CN107335581A - Led module and its surface glue-pouring method - Google Patents
Led module and its surface glue-pouring method Download PDFInfo
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- CN107335581A CN107335581A CN201710514005.XA CN201710514005A CN107335581A CN 107335581 A CN107335581 A CN 107335581A CN 201710514005 A CN201710514005 A CN 201710514005A CN 107335581 A CN107335581 A CN 107335581A
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- Prior art keywords
- led module
- glue
- mold component
- pouring method
- encapsulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/11—Vats or other containers for liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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Abstract
The invention belongs to encapsulating technical field, and in particular to a kind of LED module and its surface glue-pouring method.This method includes：LED module, glue and encapsulating die are provided；Encapsulating die includes the first mold component and the second mold component arranged up and down, is provided with cavity at the top of the second mold component, and the bottom surface of cavity is horizontal plane；The LED module is fixed on first mold component, and the light emitting diode on the LED module surface is oppositely arranged with second mold component, the glue is poured into the cavity；First mold component and second mold component are coincide each other up and down makes the light emitting diode on the LED module surface be immersed in down in the glue；After glue solidification, demoulding processing is carried out to the LED module.The present invention makes the encapsulating layer surface after LED module encapsulating smooth, more preferable protective effect is played to light emitting diode, and need not be polished after encapsulating.
Description
Technical field
The invention belongs to encapsulating technical field, and in particular to a kind of LED module and its surface glue-pouring method.
Background technology
LED module be light emitting diode (Light Emitting Diode, LED) by it is certain it is regularly arranged together again
It is encapsulated, the product formed plus some water-proof treatment technologies.LED module is that wider product is applied in LED product,
There is also very big difference in terms of configuration aspects and electronics, it is simple be exactly with a wiring board that LED is housed and shell just
Into a LED module, the complicated heat dissipation processing device for just also having some controllers, constant-current source and correlation, so make the LED longevity
Life and luminous intensity are more preferable.
Because the light emitting diode in existing LED module is more fragile, the LED module for having correlation on the market is needed to thereon
Light emitting diode carry out encapsulating protection.In general process for filling colloid is all to LED module surface encapsulating from top to bottom, due to liquid
The tension force on surface, a horizontal plane is not likely to form above LED module, and the thickness of glue-line can not be controlled disposably
The thickness needed；Therefore, after encapsulating terminates, it is also necessary to glue-line is polished, horizontal glue-line is worn into and further controlled
The thickness of glue-line.This manual polishing method, can not accomplish substantially flat, and technique is cumbersome, cost is high.
The content of the invention
It is an object of the invention to overcome the above-mentioned deficiency of prior art, there is provided a kind of LED module and its surface encapsulating side
Method, it is intended to which it is undesirable to solve the process for filling colloid effect of existing LED module, and the technical problem that technique is cumbersome, cost is high.
For achieving the above object, the technical solution adopted by the present invention is as follows：
One aspect of the present invention provides a kind of LED module surface glue-pouring method, comprises the following steps：
LED module, glue and encapsulating die are provided；Wherein, the encapsulating die includes the first mold arranged up and down
Part and the second mold component, cavity is provided with the top of second mold component, and the bottom surface of the cavity is horizontal plane；
The LED module is fixed on first mold component, and causes the light-emitting diodes on the LED module surface
Pipe is oppositely arranged with second mold component, and the glue is poured into the cavity；
First mold component and second mold component are coincide each other up and down makes the hair on the LED module surface
Optical diode is immersed in the glue down；
After glue solidification, to carrying out demoulding processing to the LED module after encapsulating.
