CN103872220A - LED packaging method - Google Patents
LED packaging method Download PDFInfo
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- CN103872220A CN103872220A CN201410131483.9A CN201410131483A CN103872220A CN 103872220 A CN103872220 A CN 103872220A CN 201410131483 A CN201410131483 A CN 201410131483A CN 103872220 A CN103872220 A CN 103872220A
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000003292 glue Substances 0.000 claims description 101
- 229920003023 plastic Polymers 0.000 claims description 31
- 238000012856 packing Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 abstract 6
- 238000005538 encapsulation Methods 0.000 description 15
- 238000000605 extraction Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention belongs to the technical field of LED packaging, and discloses an LED packaging method used for packaging an LED component. The LED component comprises a substrate, an LED chip installed on the substrate and a lens wrapping the LED chip. The method includes the following steps that fluid dispensing is carried out on the upper portion of the LED chip for the first time, after being cooled to be at a room temperature, fluids are solidified to form a foundation layer, and the fluids of fluid dispensing carried out for the first time at least wrap the LED chip but do not overflow the edge of the substrate; the following sub-steps are carried out repeatedly to form a stacking layer on the foundation layer, so that the stacking layer and the foundation layer form the lens together: fluid dispensing is carried out on the upper portion of a vertex of the foundation layer again, and after being cooled to be at the room temperature, the fluids are solidified. According to the method, on the condition that molds are not needed, the shape of the lens can be well controlled, and the lens with a high height-width ratio is formed.
Description
Technical field
The invention belongs to LED encapsulation technology field, be specifically related to a kind of LED method for packing.
Background technology
Due to advantages such as power saving, long-life, small sizes, LED lamp has been applied to illumination, the field such as backlight more and more, and is expected to replace as the conventional light source such as incandescent lamp, fluorescent lamp.
At present, the main obstruction of popularization LED lamp is that its cost is higher.Wafer scale LED encapsulation is the effective ways that reduce costs.Wafer stage chip encapsulation technology is that full wafer wafer is carried out cutting the technology that obtains single finished product chip after packaging and testing again, and the chip size after encapsulation is consistent with nude film.Crystal wafer chip dimension encapsulation technology changes conventional package as the pattern of ceramic leadless chip carrier, organic leadless chip carrier and digital-code camera module formula, has complied with market day by day light, thin, short, little and low priceization requirement to microelectronic product.It is highly microminiaturized that chip size after crystal wafer chip dimension encapsulation technology has reached, chip cost along with chip size reduce showing and reducing with the increase of wafer size.Crystal wafer chip dimension encapsulation technology be IC can be designed, technology that wafer manufacture, packaging and testing, basic plate manufacture integrate, be the focus of current encapsulation field and the trend of future development.
But the packaging technology of traditional LED device is device level technique, and its cost is higher, and be difficult to carry out high-density packages.And traditional lens packages mostly adopts prefabricated lens or formed in mould method one-body molded, be not suitable for wafer-level packaging.Based on this, people wish to adopt the encapsulation of without the technique of mould point glue, wafer scale LED chip being carried out lens, simple, intuitive be exactly directly on LED chip, to put glue without mould dispensing method, utilize the surface tension of plastic packaging glue to form the shape of lens.
But the shortcoming of this method is the shape of lens and depends on the surface tension of plastic packaging glue completely, thereby cannot directly control lens shape, and generally lower (being " flat " of lens) of the depth-width ratio of lens, light efficiency is lower.Therefore, urgently improve existing gluing process, to realize wafer scale LED encapsulation, and realize the effective control to lens shape.
Summary of the invention
The problem occurring in the lens of making wafer scale LED in order to solve existing prefabricated lens, mould molding or existing gluing process, the object of the invention is to provide a kind of method of the LED of being suitable for wafer-level packaging, the method also can well be controlled lens shape in the situation that not needing mould, forms compared with the lens of large ratio of height to width.
To achieve these goals, the technical solution adopted in the present invention is as follows:
A kind of LED method for packing, for encapsulating wafer scale LED device, this LED device comprises substrate, is arranged on the LED chip on described substrate and is wrapped in the lens outside described LED chip, comprises the following steps:
Above LED chip, put for the first time glue, then cool to room temperature makes it solidify to form basal layer, puts for the first time the some glue amount of glue and at least wraps up LED chip but do not overflow substrate edges;
Repeatedly repeat following sub-step and on described basal layer, form stack layer jointly to form lens with basal layer: above described basal layer or its outer summit, again put glue, then cool to room temperature solidifies it.
