CN112936689A - Surface glue pouring and film pasting method for LED module - Google Patents
Surface glue pouring and film pasting method for LED module Download PDFInfo
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- CN112936689A CN112936689A CN202110063876.0A CN202110063876A CN112936689A CN 112936689 A CN112936689 A CN 112936689A CN 202110063876 A CN202110063876 A CN 202110063876A CN 112936689 A CN112936689 A CN 112936689A
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- 239000003292 glue Substances 0.000 title claims abstract description 141
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000084 colloidal system Substances 0.000 claims abstract description 42
- 238000005498 polishing Methods 0.000 claims abstract description 29
- 238000003825 pressing Methods 0.000 claims description 17
- 239000012528 membrane Substances 0.000 claims description 14
- 239000011324 bead Substances 0.000 claims description 13
- 230000004888 barrier function Effects 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 238000004382 potting Methods 0.000 claims description 2
- 239000002313 adhesive film Substances 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 74
- 229920000297 Rayon Polymers 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/002—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the work consisting of separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The embodiment of the application discloses a surface glue pouring and film pasting method of an LED module, which is used for prolonging the service life of the LED module. The application includes: providing a glue solution, a glue filling mold, a functional film, a film sticking device, a polishing device and an LED module subjected to one-time glue filling; fixing the LED module subjected to primary glue pouring on the first mould part, pouring the glue solution into the cavity, and vertically attaching the first mould and the second mould so that the LED module subjected to primary glue pouring moves downwards and is immersed in the glue solution; after the glue solution is solidified, carrying out demoulding treatment on the LED module subjected to the primary glue pouring to obtain a first target LED module; the polishing device polishes the colloid with the second preset thickness on the surface of the first target LED module to form a preset surface; after the polishing device finishes polishing the first target LED module, obtaining a second target LED module; and the film pasting device is used for pasting a functional film on the preset surface of the second target LED module.
Description
Technical Field
The embodiment of the application relates to the technical field of glue pouring and film pasting, in particular to a surface glue pouring and film pasting method for an LED module.
Background
The LED module is a product which is widely applied in LED products, and particularly relates to a device which can realize large-range illumination by connecting circuit boards provided with LED lamp beads into long strings. The LED module is generally driven by the constant current source, and compared with an ordinary LED lamp panel and an old lamp tube, the LED module has larger luminous surface and smaller power consumption, and can be widely applied to daily life of people.
Because the light-emitting diode on the existing LED module is fragile, the common protection means is glue pouring protection, but the common glue pouring process achieves the purpose of protecting the diode, the surface glue layer of the LED module after glue pouring can not form a smooth surface due to the shape of the LED lamp beads, the wear resistance of the glue layer is not high, and the service life of the LED module is influenced.
Disclosure of Invention
The embodiment of the application provides a surface glue pouring and film pasting method of an LED module, which is used for prolonging the service life of the LED module.
The application provides a surface glue pouring and film pasting method of an LED module, which comprises the following steps: providing a glue solution, a glue filling mold, a functional film, a film sticking device, a polishing device and an LED module subjected to one-time glue filling; the LED module subjected to primary glue filling is adhered with a first glue body, the first glue body is provided with a first preset thickness, the glue filling mold comprises a first mold part and a second mold part which are arranged up and down, the top end of the second mold part is provided with a cavity, the bottom surface of the cavity is a horizontal plane, the side surface of the LED module subjected to primary glue filling is provided with a horizontal bead, and the LED module subjected to primary glue filling is detected to be in a horizontal state through the horizontal bead;
fixing the LED module subjected to primary glue pouring on the first mould part, pouring the glue solution into the cavity, and vertically attaching the first mould and the second mould so that the LED module subjected to primary glue pouring moves downwards and is immersed in the glue solution;
after the glue solution is solidified, demolding the LED module subjected to the primary glue filling to obtain a first target LED module, wherein a second colloid is adhered to the first target LED module and is provided with a second preset thickness, the colloid with the second preset thickness is higher than the colloid with the first preset thickness, the colloid with the second preset thickness covers the LED lamp on the LED module subjected to the primary glue filling, and the colloid with the second preset thickness is higher than the preset height of the LED lamp, so that after the colloid with the second preset thickness is solidified, the second colloid is higher than the LED lamp or is equal in height;
the polishing device polishes the colloid with the second preset thickness on the surface of the first target LED module to form a preset surface;
after the first target LED module is polished by the polishing device, a second target LED module is obtained, a third colloid is adhered to the second target LED module, the third colloid is provided with a third preset thickness, the third preset thickness of the colloid is lower than that of the second preset thickness and higher than that of the first preset thickness, and the third colloid is higher than the LED lamp or is equal in height;
and the film pasting device is used for pasting the functional film on the preset surface of the second target LED module.