LED module surface provided by the invention glue-pouring method, encapsulating is carried out in the light emitting diode to LED module surface
When, LED module surface is fixed on the first mold component down, such first mold component and the second mold component are kissed up and down
During conjunction, the light emitting diode on LED module surface can be immersed in the glue of cavity splendid attire of the second mold component, treat that glue solidifies
When can be stripped so that on the light emitting diode on LED module surface formed one layer of encapsulating layer to shield；Because of cavity
Bottom surface is horizontal plane, therefore the beneficial effects of the present invention are：The LED module surface glue-pouring method of the present invention fills LED module
Encapsulating layer surface after glue is smooth, more preferable protective effect is played to light emitting diode, and need not be beaten after encapsulating
Mill, this method is simple and easy, and cost is low, and its significant effect is better than prior art.
Another aspect of the present invention provides a kind of LED module, and the preparation technology of the LED module includes above-mentioned LED module table
Face glue-pouring method.
LED module provided by the invention, because its preparation technology includes distinctive LED module surface of the invention glue-pouring method,
Therefore one layer of smooth encapsulating layer is contained on the LED module surface of the present invention, and more preferable protection can be played to light emitting diode
Effect, and the encapsulating layer need not polish, and cost is low, and its significant effect is better than prior art.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
In the required accompanying drawing used be briefly described, it should be apparent that, drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Accompanying drawing obtains other accompanying drawings.
Fig. 1 is the structural representation for the encapsulating die that the embodiment of the present invention 1 provides；
Fig. 2 is the structural representation for the encapsulating die that the embodiment of the present invention 2 provides；
Fig. 3 is the LED module surface glue-pouring method schematic flow sheet that the embodiment of the present invention 3 provides；
Wherein, each reference in figure：
1：LED module；
2：First mold component；
3：Second mold component；
4：Mounting hole；
5：Magnetic areas；
6：Bolt；
7：Magnet；
8：Supporting plate；
9：Light emitting diode；
10：Film layer；
11：Side plate；
12：Shell；
13：Bottom plate；
14：First screwed hole；
15：Second screwed hole；
16：Glue；
17：Cavity.
Embodiment
In order that technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, below in conjunction with
Drawings and examples, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System, it is for only for ease of and describes the present invention and simplify description, rather than indicates or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the invention, " some " are meant that two or more,
Unless otherwise specifically defined.
On the one hand, with reference to Fig. 1-3, the embodiments of the invention provide a kind of LED module surface glue-pouring method, the glue-pouring method
Flow as shown in figure 3, the encapsulating die structure being directed to as shown in Figures 2 and 3, the glue-pouring method comprises the following steps：
S01：LED module 1, glue 16 and encapsulating die are provided；Wherein, the encapsulating die includes the first mould arranged up and down
Has the mold component 3 of part 2 and second, the top of the second mold component 3 is provided with cavity 17, and the bottom surface of the cavity 17 is level
Face；
S02：LED module 1 is fixed on the first mold component 2, and cause the surface of LED module 1 light emitting diode 9 with
Second mold component 3 is oppositely arranged, and glue 16 is poured into cavity 17；
S03：First mold component 2 and the second mold component are coincide each other about 3 makes luminous the two of the surface of LED module 1
Pole pipe 9 is immersed in glue 16 down；
S04：After the solidification of glue 16, demoulding processing is carried out to the LED module 1 after encapsulating.
LED module surface provided by the invention glue-pouring method, encapsulating is carried out in the light emitting diode 9 to the surface of LED module 1
When, the surface of LED module 1 is fixed on the first mold component 2 down, on such mold component 3 of first mold component 2 and second
When coincideing down, the light emitting diode 9 on the surface of LED module 1 can be immersed in the glue 16 of the second mold component splendid attire, treat glue 16
It can be stripped during solidification, so that forming one layer of encapsulating layer to shield on the light emitting diode 9 on the surface of LED module 1；Cause
The bottom surface of cavity 17 is horizontal plane, therefore compared with prior art, LED module surface glue-pouring method of the invention makes LED module 1
Encapsulating layer surface after encapsulating is smooth, plays more preferable protective effect to light emitting diode 9, can not only reach resistance to impact
Effect, and being capable of waterproof；And need not be polished after encapsulating, this method is simple and easy, and cost is low, and its significant effect is better than
Prior art.
