CN108993835A - A kind of novel segment difference fill method - Google Patents
A kind of novel segment difference fill method Download PDFInfo
- Publication number
- CN108993835A CN108993835A CN201810775669.6A CN201810775669A CN108993835A CN 108993835 A CN108993835 A CN 108993835A CN 201810775669 A CN201810775669 A CN 201810775669A CN 108993835 A CN108993835 A CN 108993835A
- Authority
- CN
- China
- Prior art keywords
- segment difference
- melt adhesive
- hot melt
- cap rock
- coating cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of novel segment difference fill methods, comprising the following steps: step 1: hot melt adhesive being cut into the closed hoop figure being consistent with coating cap rock shape, the inward flange of the hot melt adhesive is slightly larger than the outer edge of coating cap rock；Step 2: Hot melt adhesive plaster being attached to the periphery of coating cap rock, the thickness of the hot melt adhesive is no more than segment difference height；Step 3: pushing down segment difference with one piece of thermally conductive cover board, reusable heat wind or the mode for directly heating cover board make hot melt adhesive be contracted to coating cap rock surrounding；Step 4: removing cover board；Upper cover film is attached to above segment difference in advance, heating idler wheel is recycled to carry out hot pressing；Step 5: idler wheel being recycled to drive the air in product out of.The method of the present invention reduces material cost and process flow, improves production yield, and segment difference filling effect is good.
Description
Technical field
The present invention relates to segment difference edge banding technique field, especially a kind of novel segment difference fill method.
Background technique
Existing segment difference fill method mainly has: one, using the capillary phenomenon of glue carry out segment difference in actual production, this
Kind method be easy to cause dispensing excessive or very few in actual operation, and more ugly in appearance, yield is lower in practical operation；
Two, a upper frame glue is put in advance or later in segment difference region to carry out segment difference filling using frame glue；Three, sufficiently thick half is utilized
Solid-state glue directly overcomes segment difference to be filled；Four, segment difference is directly made into cavity using the flexibility of upper cover film；Five, sharp
Segment difference is directly filled with sufficiently thick glue thickness.The filling effect filled using above-mentioned segment difference is all undesirable, therefore, is badly in need of
A kind of simple process and the good fill method of segment difference filling effect.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of novel segment difference fill method, it is applied to electronic tag/can
It is smaller or to the higher product edge sealing of product edge banding requirements depending on the edge sealing such as card or e-book distance, reduce material cost and simplification
Process flow improves production yield.
In order to solve the above technical problems, the technical solution adopted by the present invention is that:
A kind of novel segment difference fill method, comprising the following steps:
Step 1: hot melt adhesive is cut into the closed hoop figure being consistent with coating cap rock shape, the inner edge of the hot melt adhesive
Edge is slightly larger than the outer edge of coating cap rock；
Step 2: Hot melt adhesive plaster being attached to the periphery of coating cap rock, the thickness of the hot melt adhesive is no more than segment difference height；
Step 3: pushing down segment difference with one piece of thermally conductive cover board, reusable heat wind or the mode for directly heating cover board make to heat
Glue is contracted to coating cap rock surrounding；
Step 4: removing cover board；Upper cover film is attached to above segment difference in advance, heating idler wheel is recycled to carry out hot pressing, to increase
Seal up back gauge；
Step 5: idler wheel being recycled to drive the air in product out of.
Further, the step 3 replacement are as follows: push down segment difference with one piece of thermally conductive cover board, then with the lamp source, ultraviolet light of generating heat
The mode of irradiation or laser irradiation makes hot melt adhesive be contracted to coating cap rock surrounding.
Further, step 4 replacement are as follows: remove cover board；Upper cover film is attached to above segment difference in advance, it is flat using fitting
Platform heating, then upper cover film is bonded with idler wheel rolling mode.
Compared with prior art, it the beneficial effects of the present invention are: reducing material cost and simplifying process flow, improves
Production yield, segment difference filling effect are good.
Detailed description of the invention
Fig. 1 is schematic diagram of product structure made by a kind of novel segment difference fill method of the present invention.
Fig. 2 is a kind of novel segment difference fill method flow diagram of the present invention (coating cap rock is rectangular).
Fig. 3 is a kind of novel segment difference fill method flow diagram of the present invention (coating cap rock is star).
In figure: 101- substrate；The upper cover film of 102-；103- is coated cap rock；104- hot melt adhesive；105- cover board；106- heating
Idler wheel.
Specific embodiment
Below by the drawings and specific embodiments, the present invention is described in further detail.
A kind of novel segment difference fill method of the present invention, comprising the following steps:
Step 1: using hot melt adhesive 104 in low temperature the characteristics of heat shrinkable and Tg point melted by heat characteristic, will
Hot melt adhesive 104 is cut into the closed hoop figure being consistent with coating 103 shape of cap rock, and the inward flange of the hot melt adhesive 104 is bigger
In the outer edge of coating cap rock 103；
Step 2: hot melt adhesive 104 being attached to the periphery of coating cap rock 103, the thickness of the hot melt adhesive 104 is no more than section
Poor height；
Step 3: pushing down segment difference, reusable heat wind or the mode for directly heating cover board 105 with one piece of thermally conductive cover board 105
Hot melt adhesive 104 is set to be contracted to coating 103 surrounding of cap rock；This method also can effectively overcome the coating cap rock 103 of abnormity.
Step 4: removing cover board 105；Upper cover film 102 is attached to above segment difference in advance, heating idler wheel 106 is recycled to carry out heat
Pressing, to increase edge sealing distance；
Step 5: idler wheel being recycled to drive the air in product out of.
