CN110021698A - The packaging technology of the LED display of the double-deck glue sealing structure - Google Patents
The packaging technology of the LED display of the double-deck glue sealing structure Download PDFInfo
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- CN110021698A CN110021698A CN201910336608.4A CN201910336608A CN110021698A CN 110021698 A CN110021698 A CN 110021698A CN 201910336608 A CN201910336608 A CN 201910336608A CN 110021698 A CN110021698 A CN 110021698A
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- led display
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- 239000003292 glue Substances 0.000 title claims abstract description 29
- 238000012536 packaging technology Methods 0.000 title claims abstract description 19
- 238000007789 sealing Methods 0.000 title claims abstract description 18
- 239000000084 colloidal system Substances 0.000 claims abstract description 72
- 239000011324 bead Substances 0.000 claims abstract description 46
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 230000003760 hair shine Effects 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000005060 rubber Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 11
- 230000010412 perfusion Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 201000009310 astigmatism Diseases 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of packaging technologies of the LED display of double-deck sealing laminar structure, comprising: will be pasted with the shine circuit board of lamp bead of LED and is fixed on mold, the edge of mold and circuit board are concordant close to the LED one side of lamp bead that shines；The first colloid is perfused to concordant with the upper surface of lamp bead that shines LED to being pasted with the shine circuit board surface of lamp bead of LED under vacuum conditions, struck off, solidify after form the first glue-line；The second colloid is perfused to the first film surface under vacuum conditions, forms the second glue-line that hardness is greater than the first glue-line after being flattened, being solidified, completes encapsulation.The present invention is by carrying out secondary encapsulating, form the first glue-line and the second glue-line, and first glue-line hardness less than the second glue-line hardness, the first glue-line for encapsulating the LED display module after being formed is played the role of, and thermal conductivity is good, reduces the bottom PCB mass colour, is moisture-proof and distortion-free, and second layer glue, which plays, reinforces anticollision.
Description
Technical field
The present invention relates to display screen technology field more particularly to a kind of encapsulation works of the LED display of the double-deck glue sealing structure
Skill.
Background technique
In recent years, LED (Light Emitting Diode, light emitting diode) lamp because have reaction speed is fast, brightness is high,
The advantages that service life length, energy conservation and environmental protection, is able to fast-developing
Wherein, LED display is the lamp bead splicing comprising modules panel that shone by redgreenblue LED one by one, is used to text, figure
The display equipment of the various information such as picture, video, video recording, and since LED display can be used in various places,
LED display needs good heat dissipation effect, flatness equal, and whole screen color is consistent, and energy anticollision, the big environment of humidity plays moisture-proof anti-
Water effect, and the LED display of existing attachment process can not make whole screen color before not lighting due to PCB mass colour
Unanimously, the product module deformation that some enterprise's encapsulatings come out is serious, does not have the product of encapsulating to be easy wet in case of wet, causes LED short-circuit, produce
Module side is easy to collide lamp bead when product are installed.
Summary of the invention
Shortcoming present in view of the above technology, the present invention provide a kind of LED display of double-deck glue sealing structure
Packaging technology, simple process, and encapsulate formed LED display can be realized anti-deformation, it is moisture-proof, reduce PCB mass colour difference and
The effect of crashworthiness.
To achieve the above object, the present invention provides a kind of packaging technology of the LED display of double-deck glue sealing structure, including with
Lower step:
(1) circuit board for being pasted with the luminous lamp bead of LED is fixed on mold, the edge of the mold and the circuit board are close
The one side of the luminous lamp bead of the LED is concordant；
(2) it the first colloid is perfused shines lamp bead to LED to being pasted with the shine circuit board surface of lamp bead of LED under vacuum conditions
Upper surface it is concordant, struck off, solidify after form the first glue-line；
(3) the second colloid is perfused to the first film surface under vacuum conditions, forms hardness after being flattened, being solidified and is greater than first
Second glue-line of glue-line completes encapsulation.
Wherein, before the first colloid is perfused, in the circuit board surface and the luminous lamp bead gap filling perfusion modulation of LED
Good adhesive, is put into oven and dries.
Wherein, first colloid scrapes quadratic method are as follows: with scraper the first extra colloid is struck off, make the first colloid with
The luminous lamp bead of LED fits closely, and forms burnishing surface in homogeneous thickness.
