CN111403374A - Transparent flexible display module and preparation method thereof - Google Patents
Transparent flexible display module and preparation method thereof Download PDFInfo
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- CN111403374A CN111403374A CN202010329036.XA CN202010329036A CN111403374A CN 111403374 A CN111403374 A CN 111403374A CN 202010329036 A CN202010329036 A CN 202010329036A CN 111403374 A CN111403374 A CN 111403374A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a transparent flexible display module and a preparation method thereof, wherein the transparent flexible display module comprises a flexible conductive film layer, L ED light-emitting groups arranged on the first surface of the flexible conductive film layer, a flexible circuit board electrically connected with L ED light-emitting groups, a first transparent adhesive layer arranged on the first surface of the flexible conductive film layer and covering L ED light-emitting groups, a second transparent adhesive layer arranged on the second surface of the flexible conductive film layer and a protective layer arranged on the second surface of the second transparent adhesive layer, the flexible conductive film layer comprises a flexible base material and a conductive circuit arranged on the flexible base material, the L ED light-emitting groups comprise a plurality of L ED lamp beads, L ED lamp beads are electrically connected with the flexible circuit board through the conductive circuit, and the first transparent adhesive layer and the second transparent adhesive layer are organic silicon compound adhesive layers.
Description
Technical Field
The invention relates to a display screen, in particular to a transparent flexible display module with high adhesion and a preparation method thereof.
Background
Along with the gradual development of display technology, transparent flexible display module receives more and more user's welcome, in transparent flexible display module's panel manufacturing process, in order to realize folding and curling, utilized the temporary substrate in the traditional stereoplasm display screen of flexible substrate replacement.
The manufacturing process of the existing display screen generally utilizes a glass fiber board as L ED carrier substrate, the power supply and the control of L ED lamp beads are realized through an external power supply circuit and a control system, L ED lamp beads are controlled, and video and character playing are realized.
Therefore, a new transparent flexible display module is needed to solve the problems and defects of the existing display screen, such as non-foldability, curling, poor adhesion, not light and thin structure, and complex manufacturing process.
Disclosure of Invention
The invention aims to provide a transparent flexible display module with high adhesiveness and a preparation method thereof to solve the technical problems in the background art.
The solution of the invention for solving the technical problem is as follows:
one aspect of the present invention provides a transparent flexible display module with high adhesion, including:
the flexible light-emitting diode comprises a flexible conductive film layer, L ED light-emitting groups arranged on a first surface of the flexible conductive film layer, a flexible circuit board electrically connected with the L ED light-emitting groups, a first transparent adhesive layer arranged on the first surface of the flexible conductive film layer and covering the L ED light-emitting groups, a second transparent adhesive layer arranged on a second surface of the flexible conductive film layer and a protective layer arranged on the second surface of the second transparent adhesive layer, wherein the flexible conductive film layer comprises a flexible base material and a conductive circuit arranged on the flexible base material, the L ED light-emitting groups comprise a plurality of L ED lamp beads, the L ED lamp beads are electrically connected with the flexible circuit board through the conductive circuit, and the first transparent adhesive layer and the second transparent adhesive layer are organic silicon compound adhesive layers.
Further, the conductive circuits comprise a first conductive circuit and a second conductive circuit, the first conductive circuit is arranged on the first surface of the flexible substrate and electrically connected with the L ED lamp beads, and the first conductive circuit is electrically connected with the flexible circuit board through the second conductive circuit.
Furthermore, the flexible circuit board is arranged on the second surface of the flexible base material, the second conductive circuit is arranged on the second surface of the flexible base material, and the first conductive circuit is connected with the second conductive circuit through a through hole; and a conductive block is arranged at the joint of the first conductive circuit and the second conductive circuit.
Preferably, the number of the through holes is 2, the two through holes are arranged in parallel, and the first conductive circuit is uniformly connected with the second conductive circuit through the through holes; the first conductive traces and the second conductive traces may be made of the same material or different materials.