Further, in above-mentioned steps S01, the side of the first mold component 2 of the encapsulating die is provided with for controlling
Make some supporting plates 8 of the distance between the first mold component 2 and the second mold component 3.The LED module 1 of different model, due to
The thickness of its encapsulating layer is different, and the installation site of supporting plate 8 is also what is differed.
In an of the invention preferred scheme, one (i.e. totally two) and the are respectively devised in the left and right side of the first mold component 2
The supporting plate 8 that the top surface of two molds part 3 is engaged, distance is moved down control the first mold component 2 by supporting plate 8.When to
When pouring into glue in the cavity 17 of the second mold component 3, glue amount here is according to the peace of the supporting plate 8 on the second mold component 3
The thickness that holding position height, encapsulating layer need, is accurately controlled.When the glue amount in the second mold component 3 is according to the knot of calculating
After fruit determines, the glue amount of the glue 16 is poured into, then controls the first mold component 2 to decline, when the first mold component 2 drops to one
Positioning postpones, and the supporting plate 8 on the first mold component 2 is in contact with the top surface of the second mold component 3, now, the first mold
Part 2 stops moving down, and according to previous exact computation results, now 3 endoceliac glue 16 of the second mold component is just by LED
Light emitting diode 9 on module 1 wraps up, and after the solidification of its glue 16, cuts off the excess waste on the periphery of LED module 1, that is, completes
Whole encapsulating process.Because the bottom surface of the second mold component 3 is smooth, so after the completion of encapsulating, the encapsulating on the surface of LED module 1
Layer is smooth, and without being polished again, it is by the glue amount and supporting plate 8 in the second mold component 3 that it, which fills bondline thickness,
Design height together decide on.
Further, in above-mentioned steps S01, the side of the LED module 1 is provided with for whether detecting the LED module 1
Horizontal bead in horizontality (figure does not mark).After LED module 1 fixes completion, it can be carried out by horizontal bead
Adjustment, makes LED module 1 be in horizontality, adjusts, horizontal bead is arranged on the side of LED module 1 for convenience directly.Water
Flat pearl could be aware that whether LED module 1 is horizontally mounted.
Further, in above-mentioned steps S01, some first screwed holes 14, the first mold are provided with LED module 1
Some mounting holes 4 corresponding with each position of first screwed hole 14 are provided with part 2；And LED module 1 passes through peace by bolt 6
The dress screwed hole 14 of hole 4 and first coordinates to be fastenedly connected the first mold component 2.Logical bolt connection can preferably make LED module 1
Surface is fixed on the first mold component 2 down.Preferably, a screwed hole 14 and mounting hole 4 are four, four the first screw threads
Hole 14 is respectively distributed on four corners of LED module 1, and four mounting holes 4 are respectively distributed to four angles of the first mold component 2
In portion.In this way, it can realize that the first mold component 2 more firmly connects LED module 1 by four bolts 6.
Further, in above-mentioned steps S01, some second screwed holes 15, each second screw thread are provided with LED module 1
Magnet 7 is threaded with hole 15, some magnetic portions corresponding with each position of magnet 7 are provided with the first mold component 2
Position 5；Magnetic areas 5 is adsorbed with magnet 7 and connected to cause the first mold component 2 to be fixedly connected with LED module 1.The 7 preferred magnetic of magnet
Iron, magnetic absorption can also preferably be such that the surface of LED module 1 is fixed on down on the first mold component 2.Preferably, the second spiral shell
Pit 15 and magnetic areas 5 are four, and four the second screwed holes 15 are respectively distributed to four side centre positions of LED module 1, and four
Individual magnetic areas 5 is respectively distributed to four side centre positions of the first mold component 2.In this way, first can be realized by four magnets 7
Mold component 2 more firmly connects LED module 1.
