CN107731121A - A kind of double-deck glue LED display and its processing method - Google Patents
A kind of double-deck glue LED display and its processing method Download PDFInfo
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- CN107731121A CN107731121A CN201711219007.2A CN201711219007A CN107731121A CN 107731121 A CN107731121 A CN 107731121A CN 201711219007 A CN201711219007 A CN 201711219007A CN 107731121 A CN107731121 A CN 107731121A
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- glue
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention discloses a kind of double-deck glue LED display and its processing method, including circuit board and the LED luminescence chips for being mounted on the circuit board surface, also include the black glue-line for being covered in the circuit board surface, the LED luminescence chips gap is filled with the black glue-line, and the upper surface of LED luminescence chips is concordant with black glue-line, even curface is formed；And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.Double-deck glue LED display provided by the invention causes LED luminescence chips to be hacked the protection of coloring agent layer; ensure that display screen splicing after surface color uniformity; black glue-line is concordant with LED luminescence chips upper surface; expand the visual angle of display screen; and avoid moire fringes phenomenon; the display effect of double-deck glue LED display is improved, and also substratum transparent is protected, and can reach waterproof, fire prevention, dust-proof, antistatic and measuring body effect.
Description
Technical field
The present invention relates to display screen technology field, more particularly to a kind of double-deck glue LED display and its processing method.
Background technology
LED display obtains rapid just widely being paid attention to the features such as its brightness is high, low in energy consumption, stable performance
Development, and be increasingly being applied in daily life, for example, being arranged at Entertainment Plaza, commercial street, hospital, fire
The electronic display in the places such as station, concert.
Existing LED display is typically all to mount LED luminescence chips on circuit boards, and plastic rubber surface is fastened by screw
Cover protects LED display lamps, and according to the matrix arrangement positions of LED luminescence chips, formation can fall into LED and light core plastic mask
Network between piece, LED luminescence chips can be protected in plastic mask.In big display screen structure, matrix arrangement
LED luminescence chips it is thousands of setting on circuit boards, formed rear projection screen, image can be played.
The plastic rubber surface be covered with it is non-watertight, not antistatic, do not prevent fires, not resistance to compression, short not anti-oxidant and service life the shortcomings of,
The height of a little higher than LED luminescence chips of its muscles and bones structure, it is small to may result in the lateral emitting angle of LED luminescence chips, that is,
Visual angle is narrower, and luminous can be formed of a large amount of LED luminescence chips interferes, and can produce moire fringes phenomenon in display, influence to show
Effect.
Moreover, by the use of plastic mask as protection LED display circuit board front shroud when, the leading flank conduct of plastic mask
The background color of display screen, and the primitive color of plastic mask is machine is sprayed by high temperature ink-jetting style, it is difficult to keep color
Unanimously, during the display screen splicing of especially large area, there can be aberration, so, when LED display is stitched together, can go out
The inconsistent phenomenon of existing block colours, influences display effect, causes client not receive the products ＆ services of the display screen.
In addition, processing the complex process of fixed plastic rubber panel using screw, it is difficult to control the quality conformance of product, need again
Want substantial amounts of manual operation.And when LED luminescence chips density increases（LED luminescence chips diminish, to make the resolution of whole screen
Rate is lifted, i.e., pixel diminishes close）, the spacing between LED luminescence chips diminishes, and plastic mask processing is got up just more and more tired
Difficulty, assembling are also more difficult, that is to say, that plastic mask does not reach the effect of the LED display of protection dot spacing.
Therefore, prior art has yet to be improved and developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art, it is an object of the invention to provide a kind of double-deck glue LED display and its add
Work method, it is intended to solve the problems, such as that double-deck glue LED display display effect of the prior art is poor, visual angle is narrower.
Technical scheme is as follows：
A kind of double-deck glue LED display, including circuit board and the LED luminescence chips for being mounted on the circuit board surface, wherein, also
Black glue-line including being covered in the circuit board surface, the LED luminescence chips gap are filled with the black glue-line, and
The upper surface of LED luminescence chips is concordant with black glue-line, forms even curface；
And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.
Described double-deck glue LED display, wherein, the black glue-line is black hot melt adhesive layer.
Described double-deck glue LED display, wherein, the substratum transparent is one kind in epoxy resin, PU glue and UV glue.
Described double-deck glue LED display, wherein, the black glue-line is molded to be formed by low-temp low-pressure.