Optionally, the polishing device includes a first clamping plate, a second clamping plate, a bottom plate, a first motor, a polishing plate and a transmission belt; the conveyer belt sets up the bottom plate below, the conveyer belt with the bottom plate is placed for the contact, first grip block and second grip block are installed respectively the bottom plate left and right sides, wherein, first grip block second grip block and the bottom plate forms the inner chamber, the inner chamber is used for placing LED module through once encapsulating, just first grip block with the second grip block height is the same, grind the board and install on the first motor, it is in to grind the board setting first grip block with second grip block top, first motor cooperation grind the board be used for right the upper surface of first target LED module is polished and is handled.
Optionally, the film sticking device comprises a clamping frame, a second motor, a first rotating wheel, a second rotating wheel, a pressing assembly and a film storage strip; first runner is installed on the second motor, first runner with second runner parallel placement, first runner and the second runner is installed centre gripping frame top, the centre gripping frame is used for the centre gripping the second target LED module, it connects to store up the membrane strip first runner with between the second runner, functional pad pasting is placed store up on the membrane strip, sticiss the unit mount in store up membrane strip top, it will to sticiss the subassembly functional pad pasting compress tightly laminate in the upper surface of second target LED module.
Optionally, soft sponges are installed on two sides of the inner cavity, the soft sponges are used for protecting the LED modules subjected to one-time glue filling, the distance between the bottom plate and the first clamping plate and the distance between the bottom plate and the second clamping plate are preset distances, when the first target LED module is placed in the inner cavity, the distance between the bottom of the first target LED module and the top of the first target LED module is an actual distance, when the actual distance exceeds the preset distance, the motor is matched with the grinding plate and used for grinding the colloid exceeding the preset distance.
Optionally, the compressing assembly comprises an electric lifting rod, a compressing plate and a protective film, the compressing plate is mounted at the lower end of the electric lifting rod, the protective film is arranged at the lower end of the compressing plate, the cross section area of the compressing plate is the same as that of the clamping frame, and the protective film is used for protecting the upper surface of the film storage strip.
Optionally, store up the membrane strip lower surface and be provided with the viscose, the viscose with the one side adhesion of non-viscose on the functional film, it is used for the adhesion fixed to store up the membrane strip lower surface to be provided with the viscose functional film.
Optionally, the bottom of the first mold is provided with a first clamp and a second clamp, the first clamp is arranged on one side of the first mold, the second clamp is arranged on the other side of the second mold, and the first clamp and the second clamp are used for clamping and fixing the once-glue-filled LED module.
Optionally, a barrier film layer covers the cavity, the barrier film layer is in close contact with the inner wall of the cavity, and the barrier film layer is used for separating the glue solution from the cavity.
Optionally, the diaphragm layer is any one of a stripping film layer, an isolation film layer, a separation film layer, a silicon oil film layer and an anti-sticking film layer.
Optionally, after the once-glue-filled LED module is immersed in the glue solution, the glue solution is subjected to vacuum defoaming treatment.
According to the technical scheme, the embodiment of the application has the following advantages:
the LED lamp is provided with a glue pouring mold, a functional film, a film pasting device, a polishing device and an LED module which is subjected to one-time glue pouring, the LED module which is subjected to one-time glue pouring is placed in the glue pouring mold, glue solution is poured into the glue pouring mold, after the glue solution is cooled, a first target LED module is obtained, the thickness of the obtained glue on the first target LED module is higher than the preset height of an LED lamp, so that the problem that the surface of the formed LED module is concave and convex is effectively avoided, then the first target LED module is placed in the polishing device, the upper surface of the first target LED module is polished, a second target LED module is obtained after polishing, and the second target LED module is placed in the film pasting device to carry out film pasting on the upper surface of the second target LED module; according to the LED module, the LED module after being subjected to glue pouring is subjected to glue pouring again, so that glue on the LED module is firmer, the generation of gaps is reduced, the upper surface of the LED module is subjected to polishing and film pasting, the wear resistance of the glue layer of the LED module is improved, and the service life of the LED module is prolonged.
