed as shown in FIG. Note that FIG. 9F illustrates a case where the volume of the conductive material satisfies the electrical connection of each layer even when the paste is not completely filled after solidifying.

JP 2001-298271 A

  When filling vias in multilayer ceramic substrates, it is necessary to sinter the green sheet laminate to form the final substrate, and the filling material filled in the via holes shrinks during the sintering stage, often resulting in the quality of the multilayer ceramic substrate.・ This is a cause of loss of reliability.

  The main cause is not only the filling rate of the filling member into the via hole, but also the shrinkage amount during sintering of the thick film paste is often a problem. Up to now, measures for improving the sintering shrinkage of thick film pastes have been to improve the properties of thick film pastes by improving the shape and size of the conductive metal powder and the mixing ratio of organic and inorganic substances of the paste. However, the largest cause of sintering shrinkage of the thick film paste is the volume shrinkage due to evaporation of the organic solvent added to obtain the fluidity of the thick film paste, but this point has not been improved.

  In general, a thick film paste is developed for the purpose of pattern formation using a printing technique, and fluidity is added at room temperature by kneading a powdered metal with an organic binder called a vehicle. As the organic binder, those based on ethyl cellulose are widely used. The ethyl cellulose solvent is an organic solvent mainly composed of terpineol, and about 10 wt% of the weight of the paste is added.

  In the case of a silver (Ag) conductor, the metal ratio of the thick film paste is 80 to 85 wt%, and 15 to 20 wt% is occupied by an organic material. In the organic material, the ratio of the organic solvent that evaporates before sintering is about 8 to 12 wt%. When this is converted into a volume ratio, when the bulk density (bulk density) of Ag is 5 and the density of the organic binder is 1.2, the volume ratio of the inorganic material / organic material is 58 vol%: 42 vol%, Since the thinner is 58% of the organic type, it becomes 24 vol% with respect to the total paste volume, and when the thinner evaporates from the thick film paste state, the volume shrinks by 24%. Such shrinkage causes a lack of filling rate after filling the via hole.

  Therefore, it is possible to suppress unfilled areas in the vias by using the above-described technique and making the process of securing a certain amount of paste and the process of filling the paste into the vias of the substrate different from each other. Become. However, the metal mask is brought into close contact with the substrate in a reduced pressure environment, and the pressure of the atmosphere is increased after the close contact, thereby requiring a step such as filling the via filled with the paste filled in the through-opening, and filling the via. It is difficult to simplify the device scale of the device.

  The present invention relates to a method for filling a via hole formed in a green sheet in manufacturing an LTCC substrate (Low Temperature Co-fired Ceramics), which is more simplified than a conventional thick film printing technique. An object is to provide a via filling apparatus and a via filling method.

In order to achieve the above object, a via filling apparatus according to the present invention includes a convex mold in a via filling apparatus that fills a via hole formed in a green sheet used for manufacturing a multilayer ceramic substrate with a thick film paste. and via-hole formation means for forming a via hole in the green sheet by using the convex mold, and filling means for filling the thick film paste is formed via holes, have a via hole forming means, the surface of the green sheet And a metal mask having a plurality of openings, which are punching molds, are installed on the back surface, and the via is formed by pushing the convex mold into the green sheet from the back surface of the green sheet. A back plate is installed instead of a mask, thick paste is printed on the base film, and the base film is placed on the convex mold. Location and sandwiching the thick film paste with convex mold and the metal mask, filling the thick film paste by applying a load in the compression direction to convex mold and the back plates from the opening of the metal mask via holes of the green sheets It is characterized by doing.

  In the via filling apparatus according to the present invention, the thick film paste on the base film is printed on the base film and dried.

  In the via filling device according to the present invention, a carbon sheet or carbon graphite sheet obtained by printing and drying a carbon paste on a base film is filled in a via hole of a green sheet with a convex mold, and then fired. It has the hole formation means which forms a hole in a board | substrate, It is characterized by the above-mentioned.