Further, the transparent flexible display module comprises a display area and a peripheral area, the first conductive circuit is arranged in the display area, and the second conductive circuit is arranged in the peripheral area.
Further, the viscosity coefficient of the adhesive layer of the organic silicon compound is 560 to 800mPa, and more preferably 600 mPa.
Further, the thickness of the second transparent adhesive layer is 0.2-1.0 mm.
Further, the thickness of the first transparent adhesive layer is 0.1-0.5 mm higher than the top end of the L ED light-emitting group.
Further, the protective layer is a PET film, and the thickness of the PET film is 0.012-0.25 mm.
The invention also provides a preparation method of the transparent flexible display module with high adhesiveness, which comprises the following steps:
(1) binding a flexible circuit board with a conductive circuit on a flexible conductive film layer provided with L ED light-emitting groups;
(2) stirring the transparent colloid, vacuumizing and discharging bubbles;
(3) placing the soft conductive film layer in a jig in a manner that the back of an L ED light-emitting group faces upwards, pouring transparent colloid into a film cavity of the jig, and curing to form a second transparent adhesive layer with a smooth surface;
(4) covering a PET film on the second surface of the second transparent adhesive layer, namely forming the second transparent adhesive layer and the PET film on the second surface of the flexible conductive film layer;
(5) and (3) placing the soft conductive film layer obtained in the step (4) in the jig in a manner that the L ED light emitting groups face upwards, pouring transparent colloid into the die cavity, filling gaps of L ED light emitting groups and covering the surfaces of L ED light emitting groups, and curing to form a first transparent adhesive layer with a smooth surface, so as to obtain the transparent flexible display module.
Further, the transparent colloid is an organic silicon compound.
Further, the organic silicon compound is a two-component organic silicon compound.
Further, the thickness of the second transparent adhesive layer is 0.2-1.0 mm.
Further, the thickness of the first transparent adhesive layer is 0.1-0.5 mm higher than the top end of the L ED light-emitting group.
Further, the thickness of the PET film is 0.012-0.25 mm.
Further, the viscosity coefficient of the transparent adhesive layer is 560 to 800mPa, and more preferably 600 mPa.
The invention further provides a transparent flexible display screen which comprises a plurality of transparent flexible display modules, and the transparent flexible display screen is formed by the transparent flexible display modules through a connecting structure.
By adopting the technical scheme provided by the invention, the beneficial effects of the invention are as follows:
1. the adhesive property is good, and the glass wall can be attached to the existing glass wall for use;
2. the formed soft protective layer is not layered and does not crack;
3. the screen body does not have steel construction dustcoat, realizes ultra-thin, ultralight, and the screen body is waterproof.
4. The glass is suitable for the set curtain wall glass with any size and radian, and the original glass is not required to be disassembled or replaced;
5. has mature process and equipment, can realize the modularization of production, and has low cost and high efficiency.
Description of the drawings:
the accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
FIG. 1 is a schematic structural diagram of a transparent flexible display module according to a preferred embodiment of the invention.
FIG. 2 is a schematic structural diagram of a light-emitting layer of a transparent flexible display module according to a preferred embodiment of the invention.
FIG. 3 is a flowchart illustrating a method for manufacturing a transparent flexible display module according to a preferred embodiment of the invention.
Fig. 4 is a schematic structural diagram of the transparent flexible display screen of the present invention.
Description of the symbols:
1 transparent flexible display module
2 luminescent layer
3 transparent flexible display screen
10 soft conductive film layer
20L ED light emitting group
30 first transparent adhesive layer
40 second transparent adhesive layer
50 protective layer
60 flexible circuit board
70 through hole
80 connecting structure
90 conductive block
100 conductive circuit
101 soft base material
102 first conductive line
103 second conductive traces
A1 display area
Peripheral region of A2
The specific implementation mode is as follows:
specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present invention. The present invention may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "upper surface", "lower surface", "above", "below", "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or component being referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or more of the features.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
FIG. 1 is a schematic structural diagram of a transparent flexible display module according to a preferred embodiment of the invention.