Further, in above-mentioned encapsulating die, the inwall of cavity 17 is provided with to make the film that light emitting diode 9 is stripped
Layer 10.Because of the presence of film layer 10, the demoulding processing being more beneficial in step S04.Further, above-mentioned film layer 10 is stripping
Any one in film, barrier film, seperation film, adhesive block film, fractal film, plastic sheeting, masking hole film, antiadhesion barrier etc., when second
After the inwall of cavity 17 of mold component 3 sticks film layer 10, then to the cavity 17 of the second mold component 3 glue 16 is poured into, therefore,
Glue 16 does not contact with the second mold component 3, after glue 16 is formed by curing encapsulating layer, directly by the mold of film layer 10 and second
Part 3 is separated, and then film layer 10 is torn off from the glue surface of encapsulating layer, is easy to be stripped.Can be by selecting different film layers 10, to determine
The encapsulating layer surface for determining LED module 1 is minute surface or cloudy surface, when selection be the film layer 10 of smoother when, LED module 1
Encapsulating layer surface is minute surface, when the more coarse film layer 10 of selection, then the encapsulating layer surface of LED module 1 is cloudy surface, root
According to being actually needed for different product, the effect that different types of film layer 10 reaches needs can be arbitrarily changed.
And in the LED module surface glue-pouring method of the present invention, glue 16 can be epoxy resin liquid, thermosetting glue and ultraviolet solid
Change any one in glue, these glues 16 have the small function of pyrocondensation.When using condensation glue, vacuum is completed
After defoaming, its natural coagulation is allowed.When using thermosetting glue, after vacuum defoaming is completed, to its heating, drying, make
It solidifies.When using ultra-violet curing glue, after vacuum defoaming is completed, directly shone upwards by the second mold component 3
Ultraviolet is penetrated, makes adhesive curing.
Further, in above-mentioned steps S03, after light emitting diode 9 is immersed in glue 16 down, in addition to glue
16 carry out vacuum defoaming treatment.When the first mold component 2 and the second mold component coincide about 3, due to the tension force of glue 16
It is larger, a little bubble occurs in filler liquid 16 between the light emitting diode 9 in LED module 1, if acted on without external force,
These bubbles will be stayed in LED module 1, as glue solidification will be quite ugly.In order to eliminate bubble, in light emitting diode
After 9 are immersed in glue 16 down, before glue 16 solidifies, vacuum defoaming is carried out to it, when vacuum defoams, due to glue 16
Outer air pressure is negative pressure, and now, the air pressure of bubble is more than the air pressure outside glue in glue 16, and bubble is in the presence of pressure differential, slowly
It is discharged outside glue, realizes the purpose of defoaming.
Further, the bottom of the second mold component 3 of above-mentioned encapsulating die is made of transparent material.Preferably,
Two molds part 3 includes dianegative 13, shell 12 and side plate 11, and shell 12 is fixedly connected with the surrounding of dianegative 13, side
Plate 11 is connected to the top of dianegative 13 and encloses to set with dianegative 13 to form cavity 17 or side plate 11 is connected to shell 12
Top and enclose to set to form cavity 17 with dianegative 13.It is highly preferred that both shell 12 and dianegative 13 are consolidated by screw
Fixed connection, meanwhile, side plate 11 can be installed to by screw on dianegative 13 or on shell 12.Dianegative 13 can be realized
The glue 10 of LED module 1 is checked with the presence or absence of bubble, now also in the bottom of dianegative 13 bubble can be set to examine
Device is surveyed, more effectively detects whether bubble be present.
Further, in above-mentioned steps S03, when the first mold component 2 and the second mold component coincide each other about 3, hair
The distance on the surface of optical diode 9 and the bottom surface of cavity 17 is 0.2-1.6mm；In this way, after the solidification of glue 16, in light emitting diode 9
0.2-1.6mm encapsulating layer can be formed on surface.When encapsulating layer is more than 1.6mm, the illumination effect of light emitting diode 9 is paid no attention to
Think, and when encapsulating layer is less than 0.2mm, the protecting effect of light emitting diode 9 is undesirable；Therefore, thickness is 0.2-1.6mm filling
The best results of glue-line.