Wherein, the flattening method of second colloid are as follows: plane plate is pressed on the second colloid, extrudes extra second
Colloid fits closely the second colloid with the first glue-line.
Wherein, the plane plate be press to second colloid be covered with the processing release paper with transparent frosting on one side
Or glass blocks and the special one of which for demoulding plane bloom of graphic printing paper.
Wherein, first colloid or the method for the second colloid drying are as follows: sent after striking off the first colloid or the second glue-line
Enter and carry out heating fixation in oven, fixed temperature is 90-150 DEG C.
Wherein, the material of first colloid is the one of which of rubber, silica gel, epoxy resin, PU glue or UV glue.
Wherein, the material of second colloid is the one of which of epoxy resin, PC, PVC or transparent plastic.
Wherein, thickness of the thickness of second glue-line less than the first glue-line.
Wherein, further include taking apart a die, packaged LED display progress leftover pieces are cut, are polished.
The beneficial effects of the present invention are: compared with prior art, it is provided by the invention compared with prior art, the present invention mentions
The packaging technology of the LED display of the double-deck glue sealing structure supplied, is arranged in parallel to the top edge of mold to be pasted with LED and shines
The first colloid and LED lamp bead upper surface is perfused to the circuit board surface for being pasted with the luminous lamp bead of LED in the one side of the circuit board of lamp bead
Concordantly, struck off, solidify after form the first glue-line, to the first film surface be perfused the second colloid, shape after being flattened, being solidified
It is greater than the second glue-line of the first glue-line at hardness, completes encapsulation, the present invention forms the first glue-line and the by carrying out secondary encapsulating
Two glue-lines, and the hardness of the first glue-line is less than the hardness of the second glue-line so that encapsulation formed after LED display the first glue-line
It is good and moisture-proof that thermal conductivity can be played；Second glue-line can play the role of anticollision；Before the first colloid being perfused, it is also necessary to
The adhesive modulated is perfused in circuit board surface and LED the lamp bead gap filling that shines, and is put into oven and dries so that circuit board and
The compactness of the luminous lamp bead of LED is more preferable, because the viscosity of the first glue-line is limited, passes through adhesive and reinforces the first glue-line and PCB table
Face bonding force.
Detailed description of the invention
Fig. 1 is overall schematic of the invention；
Fig. 2 is explosive view of the invention；
Fig. 3 is first pass figure of the invention；
Fig. 4 is second flow chart of the invention；
Fig. 5 is third flow chart of the invention.
Main element symbol description is as follows:
1, the luminous lamp bead of circuit board 2, LED
3, the first glue-line 4, the second glue-line
5, matte surface 6, adhesive layer.
Specific embodiment
In order to more clearly state the present invention, the present invention is further described with reference to the accompanying drawing.
Fig. 1-Fig. 3 is please referred to, it is of the invention to provide a kind of LED display of double-deck glue sealing structure to achieve the above object,
The LED display includes the luminous lamp bead 2 of the LED of circuit board 1 and attachment on circuit boards, further includes being covered on 1 surface of circuit board
Have the first glue-line 3 with LED 2 gap filling of lamp bead that shines, and LED shine lamp bead 2 upper surface it is concordant with the first glue-line 3, formation
Even curface；First glue-line, 3 upper surface is covered with the second glue-line 4, and the hardness of the first glue-line 3 is hard less than the second glue-line 4
Degree.And it is completed by following packaging technology:
Prepare before S1 encapsulation: the circuit board for being pasted with the luminous lamp bead of LED being fixed on mold, and the edge and circuit board of mold
Close to LED shine lamp bead one side it is concordant, be pasted with LED shine lamp bead circuit board with and mold can be screwed, make
Circuit board and mold are obtained close to seamless connection, and the edge of mold is again concordant with the luminous one side of lamp bead of the close LED of circuit board,
It is not only fixed more preferable, and prevent when carrying out subsequent operation, circuit board shifts, and carries out leak-proof measure, effectively prevents
Only the first colloid and the second colloid flow to the one side with electronic component of circuit board, protect to circuit board；
The encapsulation of the first glue-line of S2: the first colloid is perfused extremely to the circuit board surface for being pasted with the luminous lamp bead of LED under vacuum conditions
It is concordant with the upper surface of lamp bead that shines LED, struck off, solidify after form the first glue-line；
The second glue-line of S3 encapsulation: under vacuum conditions to the first film surface be perfused the second colloid, cut flat with, solidify after formed
Hardness is greater than the second glue-line of the first glue-line, completes encapsulation.