Referring to fig. 1, the present invention provides a transparent flexible display module 1 with high adhesion, which includes a flexible conductive film 10, L ED light emitting groups 20 attached to a surface of the flexible conductive film, a first transparent adhesive layer 30 on a first surface of the flexible conductive film, a second transparent adhesive layer 40 on a second surface of the flexible conductive film, and a protection layer 50.
The flexible conductive film layer 10 comprises a flexible substrate 101 and a conductive circuit arranged on the flexible substrate 101, the first transparent adhesive layer 30 covers a first surface of the flexible conductive film layer 10, the first transparent adhesive layer 30 fills L ED light emitting groups 20 and covers L ED light emitting groups 20, L ED light emitting groups 20 are completely covered by the first transparent adhesive layer 30, that is, the first transparent adhesive layer 30 is higher than L ED light emitting groups 20, the first transparent adhesive layer 30 is transparent, therefore, light rays emitted by L ED light emitting groups 20 can not be shielded, L ED light emitting groups 20 are more comprehensively protected, L ED light emitting groups 20 are effectively protected from being damaged by external force, the second transparent adhesive layer 40 covers a second surface of the flexible conductive film layer 10, a protective layer 50 is arranged on the surface of the second transparent adhesive layer 40 on the second surface of the flexible conductive film layer 10, the protective layer 50 is non-adhesive, reasonable protection is carried out on the second transparent adhesive layer 40, an effective scratch prevention effect is achieved, and products can be fully protected from dust and water stains in an external environment, wherein the first transparent adhesive layer 30 and the second transparent adhesive layer are an organic silicon compound.
The first transparent adhesive layer 30 and the second transparent adhesive layer 40 of the transparent flexible display module 1 provided by the invention are organic silicon compound adhesive layers, the viscosity coefficient of the organic silicon compound layers is 560-800 mPa, preferably 600mPa, the organic silicon compounds have high adhesion performance, when in use, the first transparent adhesive layer 30 can be directly attached to the surface of an application scene, such as a glass curtain wall, an elevator cage and the like, namely, the first transparent adhesive layer can be directly attached to the surface of the application scene under the condition that the original structure of the application scene is not changed, and the display module can be used. For example, the glass wall can be directly attached to the existing glass wall and elevator cage for use.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a light emitting layer of a transparent flexible display module 1 according to a preferred embodiment of the present invention, in the above structure, a flexible conductive film layer 10, conductive traces 100 on the flexible conductive film layer 10, L ED light emitting groups 20, and a flexible circuit board 60 electrically connected to L ED light emitting groups 20 through the conductive traces 100 form the light emitting layer 2. in the preferred embodiment of the light emitting layer provided by the present invention, the light emitting layer 2 includes a flexible substrate 101, a flexible circuit board 60, and L ED lamp beads 201 arranged on a first surface of the flexible substrate 101, the L ED light emitting groups 20 are formed by connecting a plurality of L ED lamp beads 201, L ED lamp beads 201 are electrically connected to the flexible circuit board 60 through the conductive traces 100, the conductive traces 100 include a first conductive trace 102 and a second conductive trace 103, the first conductive trace 102 is disposed on the first lamp bead surface of the flexible substrate 101 and electrically connected to the plurality of L ED light emitting groups 201, the first conductive trace 102 is electrically connected to the flexible circuit board 60 through the second conductive trace 103, the flexible circuit board 60 is disposed on a second conductive trace surface of the flexible substrate 101, the second conductive trace 103 is disposed on a second surface of the flexible.