Described double-deck glue LED display, wherein, the substratum transparent is formed by encapsulating mode.
Described double-deck glue LED display, wherein, the encapsulating mode is inversion encapsulating.
Described double-deck glue LED display, wherein, adjacent LED luminescence chips center spacing is 2.0-5.0mm.
A kind of double-deck glue LED display processing method, wherein, including：
Needs of several LED luminescence chips according to design are mounted on the board surface；
The circuit board for being pasted with LED luminescence chips is put into the first die cavity, it is low to the circuit board surface for being pasted with LED luminescence chips
Warm low-pressure injection molding black colloid, until it is concordant with LED luminescence chips upper surface, form the black glue-line of surfacing；
After black curable adhesive layer, transparent colloid is irrigated into one second die cavity, is inverted the circuit for being pasted with LED luminescence chips
Plate, is put into second die cavity, keeps being provided with the one of the LED luminescence chips down, in the black glue-line and described
Substratum transparent is formed above LED luminescence chips；
After transparent colloid solidification, the substratum transparent of surfacing is formed.
Described double-deck glue LED display processing method, wherein, the black colloid is black PUR.
Described double-deck glue LED display processing method, wherein, the transparent colloid is epoxy resin, PU glue and UV glue
In one kind.
Compared with prior art, a kind of double-deck glue LED display provided by the invention, including circuit board and be mounted on described
The LED luminescence chips of circuit board surface, in addition to the black glue-line of the circuit board surface is covered in, the LED luminescence chips
Gap is filled with the black glue-line, and the upper surface of LED luminescence chips is concordant with black glue-line, forms even curface；With
And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.Double-deck glue provided by the invention
LED display causes LED luminescence chips to be hacked the protection of coloring agent layer, ensure that the uniformity of surface color after display screen splicing, black
Coloring agent layer is concordant with LED luminescence chips upper surface, expands the visual angle of display screen, and avoids moire fringes phenomenon, improves
The display effect of double-deck glue LED display, and also substratum transparent is protected, and can reach waterproof, fire prevention, dust-proof, antistatic
And measuring body effect.The problem of display effect that efficiently solves LED display in the prior art is poor, visual angle is narrower.
Brief description of the drawings
Fig. 1 is the structural representation of the double-deck glue LED display preferred embodiment of the present invention.
Fig. 2 is the front view of the double-deck glue LED display preferred embodiment of the present invention.
Fig. 3 is the side view of the double-deck glue LED display preferred embodiment of the present invention.
Fig. 4 is the flow chart of the double-deck glue LED display processing method preferred embodiment of the present invention.
Embodiment
The invention provides a kind of double-deck glue LED display and its processing method, to make the purpose of the present invention, technical scheme
And effect is clearer, clear and definite, referring to the drawings and give an actual example that the present invention is described in more detail.It should be appreciated that herein
Described specific embodiment only to explain the present invention, is not intended to limit the present invention.
Fig. 1 is a kind of structural representation of double-deck glue LED display preferred embodiment of the present invention；Fig. 2 is double-deck for the present invention
The front view of glue LED display preferred embodiment；Fig. 3 is the side view of the double-deck glue LED display preferred embodiment of the present invention.
As shown in Figure 1, Figure 2 and Figure 3, the invention provides a kind of double-deck glue LED display, including circuit board 10, LED to send out
Optical chip 20, black glue-line 30 and substratum transparent 40.
The LED luminescence chips 20 are mounted on the surface of the circuit board 10, can according to the actual needs, and setting is adopted
LED luminescence chip sizes, and its ranks spacing.
Black glue-line 30 of the present invention is covered in the surface of circuit board 10 for being pasted with LED luminescence chips 20, the LED hairs
The gap of optical chip 20 is filled with the black glue-line 30, and the upper surface of LED luminescence chips 20 is concordant with black glue-line 30, is formed
Even curface, that is, the black glue-line 30 only covers the space between the LED luminescence chips 20, lighted with increasing LED
The luminous visual angle of chip 20.
The substratum transparent 40 is covered in black glue-line 30 and LED luminescence chips 20 upper surface, and its surface is smooth flat
It is whole.That is, as shown in figure 3, the double-deck glue LED display of the present invention is followed successively by circuit board from the bottom to top altogether including three layers
10th, black glue-line 30 and substratum transparent 40, LED luminescence chips 20 have collectively constituted middle one layer with black glue-line 30.