Further, the some glue position while putting glue for the first time above LED chip is near the geometric center of described upper surface of base plate.
Further, be provided with at described upper surface of base plate the basal layer limited impression of making the flow range of glue when basal layer for being limited in.
Further, be provided with the layer laminate limited impression of the flow range of glue when being limited in making layer lamination at described upper surface of base plate.
Further, be provided with for being limited in simultaneously and make the basal layer limited impression of the flow range of glue when basal layer and the layer laminate limited impression of the flow range of glue when being limited in making layer lamination at described upper surface of base plate.
Further, described basal layer and stack layer adopt identical or different packaging plastic.
Further, in described packaging plastic, be mixed with fluorescent material.
Further, the described some glue amount of putting for the first time glue just spreads the outward flange to described substrate.
Further, the described some glue amount of putting for the first time glue does not spread the outward flange to described substrate.
Compared with prior art, the present invention has the following advantages and beneficial effect:
(1) the present invention completes the encapsulation of whole lens by the technique of " stack " of " some glue-solidify-put again glue-curing again " repeatedly, without mould in the situation that, can realize the wafer-level packaging of LED; Not only technical operation is strong, and technique is simple, also can reduce the production cost of LED;
(2) the present invention adopts repeatedly stacking mode to carry out without mould point glue, can form the LED package lens having compared with large ratio of height to width;
(3) the present invention can further limit by make groove on substrate the shape of basal layer and stack layer, realizes LED lens shape is more specifically controlled, and can play the effect that regulates lens shape and improve light extraction efficiency;
(4) basal layer of the present invention and stack layer can be selected different plastic packaging glue, thereby reach the effect that regulates lens shape and light extraction efficiency;
(5) the present invention can be at basal layer or/and stack layer doping fluorescent powder, thereby the fluorescent material that completes white light LEDs applies.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED device made by the embodiment of the present invention 1 method;
Fig. 2 is the structural representation of the LED device made by the embodiment of the present invention 2 methods;
Fig. 3 is the structural representation of the LED device made by the embodiment of the present invention 3 methods;
Fig. 4 is the structural representation of the LED device made by the embodiment of the present invention 4 methods;
Fig. 5 is the structural representation of the LED device made by the embodiment of the present invention 5 methods.
In figure:
100, substrate 200, LED chip
301, basal layer 302, stack layer
401, basal layer limited impression 402, layer laminate limited impression
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Embodiment 1
As shown in Figure 1, the present embodiment discloses a kind of LED method for packing, be used for encapsulating wafer scale LED device, this LED device comprises substrate 100, is arranged on the LED chip 200 on described substrate and is wrapped in the lens outside described LED chip 200, lens in the present embodiment are made up of jointly basal layer 301 and stack layer 302, and the method comprises the following steps:
(1), as shown in Figure 1, first above LED chip 200, put for the first time glue, then cool to room temperature makes it solidify to form basal layer, put for the first time the some glue amount of glue and at least wrap up LED chip but do not overflow substrate edges, the some glue amount that the present embodiment is put glue for the first time just spreads the outward flange to described substrate.
This step specifically can adopt point gum machine directly above LED chip 200, to carry out a glue basis of formation layer 301, this basal layer 301 is disposable the cooling formation of glue, so it is suitable to put for the first time the amount of glue, at least to wraps up LED chip, but can not overflow substrate edges.As shown in Figure 1, the point glue amount of the present embodiment just spreads to the outward flange of described substrate 100, and do not overflow substrate, because in the time that the volume of plastic packaging glue is less than certain critical value, the mobile meeting of plastic packaging glue is lived by the boundary limitation of substrate, can not overflow, thereby form a droplet profile of heaving, the critical value that described plastic packaging colloid is long-pending and the material character of plastic packaging glue, as viscosity, surface tension, and the surface nature of substrate is as roughness, and the environmental parameter such as temperature is relevant.In the present embodiment practical operation, can first obtain by experiment this critical value, and then produce on a large scale.
Why carry out above LED chip the point glue position of this step, to protrude and substrate based on LED chip itself, higher than substrate, put above it glue and be conducive to wrap up LED chip, and be convenient to packaging plastic and spread from high to lower mobile, the final low shape of heaving in high both sides, a centre that forms, that is to say the common shape of lens.