On the other hand, the embodiment of the present invention additionally provides a kind of LED module, and the preparation technology of the LED module is including above-mentioned
LED module surface glue-pouring method.Because the preparation technology of LED module provided in an embodiment of the present invention is peculiar comprising the embodiment of the present invention
LED module surface glue-pouring method, therefore one layer of smooth encapsulating layer is contained on the LED module surface, can be to light-emitting diodes
Pipe 9 plays more preferable protective effect, and the encapsulating layer need not polish, and cost is low, and its significant effect is better than prior art.
It is of the invention successively to carry out test of many times, it is further detailed as reference pair invention progress now to lift A partial experiment result
Thin description, is described in detail with reference to specific embodiment.
Embodiment 1
A kind of encapsulating die, for carrying out encapsulating to the light emitting diode 9 on the surface of LED module 1, the encapsulating die structure is such as
Shown in Fig. 1, including the first mold component 2 and the second mold component 3, LED module 1 arranged up and down are fixed on the first mold component
2 bottom, the top of the second mold component 3 are provided with the cavity 17 for containing glue 16, and the bottom surface of cavity 17 is horizontal plane；
The left and right side of first mold component 2 respectively sets a supporting plate 8, and the side of LED module 1 is provided with horizontal bead and (schemes not mark
Note).Four dry first screwed holes 14 are provided with four corners of LED module 1, are set on four corners of the first mold component 2
There are four mounting holes 4 corresponding with each position of first screwed hole 14；And LED module 1 passes through mounting hole 4 by four bolts 6
Coordinate with the first screwed hole 14 to be fastenedly connected the first mold component 2.
Embodiment 2
A kind of encapsulating die, for carrying out encapsulating to the light emitting diode 9 on the surface of LED module 1, the encapsulating die structure is such as
Shown in Fig. 2, including the first mold component 2 and the second mold component 3, LED module 1 arranged up and down are fixed on the first mold component
2 bottom, the top of the second mold component 3 are provided with the cavity 17 for containing glue 16, and the bottom surface of cavity 17 is horizontal plane；
The left and right side of first mold component 2 respectively sets a supporting plate 8, and the side of LED module 1 is provided with horizontal bead and (schemes not mark
Note).Four side centre positions of LED module 1 are provided with four the second screwed holes 15, are threaded with each second screwed hole 15
Magnet 7, four side centre positions of the first mold component 2 are provided with four magnetic areas 5 corresponding with each position of magnet 7；Four
Individual magnetic areas 5 is connected to cause the first mold component 2 to be fixedly connected with LED module 1 with four absorption of magnet 7.
Embodiment 3
A kind of LED module surface glue-pouring method, comprises the following steps：
S31：Encapsulating die in LED module 1, glue 16 and the embodiment 2 of embodiment 1/ is provided.
S32：LED module 1 is fixed on the first mold component 2, and cause the surface of LED module 1 light emitting diode 9 with
Second mold component 3 is oppositely arranged, and glue 16 is poured into cavity 17.
S33：First mold component 2 and the second mold component are coincide each other about 3 makes luminous the two of the surface of LED module 1
Pole pipe 9 is immersed in glue 16 down, then carries out vacuum defoaming treatment.
S34：After the solidification of glue 16, demoulding processing is carried out to the LED module 1 after encapsulating.
Embodiment 4
A kind of LED module, the preparation technology of the LED module include LED module surface glue-pouring method in above-described embodiment 3.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of LED module surface glue-pouring method, it is characterised in that comprise the following steps：
LED module, glue and encapsulating die are provided；Wherein, the encapsulating die include the first mold component for arranging up and down and
Second mold component, cavity is provided with the top of second mold component, and the bottom surface of the cavity is horizontal plane；
The LED module is fixed on first mold component, and cause the LED module surface light emitting diode with
Second mold component is oppositely arranged, and the glue is poured into the cavity；
First mold component and second mold component are coincide each other up and down makes luminous the two of the LED module surface
Pole pipe is immersed in the glue down；
After glue solidification, demoulding processing is carried out to the LED module after encapsulating.