The transparent flexible display module 1 provided by the invention comprises a display area A1 and a peripheral area A2, wherein the first conductive circuit 102 is arranged in the display area A1, and the second conductive circuit 103 is arranged in the peripheral area A2. The through-hole 70 is disposed in the peripheral area a 2. In this embodiment, the number of the through holes 70 is one, but a plurality of through holes may be provided according to the arrangement of the conductive lines. In a preferred embodiment, the number of the through holes 70 is two, two through holes 70 may be provided in parallel in the peripheral area a2, and the first conductive trace 102 is uniformly connected to the second conductive trace 103 via the two through holes 70. The first conductive traces 102 and the second conductive traces 103 may be the same material or different materials; the conductive block 90 is disposed at the connection position of the first conductive trace 102 and the second conductive trace 103, and is used for further enhancing the electrical connection between the first conductive trace 102 and the second conductive trace 103, so as to avoid the problem that the circuit is not connected due to the disconnection when the first conductive trace 102 is connected with the second conductive trace 103. The conductive bumps 90 may better strengthen the electrical connection between the first conductive trace 102 and the second conductive trace 103. The position of the conductive block 90 may be adjusted according to the position of the connection of the actual first conductive trace 102 and the second conductive trace 103, and is not limited to being disposed in the through hole 70.
In the preferred embodiment of the invention, the viscosity coefficient of the organic silicon compound adhesive layer is 560-800 mPa, preferably 600mPa, the adhesive property of the organic silicon compound adhesive layer is good, and the organic silicon compound adhesive layer can be well attached to a glass wall for use, the thickness of the second transparent adhesive layer is 0.2-1.0 mm, the thickness of the first transparent adhesive layer is 0.1-0.5 mm higher than the top end of the L ED light-emitting group, the protective layer is a PET film, and the thickness of the PET film is 0.012-0.25 mm.
In the embodiment provided by the invention, the L ED lamp beads 201 can be single-color lamp beads, three-color lamp beads or four-color lamp beads and can be packaged in a patch manner, the first conductive circuit 102 and the second conductive circuit 103 are made of metal conductive materials such as copper, silver, nano silver and the like, the first conductive circuit 102 and the second conductive circuit 103 can be made of the same material or different materials, and the first conductive circuit 102 and the second conductive circuit 103 are in a honeycomb structure or a tree root structure, but not limited to this.
Referring to fig. 3, fig. 3 is a flowchart illustrating a method for manufacturing a transparent flexible display module according to a preferred embodiment of the invention. The invention provides a preparation method of a transparent flexible display module with high adhesiveness, which comprises the following steps:
s1, binding a flexible circuit board with a conductive circuit on a flexible conductive film layer provided with L ED light-emitting groups;
s2: stirring the transparent colloid, vacuumizing and discharging bubbles;
s3, placing the soft conductive film layer in a jig with the back of the L ED light-emitting group facing upwards, pouring transparent colloid into a film cavity of the jig, and curing to form a second transparent adhesive layer with a smooth surface;
s4: covering a PET film on the second surface of the second transparent adhesive layer, namely forming the second transparent adhesive layer and the PET film on the second surface of the flexible conductive film layer;
and S5, placing the soft conductive film layer obtained in the S4 in a jig in a mode that the front face of the L ED light emitting group faces upwards, pouring transparent colloid into the die cavity, filling gaps of the L ED light emitting group and covering the surface of the L ED light emitting group, and curing to form a first transparent adhesive layer with a smooth surface to obtain the transparent flexible display module.
In step S1, a flexible circuit board 60 is bonded to a conductive trace 100 on a flexible conductive film 10 having L ED light emitting elements 20, in this embodiment, a through hole 70 is formed on the flexible conductive film 10, the conductive trace 100 is electrically connected to the flexible circuit board 60 through the through hole 70, and a conductive block 90 is disposed at a connection between a first conductive trace 102 and a second conductive trace 103 for electrically connecting the first conductive trace 102 and the second conductive trace 103, so as to avoid a problem of circuit disconnection caused by a disconnection between the first conductive trace 102 and the second conductive trace 103.
In step S2, the transparent colloid is a two-component silicone compound, and the two-component silicone compound is mixed and stirred to complete vacuum bubble removal.