Point glue position when this step is put glue for the first time above LED chip, the preferably geometric center of close upper surface of base plate, soly evenly spread and form convex cambered surface to surrounding after being conducive to glue and dripping, be exactly in the situation of substrate center for encapsulation and the center of only having a LED chip, can directly put the geometric center at LED chip upper surface.Described in the present embodiment near being the meaning statement that is positioned at geometric center or approaches geometric center, because the reasons such as the precision that can reach due to technique when actual production possibly cannot make its position that is in appointment, so the present embodiment has just adopted close form of presentation always.
The present embodiment is actual adds man-hour, and the impact of a glue face when avoiding dripping of can trying one's best of the position height of some glue causes that too greatly glue drop overflows, and also should too not press close to, and causes glue drop freely to sprawl.
(2), repeatedly repeat following sub-step and on described basal layer, form stack layer jointly to form lens with basal layer: above described basal layer or its outer summit, again put glue (be the second layer above basal layer summit, put glue, the 3rd layer above second layer summit, put glue, the like later layer at the vertex point glue of front one deck), then cool to room temperature solidifies it.Why this step carries out a glue above basal layer or its outer summit, is also for glue can better be extended downwards, and forms that more heap is higher, the more sharper object of heap.The number of times that this step repeats requires relevant with properties of product, such as depth-width ratio, light extraction efficiency etc., and equally can be according to product particular requirement experiment acquisition before large-scale production.This step does not have too many substantive difference with step (1), but the contact-making surface difference of packaging plastic, and the contact-making surface of basal layer is substrate surface, is more flat face.Stack layer be a glue on basal layer or other stack layers, some glue face is cambered surface, and is the glue level after solidifying, its surface characteristic and substrate surface do not have direct relation.
It should be noted that, basal layer in the present embodiment figure and stack layer look like the structure of one deck, in fact only having basal layer is the structure of one deck only, and stack layer is repeatedly to put the sandwich construction that glue forms, and the present embodiment is only used to distinguish the signal of basal layer and stack layer.
According to those skilled in the art's conventional thought, due to still relatively more flat factors such as (cause) difference in height between LED chip and substrate are smaller of the face of whole carrying packaging plastic, the impact that the moulding of final lens is subject to base plan is very large, rely on packaging plastic itself to spread the mobile lens shape with higher depth-width ratio (more " protruding ") that is difficult to form, and its shape is also difficult to control, especially the LED technical field that light extraction efficiency has higher requirements, those skilled in the art have just abandoned the method for direct some glue formation lens substantially, be difficult to keep the shape of intermediate projections because often see water droplet to spread out soon on the table in daily life.
Traditional gluing process is all directly to put glue once to form on substrate, there is no basal layer, and its glue face is more smooth, and the impact that the moulding of final lens is subject to base plan is very large, is not easy to form the lens shape with higher depth-width ratio (more " protruding ").
The present embodiment is broken through above-mentioned conventional thought just, adopts repeatedly some glue, the curing process of " stack ".On the substrate that contains LED chip, directly put glue and solidify, form the basal layer of lens.On basal layer, carry out afterwards a glue and solidify, forming stack layer.Basal layer forms whole lens together with stack layer.The lens of the present embodiment are not one-shot forming, but complete the encapsulation of whole lens by the technique of " stack " of " some glue-solidify-put again glue-curing again " repeatedly.
The present embodiment method can also can well be controlled lens shape in the situation that not needing mould, form compared with the lens of large ratio of height to width, main cause the present embodiment is first at glue cooling curing basis of formation layer of LED chip point, this basal layer upper surface is exactly the cambered surface raising up, with direct glue in the plane compared with, stack layer is put after adhesive curing and is just easier to form compared with the shape of large ratio of height to width on this convex surface.And do not need once to form, mode that can be repeatedly stacking is put the amount of glue relatively still less at every turn, is also easier to control.
In the present embodiment, described stacking being not limited to once; But can be repeatedly stacking.And basal layer and stack layer can adopt the plastic packaging glue of the different in kinds such as viscosity, surface tension, refractive index.Thereby can reach the effect that regulates lens shape and light extraction efficiency.For example adopt refractive index higher plastic packaging glue at basal layer, and adopt the lower plastic packaging glue of refractive index at stack layer, thereby make whole lens there is from center the layer refractive index of step-down gradually outward.The grading structure of this refractive index contributes to improve light extraction efficiency.Even can be at basal layer or stack layer doping fluorescent powder, thus in this lens encapsulation process, the fluorescent powder coating technique of LED is completed in the lump.