Drawings
FIG. 1 is a schematic flow chart of a glue-pouring and film-pasting method;
FIG. 2 is a schematic structural view of a glue-pouring mold;
FIG. 3 is a schematic view of a polishing apparatus;
FIG. 4 is a schematic view of a film storage strip in a film sticking device structure;
FIG. 5 is a schematic view of a film storage strip in the structure of the film sticking device;
fig. 6 is a schematic diagram of the LED module after the film pasting is completed.
Detailed Description
The LED on the existing LED module is fragile, the protection means commonly used for the LED module is glue pouring protection, but the common glue pouring process achieves the purpose of protecting the LED, the surface glue layer of the LED module after glue pouring can not form a smooth surface due to the shape of the LED lamp beads, the wear resistance of the glue layer is not high, and the service life of the LED module is influenced.
Based on this, the application provides a surface potting adhesive pad pasting method of LED module for prolong the life of LED module.
The embodiment of the invention provides a surface glue pouring and film pasting method of an LED module, the flow of the glue pouring and film pasting method is shown in figure 1, the structure of a related glue pouring mold is shown in figure 2, the structure of a grinding device is shown in figure 3, the structure of a film pasting device is shown in figures 4 and 5, the film pasting effect display is shown in figure 6, and the following description is respectively given: the glue pouring method comprises the following steps:
s01, providing glue solution 4, a glue pouring mold, a functional film 78, a film pasting device, a polishing device and the LED module 2 subjected to one-time glue pouring; the LED module 2 subjected to one-time glue filling is adhered with a first glue body 21, the first glue body 21 is provided with a first preset thickness, the glue filling mould comprises a first mould 1 part and a second mould part which are arranged up and down, the top end of the second mould part is provided with a cavity 31, the bottom surface of the cavity 31 is a horizontal plane, the side surface of the LED module 2 subjected to one-time glue filling is provided with a horizontal bead, and the LED module 2 subjected to one-time glue filling is detected to be in a horizontal state through the horizontal bead;
s02, fixing the LED module 2 subjected to the primary glue pouring on the first mould 1 component, pouring the glue solution 4 into the cavity 31, and vertically attaching the first mould 1 and the second mould to enable the LED module 2 subjected to the primary glue pouring to move downwards and be immersed in the glue solution 4;
in the embodiment of the application, the once-filled LED module 2 is provided, in order to effectively solve the problem that the surface of the once-filled LED module 2 has unevenness, the once-filled LED module 2 needs to be filled again, in practical application, the once-filled LED module 2 is placed in a filling mold, the filling mold is provided with a first mold 1 and a second mold, wherein it should be noted that the first mold 1 and the second mold are not in a connection relationship but in a separated state, the first mold 1 mainly fixes the once-filled LED module 2, the second mold is provided with a cavity 31 mainly used for storing the glue solution 4, the depth of the cavity 31 is smaller than the overall height of the mold, when the glue solution 4 is placed in the cavity 31, the liquid plane of the glue solution 4 is lower than the opening plane of the cavity 31, the problem that when the LED module 2 which is subjected to one-time glue filling is immersed into the cavity 31 by the first mold 1, the glue solution 4 stored in the cavity 31 overflows to cause waste is avoided; it should be noted that the bottom of the cavity 31 is set to be a horizontal plane, and a horizontal bead is arranged on the side of the LED module 2 after being subjected to one-time glue filling, the horizontal bead is mainly used for detecting whether the LED module 2 after being subjected to one-time glue filling is in a horizontal state when being placed on the first mold 1, and if the horizontal bead is not in the horizontal state, the LED module 2 after being subjected to one-time glue filling can be adjusted through the horizontal bead, so that the LED module 2 after being subjected to one-time glue filling is parallel to the second mold.