  Further, in the via filling apparatus according to the present invention, after filling the filling member obtained by printing and drying the thick film paste and the carbon paste on the base film respectively into the via hole and the hole of the green sheet with the convex mold, By baking, a via filling portion and a hole portion are formed.

The via filling device according to the present invention is a via filling device that fills a via hole using a conductive sheet mainly composed of a conductive material in a via hole formed in a green sheet used for manufacturing a multilayer ceramic substrate as a filling member. , and via-hole formation means for forming a via hole in the green sheet by the convex mold, by using the convex mold, and filling means for filling the filling member to the formed via hole, it has a via hole forming means, A metal mask having a plurality of openings, which are punching molds, is installed on the front and back surfaces of the green sheet, and a convex mold is pushed into the green sheet from the back surface of the green sheet to form via holes. Instead of a metal mask on the surface of the back plate, a back plate is installed, and the filling member is printed on the base film. The rumm is placed on the convex mold, the filling member is sandwiched between the convex mold and the metal mask, and the filling member is placed in the opening of the metal mask by applying a load in the compression direction between the convex mold and the back plate. To fill the via hole of the green sheet .

Further, the via filling method according to the present invention is a via filling method for filling a via hole formed in a green sheet used for manufacturing a multilayer ceramic substrate with a thick film paste, and forming a via hole in the green sheet by a convex mold. and forming step, by using the convex mold, a filling step of the formed via hole to fill the thick film paste, have a via hole forming step is the cutting die mold on the surface and the back surface of the green sheet A metal mask with multiple openings is installed, a convex mold is pushed into the green sheet from the back side of the green sheet to form a via hole, and a back plate is installed instead of the metal mask on the surface of the green sheet. The thick film paste is printed on the base film, and the base film is placed on the convex mold. And sandwiched between the metal mask, characterized by filling the thick film paste from the opening of the metal mask via holes of the green sheets by applying a load in the compression direction to convex mold and the back plates.

  In the via filling method according to the present invention, the thick film paste on the base film is printed on the base film and dried.

  Further, in the via filling method according to the present invention, a carbon sheet or carbon graphite sheet obtained by printing and drying a carbon paste on a base film is filled in a via hole of a green sheet with a convex mold, and then fired. It includes a hole forming step of forming holes in the substrate.

  Further, in the via filling method according to the present invention, after filling the filling member obtained by printing and drying the thick film paste and the carbon paste on the base film, respectively, into the via hole and the hole of the green sheet with a convex mold, By baking, a via filling portion and a hole portion are formed.

Furthermore, the via filling method according to the present invention is a via filling method in which a via sheet formed in a green sheet used for manufacturing a multilayer ceramic substrate is filled in a via hole with a conductive sheet mainly composed of a conductive material as a filling member. , and via-hole forming step of forming a via hole in the green sheet by the convex mold, by using the convex mold, the filling member is formed via holes have a, a filling step of filling a via hole forming step, A metal mask having a plurality of openings, which are punching molds, is installed on the front and back surfaces of the green sheet, and a via hole is formed by pushing the convex mold into the green sheet from the back surface of the green sheet. Instead of the metal mask on the surface of the back, a back plate is installed, and the filling member is printed on the base film. The film is placed on the convex mold, the filling member is sandwiched between the convex mold and the metal mask, and a load in the compression direction is applied between the convex mold and the back plate so that the filling member is placed in the opening of the metal mask. To fill the via hole of the green sheet .

  The present invention is capable of highly reliable via filling in the production of LTCC substrates (low temperature sintered multilayer ceramic substrates), and further using a thick film paste sheet replaced with carbon graphite as a filling member disposed at a predetermined site, This has the effect that holes with high accuracy can be formed in a single step in a predetermined part of the LTCC substrate.

