CN207458490U - A kind of bilayer glue LED display - Google Patents
A kind of bilayer glue LED display Download PDFInfo
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- CN207458490U CN207458490U CN201721616277.2U CN201721616277U CN207458490U CN 207458490 U CN207458490 U CN 207458490U CN 201721616277 U CN201721616277 U CN 201721616277U CN 207458490 U CN207458490 U CN 207458490U
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- 239000003292 glue Substances 0.000 title claims abstract description 53
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- 239000004831 Hot glue Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
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- 108010010803 Gelatin Proteins 0.000 description 1
- 206010047505 Visceral leishmaniasis Diseases 0.000 description 1
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Abstract
The utility model discloses a kind of double-deck glue LED displays, including circuit board and the LED luminescence chips for being mounted on the circuit board surface, further include the black glue-line for being covered in the circuit board surface, the LED luminescence chips gap filling has the black glue-line, and the upper surface of LED luminescence chips is concordant with black glue-line, forms even curface；And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.Bilayer glue LED display provided by the utility model causes LED luminescence chips to be hacked the protection of coloring agent layer; it ensure that display screen splices rear surface consistency of colour; black glue-line is concordant with LED luminescence chips upper surface; expand the visual angle of display screen; and avoid moire fringes phenomenon; the display effect of double-deck glue LED display is improved, and also substratum transparent is protected, and can reach waterproof, fire prevention, dust-proof, antistatic and measuring body effect.
Description
Technical field
The utility model is related to display screen technology field more particularly to a kind of double-deck glue LED displays.
Background technology
LED display obtains rapid when just being subject to widely to pay attention to the features such as its brightness is high, low in energy consumption, performance is stablized
Development, and be increasingly being applied in daily life, for example, being arranged at Entertainment Plaza, commercial street, hospital, fire
The electronic display in the places such as station, concert.
Existing LED display is typically all to mount LED luminescence chips on circuit boards, and plastic rubber surface is fastened by screw
Cover protects LED display lamps, and according to the matrix arrangement positions of LED luminescence chips, formation can fall into LED and shine core plastic mask
Network between piece can protect LED luminescence chips in plastic mask.In big display screen structure, matrix arrangement
LED luminescence chips it is thousands of setting on circuit boards, formed rear projection screen, image can be played.
The plastic rubber surface be covered with it is non-watertight, not antistatic, do not prevent fires, not resistance to compression, short not anti-oxidant and service life the shortcomings of,
The height of a little higher than LED luminescence chips of its muscles and bones structure, it is small to may result in the lateral emitting angle of LED luminescence chips, that is,
Visual angle is relatively narrow, and a large amount of LED luminescence chips shine to be formed and interfere with each other, and can generate moire fringes phenomenon in display, influence to show
Effect.
Moreover, by the use of plastic mask as protection LED display circuit board front shroud when, the leading flank conduct of plastic mask
The background color of display screen, and the primitive color of plastic mask is machine is sprayed by high temperature ink-jetting style, it is difficult to keep color
Unanimously, during the display screen splicing of especially large area, in this way, when LED display is stitched together, can go out there are aberration
The phenomenon that now block colours are inconsistent, influences display effect, client is caused not receive the products ＆ services of the display screen.
In addition, processing the complex process of fixed plastic rubber panel using screw, it is difficult to control the quality conformance of product, and need
Want substantial amounts of manual operation.And when LED luminescence chips density increases（LED luminescence chips become smaller, to make the resolution of entire screen
Rate is promoted, i.e., pixel becomes smaller close）, the spacing between LED luminescence chips becomes smaller, and plastic mask processing is got up just more and more tired
Difficulty, assembling are also more difficult, that is to say, that the effect of the LED display of protection dot spacing is not achieved in plastic mask.
Therefore, the prior art has yet to be improved and developed.
Utility model content
In view of above-mentioned deficiencies of the prior art, the purpose of this utility model is to provide a kind of double-deck glue LED display, purports
Solving the problems, such as that double-deck glue LED display display effect of the prior art is poor, visual angle is relatively narrow.