S03, after the glue solution 4 is solidified, demolding the LED module 2 subjected to the primary glue pouring to obtain a first target LED module, wherein a second glue body 22 is adhered to the first target LED module, the second glue body 22 is provided with a second preset thickness, the glue body with the second preset thickness is higher than the glue body with the first preset thickness, the glue body with the second preset thickness covers the LED lamp on the LED module 2 subjected to the primary glue pouring, and the glue body with the second preset thickness is higher than the LED lamp by a preset height, so that after the glue body with the second preset thickness is solidified, the second glue body 22 is higher than the LED lamp or is equal in height;
in the embodiment of the present application, the demolding treatment refers to taking out the LED module 2 subjected to one-time glue filling from the cavity 31 of the second mold, the second glue 22 is adhered to the LED module after the LED module is taken out, it should be noted that the second glue 22 is a glue additionally adhered to the first glue 21, after the obtained glue is cooled and solidified, a second preset thickness is provided on the second glue 22, the thickness of the second glue 22 is greater than that of the first glue 21, and the second glue 22 covers the LED lamp on the LED module, because the inner surface of the second mold is smooth, the surface formed by the first target LED module is also smooth and non-concave, and by performing the glue filling treatment on the LED module subjected to the one-time glue filling again, the problem that the existing LED lamp of the LED module is protruded after the one-time glue filling can be solved well, and the phenomenon that the surface of the LED module is uneven can be effectively avoided, so that the surface of the LED module is smooth and has no unevenness.
S04, polishing the colloid with the second preset thickness on the surface of the first target LED module by a polishing device to form a preset surface;
s05, obtaining a second target LED module after the first target LED module is polished by the polishing device, wherein a third colloid is adhered to the second target LED module and is provided with a third preset thickness, the third preset thickness of the colloid is lower than that of the second preset thickness and higher than that of the first preset thickness, and the third colloid is higher than the LED lamp or is equal in height;
and S06, pasting the functional film 78 on the preset surface of the second target LED module by a film pasting device.
In the above embodiment, the polishing device first polishes the surface of the first target LED module, and mainly polishes the surface of the first target LED module smoothly, so that the surface of the first target LED module is in a relatively flat and smooth state, the LED module obtained after polishing is referred to as a second target LED module, and a third colloid adhered to the second target LED module, it should be noted that the third colloid is obtained after polishing the second colloid 22, and when the polishing device polishes, the thickness of the second colloid 22 is reduced, so that the thickness of the obtained third colloid is lower than the thickness of the second colloid 22 and is higher than the thickness of the first colloid 21, but the third colloid covers the preset height of the LED lamp, in this application, the preset height of the LED lamp is not limited, and the thickness of the colloid is not specifically limited, the LED lamp on the LED module can be covered by the thickness of the colloid; finally, carry out the pad pasting with second target LED module and handle, the pad pasting device mainly carries out the pad pasting to the predetermined surface on the second target LED module, in this application, functional film 78 mainly indicates the Pcb pad pasting, optical film or prevent blue ray membrane etc. it needs to explain, the pad pasting device is when carrying out the pad pasting, need guarantee to carry out the pad pasting under vacuum environment and handle, carry out the bubble that the pad pasting can effectual reduction pad pasting under vacuum environment and produce behind the pad pasting, make the laminating that functional film 78 can be better on the surface of LED module, the wearability and the life of improvement LED module.
The following description is made of a polishing apparatus:
optionally, the grinding device includes a first clamping plate 61, a second clamping plate 62, a bottom plate 6, a first motor 64, a grinding plate 63, and a conveyor belt; the conveyer belt sets up bottom plate 6 below, the conveyer belt with bottom plate 6 is placed for the contact, first grip block 61 and second grip block 62 are installed respectively the 6 left and right sides of bottom plate, wherein, first grip block 61 second grip block 62 and bottom plate 6 forms the inner chamber, the inner chamber is used for placing LED module 2 through once encapsulating, just first grip block 61 with second grip block 62 height-alike, grind the board 63 and install on the first motor 64, it sets up to grind the board 63 first grip block 61 with second grip block 62 top, first motor 64 cooperation grind the board 63 be used for right the upper surface of first target LED module polishes.