The center spacing of the adjacent LED luminescence chips 20 can accomplish compared with big-pitch screen, can also accomplish smaller
Clearance display screen, most preferably, the adjacent center spacing of LED luminescence chips 20 is 2.0-5.0mm.That is, the present invention is most suitably used
The center spacing range of LED luminescence chips 20 is 2.0-5.0mm.That is, LED luminous core of the present invention using black glue-line
Piece 20 can reach dot spacing, and pixel is very high, and display picture becomes apparent from.
In present pre-ferred embodiments, black glue-line 30 is preferably black hot melt adhesive layer, is molded by low-temp low-pressure
Mode is formed on the surface of circuit board 10 for being already installed with LED luminescence chips 20, i.e. is mounting LED luminescence chips
On the surface of circuit board 10 of 20 arrays, under conditions of low-temp low-pressure, using low-temp low-pressure Shooting Technique to LED luminescence chips 20
Between gap in be molded black PUR, be allowed to form black hot melt adhesive layer.The black hot melt adhesive layer and all LED
The upper surface of luminescence chip 20 forms even curface, the purpose is to both protect LED luminescence chips 20, is allowed to be not easy by outer
Power and damage, and can enough makes the light of LED luminescence chips 20 normally project, that is to say, that LED luminescence chips 20 constitute black
The pixel on hot melt adhesive layer surface.
In present pre-ferred embodiments, substratum transparent 40 is one kind in epoxy resin, PU glue and UV glue.It is described transparent
Glue-line 40 is formed by encapsulating mode, it is preferred that the encapsulating mode is inversion encapsulating.Inversion encapsulating is first into the second die cavity
Transparent colloid, then the circuit board 10 be inverted and be pasted with LED luminescence chips 20, be molded with black glue-line 30 are irrigated, keeps being provided with
The one of the LED luminescence chips down, slowly pushes circuit board 10, because mold cavity bottoms are smooth, then by solidifying, just
Form the substratum transparent 30 with flat surface, it needs to be understood that, LED display surface must assure that smooth, can just make
The light of LED luminescence chips 20 is launched along normal direction, can just play out normal picture.Encapsulating is inverted to form with flat
The substratum transparent 40 on whole surface, the purpose is to both protect LED luminescence chips 20, it is allowed to be not easy to damage by external force,
And can enough makes the light of LED luminescence chips 20 normally project, also, substratum transparent 40 have waterproof and dustproof, protection against the tide, antistatic,
The advantages that fire prevention, anticollision, resistance to compression, long anti-oxidant and service life.
In fact, the surface of LED display should avoid smooth reflective, and double-deck glue LED display table provided by the invention
Face is substratum transparent 40, is smooth reflective, therefore obtain is intermediate products to the present invention, and final finished product bilayer glue LED shows
Display screen surface is the product of dull surface, avoids the problem of reflective.
In the prior art, LED display is to protect LED luminescence chips 20 without damage using plastic mask, its
The explanation of technological deficiency such as background section, the protecting effect of plastic mask can be negatively affected：First, due to plastic mask
The all a little higher than LED luminescence chips 20 of height height, have impact on the diverging of light so that lateral emitting angle is small, that is, regards
Angle is narrower, for example, when seeing concert at the scene, scene is generally numerous, when watching LED display, in flank angle
Spectators can not just watch the picture of LED display complete display；2nd, a little higher than LED luminescence chips of the height of plastic mask
20 height also brings another problem, in display picture, can produce moire fringes phenomenon, moire fringes phenomenon naked eyes can not be seen
When arriving, but using digital camera or mobile phone shooting LED display, the ripple of the rule of a circle circle one can be shown, influences to show
Effect；3rd, existing LED display is the generally black using the primitive color of circuit board 10 and plastic face mask as background color（With
Black is that background color could cause the light color of LED luminescence chips 20 not to be changed）, due to being with the side of high temperature ink-jet with machine
What formula was sprayed, the color so made is difficult to keep completely the same（Aberration drift be present, it is difficult to control it harmonious）, because
This, when some display screens are spliced together, its difference naked eyes are all visible, influence the image effect of the formation of LED luminescence chips 20.
