CN111564435A - 3D-LED (three-dimensional-light-emitting diode) fitting method based on photoinitiation mechanism - Google Patents
3D-LED (three-dimensional-light-emitting diode) fitting method based on photoinitiation mechanism Download PDFInfo
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- CN111564435A CN111564435A CN202010328989.4A CN202010328989A CN111564435A CN 111564435 A CN111564435 A CN 111564435A CN 202010328989 A CN202010328989 A CN 202010328989A CN 111564435 A CN111564435 A CN 111564435A
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- led
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- mixed glue
- polarizing film
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 230000007246 mechanism Effects 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 57
- 239000011324 bead Substances 0.000 claims abstract description 33
- 239000004814 polyurethane Substances 0.000 claims abstract description 22
- 229920002635 polyurethane Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000003475 lamination Methods 0.000 claims abstract description 4
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Polarising Elements (AREA)
Abstract
The invention discloses a 3D-LED (light-emitting diode) laminating method based on a photoinitiation mechanism, belongs to the technical field of 3D-LED three-dimensional display, and aims to solve the problems that the 2D display quality and the 3D comfort level of product output are influenced due to large optical interference of a 3D-LED product caused by the fact that a mask with a diffuse reflection design is cancelled and a related process. The 3D polarizing film and the LED light-emitting module are attached by the following method: step one, coating mixed glue on the gaps of lamp beads and the surfaces of LED light-emitting modules; the mixed glue is formed by mixing PU polyurethane transparent glue and resin transparent glue; step two, the 3D polarizing film is attached to the lamp bead side of the LED light-emitting module; step three, curing the mixed glue through UV ultraviolet irradiation to finish the lamination; the mixed glue between the lamp beads shields the LED scattered light by changing the color based on a light-induced mechanism so as to prevent light interference.
Description
Technical Field
The invention relates to an optical element attaching technology, and belongs to the technical field of 3D-LED stereoscopic display.
Background
Under the low condition of 3D display technology initial stage resolution, the lamp pearl clearance of LED module is big, often adopts plastic face guard to seal flat, and the plastic face guard internal surface that adopts has a plurality of archs, and the dispersion is pegged graft in the clearance department between each lamp pearl, plays the mutual interference of stopping light and light, and plastic face guard adopts the diffuse reflection design to make the contribution for stopping light interference usually.
Along with the improvement of the requirement on resolution, a schedule is provided for the research of an indoor small-dot-pitch LED display technology, the small-pitch pixels enable the gaps between lamp beads of an LED module to be reduced, the technological requirement on the preparation of an anti-interference plastic mask is higher and higher, the die sinking cost of the plastic mask is high, and therefore the plastic mask is not suitable for the requirement of batch production of LEDs.
With the development of 3D-LED display technology, a technology of plating a 3D polarizing film on the surface of an LED is generally adopted, but the surface of a mask made of a diffuse reflection material is smooth, and has a defect of high difficulty in bonding with the 3D polarizing film, and in order to meet the reliability requirement of bonding of a 3D-LED product, a plastic mask and related processes are generally cancelled, but as a result, the light of the 3D-LED product has large mutual interference, which affects the 2D display quality and 3D comfort level of the product output.
Disclosure of Invention
The invention aims to solve the problems that 2D display quality and 3D comfort of product output are affected due to large light interference of a 3D-LED product caused by the fact that a mask with a diffuse reflection design is cancelled and a related process, and provides a 3D-LED attaching method based on a light initiation mechanism.
According to the 3D-LED attaching method based on the photoinitiation mechanism, the 3D polarizing film 1 and the LED light-emitting module 2 are attached through the following method:
step one, coating mixed glue on the gaps of lamp beads and the surfaces of the LED light-emitting modules 2;
the mixed glue is formed by mixing PU polyurethane transparent glue and resin transparent glue;
step two, the 3D polarizing film 1 is attached to the lamp bead side of the LED light-emitting module 2;
step three, curing the mixed glue through UV ultraviolet irradiation to finish the lamination; the mixed glue between the lamp beads shields the LED scattered light by changing the color based on a light-induced mechanism so as to prevent light interference.