In the embodiment of the present application, the bottom plate 6, the first clamping plate 61 and the second clamping plate 62 form a clamping structure, which mainly clamps the first target LED module, in the process of installing and placing the bottom plate 6, the bottom plate 6 needs to be installed in a balanced manner, the distance from the bottom plate 6 to the first clamping plate 61 and the distance from the bottom plate 62 to the second clamping plate 62 are the same, the installation smoothness of the first target LED module is ensured, the conveyor belt drives the bottom plate 6 to move, the first motor 64 is matched, the first motor 64 is fixedly placed, the grinding plate 63 is installed on the first motor 64, the grinding plate 63 is arranged at the equal height of the first clamping plate 61 and the second clamping plate 62, when the first target LED module is placed in the holding structure, if the height of the second glue body 22 adhered to the first target LED template is higher than the height from the bottom plate 6 to the first holding plate 61 and the second holding plate 62, the first motor 64 drives the grinding plate 63 to rotate to remove the raised portion of the colloid.
The film sticking device is described as follows:
optionally, the film sticking device comprises a clamping frame 71, a second motor 73, a first rotating wheel 72, a second rotating wheel 75, a pressing component and a film storage strip 77; first runner 72 is installed on the second motor 73, first runner 72 with second runner 75 parallel placement, first runner 72 and second runner 75 are installed centre gripping frame 71 top, centre gripping frame 71 is used for the centre gripping second target LED module, storage membrane strip 77 is connected first runner 72 with between the second runner 75, functional pad pasting is placed on storage membrane strip 77, the subassembly that sticiss is install storage membrane strip 77 top, the subassembly that sticiss is used for with functional pad pasting compresses tightly the laminating in the upper surface of second target LED module.
In the embodiment of the present application, the second target LED module is placed in the holding frame 71, and the holding frame 71 can ensure that the second target LED module is in a horizontal position, wherein when the holding frame 71 holds the second target LED module, a part of the glue portion on the second target LED module extends outward, and when the second target LED module is attached, the extended part of the glue surface is mainly attached with a film, it should be noted that the horizontal position mainly means that the second target LED module is parallel to the plane of the holding frame 71, after the second target LED module is installed, the second motor 73 drives the first rotating wheel 72 to rotate, so that the film storage strip 77 rotates on the first rotating wheel 72 and the second rotating wheel 75, and when the functional film 78 on the film storage strip 77 rotates to above the holding frame 71, the pressing component presses downward, so that the functional film 78 is attached on the surface of the second target LED module, in practical application, the spacing distance between the first rotating wheel 72 and the second rotating wheel 75 is large, and the film storage strip 77 has relaxation performance, so that when the pressing component presses downwards, the rotation of the first rotating wheel 72 and the second rotating wheel 75 cannot be caused, the distance between the film storage strip 77 and the clamping frame 71 is small, and the pressing component can quickly paste the functional film on the surface of the second target LED module.
Optionally, the soft sponge is installed to the inner chamber both sides, the soft sponge is used for protecting LED module 2 through once encapsulating, bottom plate 6 with first grip block 61 with the distance of second grip block 62 is for predetermineeing the distance, works as first target LED module is placed during the inner chamber, the distance of first target LED module bottom to top is actual distance, works as actual distance surpasses when predetermineeing the distance, the motor cooperation grind the board 63 be used for will surpassing predetermine the colloid of distance and polish the processing.
In the embodiment of the present application, soft sponges are installed on two sides of an inner cavity formed by the first clamping plate 61, the second clamping plate 62 and the bottom plate 6 in the polishing device, it should be noted that the installed soft sponges are installed in an adhesion manner, the thickness and height of the soft sponges installed on the two sides of the inner cavity are the same, and the soft sponges cover the two sides of the inner cavity, when the first target LED module is placed in the inner cavity, the soft sponges face a part of the inner groove, so that the first target LED module is directly contacted with the soft sponges instead of directly contacting with the first clamping plate 61 and the second clamping plate 62, thereby effectively avoiding damage to the first target LED module caused by the first clamping plate 61 and the second clamping plate 62, the first target LED module is protected by the existence of the soft sponges, it should be noted that the soft sponges face inwards concave when the pressing is performed, but when no article is pressed, the soft sponge will automatically recover.