In this way encapsulate after the completion of, the first glue-line relative to the second glue-line be flexible glue, and the second glue-line be prevent hit it is hard
Glue, so that stress of the stress of the first glue-line less than the second glue-line, plays certain buffer function, for example the first colloid can be
Liquid software, the first glue-line that perfusion is struck off, immobilization is formed is solid-state software, and the second colloid is liquid hardware, is filled
The second glue-line that note is struck off, immobilization is formed is solid-state hardware, software referred herein and hardware be in contrast, can
It is according to the present invention to be selected, it can be to the mold for the circuit board for being pasted with the luminous lamp bead of LED in the environment of vacuum
It is put into vacuum tank, closes vacuum box hermetic door, open vacuum suction device and control device is vacuumized and carries out first
The perfusion of glue-line extracts the air inside the first colloid, drives bubble away, and the surface of formation is more smooth, the second glue-line
Vacuum environment can also be in this way, and since most LED display be to be with the primitive color of circuit board and plastic face mask
Background color, generally black, therefore the first glue-line can be set to Transparent color, it can also be with black, and the second glue-line is necessary for
Light colour, the characteristics of according to the first glue-line and the second glue-line, the material of the first colloid is rubber, silica gel, epoxy resin, PU glue or UV
The one of which of glue, the material of the second colloid are the one of which of epoxy resin, PC, PVC or transparent plastic, meet the first glue-line
It can prevent from deforming, and can be bonded with the second glue-line perfection, and the second glue-line can carry out reinforced surface hardness, realize crashworthiness
With the effect for preventing deformation.
In the present embodiment, refering to Fig. 2 and Fig. 4, the first glue-line and circuit board are pasted with the luminous lamp bead of LED in order to prevent
It is bonded on one side bad, it is also necessary to before the first colloid is perfused, setting steps S4: in circuit surface and the luminous lamp bead gap LED
The adhesive that filling perfusion modulates, is put into oven and dries, and forms adhesive surface 6, since circuit board is pasted with the luminous lamp bead of LED
One side by varnish coating, therefore it is relatively smooth, in this way when Nian Jie with the first glue-line, it is not easy to be bonded together, be easy
The problem of existing degumming, and adhesive is set, it shines in LED and forms adhesive layer between lamp bead and the first glue-line, increase LED and shine
Frictional force between lamp bead and the first glue-line, so that circuit board is pasted with shape between the one side and the first glue-line of the luminous lamp bead of LED
At good adhesive layer, so that compactness is more preferable.
In the present embodiment, refering to Fig. 2 and Fig. 4, Fig. 5, quadratic method is scraped to the first colloid are as follows: with scraper by extra
Colloid strikes off, and the mode struck off can be moved since the side of the first colloid along opposite side, is struck off, and scrape
Knife and the first colloid are to be mutually perpendicular to relationship, can also be struck off in other way, make the first colloid and LED electroluminescent lamp
Pearl fits closely, and forms burnishing surface in homogeneous thickness, and can be struck off the first extra colloid by way of vapour-pressure type, makes
The first bondline thickness that must be formed is more uniform, guarantees the luminous uniform of LED display, also provides well for the second colloid of perfusion
Basis；When second colloid is perfused, including S31: the second colloid is perfused on the second glue-line；Second colloid scrapes quadratic method are as follows:
S32: plane plate is pressed on the second colloid, extrudes the second extra colloid, and the second glue-line that the second colloid is formed is far from the
The one side of one glue-line be with the plane that contact of the external world, therefore second colloid is final light-emitting surface, and the formation of the second colloid
The hardness of second glue-line is higher than the second glue-line, is struck off by plane plate, effect is more preferable.