4th, when the density of LED luminescence chips 20 is larger, spacing very little between LED luminescence chips 20 when, plastic mask difficulty of processing is more next
It is bigger（Plastic mask is screwed on circuit board 10）, and do not control its flatness；And plastic mask is smaller,
Protective effect is also just smaller.5th, plastic rubber surface be covered with it is non-watertight, do not prevent fires, be not dust-proof, not antistatic, not resistance to compression, it is not anti-oxidant and
The shortcomings of service life is short.
Double-deck glue LED display provided by the invention is to protect LED luminescence chips 20 using black glue-line 30, then in black
Glue-line 30 covers layer of transparent glue-line 40 above, because substratum transparent 40 is transparent, therefore, can't block the luminous cores of LED
The light that piece 20 is sent, so, by LED luminescence chips 20 protect more comprehensively, and solve problem above.First, it is black
Coloring agent layer 30 is completed using the mode of low temperature injection, be can control the spliced uniformity of its surface color, is improved display
Effect.Secondth, black glue-line 30 forms even curface with LED luminescence chips 20, therefore, does not interfere with LED luminescence chips
The diverging of 20 light, the angle less than normal from the side of display screen can also light, and visual angle becomes big, and viewing effect is more preferable.3rd,
Without shelter when LED luminescence chips 20 launch light, moire fringes phenomenon will not be produced.Between 4th, LED luminescence chips 20
Spacing it is smaller when, black PUR can be also molded into the gap of LED luminescence chips 20, and the accommodation of production technology is more
It is wide.5th, substratum transparent 40 cause the present invention double-deck glue LED display have waterproof and dustproof, protection against the tide, antistatic, fire prevention,
The advantages that anticollision, resistance to compression, long anti-oxidant and service life.In addition, after several double-deck glue LED display splicings of the present invention
It can be achieved to be seamlessly connected, people do not see that giant-screen is made up of several display screens in viewing, that is to say, that visually
It is complete giant-screen, therefore, display effect is more preferable.
As shown in figure 4, present invention also offers a kind of double-deck glue LED display processing method, comprise the following steps：
S100, by several LED luminescence chips according to design needs attachment on the board surface；
S200, the circuit board for being pasted with LED luminescence chips is put into the first die cavity, to the circuit board for being pasted with LED luminescence chips
Surface low-temperature low-pressure injection molding black colloid, until it is concordant with LED luminescence chips upper surface, form the black glue-line of surfacing；
S300, after black curable adhesive layer, irrigate transparent colloid into one second die cavity, inversion is pasted with LED luminescence chips
Circuit board, is put into second die cavity, keeps being provided with the one of the LED luminescence chips down, in the black glue-line and
Substratum transparent is formed above the LED luminescence chips；
S400, after transparent colloid solidification, form the substratum transparent of surfacing..
In the step s 100, the attachment of LED luminescence chips 20 is fixed on the surface of circuit board 10,.The surface of circuit board 10
The center spacing of adjacent LED luminescence chip 20 can accomplish big-pitch screen, dot clearance display screen can also be accomplished, most
Preferably, the adjacent center spacing of LED luminescence chips 20 is 2.0-5.0mm.That is, black glue LED display of the invention is most suitably used
The center spacing ranges of LED luminescence chips 20 be 2.0-5.0mm.Pixel is very high, and display picture becomes apparent from.
In step s 200, black colloid is preferably black PUR, and the temperature of low-temp low-pressure injection black PUR is
180-240 DEG C, pressure 1.5-40Bar.When the center spacing of adjacent LED luminescence chip 20 is smaller, low-temp low-pressure injection black
Most suitably used scope is 2.0-5.0mm during colloid.Mould used in the present invention is special large mold, will be provided with
After the circuit board 10 of LED luminescence chips 20 is put into die cavity, black PUR is imported by 9 glue-feeders, until black heats
Glue is full of the gap of LED luminescence chips 20, and the glue-feeder diameter is preferably 1.7mm.
In step S300, the transparent colloid is one kind in epoxy resin, PU glue and UV glue.First irrigated into die cavity
It enough transparent colloids, need to ensure that LED luminescence chips 20 and black glue-line 30, then inverting circuit plate 10 can be completely covered, keep
Be provided with the LED luminescence chips one down, i.e., the drain pan of holding circuit plate 10 upward, slowly pushes circuit board 10 to mould
Chamber, because mold cavity bottoms are smooth, it is formed the substratum transparent 40 with flat surface.Encapsulating is inverted to form with flat
The substratum transparent 30 on whole surface, the purpose is to both protect LED luminescence chips 20, it is allowed to be not easy to damage by external force,
And can enough makes the light of LED luminescence chips 20 normally project.