2. LED module surface as claimed in claim 1 glue-pouring method, it is characterised in that the side of first mold component
It is provided with some supporting plates for controlling the distance between first mold component and second mold component.
3. LED module surface as claimed in claim 1 glue-pouring method, it is characterised in that the side of the LED module is provided with
The horizontal bead of horizontality whether is in for detecting the LED module.
4. LED module surface as claimed in claim 1 glue-pouring method, it is characterised in that characterized in that, the LED module
On be provided with some first screwed holes, be provided with first mold component corresponding with each first screw thread hole site
Some mounting holes, the LED module are coordinated to be fastenedly connected by bolt through the mounting hole and first screwed hole
State the first mold component；And/or
Some second screwed holes are provided with the LED module, magnet is threaded with each second screwed hole, it is described
Some magnetic areas corresponding with each magnet positions, the magnetic areas and the magnetic are provided with first mold component
Body absorption is connected to cause first mold component to be fixedly connected with the LED module.
5. the LED module surface glue-pouring method as described in claim any one of 1-4, it is characterised in that second mold
The cavity inner wall of part is provided with to make the film layer of the light emitting diode demoulding.
6. LED module surface as claimed in claim 5 glue-pouring method, it is characterised in that the film layer is stripping film, isolation
Any one in film, seperation film, adhesive block film, fractal film, plastic sheeting, masking hole film, silicon oil membrane, antiadhesion barrier；And/or
The glue is any one in condensation glue, thermosetting glue and ultra-violet curing glue.
7. the LED module surface glue-pouring method as described in claim any one of 1-4, it is characterised in that the light emitting diode
After being immersed in down in the glue, in addition to vacuum defoaming treatment is carried out to the glue.
8. the LED module surface glue-pouring method as described in claim any one of 1-4, it is characterised in that second mold
The bottom of part is made of transparent material.
9. the LED module surface glue-pouring method as described in claim any one of 1-4, it is characterised in that first mold
When part coincide each other up and down with second mold component, the LED surface and the distance of the cavity bottom surface are
0.2-1.6mm。
10. a kind of LED module, it is characterised in that the preparation technology of the LED module is included described in claim any one of 1-9
LED module surface glue-pouring method.
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| CN201710514005.XA CN107335581B (en) | 2017-06-29 | 2017-06-29 | LED module and surface glue pouring method thereof |
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|---|---|---|---|
| CN201710514005.XA CN107335581B (en) | 2017-06-29 | 2017-06-29 | LED module and surface glue pouring method thereof |
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| CN108597388A (en) * | 2018-04-08 | 2018-09-28 | 周卫江 | LED display module packaging technologies |
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| CN109177008A (en) * | 2018-09-30 | 2019-01-11 | 深圳市华夏光彩股份有限公司 | A kind of encapsulating die and its glue-pouring method for LED module |
| CN109499817A (en) * | 2018-11-23 | 2019-03-22 | 利亚德光电股份有限公司 | LED display casting glue jig and LED display encapsulating method |
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| CN112936689A (en) * | 2021-01-18 | 2021-06-11 | 深圳市艾森视讯科技有限公司 | Surface glue pouring and film pasting method for LED module |
| CN113393777A (en) * | 2021-05-07 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Display screen module and glue filling process thereof |
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| CN113393777A (en) * | 2021-05-07 | 2021-09-14 | 深圳市洲明科技股份有限公司 | Display screen module and glue filling process thereof |
| CN113393777B (en) * | 2021-05-07 | 2023-03-21 | 深圳市洲明科技股份有限公司 | Display screen module and glue filling process thereof |
| CN113927804A (en) * | 2021-09-18 | 2022-01-14 | 东莞阿尔泰显示技术有限公司 | Glue filling mold of LED display module |
| CN113927804B (en) * | 2021-09-18 | 2023-11-07 | 东莞阿尔泰显示技术有限公司 | Glue filling die of LED display module |
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