Optionally, the pressing assembly comprises an electric lifting rod 74, a pressing plate 76 and a protective film, the pressing plate 76 is mounted at the lower end of the electric lifting rod 74, the protective film is arranged at the lower end of the pressing plate 76, the cross-sectional area of the pressing plate 76 is the same as that of the clamping frame 71, and the protective film is used for protecting the upper surface of the film storage strip 77.
Optionally, store up the membrane strip 77 lower surface and be provided with the viscose, the viscose with the one side adhesion of no viscose on the functional film 78, it is used for the adhesion fixed to store up the membrane strip 77 lower surface to be provided with the viscose the functional film 78.
In the embodiment of the present application, a less adhesive glue is disposed on the lower surface of the film storage strip 77, such as: the double-sided adhesive tape with low viscosity is adhered to the lower surface of the touch film strip, and the other surface of the double-sided adhesive tape is adhered to the non-adhesive surface of the functional film 78.
Optionally, a first clamp 11 and a second clamp 312 are installed at the bottom of the first mold 1, the first clamp 11 is installed on one side of the first mold 1, the second clamp 312 is installed on the other side of the second mold, and the first clamp 11 and the second clamp 312 are used for clamping and fixing the once-glue-poured LED module 2.
A barrier film layer 5 covers the cavity 31, the barrier film layer 5 is in close contact with the inner wall of the cavity 31, and the barrier film layer 5 is used for separating the glue solution 4 from the cavity 31; the barrier film layer 5 is any one of a stripping film layer, an isolation film layer, a separation film layer, a silicon oil film layer and an anti-sticking film layer.
Optionally, after the once-glue-filled LED module is immersed in the glue solution 4, the glue solution is subjected to vacuum defoaming treatment.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a read-only memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and the like.
Claims (10)
1. A surface glue pouring and film pasting method of an LED module is characterized by comprising the following steps:
providing a glue solution, a glue filling mold, a functional film, a film sticking device, a polishing device and an LED module subjected to one-time glue filling; the LED module subjected to primary glue filling is adhered with a first glue body, the first glue body is provided with a first preset thickness, the glue filling mold comprises a first mold part and a second mold part which are arranged up and down, the top end of the second mold part is provided with a cavity, the bottom surface of the cavity is a horizontal plane, the side surface of the LED module subjected to primary glue filling is provided with a horizontal bead, and the LED module subjected to primary glue filling is detected to be in a horizontal state through the horizontal bead;
fixing the LED module subjected to primary glue pouring on the first mould part, pouring the glue solution into the cavity, and vertically attaching the first mould and the second mould so that the LED module subjected to primary glue pouring moves downwards and is immersed in the glue solution;
after the glue solution is solidified, demolding the LED module subjected to the primary glue filling to obtain a first target LED module, wherein a second colloid is adhered to the first target LED module and is provided with a second preset thickness, the colloid with the second preset thickness is higher than the colloid with the first preset thickness, the colloid with the second preset thickness covers the LED lamp on the LED module subjected to the primary glue filling, and the colloid with the second preset thickness is higher than the preset height of the LED lamp, so that after the colloid with the second preset thickness is solidified, the second colloid is higher than the LED lamp or is equal in height;
the polishing device polishes the colloid with the second preset thickness on the surface of the first target LED module to form a preset surface;
after the first target LED module is polished by the polishing device, a second target LED module is obtained, a third colloid is adhered to the second target LED module, the third colloid is provided with a third preset thickness, the third preset thickness of the colloid is lower than that of the second preset thickness and higher than that of the first preset thickness, and the third colloid is higher than the LED lamp or is equal in height;
and the film pasting device is used for pasting the functional film on the preset surface of the second target LED module.
2. The method for surface-pouring adhesive film pasting of the LED module as claimed in claim 1, wherein the polishing device comprises a first clamping plate, a second clamping plate, a bottom plate, a first motor, a polishing plate and a transmission belt; the conveyor belt is arranged below the bottom plate, and the conveyor belt and the bottom plate are placed in contact; first grip block and second grip block are installed respectively the bottom plate left and right sides, wherein, first grip block second grip block and the bottom plate forms the inner chamber, the inner chamber is used for placing LED module through the encapsulating once, just first grip block with the second grip block height is the same, grind the board and install on the first motor, it is in to grind the board setting first grip block with second grip block top, first motor cooperation grind the board be used for right the upper surface of first target LED module is polished and is handled.