In the present embodiment, the method S33 of the first colloid and the drying of the second colloid are as follows: scrape the first colloid or the second glue-line
It is sent into oven after flat and carries out heating fixation, fixed temperature is 90-150 DEG C, at such a temperature, be may be implemented good solid
Change；And after drying, the effect of the second glue-line is formed at this time surface close to mirror surface is put down and in order to meet the requirement of different-effect
Panel block be press to the processing release paper being covered on one side with transparent frosting or graphic printing paper of the second colloid glass blocks and
The one of which of special demoulding plane bloom, after drying in this way, it is only necessary to which plane plate is removed from the second glue-line, the second glue-line
Upper surface is matte surface or pattern plane, be can be set according to actual needs, and the matte surface of formation can carry out astigmatism, is made entire
The effect of LED display is consistent, and light source, into after crossing the astigmatism of atomization face, light is less dazzling, more soft；Or it is formed
Pattern plane, appearance is more preferable, therefore further includes S34 after the drying of the second glue-line: will be covered with the demoulding with transparent frosting
The glass blocks and special demoulding plane bloom of paper or graphic printing paper are removed from the second glue-line, and the second glue-line upper surface is dumb light
Face or pattern plane；And in order to guarantee that the light-emitting surface formed after LED display is assembled is more preferable, the thickness of the second glue-line 4 is less than first
The thickness of glue-line 3, such as when will be perfused needs for the first colloid to be perfused to concordant with the upper surface of lamp bead that shines LED, and into mistake
After drying, the first glue-line that the first colloid is formed can be lower than the upper surface of the luminous lamp bead of LED, as shown in Figure 1, about the first glue
The height of layer is lower than upper surface 0.1-1 millimeters of the luminous lamp bead of LED, and the second glue-line can be set above to LED hair at this time
The 0.5-1 millimeter of the upper surface of light lamp bead, after such LED display is assembled, the light that the luminous lamp bead of adjacent LED issues is through rolling over
Apparent refractive power line is not will form after penetrating, whole illumination effect is good.
In the present embodiment, after the completion of encapsulation, it is also necessary to take apart a die, carry out leftover pieces to packaged LED display
It cuts, polish, so that overall effect is more preferable；And in order to guarantee yield rate, it is also necessary to be detected, firstly, forming the first glue
After layer, the luminous lamp bead of the LED for being perfused with the first glue-line at this time and circuit board are integrally become into level package body, by level package body
It is powered, if normal luminous, is irrigated the second colloid, if abnormal shine, check reason, replacement damage zero
Part is removed adhesive and the first glue-line and is repaired, until all going well, repeats packaging technology；The second colloid is being perfused
After forming the second glue-line, it is at this time the second packaging body, equally second level package body is powered, if normal luminous, carry out
The second colloid is perfused, if abnormal shine, checks reason, replaces part of damage, remove adhesive, the first glue-line and second
It glue-line and repairs, repeats packaging technology until all going well, when the first glue-line and the second glue-line are completed, examined
It surveys, avoids guaranteeing that the work of early period is effective, prevent extra work from wasting, and guarantee certain yield rate.
Present invention has an advantage that
(1) secondary encapsulating is carried out, forms the first glue-line and the second glue-line, and the hardness of the first glue-line is played less than the second glue-line
It is moisture-proof, the effect of good heat dissipation and crashworthiness；
(2) by striking off the second colloid when, plane plate is to be covered with the glass blocks of the processing release paper of transparent frosted and special de-
Mould plane bloom carries out astigmatism by matte surface, forms area source, it is aobvious to reach entire LED so that the second glue-line forms matte surface
Display screen shines consistent effect.
Disclosed above is only one or several specific embodiments of the invention, but the present invention is not limited to this, is appointed
What what those skilled in the art can think variation should all fall into protection scope of the present invention.
Claims (10)
1. a kind of packaging technology of the LED display of bilayer glue sealing structure, which comprises the following steps:
The circuit board for being pasted with the luminous lamp bead of LED is fixed on mold, the edge of the mold and the circuit board are close to institute
The one side for stating the luminous lamp bead of LED is concordant；
It the first colloid is perfused shines lamp bead to LED to being pasted with the shine circuit board surface of lamp bead of LED under vacuum conditions
Upper surface is concordant, struck off, solidify after form the first glue-line；
The second colloid is perfused to the first film surface under vacuum conditions, forms hardness after being flattened, being solidified and is greater than the first glue
Second glue-line of layer completes encapsulation.
2. the packaging technology of the LED display of bilayer glue sealing structure according to claim 1, which is characterized in that be perfused
Before first colloid, the adhesive modulated is perfused in the circuit board surface and the luminous lamp bead gap filling of LED, is put into oven
Middle drying.