The technical solution of the utility model is as follows：
A kind of bilayer glue LED display, including circuit board and the LED luminescence chips for being mounted on the circuit board surface,
In, the black glue-line for being covered in the circuit board surface is further included, the LED luminescence chips gap filling has the black glue
Layer, and the upper surface of LED luminescence chips is concordant with black glue-line, forms even curface；
And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.
The double-deck glue LED display, wherein, the black glue-line is black hot melt adhesive layer.
The double-deck glue LED display, wherein, the substratum transparent is one kind in epoxy resin, PU glue and UV glue.
The double-deck glue LED display, wherein, the black glue-line is molded to be formed by low-temp low-pressure.
The double-deck glue LED display, wherein, the substratum transparent is formed by encapsulating mode.
The double-deck glue LED display, wherein, the encapsulating mode is inversion encapsulating.
The double-deck glue LED display, wherein, adjacent LED luminescence chips center spacing is 2.0-5.0mm.
Compared with prior art, a kind of double-deck glue LED display provided by the utility model, including circuit board and is mounted on
The LED luminescence chips of the circuit board surface, further include the black glue-line for being covered in the circuit board surface, and the LED shines
Chip gap is filled with the black glue-line, and the upper surface of LED luminescence chips is concordant with black glue-line, forms smooth table
Face；And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.The utility model provides
Double-deck glue LED display cause LED luminescence chips be hacked coloring agent layer protection, ensure that display screen splicing rear surface color one
Cause property, black glue-line is concordant with LED luminescence chips upper surface, expands the visual angle of display screen, and avoids moire fringes phenomenon,
Improve the display effect of double-deck glue LED display, and also substratum transparent is protected, can reach waterproof, fire prevention, it is dust-proof,
Antistatic and measuring body effect.The display effect that efficiently solves LED display in the prior art is poor, visual angle is relatively narrow
Problem.
Description of the drawings
Fig. 1 is the structure diagram of the utility model bilayer glue LED display preferred embodiment.
Fig. 2 is the front view of the utility model bilayer glue LED display preferred embodiment.
Fig. 3 is the side view of the utility model bilayer glue LED display preferred embodiment.
Fig. 4 is the flow chart of the utility model bilayer glue LED display processing method preferred embodiment.
Specific embodiment
The utility model provides a kind of double-deck glue LED display, to make the purpose of this utility model, technical solution and effect
Fruit is clearer, clear and definite, referring to the drawings and gives an actual example to the utility model further description.It should be appreciated that herein
Described specific embodiment is only used to explain the utility model, is not used to limit the utility model.
Fig. 1 is a kind of structure diagram of double-deck glue LED display preferred embodiment of the utility model；Fig. 2 is this practicality
The front view of novel double-layer glue LED display preferred embodiment；Fig. 3 is preferably implemented for the utility model bilayer glue LED display
The side view of example.
As shown in Figure 1, Figure 2 and Figure 3, the utility model provides a kind of double-deck glue LED display, including circuit board 10,
LED luminescence chips 20, black glue-line 30 and substratum transparent 40.
The LED luminescence chips 20 are mounted on the surface of the circuit board 10, can according to the actual needs, and setting is adopted
LED luminescence chips size and its ranks spacing.
Black glue-line 30 described in the utility model is covered in 10 surface of circuit board for being pasted with LED luminescence chips 20, described
20 gap filling of LED luminescence chips has the black glue-line 30, and the upper surface of LED luminescence chips 20 and black glue-line 30 are flat
Together, even curface is formed, that is, the black glue-line 30 only covers the gap between the LED luminescence chips 20, to increase
The luminous visual angle of LED luminescence chips 20.
The substratum transparent 40 is covered in 20 upper surface of the black glue-line 30 and LED luminescence chips, and surface is smooth flat
It is whole.That is, as shown in figure 3, the double-deck glue LED display of the utility model is followed successively by electricity from the bottom to top altogether including three layers
Road plate 10, black glue-line 30 and substratum transparent 40, LED luminescence chips 20 have collectively constituted intermediate one layer with black glue-line 30.
The center spacing of the adjacent LED luminescence chips 20 can accomplish compared with big-pitch screen, can also accomplish smaller
Clearance display screen, most preferably, adjacent 20 center spacing of LED luminescence chips are 2.0-5.0mm.That is, the utility model is most suitable
The center spacing range of LED luminescence chips 20 is 2.0-5.0mm.That is, the utility model is using black glue-line
LED luminescence chips 20 can reach dot spacing, and pixel is very high, and display picture becomes apparent from.