It is a structural diagram showing the structure of a via filling device according to an embodiment of the present invention. It is explanatory drawing explaining the via hole formation process of the via filling apparatus in 1st Embodiment. It is explanatory drawing explaining the via filling preparation process in 1st Embodiment. It is explanatory drawing explaining the via filling process in 1st Embodiment. It is explanatory drawing explaining the process of taking out a green sheet after the via filling in 1st Embodiment. It is explanatory drawing explaining the hole formation process in 2nd Embodiment. It is explanatory drawing of the process of performing the cavity formation and via filling in 3rd Embodiment simultaneously. It is explanatory drawing explaining the via filling process to the via hole in 4th Embodiment. It is explanatory drawing explaining the conventional via filling process.

  Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described with reference to the drawings.

(First embodiment)
FIG. 1 shows the structure of a via filling device 10 in the present embodiment. The via filling device 10 is provided with a pressurizing cylinder 25, a convex bottom cast 12 that forms fine holes in the green sheet 11, and a release from the bottom in order to process the hole of the green sheet 11 and fill the filling member. Mask 13, thick film paste sheet 30, back plate 21, upper cast 14 that is a punching die, release mask 13 and guide pins 22 and 23 that support upper cast 14, and pressure cylinder 25 A press head 16 for receiving the load of the sheet, a feeding roller 18 for feeding the adhesive tape 17 for removing punch scraps opened by the bottom cast 12 to the lower surface of the press head 16, a take-up roller 19 for winding the adhesive tape 17, have.

  2A to 2D show a via hole forming process in which one via hole is enlarged. In FIG. 2A, from the bottom, for example, a bottom cast 12 having a protrusion and a protrusion having a protrusion height of approximately 80 μm, a release mask 13 having a thickness of approximately 40 μm, and a protrusion mask having a protrusion height of approximately 80 μm. A green sheet 11 having a thickness, an upper cast 14 having a thickness of about 40 μm, and an adhesive tape 17 having a thickness of about 70 μm are disposed.

  When pressed from above and below as shown in FIG. 2 (B), the bottom cast 12 pushes the green sheet 11 into the space formed by the upper cast 14 and the adhesive tape 17, and the periphery of the protrusion is sheared. The Next, in FIG. 2C, the punch scraps are removed together with the adhesive tape 17 by winding up the adhesive tape 17, and the via hole 15 appears. In FIG. 2 (D), the upper cast 14 is raised and the restraint of the green sheet 11 is released.

  3E to 3G show a preparation process for via filling. One of the characteristic features of the present invention is that the opening diameter of the release mask 13 is made larger than the opening diameter of the upper cast 14 that affects the opening diameter of the via hole 15. In FIG. 3E, the distance between the bottom cast 12 and the release mask 13 is increased by raising the release mask 13. Next, in FIG. 3F, the thick film paste sheet 30 is inserted from the side into the expanded space.

  The thick film paste sheet 30 includes a base film 32 and a solid filling member 31 in which the organic thinner is evaporated by printing the paste on the base film 32 and drying it. Moreover, the base film 32 used for the thick film paste sheet 30 uses a polyethylene film having a film thickness of 20 μm to 40 μm.

  In FIG. 3 (G), the bottom surface of the base film 32 of the thick film paste sheet 30 is placed in contact with the top surface of the bottom cast 12, and the green sheet 11 is the same as the pattern of the via hole 15 formed by the upper cast 14. A via hole having a shape is formed, and is held in a state where the patterns of the upper cast 14 and the via hole 15 are aligned with each other and is sandwiched between the back plates 21. Further, the protrusions of the bottom cast 12 are also aligned with the upper cast 14 and the via holes 15 of the green sheet 11.

  4 (H) to 4 (J) show a via filling process. When a load in the compression direction is applied between the back plate 21 and the bottom cast 12, the thick film paste sheet 30 is filled with a dry paste with the base film 32 extended by the protrusions of the bottom cast 12 as shown in FIG. The member 31 is guided into the via hole 15 of the green sheet 11. At this time, the filling member 31 on the thick film paste sheet 30 is press-fitted into the via hole 15 of the green sheet 11 by the projection pattern of the bottom cast 12, and as shown in FIG. It is fixed.