3. the packaging technology of the LED display of bilayer glue sealing structure according to claim 1, which is characterized in that described the
Colloid scrapes quadratic method are as follows: strikes off the first extra colloid with scraper, pastes the first colloid closely with the luminous lamp bead of LED
It closes, forms burnishing surface in homogeneous thickness.
4. the packaging technology of the LED display of the upper double-deck glue sealing structure according to claim 1, which is characterized in that described
The flattening method of second colloid are as follows: plane plate is pressed on the second colloid, the second extra colloid is extruded, make the second colloid with
First glue-line fits closely.
5. the packaging technology of the LED display of bilayer glue sealing structure according to claim 4, which is characterized in that described flat
Panel block is the glass for pressing to the processing release paper being covered on one side with transparent frosting or graphic printing paper of second colloid
The one of which of block and special demoulding plane bloom.
6. the packaging technology of the LED display of bilayer glue sealing structure according to claim 3 or 4, which is characterized in that described
First colloid or the method for the second colloid drying are as follows: be sent into oven after striking off the first colloid or the second glue-line and heat admittedly
Fixed, fixed temperature is 90-150 DEG C.
7. the packaging technology of the LED display of bilayer glue sealing structure according to claim 1, which is characterized in that described the
The material of colloid is the one of which of rubber, silica gel, epoxy resin, PU glue or UV glue.
8. the packaging technology of the LED display of bilayer glue sealing structure according to claim 1, which is characterized in that described the
The material of two colloids is the one of which of epoxy resin, PC, PVC or transparent plastic.
9. the packaging technology of the LED display of bilayer glue sealing structure according to claim 7 or 8, which is characterized in that described
Thickness of the thickness of second glue-line less than the first glue-line.
10. the packaging technology of the LED display of bilayer glue sealing structure according to claim 1, which is characterized in that further include
It takes apart a die, packaged LED display progress leftover pieces is cut, are polished.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910336608.4A CN110021698B (en) | 2019-04-25 | 2019-04-25 | Packaging process of LED display screen with double-layer sealing adhesive structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910336608.4A CN110021698B (en) | 2019-04-25 | 2019-04-25 | Packaging process of LED display screen with double-layer sealing adhesive structure |
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| Publication Number | Publication Date |
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| CN110021698A true CN110021698A (en) | 2019-07-16 |
| CN110021698B CN110021698B (en) | 2020-05-29 |
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| CN201910336608.4A Active CN110021698B (en) | 2019-04-25 | 2019-04-25 | Packaging process of LED display screen with double-layer sealing adhesive structure |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111462649A (en) * | 2020-04-23 | 2020-07-28 | 惠州雷曼光电科技有限公司 | L ED integrated packaging display module, maintenance method thereof and display device |
| CN111564435A (en) * | 2020-04-23 | 2020-08-21 | 宁波维真显示科技股份有限公司 | 3D-LED (three-dimensional-light-emitting diode) fitting method based on photoinitiation mechanism |
| CN112038462A (en) * | 2020-08-25 | 2020-12-04 | 东莞阿尔泰显示技术有限公司 | LED display module packaging process |
| CN112767848A (en) * | 2021-01-12 | 2021-05-07 | 深圳市艾比森光电股份有限公司 | LED display module and manufacturing method thereof |
| CN112936689A (en) * | 2021-01-18 | 2021-06-11 | 深圳市艾森视讯科技有限公司 | Surface glue pouring and film pasting method for LED module |
| CN113393777A (en) * | 2021-05-07 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Display screen module and glue filling process thereof |
| CN113421507A (en) * | 2021-07-14 | 2021-09-21 | 深圳市雷迪奥视觉技术有限公司 | Floor tile display screen and manufacturing method |
| CN113764559A (en) * | 2021-08-10 | 2021-12-07 | 中山市雄纳五金照明科技有限公司 | Waterproof lamp bead and manufacturing method thereof |
| CN114187850A (en) * | 2021-12-17 | 2022-03-15 | 合肥达视光电科技有限公司 | Film-attached display screen with high permeability and production process |
| CN117012882A (en) * | 2023-09-28 | 2023-11-07 | 天津德高化成新材料股份有限公司 | Packaging method and application of high-ink-color-consistency LED display screen |
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