Preferably, the gap between the lamp beads is filled with an anti-interference layer 3 formed by curing mixed glue and changing color, a light-transmitting adhesive layer 4 formed by bonding mixed glue is arranged between the lamp beads and the 3D polarizing film 1, and the anti-interference layer 3 and the light-transmitting adhesive layer 4 jointly complete the bonding of the 3D polarizing film 1 and the LED light-emitting module 2.
Preferably, the thickness of the anti-interference layer 3 is 0.5 mm-1 mm, and the thickness of the light-transmitting adhesive layer 4 is 30 μm-80 μm.
Preferably, the adding proportion of the PU polyurethane material transparent glue and the resin transparent glue in the mixed glue is 1: 1.
preferably, the curing rate ratio of the PU polyurethane material transparent glue in the mixed glue to the resin transparent glue is 1: 3.
preferably, the 3D polarizing film 1 includes a circular polarizer 1-1, an 1/2 retardation film 1-3 and an AG hardened layer 1-5, 1/2 retardation film 1-3 prepared on the upper surface of the circular polarizer 1-1, a filling layer 1-2 provided at the gap of the 1/2 retardation film 1-3, and the AG hardened layer 1-5 adhered to the upper surface of the 1/2 retardation film 1-3 through an intermediate adhesive layer 1-4.
Preferably, the LED light-emitting module 2 comprises a driving chip unit 2-1, a PCB 2-2 and lamp beads 2-3, and a lamp bead array formed by a plurality of lamp beads 2-3 is arranged on the PCB 2-2.
Preferably, the curing conditions of the mixed glue in the third step based on the light guiding mechanism are as follows: UV wavelength is 365 nm-405 nm, energy density is more than or equal to 1500MJ/cm2(ii) a The curing time is 1-3 min.
The invention has the advantages that: (1) the anti-interference layer formed by curing and color changing mixed glue in the gap of the lamp bead can directly replace the traditional mask design and related processes, and the process flow is simple; (2) the chemical characteristics of two kinds of glue with large difference of curing rates are fully utilized, the color can be effectively changed when the photo-initiated curing is carried out, the color changing part shields interference light, and the light between lamp beads is prevented from being interfered with each other; (3) the mixed glue has multiple functions of attaching, bonding and shading, and the process flow is simple and suitable for batch introduction.
Drawings
Fig. 1 is a schematic diagram of a 3D-LED bonding method based on photoinitiation mechanism according to the present invention.
Detailed Description
The first embodiment is as follows: the following describes the present embodiment with reference to fig. 1, which illustrates a method for attaching a 3D-LED based on a photoinitiation mechanism, wherein a 3D polarizing film 1 includes a circular polarizer 1-1, a 1/2 retardation film 1-3 and an AG hardened layer 1-5, the 1/2 retardation film 1-3 is prepared on the upper surface of the circular polarizer 1-1, a filling layer 1-2 is disposed in the gap between the 1/2 retardation film 1-3, and the AG hardened layer 1-5 is adhered to the upper surface of the 1/2 retardation film 1-3 through an intermediate adhesive layer 1-4. The LED light-emitting module 2 comprises a driving chip unit 2-1, a PCB 2-2 and lamp beads 2-3, wherein a lamp bead array formed by a plurality of lamp beads 2-3 is arranged on the PCB 2-2.
The 3D polarizing film 1 and the LED light-emitting module 2 are attached by the following method:
step one, coating mixed glue on the gaps of lamp beads and the surfaces of the LED light-emitting modules 2;
the mixed glue is formed by mixing PU polyurethane transparent glue and resin transparent glue; the adding proportion of the PU polyurethane transparent glue and the resin transparent glue in the mixed glue is 1: 1. the curing rate ratio of the PU polyurethane transparent glue in the mixed glue to the resin transparent glue is 1: 3.
step two, the 3D polarizing film 1 is attached to the lamp bead side of the LED light-emitting module 2;
step three, curing the mixed glue through UV ultraviolet irradiation to finish the lamination; the mixed glue between the lamp beads shields the LED scattered light by changing the color based on a light-induced mechanism so as to prevent light interference.