  5K to 5L show a process of taking out the green sheet after filling the via. In FIG. 5K, the back plate 21 is raised, and then the bottom cast 12 is moved to take out the green sheet 11 filled with the filling material 31a in the via hole 15. At this time, the thick film paste sheet 30 has the base film 32 held in the shape of the projection pattern of the bottom cast 12. By raising the release mask 13 in this state, the filling member 31 is broken, and the filling material 31 a remains in the via hole 15 of the green sheet 11.

  The various conditions in embodiment of this inventor are shown. In this embodiment, a C4676 paste made by Sumitomo Metal Mining Co., Ltd. is used for the thick film paste sheet 30 and a polyethylene film having a thickness of 38 μm is used for the base film 32. A thick film screen printing method is used on this film. A solid pattern was formed. In order to ensure the printed film thickness, printing was performed by combining a 200-mesh stainless mesh and a paste whose viscosity was adjusted to 350 kcps. After drying, printing and drying were performed under the same conditions to obtain a dried film thickness of 90 μm.

  Similarly, GCS71E manufactured by Nippon Electric Vacuum Glass Co., Ltd. was used as the green sheet 11, and the green sheet 11 having a thickness of 100 μm was used. The via hole was formed by the NC punch method, and the via hole diameter was 200 μm. The upper cast 14 was made of a SUS304 material having a thickness of 40 μm by an etching method, and the bottom cast 12 was formed by an additive plating method, and the diameter of the upper part of the protrusion was 160 μm and the height of the protrusion was 100 μm.

  The back plate 21 was made of SUS304 material having a thickness of 3 mm. The pressure press was performed with the pressure cylinder of FIG. 1, and the pressure condition was 1 MPa to 2 MPa per unit area.

(Second Embodiment)
Next, a second embodiment in which holes are formed in a multilayer ceramic substrate, which is an application example of this embodiment, will be described. In general, a multilayer ceramic substrate is produced through a hole punching process (via hole formation), a hole filling process (via filling), a circuit pattern forming process, a sheet laminating process, a laminate pressing process, and a firing process in a green sheet. The In the above-described via filling process, a material that is thermally decomposed at the stage of substrate sintering is selected as a filling member, and by filling this filling member into a hole (via hole) in advance, a void that has been prevented from being deformed in the filling portion. A hole is formed. In the present embodiment, GCS71E manufactured by Nippon Electric Vacuum Glass Co., Ltd. was used as the ceramic green sheet, carbon paste manufactured by Kyoto Elex Co., Ltd., and GRAFOIL manufactured by Sakai Kogyo Co., Ltd. was used as the carbon paste sheet.

  FIG. 6 shows a hole forming process for forming holes. 6A is a front view of the green sheet 11 having holes (via holes), and FIGS. 6B to 6E show FIG. 6A viewed from the QQ ′ cross-sectional direction. FIG. In FIG. 6 (B), it becomes the same arrangement | positioning as FIG. 4 (H) mentioned above, and the carbon graphite sheet 33 is inserted on the bottom cast 12. FIG. The green sheet 11 is formed with holes having the same shape as the pattern of the via hole 15 formed by the upper cast 14 shown in FIG. 2, and is held in a state where the positions of the upper cast 14 and the hole pattern are aligned with each other. And is held by the back plate 21. Further, the protrusions of the bottom cast 12 are also aligned with the upper cast 14 and the holes. By applying a load in the compression direction between the bottom cast 12 and the back plate 21, the pores of the green sheet 11 as shown in FIG. 6C are filled with the carbon graphite filler 33a.