3. The method for coating the surface of the LED module by using the potting adhesive according to claim 1, wherein the coating device comprises a clamping frame, a second motor, a first rotating wheel, a second rotating wheel, a pressing assembly and a film storage strip; first runner is installed on the second motor, first runner with second runner parallel placement, first runner and the second runner is installed centre gripping frame top, the centre gripping frame is used for the centre gripping the second target LED module, it connects to store up the membrane strip first runner with between the second runner, functional pad pasting is placed store up on the membrane strip, sticiss the unit mount in store up membrane strip top, it will to sticiss the subassembly functional pad pasting compress tightly laminate in the upper surface of second target LED module.
4. The method for sticking the film on the surface of the LED module according to claim 2, wherein soft sponges are mounted on two sides of the inner cavity and used for protecting the LED module subjected to the one-time glue pouring, the distance between the bottom plate and the first clamping plate and the distance between the bottom plate and the second clamping plate are preset distances, when the first target LED module is placed in the inner cavity, the distance from the bottom to the top of the first target LED module is an actual distance, and when the actual distance exceeds the preset distance, the motor is matched with the grinding plate and used for grinding the glue exceeding the preset distance.
5. The method for sticking the film on the surface of the LED module according to claim 3, wherein the pressing assembly comprises an electric lifting rod, a pressing plate and a protective film, the pressing plate is mounted at the lower end of the electric lifting rod, the protective film is arranged at the lower end of the pressing plate, the cross section area of the pressing plate is the same as that of the clamping frame, and the protective film is used for protecting the upper surface of the film storage strip.
6. The method as claimed in claim 5, wherein an adhesive is disposed on a lower surface of the film storage strip, the adhesive is adhered to a surface of the functional film without adhesive, and the adhesive disposed on the lower surface of the film storage strip is used for adhering and fixing the functional film.
7. The method for surface-pouring adhesive film pasting of the LED module set according to claim 1, wherein a first clamp and a second clamp are installed at the bottom of the first mold, the first clamp is installed at one side of the first mold, the second clamp is installed at the other side of the second mold, and the first clamp and the second clamp are used for clamping and fixing the LED module set subjected to the one-time pouring adhesive.
8. The method for sticking the film on the surface of the LED module according to claim 1, wherein a barrier film layer is covered inside the cavity and is in close contact with the inner wall of the cavity, and the barrier film layer is used for separating the glue solution from the cavity.
9. The method for laminating the surface glue of the LED module according to claim 8, wherein the barrier film layer is any one of a peeling film layer, a separation film layer, a silicon oil film layer and an anti-sticking film layer.
10. The method for sticking the film on the surface of the LED module according to claim 1, wherein the LED module subjected to the primary glue pouring is immersed in the glue solution and then subjected to vacuum defoaming treatment.
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| CN202110063876.0A CN112936689A (en) | 2021-01-18 | 2021-01-18 | Surface glue pouring and film pasting method for LED module |
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| CN202110063876.0A CN112936689A (en) | 2021-01-18 | 2021-01-18 | Surface glue pouring and film pasting method for LED module |
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| CN110814936A (en) * | 2019-11-11 | 2020-02-21 | 温州大学瓯江学院 | High-efficient grinding device of machine part processing usefulness |
| CN111477121A (en) * | 2020-05-26 | 2020-07-31 | 深圳市洲明科技股份有限公司 | Manufacturing method of L ED display screen |
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| US20120319159A1 (en) * | 2010-03-01 | 2012-12-20 | Seiichi Nakatani | Substrate for light-emitting element, method for manufacturing the same and light-emitting device |
| CN107335581A (en) * | 2017-06-29 | 2017-11-10 | 深圳市艾森视讯科技有限公司 | Led module and its surface glue-pouring method |
| CN110021698A (en) * | 2019-04-25 | 2019-07-16 | 吴宇嘉 | The packaging technology of the LED display of the double-deck glue sealing structure |
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Application publication date: 20210611 |