Firstly, placing the electrically-measured qualified soft conductive film layer 10 provided with the L ED light-emitting group 20 in a jig in a mode that the back of the L ED light-emitting group 20 faces upwards, enabling the soft conductive film layer 10 to be located at a set height position in the jig, pouring the stirred and foamed organic silicon compound side by side into a mold cavity of the jig, and curing at normal temperature to form a second transparent adhesive layer 40 with a smooth surface, wherein the thickness of the second transparent adhesive layer is 0.2-1.0 mm.
In step S4, the PET film 50 is covered on the second surface of the second transparent adhesive layer 40, that is, the second transparent adhesive layer 40 and the PET film 50 are formed on the second surface of the flexible conductive film layer 10. Wherein, the thickness of PET membrane 50 is 0.012 ~ 0.25mm, can rationally protect second transparent adhesive layer 40, plays effectual scratch-resistant effect to can fully protect the product not receive dust and the water stain pollution in the external environment.
In step S5, the poured transparent colloid is an organic silicon compound, and the formed transparent adhesive layer is an organic silicon compound layer, which has high adhesion performance, and can be used to firmly stick the transparent flexible display module to a glass wall body, the soft conductive film layer 10 obtained in step S4 is placed in a jig in a manner that the L ED light-emitting group 20 faces upwards, the transparent colloid is poured into a mold cavity of the jig, a gap between L ED light-emitting groups 20 is filled and covers the surface of L ED light-emitting group 20, and a first transparent adhesive layer 30 with a smooth surface is formed by curing, so that a complete transparent flexible display module 1 is obtained, wherein the thickness of the first transparent adhesive layer 30 is 0.1-0.5 mm higher than the top end of L ED light-emitting group 20, and the transparent adhesive layer has a thickness capable of effectively protecting L ED light-emitting group from being damaged by external force, and has yellowing resistance and waterproof performance.
In this embodiment, the poured transparent colloid is an organosilicon compound, the formed transparent adhesive layer is an organosilicon compound layer, the viscosity coefficient of the organosilicon compound layer is 560-800 mPa, preferably 600mPa, and the organosilicon compound has high adhesion performance and can be well attached to a glass wall for use.
Referring to fig. 4, the present invention further provides a transparent flexible display screen 3. The transparent flexible display screen 3 comprises a plurality of transparent flexible display modules 1 provided by the invention. The transparent flexible display module 1 is connected together through a connecting structure 80 to form a transparent flexible display screen 3. Transparent flexible display module assembly 1 can satisfy the demand of product outward appearance according to product demand encapsulation in vice frame when the concatenation. In this implementation, the number of the transparent flexible display modules 1 is four, and the number of the transparent flexible display modules 1 in other embodiments can be set arbitrarily according to actual requirements.
In the embodiment, the transparent flexible display screen 3 composed of the plurality of transparent flexible display modules 1 can be made according to the customer requirements, the transparent flexible display screen is light, thin and high in adhesion performance, can be directly attached to the existing building glass for use, and has application flexibility and wide application scenes.
While the foregoing specification illustrates and describes the preferred embodiments of this invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A transparent flexible display module comprises a flexible conductive film layer, L ED light-emitting groups arranged on a first surface of the flexible conductive film layer, and a flexible circuit board electrically connected with the L ED light-emitting groups, and is characterized by further comprising a first transparent adhesive layer arranged on the first surface of the flexible conductive film layer and covering the L ED light-emitting groups, a second transparent adhesive layer arranged on a second surface of the flexible conductive film layer, and a protective layer arranged on the second surface of the second transparent adhesive layer, wherein the flexible conductive film layer comprises a flexible base material and a conductive circuit arranged on the flexible base material, the L ED light-emitting groups comprise a plurality of L ED lamp beads, the L ED lamp beads are electrically connected with the flexible circuit board through the conductive circuit, and the first transparent adhesive layer and the second transparent adhesive layer are organic silicon compound adhesive layers.