  In FIG. 6D, the green sheet 11 filled with the carbon graphite filler 33a is laminated with another green sheet, and in this state, a pressure of 30 MPa is applied in a temperature environment of 90 ° C. The binder is softened and the green sheets are welded together to form a laminate. Next, the laminate is fired. As the firing conditions, the temperature in the furnace is increased from room temperature to 550 ° C. at a temperature increase rate of 50 ° C./h in an atmospheric pressure atmosphere. At this stage, the carbon graphite in the laminate is pyrolyzed. The thermal decomposition temperature of the carbon graphite used this time is 500 ° C., and the ash content at that time is 500 ppm. For this reason, there is almost no solid content at a firing temperature of 550 ° C., and voids are formed in the via holes in the laminate.

  Next, the furnace temperature is raised from 550 ° C. to 850 ° C. at a rate of 100 ° C./h, and then the glass of the green sheet is softened by keeping 850 ° C. for 1 hour. By performing under the condition of −150 ° C./h, a highly accurate hole 36 is formed in the LTCC substrate 35 as shown in FIG.

(Third embodiment)
A characteristic matter in the third embodiment is that a conductive paste and a carbon paste are applied on the thick film paste sheet 30 and then dried and used. By applying different types of pastes with different characteristics on the base film 32, the portion where the conductive paste is applied becomes conductive when the green sheet is sintered, and the portion where the carbon paste is applied is the green sheet. It becomes a void | hole when it sinters, and it becomes possible to make it a non-conduction state.

  FIG. 7 shows a step of simultaneously performing hole formation and via filling. FIG. 7A is a front view of the green sheet 11, and via holes 41 and 42 and holes 43 are formed in the green sheet 11. FIGS. 7B to 7D are views of FIG. 7A viewed from the R-R ′ cross-sectional direction. In FIG. 7B, a sheet in which a thick paste filling member 31 and a carbon paste filling member 34 are formed on a base film 32 is inserted, and a load in the compression direction is placed between the bottom cast 12 and the back plate 21. As shown in FIG. 7C, the holes 43 of the green sheet 11 as shown in FIG. 7C are filled with the carbon filler 34a, and the via holes 41 and 42 are filled with the thick film paste filler 31a. .

  The green sheet 11 filled with the filling material 31a and the filling material 34a is laminated with another green sheet, heated and pressurized, and then fired to fill holes and vias as shown in FIG. Thus, the multilayer ceramic substrate 40 can be formed. In this embodiment, the green sheet is handled as a non-conductive substrate. However, it goes without saying that a combination of filling a conductive carbon graphite sheet with an insulating paste is also possible.

(Fourth embodiment)
A characteristic feature of the fourth embodiment is that a conductive sheet mainly composed of a conductive material such as silver (Ag) or a silver (Ag) / palladium (Pd) mixture is used as the filling member. Since the conductor sheet is formed using a doctor blade method, it is a sheet body having a higher film thickness accuracy than a sheet formed by a thick film printing method. The film thickness of the conductive sheet in the present embodiment is equal to the target film thickness, compared to the film thickness of the conductive paste formed by the thick film printing method with an accuracy of about ± 30% with respect to the target film thickness. On the other hand, it is excellent with an accuracy of ± 10% or less. Therefore, by filling the via hole of the green sheet with the conductor sheet in this embodiment as a filling member, it is possible to increase the accuracy of the filling amount.

  FIG. 8 shows a via filling process to the via hole of the green sheet. FIG. 8A is a front view of the green sheet 11 having a via hole, and FIGS. 8B to 8E are views of FIG. 8A viewed from the S-S ′ cross-sectional direction. In FIG. 8B, the arrangement is the same as in FIG. 4H described above, and the conductor sheet 37 is inserted on the bottom cast 12. The green sheet 11 is formed with a via hole having the same shape as the pattern of the via hole 15 formed by the upper cast 14 shown in FIG. 2, and is held in a state where the positions of the patterns of the upper cast 14 and the via hole are aligned. It is held by the back plate 21. Further, the protrusion of the bottom cast 12 is also aligned with the upper cast 14 and the via hole. By applying a load in the compression direction between the bottom cast 12 and the back plate 21, the filler 37a of the conductor sheet 37 is filled in the via hole of the green sheet 11 as shown in FIG.