In the present embodiment, the material of basal layer and stack layer is not limited to transparent plastic packaging glue, and so that plastic packaging glue and fluorescent material are mixed, thereby integrated fluorescent material applies in this lens encapsulation process.For example, plastic packaging glue and the mixed glue of fluorescent material are used for to stack layer, can form the structure of " coating of long distance formula fluorescent material ".
Embodiment 2
As shown in Figure 2, the present embodiment is only from the different of embodiment 1: the some glue amount that the present embodiment is put glue for the first time does not spread to the outward flange of described substrate 100, is the border that the some glue of basal layer 301 can reach substrate 100.When glue amount hour, or substrate is when larger, or plastic packaging adhesiveness is when larger, the plastic packaging glue of basal layer flowing on substrate cannot reach the border of substrate.The shape of basal layer 301 is determined jointly by factors such as the character of surface tension, viscosity and the substrate of a glue amount and plastic packaging glue.Can according to the actual requirements, first obtain by experiment this and put for the first time the numerical value of the some glue amount of glue, and then produce on a large scale equally.
Embodiment 3
As shown in Figure 3, the present embodiment is only from the different of embodiment 1: be provided with at substrate 100 upper surfaces the basal layer limited impression 401 of making the flow range of glue when basal layer for being limited in.In some cases, for example, when glue amount is less, or substrate is larger, or plastic packaging adhesiveness is when larger, and the plastic packaging glue of basal layer does not need to flow to the border of substrate.Now, can on substrate, produce groove 401, utilize the border of groove 401 to limit flowing of plastic packaging glue, thereby control the shape of lens.
Embodiment 4
As shown in Figure 4, the present embodiment is only from the different of embodiment 1: be provided with the layer laminate limited impression 402 of the flow range of glue when being limited in making layer lamination 302 at substrate 100 upper surfaces.
The present embodiment is from the different of embodiment 3, and groove 402 is not meant to limit the flowing of plastic packaging glue of basal layer 301, but is used for limiting flowing of stack layer 302, thereby reaches the object of controlling stack layer shape.
Embodiment 5
As shown in Figure 5, the present embodiment is only from the different of embodiment 1: be provided with for being limited in simultaneously and make the basal layer limited impression 401 of the flow range of glue when basal layer and the layer laminate limited impression 402 of the flow range of glue when being limited in making layer lamination at substrate 100 upper surfaces.
The difference of the present embodiment and embodiment 4 is, is manufactured with multiple grooves 401,402 on substrate 100.These grooves can be respectively used to limit flowing of basal layer 301 and stack layer 302, thereby reach the object of controlling its shape.By changing flute pitch, can control the shape of basal layer and stack layer respectively, thereby reach the object of adjusting light type and improving light extraction efficiency.
Above-mentioned explanation is the detailed description for the better possible embodiments of the present invention, but embodiment is not in order to limit patent claim of the present invention, the equal variation completing under all disclosed technical spirits or modification are changed, and all should belong to the scope of the claims that the present invention is contained.
Claims (9)
1. a LED method for packing, for encapsulating wafer scale LED device, this LED device comprises substrate, is arranged on the LED chip on described substrate and is wrapped in the lens outside described LED chip, it is characterized in that comprising the following steps:
Above LED chip, put for the first time glue, then cool to room temperature makes it solidify to form basal layer, puts for the first time the some glue amount of glue and at least wraps up LED chip but do not overflow substrate edges;
Repeatedly repeat following sub-step and on described basal layer, form stack layer jointly to form lens with basal layer: above described basal layer or its outer summit, again put glue, then cool to room temperature solidifies it.
2. LED method for packing according to claim 1, is characterized in that:
Point glue position put glue for the first time above LED chip time is near the geometric center of described upper surface of base plate.
3. LED method for packing according to claim 1 and 2, is characterized in that:
Be provided with at described upper surface of base plate the basal layer limited impression of making the flow range of glue when basal layer for being limited in.
4. LED method for packing according to claim 1 and 2, is characterized in that:
Be provided with the layer laminate limited impression of the flow range of glue when being limited in making layer lamination at described upper surface of base plate.
5. LED method for packing according to claim 1 and 2, is characterized in that:
Be provided with for being limited in simultaneously and make the basal layer limited impression of the flow range of glue when basal layer and the layer laminate limited impression of the flow range of glue when being limited in making layer lamination at described upper surface of base plate.
6. LED method for packing according to claim 1 and 2, is characterized in that:
Described basal layer and stack layer adopt identical or different packaging plastic.