In the utility model preferred embodiment, black glue-line 30 is preferably black hot melt adhesive layer, is noted by low-temp low-pressure
The mode of modeling is formed on 10 surface of circuit board for being already installed with LED luminescence chips 20, i.e. is shone having mounted LED
On 10 surface of circuit board of 20 array of chip, under conditions of low-temp low-pressure, shone core to LED using low-temp low-pressure Shooting Technique
The hot melt adhesive of black is molded in gap between piece 20, is allowed to form black hot melt adhesive layer.The black hot melt adhesive layer is with owning
20 upper surface of LED luminescence chips formed even curface, the purpose is to both protect LED luminescence chips 20, be allowed to be not easy
It is damaged by external force, and the light of LED luminescence chips 20 can be made normally to project, that is to say, that LED luminescence chips 20 form
The pixel on black hot melt adhesive layer surface.
In the utility model preferred embodiment, substratum transparent 40 is one kind in epoxy resin, PU glue and UV glue.It is described
Substratum transparent 40 is formed by encapsulating mode, it is preferred that the encapsulating mode is inversion encapsulating.It is first to the second mould to be inverted encapsulating
Transparent colloid is perfused in chamber, then the circuit board 10 be inverted and be pasted with LED luminescence chips 20, be molded with black glue-line 30, keep peace
One equipped with the LED luminescence chips is face-down, slowly pushes circuit board 10, since mold cavity bottoms are smooth, using solid
Change, be formed the substratum transparent 30 with flat surface, it needs to be understood that, LED display surface must assure that smooth,
The light of LED luminescence chips 20 can be made to emit along normal direction, can just play out normal picture.It is inverted encapsulating and forms tool
There is the substratum transparent 40 of even curface, the purpose is to both protect LED luminescence chips 20, be allowed to be not easy to damage by external force
It is bad, and the light of LED luminescence chips 20 can be made normally to project, also, substratum transparent 40 has waterproof and dustproof, moisture-proof, anti-quiet
The advantages that electricity, fire prevention, anticollision, resistance to compression, long anti-oxidant and service life.
In fact, the surface of LED display should avoid smooth reflective, and bilayer glue LED provided by the utility model is shown
Screen surfaces are substratum transparents 40, are smooth reflective, therefore what the utility model obtained is intermediate products, and final finished product is double-deck
Glue LED display surface is the product of dull surface, avoids the problem of reflective.
In the prior art, LED display is to protect LED luminescence chips 20 without damage using plastic mask,
The explanation of technological deficiency such as background section, the protecting effect of plastic mask can be negatively affected：First, due to plastic mask
The all a little higher than LED luminescence chips 20 of height height, affect the diverging of light so that lateral emitting angle is small, that is, regards
Angle is relatively narrow, for example, when seeing concert at the scene, scene is usually numerous, when watching LED display, in flank angle
Spectators can not just watch the picture of LED display complete display；2nd, a little higher than LED luminescence chips of the height of plastic mask
20 height also brings another problem, when showing picture, can generate moire fringes phenomenon, moire fringes phenomenon naked eyes can not be seen
When arriving, but using digital camera or mobile phone shooting LED display, it can show the ripple of one rule of a circle circle, influence to show
Effect；3rd, existing LED display is using the primitive color of circuit board 10 and plastic face mask as background color, is generally black（With
Black could cause the light color of LED luminescence chips 20 not to be changed for background color）, due to being with the side of high temperature ink-jet with machine
What formula was sprayed, the color so made is difficult to remain exactly the same（There are aberration drift, it is difficult to control it harmonious）, because
This, when several display screens are spliced together, difference naked eyes are all as it can be seen that influence the image effect that LED luminescence chips 20 are formed.
4th, when 20 density of LED luminescence chips is larger, spacing very little between LED luminescence chips 20 when, plastic mask difficulty of processing is more next
It is bigger（Plastic mask is screwed on circuit board 10）, and do not control its flatness；And plastic mask is smaller,
Protective effect is also just smaller.5th, plastic rubber surface be covered with it is non-watertight, do not prevent fires, be not dust-proof, not antistatic, not resistance to compression, it is not anti-oxidant and
The shortcomings of service life is short.