  In FIG. 8D, the green sheet 11 filled with the filler 37a of the conductor sheet 37 is laminated with another green sheet, and in this state, a pressure of 30 MPa is applied in a temperature environment of 90 ° C. The organic binder is softened and the green sheets are welded together to form a laminate. Next, the laminate is fired. As the firing conditions, the temperature in the furnace is increased from room temperature to 550 ° C. at a temperature increase rate of 50 ° C./h in an atmospheric pressure atmosphere. At this stage, the organic binder of the green sheet and conductor sheet in the laminate is thermally decomposed. Since the conductor sheet 37 in this embodiment uses the same organic binder as that of the green sheet 11, the organic binder decomposing step of the laminate can be achieved under a single processing condition. For this reason, the organic binder of the filling material 37a is also decomposed at the stage of being treated at a temperature condition of 550 ° C.

  Next, the furnace temperature is raised from 550 ° C. to 850 ° C. at a rate of 100 ° C./h, and then kept at 850 ° C. for 1 hour, so that the glass of the green sheet is softened and the metal of the filling 37a The powder is sintered, and the filling 37a is formed as a via fill. Furthermore, by performing under the condition of 850 ° C. to a temperature decrease rate of −150 ° C./h, a via fill 38 with a high filling amount is formed in the LTCC substrate 35 as shown in FIG.

  As described above, highly reliable via filling can be performed in manufacturing an LTCC substrate (low-temperature sintered multilayer ceramic substrate) using each embodiment according to the present invention. Further, by using a sheet in which a thick film paste filling member and a carbon paste filling member are combined as a filling member disposed at a predetermined site, high-accuracy holes and vias can be filled at a predetermined site in the LTCC substrate. It can be formed in a single process.

  The via filling device according to the present invention is capable of highly reliable via filling in the manufacture of LTCC and has industrial applicability.

  10 via filling device, 11 green sheet, 12 bottom cast, 13 release mask, 14 upper cast, 15 via hole, 16 press head, 17 adhesive tape, 18 feed roller, 19 take-up roller, 21 back plate, 22, 23 guide pin , 25 Pressure cylinder, 30 Thick film paste sheet, 31, 34 Filling member, 31a, 33a, 34a, 37a Filling material, 32 Base film, 33 Carbon graphite sheet, 36, 43 Air hole, 35 LTCC substrate, 37 Conductor sheet 38 Via Fill, 40 Multilayer Ceramic Substrate, 41, 42 Via Hole, 51 Paste, 52 Metal Mask, 53 Through Opening, 54 Squeegee, 60 Substrate, 61 Copper Wiring, 62 Glass Epoxy Substrate, 63 Copper Polyimide Tape, 64 Thermoplastic polyimide, 65 copper layer, 67 a via.

Claims (10)