In addition, glue can be made to reach with the method for fever lamp source, ultraviolet light or laser irradiation in step 3
The purpose of contraction.In step 4, can also be used, with fitting platform heating, then with idler wheel rolling mode to upper cover film 102 into
Row fitting.
Claims (3)
1. a kind of novel segment difference fill method, which comprises the following steps:
Step 1: hot melt adhesive (104) is cut into the closed hoop figure being consistent with coating cap rock (103) shape, the hot melt adhesive
(104) inward flange is slightly larger than the outer edge of coating cap rock (103)；
Step 2: hot melt adhesive (104) being attached to the periphery of coating cap rock (103), the thickness of the hot melt adhesive (104) is no more than
Segment difference height；
Step 3: pushing down segment difference, reusable heat wind or the mode for directly heating cover board (105) with one piece of thermally conductive cover board (105)
Hot melt adhesive (104) is set to be contracted to coating cap rock (103) surrounding；
Step 4: removing cover board (105)；Upper cover film (102) is attached to above segment difference in advance, heating idler wheel (106) is recycled to carry out
Hot pressing, to increase edge sealing distance；
Step 5: idler wheel being recycled to drive the air in product out of.
2. a kind of novel segment difference fill method as described in claim 1, which is characterized in that step 3 replacement are as follows: with one piece
Thermally conductive cover board (105) pushes down segment difference, then makes hot melt adhesive with the mode of fever lamp source, ultraviolet light or laser irradiation
(104) it is contracted to coating cap rock (103) surrounding.
3. a kind of novel segment difference fill method as described in claim 1, which is characterized in that step 4 replacement are as follows: remove lid
Plate (105)；Upper cover film (102) is attached to above segment difference in advance, is heated with fitting platform, then with idler wheel rolling mode to upper covering
Film (102) is bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810775669.6A CN108993835A (en) | 2018-07-16 | 2018-07-16 | A kind of novel segment difference fill method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810775669.6A CN108993835A (en) | 2018-07-16 | 2018-07-16 | A kind of novel segment difference fill method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108993835A true CN108993835A (en) | 2018-12-14 |
Family
ID=64599336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810775669.6A Pending CN108993835A (en) | 2018-07-16 | 2018-07-16 | A kind of novel segment difference fill method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108993835A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650598A (en) * | 2019-10-31 | 2020-01-03 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board for improving bubbling |
| CN110769619A (en) * | 2019-10-31 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board |
Citations (8)
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|---|---|---|---|---|
| US20050064630A1 (en) * | 2002-01-14 | 2005-03-24 | Juergen Zacherl | Method for producing a protection for chip edges and system for the protection of chip edges |
| JP2005203562A (en) * | 2004-01-15 | 2005-07-28 | Denso Corp | Semiconductor device and manufacturing method of semiconductor device |
| TW201001641A (en) * | 2008-06-24 | 2010-01-01 | Raydium Semiconductor Corp | Package structure and method for chip on film |
| JP2010021540A (en) * | 2008-06-11 | 2010-01-28 | Nikkiso Co Ltd | Via-hole filling device and method of filling via-hole |
| CN103606635A (en) * | 2013-11-26 | 2014-02-26 | 上海和辉光电有限公司 | Method for packaging electric excitation light-emitting component |
| CN104638201A (en) * | 2015-03-06 | 2015-05-20 | 京东方科技集团股份有限公司 | OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof |
| CN105844325A (en) * | 2016-05-20 | 2016-08-10 | 厦门英诺尔信息科技有限公司 | Washable RFID tag and preparation method thereof |
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-
2018
- 2018-07-16 CN CN201810775669.6A patent/CN108993835A/en active Pending
Patent Citations (8)
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|---|---|---|---|---|
| US20050064630A1 (en) * | 2002-01-14 | 2005-03-24 | Juergen Zacherl | Method for producing a protection for chip edges and system for the protection of chip edges |
| JP2005203562A (en) * | 2004-01-15 | 2005-07-28 | Denso Corp | Semiconductor device and manufacturing method of semiconductor device |
| JP2010021540A (en) * | 2008-06-11 | 2010-01-28 | Nikkiso Co Ltd | Via-hole filling device and method of filling via-hole |
| TW201001641A (en) * | 2008-06-24 | 2010-01-01 | Raydium Semiconductor Corp | Package structure and method for chip on film |
| CN103606635A (en) * | 2013-11-26 | 2014-02-26 | 上海和辉光电有限公司 | Method for packaging electric excitation light-emitting component |
| CN104638201A (en) * | 2015-03-06 | 2015-05-20 | 京东方科技集团股份有限公司 | OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof |
| CN105844325A (en) * | 2016-05-20 | 2016-08-10 | 厦门英诺尔信息科技有限公司 | Washable RFID tag and preparation method thereof |
| CN108153069A (en) * | 2017-12-28 | 2018-06-12 | 惠州市华星光电技术有限公司 | A kind of liquid crystal display panel and preparation method thereof, display device |
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| Title |
|---|
| 杜郢: "《石蜡情报信息资料汇编 1993》", 31 December 1993 * |
| 郭邵义: "《机械工程概论》", 31 July 2015, 华中科技大学出版社 * |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650598A (en) * | 2019-10-31 | 2020-01-03 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board for improving bubbling |
| CN110769619A (en) * | 2019-10-31 | 2020-02-07 | 厦门弘信电子科技股份有限公司 | Manufacturing method of step multilayer board |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20181214 |