Slowly push circuit board 10 so that the upper surface of LED luminescence chips 20 and black glue-line 30 forms substratum transparent
40, certain, the thickness of substratum transparent 40 can control at this moment, such as need to make the substratum transparent 30 of a certain thickness, then will
Circuit board 10 is pressed to apart from mold cavity bottoms identical highly, natural cooling, and then related mould will be covered with transparent colloid together
Circuit board 10 be put into curing oven and solidified, the solidification furnace temperature is 80 DEG C, after solidifying 4 hours, takes out, utilizes numerical control
Lathe cleans out unnecessary transparent colloid, has just processed the double-deck glue LED with black glue-line 30 and substratum transparent 40 and has shown
Display screen.It is to be understood that LED display surface must assure that smooth, it can just make the light of LED luminescence chips 20 along normal
Direction is launched, and can just play out normal picture.The inversion encapsulating technology that the present invention utilizes, the mold cavity bottoms of mould therefor are flat
Whole, also, the circuit board 10 for being covered with transparent colloid is put into curing oven together and solidified by related mould, ensure that transparent adhesive tape
The flatness of layer 40, so as to ensure that the quality of LED display.
It should be appreciated that the application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can
To be improved or converted according to the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect scope.
Claims (10)
1. a kind of double-deck glue LED display, including circuit board and the LED luminescence chips for being mounted on the circuit board surface, it is special
Sign is, in addition to is covered in the black glue-line of the circuit board surface, and the LED luminescence chips gap is filled with the black
Glue-line, and the upper surface of LED luminescence chips is concordant with black glue-line, forms even curface；
And it is covered in the black glue-line and the smooth substratum transparent of LED luminescence chip surface above.
2. double-deck glue LED display according to claim 1, it is characterised in that the black glue-line is black PUR
Layer.
3. double-deck glue LED display according to claim 1, it is characterised in that the substratum transparent is epoxy resin, PU
One kind in glue and UV glue.
4. double-deck glue LED display according to claim 1, it is characterised in that the black glue-line passes through low-temp low-pressure
Injection is formed.
5. double-deck glue LED display according to claim 1, it is characterised in that the substratum transparent passes through encapsulating mode
Formed.
6. double-deck glue LED display according to claim 5, it is characterised in that the encapsulating mode is inversion encapsulating.
7. double-deck glue LED display according to claim 1, it is characterised in that adjacent LED luminescence chips center spacing
For 2.0-5.0mm.
A kind of 8. double-deck glue LED display processing method, it is characterised in that including：
Needs of several LED luminescence chips according to design are mounted on the board surface；
The circuit board for being pasted with LED luminescence chips is put into the first die cavity, it is low to the circuit board surface for being pasted with LED luminescence chips
Warm low-pressure injection molding black colloid, until it is concordant with LED luminescence chips upper surface, form the black glue-line of surfacing；
After black curable adhesive layer, transparent colloid is irrigated into one second die cavity, is inverted the circuit for being pasted with LED luminescence chips
Plate, is put into second die cavity, keeps being provided with the one of the LED luminescence chips down, in the black glue-line and described
Substratum transparent is formed above LED luminescence chips；
After transparent colloid solidification, the substratum transparent of surfacing is formed.
9. double-deck glue LED display processing method according to claim 8, it is characterised in that the black colloid is black
Color PUR.
10. double-deck glue LED display processing method according to claim 8, it is characterised in that the transparent colloid is ring
One kind in oxygen tree fat, PU glue and UV glue.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711219007.2A CN107731121A (en) | 2017-11-28 | 2017-11-28 | A kind of double-deck glue LED display and its processing method |
| PCT/CN2018/084694 WO2019104937A1 (en) | 2017-11-28 | 2018-04-26 | Double-layer gel led display screen and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711219007.2A CN107731121A (en) | 2017-11-28 | 2017-11-28 | A kind of double-deck glue LED display and its processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731121A true CN107731121A (en) | 2018-02-23 |
Family
ID=61219783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711219007.2A Pending CN107731121A (en) | 2017-11-28 | 2017-11-28 | A kind of double-deck glue LED display and its processing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107731121A (en) |
| WO (1) | WO2019104937A1 (en) |
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