In a via filling device that fills a via hole formed in a green sheet used for manufacturing a multilayer ceramic substrate with a thick film paste,
Via hole forming means for forming a via hole in the green sheet by a convex mold;
Filling means for filling the formed via hole with a thick film paste using the convex mold,
I have a,
The via hole forming means is provided with a metal mask having a plurality of openings that are punching dies on the front and back surfaces of the green sheet, and a convex mold is pushed into the green sheet from the back surface of the green sheet to form via holes,
The filling means is to place a back plate in place of the metal mask on the surface of the green sheet, print the thick film paste on the base film, place the base film on the convex mold and project the thick film paste. Via filling, characterized in that the thick film paste is filled into the via hole of the green sheet from the opening of the metal mask by applying a load in the compression direction between the convex mold and the back plate, sandwiched between the mold and the metal mask apparatus. The via filling device according to claim 1 ,
The via filling apparatus, wherein the thick film paste on the base film is printed on the base film and dried. The via filling device according to claim 1 or 2 ,
Formation of pores in the substrate by filling the via hole of the green sheet with a convex mold, and then firing the carbon sheet or carbon graphite sheet that has been printed and dried on the base film with carbon paste. A via filling device comprising means. In the via filling device according to any one of claims 1 to 3 ,
Filled parts that are printed with a thick film paste and carbon paste on the base film and dried are filled into via holes and holes in the green sheet with a convex mold, and then fired to fill and fill the vias and holes. And a via filling device. In a via filling device for filling a via hole as a filling member with a conductive sheet mainly composed of a conductive material in a via hole formed in a green sheet used for manufacturing a multilayer ceramic substrate,
Via hole forming means for forming a via hole in the green sheet by a convex mold;
Filling means for filling the formed via hole with a filling member using the convex mold,
I have a,
The via hole forming means is provided with a metal mask having a plurality of openings that are punching dies on the front and back surfaces of the green sheet, and a convex mold is pushed into the green sheet from the back surface of the green sheet to form via holes,
The filling means is to install a back plate instead of a metal mask on the surface of the green sheet, print the filling member on the base film, place the base film on the convex mold, and place the filling member on the convex mold. A via filling apparatus characterized in that a filling member is filled into a via hole of a green sheet from an opening of a metal mask by applying a load in a compression direction between a convex mold and a back plate, sandwiched between a mold and a metal mask . In a via filling method of filling a thick film paste into a via hole formed in a green sheet used for manufacturing a multilayer ceramic substrate,
A via hole forming step of forming a via hole in the green sheet by a convex mold;
A filling step of filling the formed via hole with a thick film paste using the convex mold,
I have a,
In the via hole forming step, a metal mask having a plurality of openings, which is a punching die, is installed on the front and back surfaces of the green sheet, and a convex mold is pushed into the green sheet from the back surface of the green sheet to form via holes,
In the filling process, a back plate is installed instead of the metal mask on the surface of the green sheet, the thick film paste is printed on the base film, and the base film is placed on the convex mold to project the thick film paste. Via filling, characterized in that the thick film paste is filled into the via hole of the green sheet from the opening of the metal mask by applying a load in the compression direction between the convex mold and the back plate, sandwiched between the mold and the metal mask Method. The via filling method according to claim 6 ,
The via filling method, wherein the thick film paste on the base film is printed on the base film and dried. The via filling method according to claim 6 or 7 ,
Formation of pores in the substrate by filling the via hole of the green sheet with a convex mold, and then firing the carbon sheet or carbon graphite sheet that has been printed and dried on the base film with carbon paste. A via filling method comprising a step. The via filling method according to any one of claims 6 to 8 ,
Filled parts that are printed with a thick film paste and carbon paste on the base film and dried are filled into via holes and holes in the green sheet with a convex mold, and then fired to fill and fill the vias and holes. And forming a via. In a via filling method of filling a via hole as a filling member with a conductive sheet mainly composed of a conductive material in a via hole formed in a green sheet used for manufacturing a multilayer ceramic substrate,
A via hole forming step of forming a via hole in the green sheet by a convex mold;
A filling step of filling the formed via hole with the filling member using the convex mold,
I have a,
In the via hole forming step, a metal mask having a plurality of openings, which is a punching die, is installed on the front and back surfaces of the green sheet, and a convex mold is pushed into the green sheet from the back surface of the green sheet to form via holes,
In the filling process, a back plate is installed instead of the metal mask on the surface of the green sheet, the filling member is printed on the base film, the base film is placed on the convex mold, and the filling member is placed on the convex mold. A via filling method characterized in that a filling member is filled into a via hole of a green sheet from an opening of a metal mask by applying a load in a compression direction between a mold and a back plate between a mold and a metal mask .

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