Bilayer glue LED display provided by the utility model is to utilize the protection LED of black glue-line 30 luminescence chips 20, then
Black glue-line 30 covers layer of transparent glue-line 40 above, due to substratum transparent 40 be it is transparent, LED hairs can't be blocked
The light that optical chip 20 is sent, in this way, by LED luminescence chips 20 protect more comprehensively, and solve problem above.It is first
First, black glue-line 30 is completed using the mode of low temperature injection, be can control the spliced uniformity of its surface color, is improved
Display effect.Secondth, black glue-line 30 forms even curface with LED luminescence chips 20, therefore, does not interfere with LED and shines
The diverging of 20 light of chip, the angle less than normal from the side of display screen can also shine, and visual angle becomes larger, and viewing effect is more preferable.The
3rd, without shelter when LED luminescence chips 20 emit light, moire fringes phenomenon will not be generated.4th, LED luminescence chips 20
Between spacing it is smaller when, black hot melt adhesive can be also molded into the gap of LED luminescence chips 20, the adaptation model of production technology
It encloses wider.5th, substratum transparent 40 is so that the double-deck glue LED display of the utility model has waterproof and dustproof, moisture-proof, anti-quiet
The advantages that electricity, fire prevention, anticollision, resistance to compression, long anti-oxidant and service life.In addition, several double-deck glue LED of the utility model
It can be achieved to be seamlessly connected after display screen splicing, people do not see that large screen is made of several display screens in viewing, yet
It is to say, is exactly visually complete large screen, therefore, display effect is more preferable.
As shown in figure 4, the utility model additionally provides a kind of double-deck glue LED display processing method, comprise the following steps：
S100, needs of several LED luminescence chips according to design are mounted on the board surface；
S200, the circuit board for being pasted with LED luminescence chips is put into the first die cavity, to the electricity for being pasted with LED luminescence chips
Road plate surface low-temp low-pressure injection black colloid, until it is concordant with LED luminescence chips upper surface, form the black glue of surfacing
Layer；
S300, after black curable adhesive layer, be perfused transparent colloid into one second die cavity, inversion is pasted with LED and shines core
The circuit board of piece, is put into second die cavity, keeps being equipped with the one of the LED luminescence chips down, in the black glue
Substratum transparent is formed above layer and the LED luminescence chips；
S400, after transparent colloid curing, form the substratum transparent of surfacing..
In the step s 100, the attachment of LED luminescence chips 20 is fixed on 10 surface of circuit board,.10 surface of circuit board
The center spacing of adjacent LED luminescence chip 20 can accomplish big-pitch screen, can also accomplish dot clearance display screen, most
Preferably, adjacent 20 center spacing of LED luminescence chips is 2.0-5.0mm.That is, the black glue LED display of the utility model is most
The center spacing range of applicable LED luminescence chips 20 is 2.0-5.0mm.Pixel is very high, and display picture becomes apparent from.
In step s 200, black colloid is preferably black hot melt adhesive, and the temperature of low-temp low-pressure injection black hot melt adhesive is
180-240 DEG C, pressure 1.5-40Bar.When the center spacing of adjacent LED luminescence chip 20 is smaller, low-temp low-pressure injection black
Most suitably used scope is 2.0-5.0mm during colloid.Mold used in the utility model is special large mold, will be installed
After the circuit board 10 for there are LED luminescence chips 20 is put into die cavity, black hot melt adhesive is imported by 9 glue-feeders, until black fever
Melten gel is full of the gap of LED luminescence chips 20, and the glue-feeder diameter is preferably 1.7mm.
In step S300, the transparent colloid is one kind in epoxy resin, PU glue and UV glue.First it is perfused into die cavity
Enough transparent colloids need to ensure that LED luminescence chips 20 and black glue-line 30, then inverting circuit plate 10 can be completely covered, keep
It is equipped with the one of the LED luminescence chips down, i.e., upward, slowly pushing circuit board 10 is to mould for 10 bottom case of holding circuit plate
Chamber since mold cavity bottoms are smooth, is formed the substratum transparent 40 with flat surface.Encapsulating is inverted to form with flat
The substratum transparent 30 on whole surface the purpose is to both protect LED luminescence chips 20, is allowed to be not easy to damage by external force,
Again the light of LED luminescence chips 20 can be made normally to project.