The curing conditions of the mixed glue based on the light guiding mechanism are as follows: UV wavelength is 365 nm-405 nm, energy density is more than or equal to 1500MJ/cm2(ii) a The curing time is 1-3 min.
The gap of the lamp bead 2-3 is filled with an anti-interference layer 3 formed by curing and changing color of mixed glue, a light-transmitting bonding layer 4 formed by bonding the mixed glue is arranged between the lamp bead 2-3 and the circular polarizer 1-1, and the anti-interference layer 3 and the light-transmitting bonding layer 4 jointly complete the bonding of the 3D polarizing film 1 and the LED light-emitting module 2.
The thickness of the anti-interference layer 3 is 0.5 mm-1 mm, and the thickness of the light-transmitting bonding layer 4 is 30 μm-80 μm.
After the two kinds of glue are fully mixed, under the condition that UV ultraviolet light irradiates through a 3D film, as the curing rate of a PU polyurethane material is slow, the curing rate of another kind of resin is fast, the color change is generated under the action of a photoinitiator due to large curing rate difference in the curing process of the two kinds of glue, the anti-interference layer 3 formed by curing and color change of the mixed glue and filled in the gap of the lamp beads 2-3 has a shielding function on LED scattered light, the light interference between the lamp beads is prevented, and the function of a traditional plastic mask is replaced. And simultaneously has the function of bonding.
And an extremely thin light-transmitting bonding layer 4 with the thickness of 30-80 microns is arranged between the surface of the lamp bead and the circular polaroid, and the light-transmitting bonding layer is mainly used for bonding and changing color, but has no influence on the light transmittance of light emitted by the LED due to the fact that the thickness is only in a micron level.
Claims (8)
1. The 3D-LED laminating method based on the photoinitiation mechanism is characterized in that the 3D polarizing film (1) and the LED light-emitting module (2) are laminated by the following method:
step one, coating mixed glue on the gaps of lamp beads and the surfaces of the LED light-emitting modules (2);
the mixed glue is formed by mixing PU polyurethane transparent glue and resin transparent glue;
step two, the 3D polarizing film (1) is attached to the lamp bead side of the LED light-emitting module (2);
step three, curing the mixed glue through UV ultraviolet irradiation to finish the lamination; the mixed glue between the lamp beads shields the LED scattered light by changing the color based on a light-induced mechanism so as to prevent light interference.
2. The 3D-LED attaching method based on the photoinitiation mechanism as claimed in claim 1, wherein the gap between the lamp beads is filled with an anti-interference layer (3) formed by curing and changing color of mixed glue, a light-transmitting adhesive layer (4) formed by bonding mixed glue is arranged between the lamp beads and the 3D polarizing film (1), and the anti-interference layer (3) and the light-transmitting adhesive layer (4) jointly complete the attaching of the 3D polarizing film (1) and the LED light-emitting module (2).
3. The method for attaching 3D-LED based on photoinitiation mechanism as claimed in claim 2, wherein the thickness of the anti-interference layer (3) is 0.5 mm-1 mm, and the thickness of the light-transmitting adhesive layer (4) is 30 μm-80 μm.
4. The method of claim 2, wherein the ratio of the transparent PU polyurethane glue and the transparent resin glue in the mixed glue is 1: 1.
5. the method of claim 4, wherein the curing rate ratio of the PU polyurethane transparent glue in the mixed glue to the resin transparent glue is 1: 3.
6. the method for attaching a 3D-LED based on a photoinitiation mechanism of claim 1, wherein the 3D polarizing film (1) comprises a circular polarizer (1-1), an 1/2 phase difference film (1-3) and an AG hardened layer (1-5), the 1/2 phase difference film (1-3) is prepared on the upper surface of the circular polarizer (1-1), the filling layer (1-2) is arranged at the gap of the 1/2 phase difference film (1-3), and the AG hardened layer (1-5) is adhered to the upper surface of the 1/2 phase difference film (1-3) through an intermediate adhesive layer (1-4).