7. LED method for packing according to claim 6, is characterized in that:
In described packaging plastic, be mixed with fluorescent material.
8. LED method for packing according to claim 1, is characterized in that:
The described some glue amount of putting for the first time glue just spreads the outward flange to described substrate.
9. LED method for packing according to claim 1, is characterized in that:
The described some glue amount of putting for the first time glue does not spread the outward flange to described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410131483.9A CN103872220A (en) | 2014-04-02 | 2014-04-02 | LED packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410131483.9A CN103872220A (en) | 2014-04-02 | 2014-04-02 | LED packaging method |
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| CN103872220A true CN103872220A (en) | 2014-06-18 |
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| CN201410131483.9A Pending CN103872220A (en) | 2014-04-02 | 2014-04-02 | LED packaging method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576888A (en) * | 2015-01-15 | 2015-04-29 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED package component, substrate and wafer level packaging method thereof |
| CN105405951A (en) * | 2015-12-20 | 2016-03-16 | 合肥艾斯克光电科技有限责任公司 | Packaging method for LED white-light lamp |
| CN105405935A (en) * | 2015-12-20 | 2016-03-16 | 合肥艾斯克光电科技有限责任公司 | Packaging method of LED chip lens |
| CN105449077A (en) * | 2015-12-20 | 2016-03-30 | 合肥艾斯克光电科技有限责任公司 | Light emitting diode (LED) encapsulating device |
| CN105789412A (en) * | 2016-03-11 | 2016-07-20 | 厦门理工学院 | Wafer LED with remote fluorescent powder layer and preparation method thereof |
| CN107835581A (en) * | 2017-11-06 | 2018-03-23 | 上海航天科工电器研究院有限公司 | A kind of encapsulating method of printed board sensitizing range |
| CN110707078A (en) * | 2019-09-12 | 2020-01-17 | 武汉华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
| CN111036515A (en) * | 2019-12-16 | 2020-04-21 | 青岛歌尔智能传感器有限公司 | Glue filling method of heart rate module |
| CN112987397A (en) * | 2021-02-19 | 2021-06-18 | 京东方科技集团股份有限公司 | Driving backboard and display device |
| CN115877612A (en) * | 2022-12-26 | 2023-03-31 | 惠科股份有限公司 | Backlight module and display device |
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| CN102437273A (en) * | 2011-12-02 | 2012-05-02 | 华中科技大学 | LED packaging device capable of realizing lens-free packaging by utilizing surface modification and method thereof |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576888A (en) * | 2015-01-15 | 2015-04-29 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | LED package component, substrate and wafer level packaging method thereof |
| CN105405951A (en) * | 2015-12-20 | 2016-03-16 | 合肥艾斯克光电科技有限责任公司 | Packaging method for LED white-light lamp |
| CN105405935A (en) * | 2015-12-20 | 2016-03-16 | 合肥艾斯克光电科技有限责任公司 | Packaging method of LED chip lens |
| CN105449077A (en) * | 2015-12-20 | 2016-03-30 | 合肥艾斯克光电科技有限责任公司 | Light emitting diode (LED) encapsulating device |
| CN105789412A (en) * | 2016-03-11 | 2016-07-20 | 厦门理工学院 | Wafer LED with remote fluorescent powder layer and preparation method thereof |
| CN105789412B (en) * | 2016-03-11 | 2023-08-04 | 厦门理工学院 | Wafer-level LED with remote fluorescent powder layer and preparation method thereof |
| CN107835581B (en) * | 2017-11-06 | 2019-10-18 | 上海航天科工电器研究院有限公司 | A kind of encapsulating method of printed board sensitizing range |
| CN107835581A (en) * | 2017-11-06 | 2018-03-23 | 上海航天科工电器研究院有限公司 | A kind of encapsulating method of printed board sensitizing range |
| CN110707078A (en) * | 2019-09-12 | 2020-01-17 | 武汉华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
| CN111036515A (en) * | 2019-12-16 | 2020-04-21 | 青岛歌尔智能传感器有限公司 | Glue filling method of heart rate module |
| CN112987397A (en) * | 2021-02-19 | 2021-06-18 | 京东方科技集团股份有限公司 | Driving backboard and display device |
| CN112987397B (en) * | 2021-02-19 | 2023-05-26 | 京东方科技集团股份有限公司 | Driving backboard and display device |
| US11868003B2 (en) | 2021-02-19 | 2024-01-09 | BOE MLED Technology Co., Ltd. | Driving backplate and display device |
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Application publication date: 20140618 |