Slowly push circuit board 10 so that the upper surface of LED luminescence chips 20 and black glue-line 30 forms substratum transparent
40, of course, the thickness of substratum transparent 40 can control at this moment, such as need to make the substratum transparent 30 of a certain thickness, then will
Circuit board 10 is pressed to apart from the identical height of mold cavity bottoms, natural cooling, and then related mold will be covered with transparent colloid together
Circuit board 10 be put into curing oven and cured, the curing furnace temperature is 80 DEG C, after curing 4 hours, takes out, utilizes numerical control
Lathe cleans up extra transparent colloid, has just processed the double-deck glue LED with black glue-line 30 and substratum transparent 40 and has shown
Display screen.It is to be understood that LED display surface must assure that smooth, it can just make the light of LED luminescence chips 20 along normal
Direction emits, and can just play out normal picture.The inversion encapsulating technology that the utility model utilizes, the mold cavity bottoms of mould therefor
It is smooth, also, the circuit board 10 for being covered with transparent colloid is put into curing oven together and cured by related mold, ensure that
The flatness of gelatin layer 40, so as to ensure that the quality of LED display.
It should be appreciated that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
It says, can be improved or converted according to the above description, all these modifications and variations should all belong to the appended power of the utility model
The protection domain of profit requirement.
Claims (7)
1. a kind of bilayer glue LED display, special including circuit board and the LED luminescence chips for being mounted on the circuit board surface
Sign is, further includes the black glue-line for being covered in the circuit board surface, and the LED luminescence chips gap filling has the black
Glue-line, and the upper surface of LED luminescence chips is concordant with black glue-line, forms even curface；
And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.
2. bilayer glue LED display according to claim 1, which is characterized in that the black glue-line is black hot melt adhesive
Layer.
3. bilayer glue LED display according to claim 1, which is characterized in that the substratum transparent is epoxy resin, PU
One kind in glue and UV glue.
4. bilayer glue LED display according to claim 1, which is characterized in that the black glue-line passes through low-temp low-pressure
Injection is formed.
5. bilayer glue LED display according to claim 1, which is characterized in that the substratum transparent passes through encapsulating mode
It is formed.
6. bilayer glue LED display according to claim 5, which is characterized in that the encapsulating mode is inversion encapsulating.
7. bilayer glue LED display according to claim 1, which is characterized in that adjacent LED luminescence chips center spacing
For 2.0-5.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616277.2U CN207458490U (en) | 2017-11-28 | 2017-11-28 | A kind of bilayer glue LED display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721616277.2U CN207458490U (en) | 2017-11-28 | 2017-11-28 | A kind of bilayer glue LED display |
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| Publication Number | Publication Date |
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| CN207458490U true CN207458490U (en) | 2018-06-05 |
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ID=62276072
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721616277.2U Expired - Fee Related CN207458490U (en) | 2017-11-28 | 2017-11-28 | A kind of bilayer glue LED display |
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| Country | Link |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731121A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of double-deck glue LED display and its processing method |
| CN108777118A (en) * | 2018-07-06 | 2018-11-09 | 深圳市艾森视讯科技有限公司 | A kind of LED display modules and mosaic display screen |
| CN110634400A (en) * | 2019-08-22 | 2019-12-31 | 武汉华星光电技术有限公司 | Backlight module, display device and manufacturing method of backlight module |
| CN113724607A (en) * | 2020-05-26 | 2021-11-30 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display module |
-
2017
- 2017-11-28 CN CN201721616277.2U patent/CN207458490U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731121A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of double-deck glue LED display and its processing method |
| CN108777118A (en) * | 2018-07-06 | 2018-11-09 | 深圳市艾森视讯科技有限公司 | A kind of LED display modules and mosaic display screen |
| CN110634400A (en) * | 2019-08-22 | 2019-12-31 | 武汉华星光电技术有限公司 | Backlight module, display device and manufacturing method of backlight module |
| CN113724607A (en) * | 2020-05-26 | 2021-11-30 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display module |
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