7. The 3D-LED attaching method based on the photoinitiation mechanism as claimed in claim 5, wherein the LED light-emitting module (2) comprises a driving chip unit (2-1), a PCB (2-2) and a lamp bead (2-3), and a lamp bead array formed by a plurality of lamp beads (2-3) is arranged on the PCB (2-2).
8. The method for attaching a 3D-LED based on a photoinitiation mechanism as claimed in claim 1, wherein the curing conditions of the mixed glue in the third step based on the photoinitiation mechanism are as follows: UV wavelength is 365 nm-405 nm, energy density is more than or equal to 1500MJ/cm2(ii) a The curing time is 1-3 min.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010328989.4A CN111564435B (en) | 2020-04-23 | 2020-04-23 | 3D-LED (three-dimensional-light-emitting diode) fitting method based on photoinitiation mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010328989.4A CN111564435B (en) | 2020-04-23 | 2020-04-23 | 3D-LED (three-dimensional-light-emitting diode) fitting method based on photoinitiation mechanism |
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| CN111564435A true CN111564435A (en) | 2020-08-21 |
| CN111564435B CN111564435B (en) | 2023-04-18 |
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Citations (7)
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|---|---|---|---|---|
| US20080018980A1 (en) * | 2006-06-21 | 2008-01-24 | Flabeg Gmbh & Co. Kg | Electrically active element |
| CN105733389A (en) * | 2016-04-13 | 2016-07-06 | 湖南省金海科技有限公司 | LED-UV-cured transfer printing adhesive and preparation method thereof |
| CN108219736A (en) * | 2018-01-05 | 2018-06-29 | 上海昀通电子科技有限公司 | Ultraviolet photo-curing cementing agent composition and application thereof |
| CN108511390A (en) * | 2018-05-09 | 2018-09-07 | 广东普加福光电科技有限公司 | A kind of preparation method of the full-color micro-display device of quantum dot |
| CN108919406A (en) * | 2018-07-11 | 2018-11-30 | 宁波维真显示科技股份有限公司 | Antiradar reflectivity 3D light polarizing film, antiradar reflectivity polarisation LED and preparation method |
| CN110021698A (en) * | 2019-04-25 | 2019-07-16 | 吴宇嘉 | The packaging technology of the LED display of the double-deck glue sealing structure |
| CN110286497A (en) * | 2019-07-01 | 2019-09-27 | 宁波维真显示科技股份有限公司 | The preparation method of plane built LED-3D mould group |
-
2020
- 2020-04-23 CN CN202010328989.4A patent/CN111564435B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080018980A1 (en) * | 2006-06-21 | 2008-01-24 | Flabeg Gmbh & Co. Kg | Electrically active element |
| CN105733389A (en) * | 2016-04-13 | 2016-07-06 | 湖南省金海科技有限公司 | LED-UV-cured transfer printing adhesive and preparation method thereof |
| CN108219736A (en) * | 2018-01-05 | 2018-06-29 | 上海昀通电子科技有限公司 | Ultraviolet photo-curing cementing agent composition and application thereof |
| CN108511390A (en) * | 2018-05-09 | 2018-09-07 | 广东普加福光电科技有限公司 | A kind of preparation method of the full-color micro-display device of quantum dot |
| CN108919406A (en) * | 2018-07-11 | 2018-11-30 | 宁波维真显示科技股份有限公司 | Antiradar reflectivity 3D light polarizing film, antiradar reflectivity polarisation LED and preparation method |
| CN110021698A (en) * | 2019-04-25 | 2019-07-16 | 吴宇嘉 | The packaging technology of the LED display of the double-deck glue sealing structure |
| CN110286497A (en) * | 2019-07-01 | 2019-09-27 | 宁波维真显示科技股份有限公司 | The preparation method of plane built LED-3D mould group |
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