2. The transparent flexible display module according to claim 1, wherein the conductive traces comprise a first conductive trace and a second conductive trace, the first conductive trace is disposed on the first surface of the flexible substrate and electrically connected to the L ED lamp beads, and the first conductive trace is electrically connected to the flexible circuit board through the second conductive trace.
3. The transparent flexible display module according to claim 2, wherein the flexible circuit board is disposed on the second surface of the flexible substrate, the second conductive traces are disposed on the second surface of the flexible substrate, the first conductive traces are connected to the second conductive traces through via holes, and conductive blocks are disposed at the connection between the first conductive traces and the second conductive traces.
4. The transparent flexible display module according to claim 1, wherein the viscosity coefficient of the organic silicon compound adhesive layer is 560 to 800 mPa.
5. The transparent flexible display module according to claim 1, wherein the thickness of the second transparent adhesive layer is 0.2-1.0 mm.
6. The transparent flexible display module according to claim 1, wherein the thickness of the first transparent adhesive layer is 0.1-0.5 mm higher than the top end of the L ED light emitting assembly.
7. The transparent flexible display module according to claim 1, wherein the protective layer is a PET film, and the thickness of the PET film is 0.012-0.25 mm.
8. A preparation method of a transparent flexible display module is characterized by comprising the following steps:
(1) binding a flexible circuit board with a conductive circuit on a flexible conductive film layer provided with L ED light-emitting groups;
(2) stirring the transparent colloid, vacuumizing and discharging bubbles;
(3) placing the soft conductive film layer in a jig in a manner that the back of an L ED light-emitting group faces upwards, pouring transparent colloid into a film cavity of the jig, and curing to form a second transparent adhesive layer with a smooth surface;
(4) covering a PET film on the second surface of the second transparent adhesive layer, namely forming the second transparent adhesive layer and the PET film on the second surface of the flexible conductive film layer;
(5) and (3) placing the soft conductive film layer obtained in the step (4) in the jig in a manner that the L ED light emitting groups face upwards, pouring transparent colloid into the die cavity, filling gaps of L ED light emitting groups and covering the surfaces of L ED light emitting groups, and curing to form a first transparent adhesive layer with a smooth surface, so as to obtain the transparent flexible display module.
9. The production method according to claim 8, wherein the transparent colloid is an organosilicon compound; the viscosity coefficient of the transparent adhesive layer is 560-800 mPa.
10. A transparent flexible display screen is characterized by comprising a plurality of transparent flexible display modules, wherein the transparent flexible display modules are obtained according to any one of claims 1 to 7 or according to any one of claims 8 to 9, and the transparent flexible display screen is formed by the plurality of transparent flexible display modules through a connecting structure.
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| CN202010329036.XA CN111403374A (en) | 2020-04-23 | 2020-04-23 | Transparent flexible display module and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112467012A (en) * | 2020-12-17 | 2021-03-09 | 深圳市西陆光电技术有限公司 | High-transparency flexible display screen with traceless glue and production method thereof |
| CN112863353A (en) * | 2021-01-21 | 2021-05-28 | 深圳市伽弥科技有限公司 | Manufacturing method of flexible transparent screen |
| CN113539119A (en) * | 2021-07-14 | 2021-10-22 | 广州市耐贝西照明有限公司 | Crystal film screen |
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2020
- 2020-04-23 CN CN202010329036.XA patent/CN111403374A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112467012A (en) * | 2020-12-17 | 2021-03-09 | 深圳市西陆光电技术有限公司 | High-transparency flexible display screen with traceless glue and production method thereof |
| CN112863353A (en) * | 2021-01-21 | 2021-05-28 | 深圳市伽弥科技有限公司 | Manufacturing method of flexible transparent screen |
| CN113539119A (en) * | 2021-07-14 | 2021-10-22 | 广州市耐贝西照明有限公司 | Crystal film screen |
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